JP5488386B2 - 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン - Google Patents

活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン Download PDF

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JP5488386B2
JP5488386B2 JP2010231490A JP2010231490A JP5488386B2 JP 5488386 B2 JP5488386 B2 JP 5488386B2 JP 2010231490 A JP2010231490 A JP 2010231490A JP 2010231490 A JP2010231490 A JP 2010231490A JP 5488386 B2 JP5488386 B2 JP 5488386B2
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polyol
active energy
energy ray
resin composition
hot melt
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JP2012082366A (ja
JP2012082366A5 (enrdf_load_stackoverflow
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善典 金川
大地 樋口
保 坂元
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DIC Corp
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DIC Corp
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  • Macromonomer-Based Addition Polymer (AREA)
JP2010231490A 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン Active JP5488386B2 (ja)

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JP2010231490A JP5488386B2 (ja) 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン

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JP2010231490A JP5488386B2 (ja) 2010-10-14 2010-10-14 活性エネルギー線硬化性ホットメルトウレタン樹脂組成物、それを用いた電子機器用部材、及びパッキン

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JP2012082366A JP2012082366A (ja) 2012-04-26
JP2012082366A5 JP2012082366A5 (enrdf_load_stackoverflow) 2013-08-29
JP5488386B2 true JP5488386B2 (ja) 2014-05-14

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Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6218306B2 (ja) * 2013-05-31 2017-10-25 アキレス株式会社 ポリウレタンフォーム
KR102271405B1 (ko) * 2014-03-26 2021-06-30 세키스이가가쿠 고교가부시키가이샤 광 습기 경화형 수지 조성물, 전자 부품용 접착제, 및 표시 소자용 접착제
JP6698524B2 (ja) * 2015-04-17 2020-05-27 積水化学工業株式会社 硬化体、電子部品、表示素子、及び、光湿気硬化型樹脂組成物
JP7003453B2 (ja) * 2017-06-08 2022-01-20 Dic株式会社 ウレタン（メタ）アクリレート樹脂
JP7300384B2 (ja) * 2017-08-10 2023-06-29 株式会社クラレ ポリウレタンホットメルト接着剤、それを用いた積層体及び積層体の製造方法
CN111741992B (zh) * 2018-02-21 2022-10-28 Dic株式会社 湿气固化型聚氨酯热熔树脂组合物
JP2019203083A (ja) * 2018-05-24 2019-11-28 Dic株式会社 湿気硬化型ウレタンホットメルト樹脂組成物、及び、積層体
JP7196435B2 (ja) * 2018-06-28 2022-12-27 Dic株式会社 湿気硬化型ポリウレタンホットメルト樹脂組成物
KR102324490B1 (ko) * 2018-11-02 2021-11-10 주식회사 엘지화학 수지 조성물
JP2023058877A (ja) * 2021-10-14 2023-04-26 Dic株式会社 接着剤、電池用包装材用接着剤、積層体、電池用包装材、電池用容器及び電池
JP7704311B2 (ja) * 2022-12-06 2025-07-08 Dic株式会社 湿気硬化型ポリウレタン樹脂組成物、接着剤、及び、積層体

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