JP5499933B2 - 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法 - Google Patents

電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法 Download PDF

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Publication number
JP5499933B2
JP5499933B2 JP2010141721A JP2010141721A JP5499933B2 JP 5499933 B2 JP5499933 B2 JP 5499933B2 JP 2010141721 A JP2010141721 A JP 2010141721A JP 2010141721 A JP2010141721 A JP 2010141721A JP 5499933 B2 JP5499933 B2 JP 5499933B2
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Japan
Prior art keywords
grain boundary
anode
electroplating
copper anode
phosphorous
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JP2010141721A
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English (en)
Japanese (ja)
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JP2011162875A (ja
Inventor
清隆 中矢
晃一 喜多
訓 熊谷
直樹 加藤
眞美 渡邊
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Mitsubishi Materials Corp
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Mitsubishi Materials Corp
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Publication date
Application filed by Mitsubishi Materials Corp filed Critical Mitsubishi Materials Corp
Priority to JP2010141721A priority Critical patent/JP5499933B2/ja
Priority to US13/521,584 priority patent/US20150308009A1/en
Priority to PCT/JP2011/050179 priority patent/WO2011086978A1/ja
Priority to CN201180005807.9A priority patent/CN102713022B/zh
Priority to KR1020127015436A priority patent/KR20120123272A/ko
Priority to TW100100819A priority patent/TWI522497B/zh
Publication of JP2011162875A publication Critical patent/JP2011162875A/ja
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Publication of JP5499933B2 publication Critical patent/JP5499933B2/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21B—ROLLING OF METAL
    • B21B37/00—Control devices or methods specially adapted for metal-rolling mills or the work produced thereby
    • B21B37/16—Control of thickness, width, diameter or other transverse dimensions
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C9/00—Alloys based on copper
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Electrochemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2010141721A 2010-01-12 2010-06-22 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法 Active JP5499933B2 (ja)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP2010141721A JP5499933B2 (ja) 2010-01-12 2010-06-22 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法
US13/521,584 US20150308009A1 (en) 2010-01-12 2011-01-07 Phosphorous-containing copper anode for electrolytic copper plating, method for manufacturing same, and electrolytic copper plating method
PCT/JP2011/050179 WO2011086978A1 (ja) 2010-01-12 2011-01-07 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法
CN201180005807.9A CN102713022B (zh) 2010-01-12 2011-01-07 电解铜电镀用含磷铜阳极、其制造方法及电解铜电镀方法
KR1020127015436A KR20120123272A (ko) 2010-01-12 2011-01-07 전기 구리 도금용 인 함유 구리 애노드, 그 제조 방법 및 전기 구리 도금 방법
TW100100819A TWI522497B (zh) 2010-01-12 2011-01-10 電鍍銅用含磷銅陽極，其製造方法及電鍍銅之方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010003718 2010-01-12
JP2010003718 2010-01-12
JP2010141721A JP5499933B2 (ja) 2010-01-12 2010-06-22 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法

Publications (2)

Publication Number Publication Date
JP2011162875A JP2011162875A (ja) 2011-08-25
JP5499933B2 true JP5499933B2 (ja) 2014-05-21

Family

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JP2010141721A Active JP5499933B2 (ja) 2010-01-12 2010-06-22 電気銅めっき用含リン銅アノード、その製造方法および電気銅めっき方法

Country Status (6)

Country Link
US (1) US20150308009A1 (zh)
JP (1) JP5499933B2 (zh)
KR (1) KR20120123272A (zh)
CN (1) CN102713022B (zh)
TW (1) TWI522497B (zh)
WO (1) WO2011086978A1 (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101926215B1 (ko) * 2011-07-22 2018-12-06 미쓰비시 마테리알 가부시키가이샤 본딩 와이어용 구리 소선 및 본딩 와이어용 구리 소선의 제조 방법
JP6619942B2 (ja) * 2015-03-06 2019-12-11 Ｊｘ金属株式会社 半導体ウエハへの電気銅めっきに使用する銅アノード又は含燐銅アノード及び銅アノード又は含燐銅アノードの製造方法
CN106381410B (zh) * 2016-11-28 2019-01-22 佛山市承安铜业有限公司 一种集成电路用磷铜阳极的制备方法及其系统
TWI727586B (zh) * 2019-02-28 2021-05-11 日商Ｊｘ金屬股份有限公司 銅電極材料
CN114269957B (zh) * 2019-09-27 2022-07-29 三菱综合材料株式会社 纯铜板
DE112022004206T5 (de) * 2021-09-02 2024-07-25 Mitsubishi Materials Corporation Anschlussmaterial mit Plattierungsschicht und Kupferblech für das Anschlussmaterial
KR102675273B1 (ko) * 2023-06-28 2024-06-13 에스케이넥실리스 주식회사 용해 속도가 향상된 동 원재료
KR102675275B1 (ko) * 2023-06-28 2024-06-13 에스케이넥실리스 주식회사 용해 속도가 향상된 동 원재료

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5702543A (en) * 1992-12-21 1997-12-30 Palumbo; Gino Thermomechanical processing of metallic materials
JP4123330B2 (ja) * 2001-03-13 2008-07-23 三菱マテリアル株式会社 電気メッキ用含燐銅陽極
US6627055B2 (en) * 2001-07-02 2003-09-30 Brush Wellman, Inc. Manufacture of fine-grained electroplating anodes
JP4076751B2 (ja) * 2001-10-22 2008-04-16 日鉱金属株式会社 電気銅めっき方法、電気銅めっき用含リン銅アノード及びこれらを用いてめっきされたパーティクル付着の少ない半導体ウエハ
JP4064121B2 (ja) * 2002-02-13 2008-03-19 日鉱金属株式会社 含リン銅アノードを使用する電気銅めっき方法
JP4607165B2 (ja) * 2007-11-20 2011-01-05 Ｊｘ日鉱日石金属株式会社 電気銅めっき方法

Also Published As

Publication number Publication date
US20150308009A1 (en) 2015-10-29
KR20120123272A (ko) 2012-11-08
CN102713022A (zh) 2012-10-03
WO2011086978A1 (ja) 2011-07-21
TW201139748A (en) 2011-11-16
TWI522497B (zh) 2016-02-21
CN102713022B (zh) 2016-06-01
JP2011162875A (ja) 2011-08-25

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