JP5501697B2 - プローブ先端 - Google Patents

プローブ先端 Download PDF

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Publication number
JP5501697B2
JP5501697B2 JP2009194869A JP2009194869A JP5501697B2 JP 5501697 B2 JP5501697 B2 JP 5501697B2 JP 2009194869 A JP2009194869 A JP 2009194869A JP 2009194869 A JP2009194869 A JP 2009194869A JP 5501697 B2 JP5501697 B2 JP 5501697B2
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Japan
Prior art keywords
probe
sample
station
tip
assembly
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JP2009194869A
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English (en)
Japanese (ja)
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JP2010056553A (ja
JP2010056553A5 (https=
Inventor
シー． コーディル ジェイソン
シー． マルーフ エドワード
政紀 山口
慎一朗 水田
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Publication of JP2010056553A5 publication Critical patent/JP2010056553A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06755—Material aspects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2855—Environmental, reliability or burn-in testing
    • G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
    • G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2009194869A 2008-08-26 2009-08-25 プローブ先端 Active JP5501697B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US9196208P 2008-08-26 2008-08-26
US61/091,962 2008-08-26

Publications (3)

Publication Number Publication Date
JP2010056553A JP2010056553A (ja) 2010-03-11
JP2010056553A5 JP2010056553A5 (https=) 2012-09-27
JP5501697B2 true JP5501697B2 (ja) 2014-05-28

Family

ID=41401830

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2009194869A Active JP5501697B2 (ja) 2008-08-26 2009-08-25 プローブ先端

Country Status (4)

Country Link
US (1) US8327727B2 (https=)
EP (1) EP2159580B1 (https=)
JP (1) JP5501697B2 (https=)
CN (1) CN101685105B (https=)

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EP2202472A1 (en) * 2008-12-29 2010-06-30 Ludwig-Maximilians-Universität München Freeze dryer monitoring device
WO2011138635A1 (en) * 2010-05-03 2011-11-10 Indian Institute Of Technology Bombay Capillary electrophoresis chips
CN105378449B (zh) * 2012-12-17 2019-02-05 胡文聪 取样组件、显微镜模块及显微镜装置
US9417266B2 (en) 2014-01-16 2016-08-16 International Business Machines Corporation Implementing handheld transfer impedance probe
CN106338625B (zh) * 2015-07-06 2019-07-26 创意电子股份有限公司 探针卡
US10060950B2 (en) 2016-01-15 2018-08-28 Formfactor Beaverton, Inc. Shielded probe systems
US10877070B2 (en) 2018-01-19 2020-12-29 Formfactor Beaverton, Inc. Probes with fiducial targets, probe systems including the same, and associated methods
US11313883B2 (en) * 2020-09-10 2022-04-26 Mpi Corporation Probe station capable of maintaining position of probe tip upon temperature change
CN114811432A (zh) * 2021-01-19 2022-07-29 中国航天科工飞航技术研究院（中国航天海鹰机电技术研究院） 用于液氦杜瓦的温度补偿支撑结构及具有其的低温容器
CN113075128B (zh) * 2021-04-06 2024-09-10 武汉佰力博科技有限公司 一种探针机构和可变温真空探针平台
US11927603B2 (en) 2021-10-20 2024-03-12 Formfactor, Inc. Probes that define retroreflectors, probe systems that include the probes, and methods of utilizing the probes
JP7507838B2 (ja) 2021-11-30 2024-06-28 イノヴェータム・インストゥルメンツ・インコーポレイテッド 荷電粒子ビームを使用するプローブ先端のｘ－ｙロケーションの識別
US12306241B2 (en) 2022-02-14 2025-05-20 Innovatum Instruments Inc. Automated probe landing
CN116773997A (zh) * 2022-03-11 2023-09-19 苏州联讯仪器股份有限公司 芯片电性老化测试装置
CN116298863B (zh) * 2023-02-01 2024-05-10 深圳市致诚达科技有限公司 一种bldc电机生产线快速检验系统及控制方法
EP4439101A1 (en) * 2023-03-31 2024-10-02 kiutra GmbH Apparatus for testing and/or operating electronic devices
CN116430088B (zh) * 2023-06-13 2023-11-24 南方科技大学 探针及其制备方法

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US3797310A (en) * 1972-02-28 1974-03-19 Steel Corp Temperature sensing device
US4123706A (en) * 1975-03-03 1978-10-31 Electroglas, Inc. Probe construction
US4115736A (en) * 1977-03-09 1978-09-19 The United States Of America As Represented By The Secretary Of The Air Force Probe station
US4194119A (en) * 1977-11-30 1980-03-18 Ford Motor Company Self-adjusting cryogenic thermal interface assembly
US4586383A (en) * 1982-09-13 1986-05-06 Blomquist George W Electronic pressure gauge and flow meter
US4499330A (en) * 1983-12-23 1985-02-12 General Electric Company Anti-vibration support for thermocouple tip
JPS6150048A (ja) * 1984-08-20 1986-03-12 Nippon Seiko Kk プロ−ブ針昇降装置
EP0252523A3 (en) * 1986-07-11 1990-02-07 Nibex Company, Ltd. Temperature sensor
US4831846A (en) * 1988-04-12 1989-05-23 The United States Of America As Represented By The United States Department Of Energy Low temperature cryoprobe
US4909588A (en) * 1988-08-25 1990-03-20 The Dow Chemical Company Sealed fiber optic probe
JPH0362938A (ja) * 1989-07-31 1991-03-19 Tokyo Electron Ltd 検査装置
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US5309088A (en) 1990-08-10 1994-05-03 Texas Instruments Incorporated Measurement of semiconductor parameters at cryogenic temperatures using a spring contact probe
US5193912A (en) * 1991-11-18 1993-03-16 Saunders Roger I Probe for sensing and measuring temperature
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US5312188A (en) * 1993-04-05 1994-05-17 Figgie International Inc. Temperature sensing apparatus
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EP0727649B1 (en) * 1995-02-17 1998-04-08 Hewlett-Packard GmbH Optical system having temperature compensated optical sensor mounting
JP3216616B2 (ja) * 1998-10-06 2001-10-09 日本電気株式会社 半導体装置
NO994363L (no) * 1999-09-09 2001-03-12 Optomed As Fiberoptisk probe for temperaturmÕlinger i biologiske media
US6483336B1 (en) * 2000-05-03 2002-11-19 Cascade Microtech, Inc. Indexing rotatable chuck for a probe station
US6784663B2 (en) * 2001-08-27 2004-08-31 Tristan Technologies, Inc. Self-adjusting assembly and method for close tolerance spacing
US6972578B2 (en) * 2001-11-02 2005-12-06 Formfactor, Inc. Method and system for compensating thermally induced motion of probe cards
US7071714B2 (en) * 2001-11-02 2006-07-04 Formfactor, Inc. Method and system for compensating for thermally induced motion of probe cards
DE10154495C5 (de) * 2001-11-07 2018-01-11 Infineon Technologies Ag Konzept zur Kompensation der Einflüsse externer Störgrößen auf physikalische Funktionsparameter von integrierten Schaltungen
KR100791136B1 (ko) * 2002-04-16 2008-01-02 닛폰 하츠죠 가부시키가이샤 도전성 접촉자용 홀더
JP4170023B2 (ja) * 2002-06-07 2008-10-22 アルプス電気株式会社 回転型センサ
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DE10254720A1 (de) * 2002-11-23 2004-06-03 Endress + Hauser Gmbh + Co. Kg Messgerät
JP2006524798A (ja) * 2003-02-13 2006-11-02 ネクセンス リミテッド 様々なパラメータの高感度測定を行なうための装置、およびそのような装置で特に有用なセンサ
JP4400909B2 (ja) * 2003-04-04 2010-01-20 日本サーモスタット株式会社 サーモスタット装置
EP1644473B1 (en) * 2003-06-03 2014-01-15 Cantimer Incorporated Phase change sensor
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Also Published As

Publication number Publication date
EP2159580A1 (en) 2010-03-03
EP2159580B1 (en) 2015-10-07
JP2010056553A (ja) 2010-03-11
CN101685105A (zh) 2010-03-31
CN101685105B (zh) 2013-09-04
US20100064784A1 (en) 2010-03-18
US8327727B2 (en) 2012-12-11

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