JP5483922B2 - 塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 - Google Patents
塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 Download PDFInfo
- Publication number
- JP5483922B2 JP5483922B2 JP2009105556A JP2009105556A JP5483922B2 JP 5483922 B2 JP5483922 B2 JP 5483922B2 JP 2009105556 A JP2009105556 A JP 2009105556A JP 2009105556 A JP2009105556 A JP 2009105556A JP 5483922 B2 JP5483922 B2 JP 5483922B2
- Authority
- JP
- Japan
- Prior art keywords
- silicon powder
- metal silicon
- basic
- basic metal
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims description 91
- 239000011863 silicon-based powder Substances 0.000 title claims description 85
- 229910052728 basic metal Inorganic materials 0.000 title claims description 45
- 150000003818 basic metals Chemical class 0.000 title claims description 45
- 238000004519 manufacturing process Methods 0.000 title claims description 10
- 239000011342 resin composition Substances 0.000 title description 11
- 229910052751 metal Inorganic materials 0.000 claims description 45
- 239000002184 metal Substances 0.000 claims description 45
- 239000000126 substance Substances 0.000 claims description 29
- 229920005989 resin Polymers 0.000 claims description 19
- 239000011347 resin Substances 0.000 claims description 19
- 239000002245 particle Substances 0.000 claims description 17
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical group C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 9
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 8
- 229910021529 ammonia Inorganic materials 0.000 claims description 4
- 239000011362 coarse particle Substances 0.000 claims description 4
- 150000001875 compounds Chemical class 0.000 claims description 4
- 125000001841 imino group Chemical group [H]N=* 0.000 claims description 4
- 239000007787 solid Substances 0.000 claims description 2
- 238000004381 surface treatment Methods 0.000 claims description 2
- 239000000843 powder Substances 0.000 description 22
- 239000003822 epoxy resin Substances 0.000 description 14
- 229920000647 polyepoxide Polymers 0.000 description 14
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 10
- 239000010703 silicon Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- -1 fluororesin Polymers 0.000 description 7
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000000203 mixture Substances 0.000 description 5
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- 238000009826 distribution Methods 0.000 description 4
- 239000010419 fine particle Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 239000005011 phenolic resin Substances 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 3
- 230000035699 permeability Effects 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- CQOZJDNCADWEKH-UHFFFAOYSA-N 2-[3,3-bis(2-hydroxyphenyl)propyl]phenol Chemical compound OC1=CC=CC=C1CCC(C=1C(=CC=CC=1)O)C1=CC=CC=C1O CQOZJDNCADWEKH-UHFFFAOYSA-N 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 238000004220 aggregation Methods 0.000 description 2
- 230000002776 aggregation Effects 0.000 description 2
- 125000003277 amino group Chemical group 0.000 description 2
- 238000002485 combustion reaction Methods 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 239000000178 monomer Substances 0.000 description 2
- 125000004430 oxygen atom Chemical group O* 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000010298 pulverizing process Methods 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical group C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 1
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 1
- 238000004438 BET method Methods 0.000 description 1
- 229930185605 Bisphenol Natural products 0.000 description 1
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- 229920000106 Liquid crystal polymer Polymers 0.000 description 1
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 1
- PEEHTFAAVSWFBL-UHFFFAOYSA-N Maleimide Chemical compound O=C1NC(=O)C=C1 PEEHTFAAVSWFBL-UHFFFAOYSA-N 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000004962 Polyamide-imide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- PJANXHGTPQOBST-VAWYXSNFSA-N Stilbene Natural products C=1C=CC=CC=1/C=C/C1=CC=CC=C1 PJANXHGTPQOBST-VAWYXSNFSA-N 0.000 description 1
- 229920001807 Urea-formaldehyde Polymers 0.000 description 1
- TWSOFXCPBRATKD-UHFFFAOYSA-N [diphenyl-(triphenylsilylamino)silyl]benzene Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)N[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 TWSOFXCPBRATKD-UHFFFAOYSA-N 0.000 description 1
- 229920000800 acrylic rubber Polymers 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 229920003244 diene elastomer Polymers 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000010574 gas phase reaction Methods 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- 238000001139 pH measurement Methods 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 229920002492 poly(sulfone) Polymers 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920002312 polyamide-imide Polymers 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- PJANXHGTPQOBST-UHFFFAOYSA-N stilbene Chemical compound C=1C=CC=CC=1C=CC1=CC=CC=C1 PJANXHGTPQOBST-UHFFFAOYSA-N 0.000 description 1
- 235000021286 stilbenes Nutrition 0.000 description 1
- 239000006228 supernatant Substances 0.000 description 1
- 235000007586 terpenes Nutrition 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
- 229920006305 unsaturated polyester Polymers 0.000 description 1
Images
Landscapes
- Silicon Compounds (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Description
表面積1m2当たり0.1μmol以上10μmol以下の塩基当量となるように前記金属シリコン粉体の表面に接触させた塩基性物質とを有することにある。
前記塩基性金属シリコン粉体を分散する有機樹脂と、を有することにある。
・次に本発明の樹脂組成物について以下詳細に説明を行う。本実施形態の樹脂組成物は上述の塩基性金属シリコン粉体とその塩基性金属シリコン粉体を分散する有機樹脂とを有する。塩基性金属シリコン粉体を含有させる割合としては特に限定しないが、樹脂組成物が硬化した状態で塩基性金属シリコン粉体間で接触(点接触)する量を添加することが望ましい。つまり、塩基性金属シリコン粉体間で接触することにより、熱伝導性が向上できる。
体積平均粒径21.5μm、比表面積0.91m2/g(BET:N2)の金属シリコン粉体を用意した。この粉末は金属シリコンを粉砕することにより用意した。粉砕後、1日間放置して用いた。
Claims (7)
- 体積平均粒径が1μm〜30μmの金属シリコン粉体と、
表面積1m2当たり0.1μmol以上10μmol以下の塩基当量となるように前記金属シリコン粉体の表面に接触させた塩基性物質とを有し、
前記塩基性物質が、イミノ基をもつ化合物、シラザン類又はアンモニアであることを特徴とする塩基性金属シリコン粉体。 - 前記塩基性物質がヘキサメチルジシラザンである請求項1に記載の塩基性金属シリコン粉体。
- 全体の質量を基準として10質量%の量を純水中に懸濁させ、10分間撹拌した後に、固形物の質量を基準として90%以上が浮遊している請求項2に記載の塩基性金属シリコン粉体。
- 前記金属シリコン粉体は破砕により製造された請求項1〜3に記載の塩基性金属シリコン粉体。
- 粒径が45μm以上である粗粒を実質的に含まない請求項1〜4の何れか1項に記載の塩基性金属シリコン粉体。
- 体積平均粒径が1μm〜30μmの金属シリコン粉体に対し、表面積1m2当たり0.1μmol以上10μmol以下の塩基当量となるように前記金属シリコン粉体の表面に塩基性物質を接触させる表面処理工程を有し、
前記塩基性物質が、イミノ基をもつ化合物、シラザン類又はアンモニアであることを特徴とする塩基性金属シリコン粉体の製造方法。 - 請求項1〜5の何れか1項に記載の塩基性金属シリコン粉体と、
前記塩基性金属シリコン粉体を分散する有機樹脂と、を有することを特徴とする高熱伝導性樹脂組成物。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009105556A JP5483922B2 (ja) | 2009-04-23 | 2009-04-23 | 塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009105556A JP5483922B2 (ja) | 2009-04-23 | 2009-04-23 | 塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2010254511A JP2010254511A (ja) | 2010-11-11 |
JP5483922B2 true JP5483922B2 (ja) | 2014-05-07 |
Family
ID=43315897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009105556A Active JP5483922B2 (ja) | 2009-04-23 | 2009-04-23 | 塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5483922B2 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5907092B2 (ja) * | 2013-02-28 | 2016-04-20 | 信越化学工業株式会社 | 金属珪素粉末の製造方法 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04280813A (ja) * | 1991-03-07 | 1992-10-06 | Fuji Davison Chem Ltd | 親水性のコントロールされた球状シリカの製法 |
JPH11240709A (ja) * | 1998-02-27 | 1999-09-07 | Taiheiyo Cement Corp | 金属珪素粉末 |
JP2006100255A (ja) * | 2004-09-03 | 2006-04-13 | Shin Etsu Chem Co Ltd | 非水電解質二次電池負極材用金属珪素粉末及び非水電解質二次電池用負極材 |
JP5087764B2 (ja) * | 2005-12-22 | 2012-12-05 | 国立大学法人 香川大学 | シリコン微粒子とその製造方法およびそれらを用いた太陽電池とその製造方法 |
JP2007204522A (ja) * | 2006-01-31 | 2007-08-16 | Konica Minolta Holdings Inc | 複合樹脂シート及び画像表示装置用基板 |
-
2009
- 2009-04-23 JP JP2009105556A patent/JP5483922B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
JP2010254511A (ja) | 2010-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US9598558B2 (en) | Nanodiamond containing composite and a method for producing the same | |
US10125289B2 (en) | Composition for interlayer filler of layered semiconductor device, layered semiconductor device, and process for producing layered semiconductor device | |
KR20160117472A (ko) | 질화붕소 응집 입자, 질화붕소 응집 입자의 제조 방법, 그 질화붕소 응집 입자 함유 수지 조성물, 성형체, 및 시트 | |
KR20110100235A (ko) | 이미다졸 화합물 함유 마이크로캡슐화 조성물, 그것을 이용한 경화성 조성물 및 마스터배치형 경화제 | |
Kirchberg et al. | Nanocomposites based on technical polymers and sterically functionalized soft magnetic magnetite nanoparticles: synthesis, processing, and characterization | |
Kim et al. | Magnetic filler alignment of paramagnetic Fe3O4 coated SiC/epoxy composite for thermal conductivity improvement | |
JP7175586B2 (ja) | 窒化ホウ素粒子凝集体、その製造方法、組成物及び樹脂シート | |
Jiang et al. | Effects of particle size distribution of silica on properties of PTFE/SiO2 composites | |
JP4276423B2 (ja) | 塩基性シリカ粉体、その製造方法及び樹脂組成物 | |
JP5803348B2 (ja) | ポリマーナノコンポジット樹脂組成物 | |
Ma et al. | Preparation of modified hexagonal boron nitride by ball-milling and enhanced thermal conductivity of epoxy resin | |
TW202231574A (zh) | 疏水性氮化鋁粉末及其製造方法 | |
Mohd Hirmizi et al. | Electrical and Thermal Behavior of Copper‐Epoxy Nanocomposites Prepared via Aqueous to Organic Phase Transfer Technique | |
JP5483922B2 (ja) | 塩基性金属シリコン粉体及びその製造方法並びに高熱伝導性樹脂組成物 | |
KR102648718B1 (ko) | 고방열성 복합조성물 및 그 제조방법 | |
Soltani et al. | Effect of carbon black silanization on isothermal curing kinetics of epoxy nanocomposites | |
JP2005171206A (ja) | 樹脂配合用粉体混合物及び樹脂組成物 | |
Sipaut et al. | The effect of surface modification of silica nanoparticles on the morphological and mechanical properties of bismaleimide/diamine matrices | |
Dominguez et al. | Modification of Oligomeric Cyanate Ester Polymer Properties with Multi‐Walled Carbon Nanotube‐Containing Particles | |
Cruz‐Montoya et al. | Influence of nanoparticle surface chemistry on the thermomechanical and magnetic properties of ferromagnetic nanocomposites | |
JP7257384B2 (ja) | 有機無機複合粒子からなる粉末 | |
CN103664834A (zh) | 一种热降解的环氧树脂单体及其制备方法与底部填充料 | |
WO2014007782A2 (en) | A non-newtonian material with shock absorption property | |
Lenfeld | Magnetic bead cellulose | |
JP2021113270A (ja) | 樹脂組成物、樹脂組成物の製造方法、及び、これらに用いる無機粒子 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20120216 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20130423 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130507 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130620 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20131022 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20140213 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20140218 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 5483922 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |