JP5534181B2 - ダイヤモンド多結晶体 - Google Patents

ダイヤモンド多結晶体 Download PDF

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Publication number
JP5534181B2
JP5534181B2 JP2010055304A JP2010055304A JP5534181B2 JP 5534181 B2 JP5534181 B2 JP 5534181B2 JP 2010055304 A JP2010055304 A JP 2010055304A JP 2010055304 A JP2010055304 A JP 2010055304A JP 5534181 B2 JP5534181 B2 JP 5534181B2
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diamond
less
polycrystalline
particles
cutting
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JP2011190124A (ja
JP2011190124A5 (https=
Inventor
佳津子 山本
武 佐藤
均 角谷
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Sumitomo Electric Industries Ltd
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Sumitomo Electric Industries Ltd
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  • Cutting Tools, Boring Holders, And Turrets (AREA)
JP2010055304A 2010-03-12 2010-03-12 ダイヤモンド多結晶体 Active JP5534181B2 (ja)

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JP2010055304A JP5534181B2 (ja) 2010-03-12 2010-03-12 ダイヤモンド多結晶体

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JP2010055304A JP5534181B2 (ja) 2010-03-12 2010-03-12 ダイヤモンド多結晶体

Publications (3)

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JP2011190124A JP2011190124A (ja) 2011-09-29
JP2011190124A5 JP2011190124A5 (https=) 2013-02-28
JP5534181B2 true JP5534181B2 (ja) 2014-06-25

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JP2010055304A Active JP5534181B2 (ja) 2010-03-12 2010-03-12 ダイヤモンド多結晶体

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Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2013161849A1 (ja) 2012-04-24 2013-10-31 株式会社東京精密 ダイシングブレード
CN104364884B (zh) * 2012-06-15 2017-06-23 株式会社东京精密 切割装置以及切割方法
JP6390152B2 (ja) * 2014-04-30 2018-09-19 住友電気工業株式会社 複合焼結体
JP6390151B2 (ja) * 2014-04-30 2018-09-19 住友電気工業株式会社 複合焼結体
DE202015009584U1 (de) * 2014-05-08 2018-06-07 Sumitomo Electric Industries, Ltd. Polykristalliner Diamantkörper, Schneidwerkzeug, verschleißfestes Werkzeug und Schleifwerkzeug
JP6458559B2 (ja) 2015-03-06 2019-01-30 住友電気工業株式会社 ダイヤモンド多結晶体、切削工具、耐摩工具、および研削工具
JP6112177B1 (ja) * 2015-10-30 2017-04-12 住友電気工業株式会社 複合多結晶体およびその製造方法
JP2019019052A (ja) * 2018-08-23 2019-02-07 住友電気工業株式会社 複合焼結体

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4203900B2 (ja) * 2002-10-11 2009-01-07 住友電気工業株式会社 ダイヤモンド多結晶体およびその製造方法
JP5070688B2 (ja) * 2005-08-22 2012-11-14 住友電気工業株式会社 高硬度ダイヤモンド多結晶体及びその製造方法
JP2007251002A (ja) * 2006-03-17 2007-09-27 Toshiba Corp ヒートシンク、電子デバイス、ヒートシンクの製造方法及び電子デバイスの製造方法

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JP2011190124A (ja) 2011-09-29

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