JP5533830B2 - 線状光源装置 - Google Patents
線状光源装置 Download PDFInfo
- Publication number
- JP5533830B2 JP5533830B2 JP2011211167A JP2011211167A JP5533830B2 JP 5533830 B2 JP5533830 B2 JP 5533830B2 JP 2011211167 A JP2011211167 A JP 2011211167A JP 2011211167 A JP2011211167 A JP 2011211167A JP 5533830 B2 JP5533830 B2 JP 5533830B2
- Authority
- JP
- Japan
- Prior art keywords
- source device
- light source
- wiring board
- light emitting
- linear light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- 238000007789 sealing Methods 0.000 claims description 31
- 229920005989 resin Polymers 0.000 claims description 30
- 239000011347 resin Substances 0.000 claims description 30
- 230000003014 reinforcing effect Effects 0.000 claims description 7
- 239000000758 substrate Substances 0.000 description 29
- 238000005452 bending Methods 0.000 description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- 230000008602 contraction Effects 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 239000004744 fabric Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- 239000004954 Polyphthalamide Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 150000004767 nitrides Chemical class 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920006375 polyphtalamide Polymers 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21S—NON-PORTABLE LIGHTING DEVICES; SYSTEMS THEREOF; VEHICLE LIGHTING DEVICES SPECIALLY ADAPTED FOR VEHICLE EXTERIORS
- F21S4/00—Lighting devices or systems using a string or strip of light sources
- F21S4/20—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports
- F21S4/28—Lighting devices or systems using a string or strip of light sources with light sources held by or within elongate supports rigid, e.g. LED bars
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V17/00—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages
- F21V17/06—Fastening of component parts of lighting devices, e.g. shades, globes, refractors, reflectors, filters, screens, grids or protective cages the fastening being onto or by the lampholder
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V21/00—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips
- F21V21/005—Supporting, suspending, or attaching arrangements for lighting devices; Hand grips for several lighting devices in an end-to-end arrangement, i.e. light tracks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V7/00—Reflectors for light sources
- F21V7/04—Optical design
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10106—Light emitting diode [LED]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1327—Moulding over PCB locally or completely
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
- H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Planar Illumination Modules (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
Description
10:配線基板
11:発光素子
12:リフレクタ
13、23:封止樹脂
14:放熱板
15、17、25:溝
16a、b:傾斜面
Claims (6)
- 長方形状で配線パターンが形成された配線基板と、前記配線基板上に前記配線基板の長手方向に配置され、前記配線基板の配線パターンと接続された複数の発光素子と、前記発光素子を封止する封止樹脂と、を有した線状光源装置において、
前記配線基板は、前記発光素子が配置された側とは反対側の面であって、前記発光素子間に対応する位置に設けられた溝と、
前記配線基板の前記発光素子が配置された側とは反対側の面に接して設けられた補強板と、
を有することを特徴とする線状光源装置。 - 前記溝は、前記配線基板の中央に対して対称な位置に設けられていることを特徴とする請求項1に記載の線状光源装置。
- 前記溝は、前記配線基板の短手方向に延びる線状であることを特徴とする請求項1または請求項2に記載の線状光源装置。
- 前記補強板は、前記配線基板よりも熱伝導性の高い放熱板であることを特徴とする請求項1ないし請求項3のいずれか1項に記載の線状光源装置。
- 前記配線基板の長手方向の一方と他方に対向する傾斜面をそれぞれ備えた2つの部分で構成され、単数ないし複数の前記発光素子ごとに前記2つの傾斜面で挟むようにして分離されて前記配線基板上に配置されたリフレクタをさらに有し、前記封止樹脂は、前記発光素子の配置された配線基板表面と、2つの前記傾斜面とにより囲まれた凹部を埋めるように形成されている、ことを特徴とする請求項1ないし請求項4のいずれか1項に記載の線状光源装置。
- 隣接する前記リフレクタ同士が連結されていることを特徴とする請求項5に記載の線状光源装置。
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011211167A JP5533830B2 (ja) | 2011-09-27 | 2011-09-27 | 線状光源装置 |
US13/619,086 US9062846B2 (en) | 2011-09-27 | 2012-09-14 | Linear light source apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2011211167A JP5533830B2 (ja) | 2011-09-27 | 2011-09-27 | 線状光源装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013074050A JP2013074050A (ja) | 2013-04-22 |
JP5533830B2 true JP5533830B2 (ja) | 2014-06-25 |
Family
ID=47911095
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011211167A Expired - Fee Related JP5533830B2 (ja) | 2011-09-27 | 2011-09-27 | 線状光源装置 |
Country Status (2)
Country | Link |
---|---|
US (1) | US9062846B2 (ja) |
JP (1) | JP5533830B2 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2013222499A (ja) * | 2012-04-12 | 2013-10-28 | Sharp Corp | 光源基板ユニット |
US9933142B1 (en) * | 2013-09-25 | 2018-04-03 | i-Lighting, LLC | LED strip lighting |
US9541255B2 (en) * | 2014-05-28 | 2017-01-10 | Lsi Industries, Inc. | Luminaires and reflector modules |
JP6519311B2 (ja) * | 2014-06-27 | 2019-05-29 | 日亜化学工業株式会社 | 発光装置 |
TWD170854S (zh) * | 2014-08-07 | 2015-10-01 | 璨圓光電股份有限公司 | 發光二極體燈絲之部分 |
USD774006S1 (en) * | 2014-08-27 | 2016-12-13 | Mitsubishi Electric Corporation | Light source module |
JP6384508B2 (ja) * | 2016-04-06 | 2018-09-05 | 日亜化学工業株式会社 | 発光装置 |
CN107403791B (zh) * | 2016-05-18 | 2020-04-10 | 光宝光电(常州)有限公司 | 发光显示器以及形成发光显示器的方法 |
JP6678089B2 (ja) * | 2016-09-29 | 2020-04-08 | 株式会社沖データ | 露光装置、画像形成装置、受光装置、及び画像読取装置 |
DE102016124270A1 (de) * | 2016-12-13 | 2018-06-14 | Infineon Technologies Ag | Halbleiter-package und verfahren zum fertigen eines halbleiter-package |
JP6662322B2 (ja) * | 2017-02-09 | 2020-03-11 | 日亜化学工業株式会社 | 発光装置 |
JP6699580B2 (ja) * | 2017-02-09 | 2020-05-27 | 日亜化学工業株式会社 | 発光装置 |
USD816881S1 (en) * | 2017-03-17 | 2018-05-01 | Jianghui Qiao | Lamp |
USD816882S1 (en) * | 2017-03-17 | 2018-05-01 | Jianghui Qiao | Lamp |
CN108019641A (zh) * | 2017-11-27 | 2018-05-11 | 安徽文尧智能光电科技有限公司 | 一种高均匀度的led线光源 |
CN109284649B (zh) * | 2018-10-25 | 2024-02-20 | 广东德尔智慧科技股份有限公司 | 一种pcb板的扫码装置 |
JP6947989B2 (ja) * | 2019-03-28 | 2021-10-13 | 日亜化学工業株式会社 | 線状光源及び面状発光装置 |
USD887617S1 (en) * | 2020-02-10 | 2020-06-16 | Peng Wang | Lamp |
USD888316S1 (en) * | 2020-03-12 | 2020-06-23 | Wenjuan Huang | Lamp |
USD898269S1 (en) * | 2020-03-12 | 2020-10-06 | Wenjuan Huang | Lamp |
USD915657S1 (en) * | 2020-04-20 | 2021-04-06 | Xiaohui Zheng | Vanity lamp |
USD961144S1 (en) * | 2020-06-12 | 2022-08-16 | Jiemin Cheng | Light |
USD907275S1 (en) * | 2020-07-01 | 2021-01-05 | Chanzhen Chen | Lamp |
USD908945S1 (en) * | 2020-07-08 | 2021-01-26 | Nan Zheng | Lamp |
CN112153838B (zh) * | 2020-09-27 | 2022-11-04 | 维沃移动通信有限公司 | 电子设备 |
USD950829S1 (en) * | 2021-05-24 | 2022-05-03 | Meimei Lin | Light |
USD950133S1 (en) * | 2021-05-24 | 2022-04-26 | Meimei Lin | Light |
USD952928S1 (en) * | 2021-05-25 | 2022-05-24 | Meizhi Wen | LED light fixture |
USD953599S1 (en) * | 2021-06-03 | 2022-05-31 | Heng JIANG | Lamp |
USD970084S1 (en) * | 2021-06-03 | 2022-11-15 | Weida Chen | Lamp |
USD984020S1 (en) * | 2021-08-16 | 2023-04-18 | Meizhi Wen | Bathroom light fixture |
USD968008S1 (en) * | 2021-08-30 | 2022-10-25 | Zhancheng Zheng | Led light fixture |
USD970787S1 (en) * | 2021-09-10 | 2022-11-22 | Zhancheng Zheng | Led lamp |
USD963915S1 (en) * | 2021-12-21 | 2022-09-13 | Yang Gao | Lamp |
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CN117203578A (zh) * | 2022-03-31 | 2023-12-08 | 京东方科技集团股份有限公司 | 一种线路板、电子装置和线路板的制作方法 |
USD975338S1 (en) * | 2022-05-09 | 2023-01-10 | Hewu Zheng | Lamp |
USD968009S1 (en) * | 2022-05-18 | 2022-10-25 | Homeangel, Llc | Lamp |
USD980495S1 (en) * | 2022-07-28 | 2023-03-07 | Mingwei GAO | Lamp |
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JP5159596B2 (ja) * | 2008-12-25 | 2013-03-06 | 京セラ株式会社 | 発光装置 |
JP2010177441A (ja) * | 2009-01-29 | 2010-08-12 | Rohm Co Ltd | Ledランプ |
JP5366687B2 (ja) * | 2009-07-14 | 2013-12-11 | シチズン電子株式会社 | 発光装置 |
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2011
- 2011-09-27 JP JP2011211167A patent/JP5533830B2/ja not_active Expired - Fee Related
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2012
- 2012-09-14 US US13/619,086 patent/US9062846B2/en not_active Expired - Fee Related
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US20130077295A1 (en) | 2013-03-28 |
JP2013074050A (ja) | 2013-04-22 |
US9062846B2 (en) | 2015-06-23 |
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