JP5502503B2 - ウエハ搬送装置およびウエハ搬送方法 - Google Patents

ウエハ搬送装置およびウエハ搬送方法 Download PDF

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JP5502503B2
JP5502503B2 JP2010010665A JP2010010665A JP5502503B2 JP 5502503 B2 JP5502503 B2 JP 5502503B2 JP 2010010665 A JP2010010665 A JP 2010010665A JP 2010010665 A JP2010010665 A JP 2010010665A JP 5502503 B2 JP5502503 B2 JP 5502503B2
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wafers
wafer
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liquid
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JP2011151167A5 (enExample
JP2011151167A (ja
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和夫 白井
寛高 宮井
保 西岡
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日鉄住金ファインテック株式会社
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JP2010010665A 2010-01-21 2010-01-21 ウエハ搬送装置およびウエハ搬送方法 Expired - Fee Related JP5502503B2 (ja)

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JP2011151167A JP2011151167A (ja) 2011-08-04
JP2011151167A5 JP2011151167A5 (enExample) 2013-03-07
JP5502503B2 true JP5502503B2 (ja) 2014-05-28

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Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014207250A (ja) * 2011-08-12 2014-10-30 株式会社安永 ウェハ分離装置及びこれを用いたウェハの製造方法
CN102956530A (zh) * 2011-08-31 2013-03-06 日本麦可罗尼克斯股份有限公司 晶片的分离方法及分离装置
JP2013149706A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置およびウエハ搬送方法
JP2013149704A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd カセット保持機構およびウエハ格納ユニット
JP2013149703A (ja) * 2012-01-18 2013-08-01 Nippon Steel & Sumikin Fine Technology Co Ltd ウエハ搬送装置
JP5600692B2 (ja) * 2012-01-18 2014-10-01 日鉄住金ファインテック株式会社 ウエハ搬送装置
CN114750057B (zh) * 2022-06-13 2022-09-02 富芯微电子有限公司 一种复合快恢复二极管生产用的背面减薄设备及工艺
CN117038548B (zh) * 2023-10-08 2024-02-13 内蒙古晶环电子材料有限公司 晶片分片装置及晶片检测方法
CN118431128B (zh) * 2024-04-22 2025-02-28 博纳半导体设备(浙江)有限公司 一种高洁净度半导体晶圆自动装载设备

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2580212B2 (ja) * 1987-11-24 1997-02-12 住友シチックス株式会社 ウエーハの枚葉化装置
JP3668336B2 (ja) * 1996-08-13 2005-07-06 三菱住友シリコン株式会社 半導体ウェーハの搬送装置
JPH10114426A (ja) * 1996-10-11 1998-05-06 Tokyo Seimitsu Co Ltd ウェーハ取出装置
JP3449455B2 (ja) * 1997-01-31 2003-09-22 株式会社日平トヤマ ウエハの搬送装置
JP2002254378A (ja) * 2001-02-22 2002-09-10 Hiroshi Akashi 液中ワーク取り出し装置
DE102007061410A1 (de) * 2007-12-11 2009-06-18 Gebr. Schmid Gmbh & Co. Verfahren und Vorrichtung zum Vereinzeln von Wafern von einem Waferstapel

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