JP5467730B2 - レーザ照射装置 - Google Patents

レーザ照射装置 Download PDF

Info

Publication number
JP5467730B2
JP5467730B2 JP2008075027A JP2008075027A JP5467730B2 JP 5467730 B2 JP5467730 B2 JP 5467730B2 JP 2008075027 A JP2008075027 A JP 2008075027A JP 2008075027 A JP2008075027 A JP 2008075027A JP 5467730 B2 JP5467730 B2 JP 5467730B2
Authority
JP
Japan
Prior art keywords
polarization
laser
polarization control
control unit
laser beam
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008075027A
Other languages
English (en)
Japanese (ja)
Other versions
JP2009231528A (ja
JP2009231528A5 (https=
Inventor
隆介 川上
紀仁 河口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Priority to JP2008075027A priority Critical patent/JP5467730B2/ja
Priority to US12/406,734 priority patent/US7864823B2/en
Publication of JP2009231528A publication Critical patent/JP2009231528A/ja
Publication of JP2009231528A5 publication Critical patent/JP2009231528A5/ja
Application granted granted Critical
Publication of JP5467730B2 publication Critical patent/JP5467730B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/0604—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams
    • B23K26/0608—Shaping the laser beam, e.g. by masks or multi-focusing by a combination of beams in the same heat affected zone [HAZ]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Recrystallisation Techniques (AREA)
  • Laser Beam Processing (AREA)
JP2008075027A 2008-03-24 2008-03-24 レーザ照射装置 Expired - Fee Related JP5467730B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2008075027A JP5467730B2 (ja) 2008-03-24 2008-03-24 レーザ照射装置
US12/406,734 US7864823B2 (en) 2008-03-24 2009-03-18 Laser irradiation apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008075027A JP5467730B2 (ja) 2008-03-24 2008-03-24 レーザ照射装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2014013119A Division JP2014123754A (ja) 2014-01-28 2014-01-28 半導体装置の作製方法

Publications (3)

Publication Number Publication Date
JP2009231528A JP2009231528A (ja) 2009-10-08
JP2009231528A5 JP2009231528A5 (https=) 2011-03-31
JP5467730B2 true JP5467730B2 (ja) 2014-04-09

Family

ID=41088878

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008075027A Expired - Fee Related JP5467730B2 (ja) 2008-03-24 2008-03-24 レーザ照射装置

Country Status (2)

Country Link
US (1) US7864823B2 (https=)
JP (1) JP5467730B2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8718103B2 (en) 2010-03-12 2014-05-06 Electronics And Telecommunications Research Institute Apparatus for adjusting polarization characteristics, and ultra-short ultra-high intensity pulse laser generator comprising same
CN104078339B (zh) * 2013-03-26 2017-08-29 上海微电子装备有限公司 一种激光退火装置和方法
CN104576336A (zh) * 2013-10-17 2015-04-29 上海华虹宏力半导体制造有限公司 激光退火设备及利用该设备改善硅片表面粗糙度的方法
US10247952B2 (en) * 2015-03-04 2019-04-02 Coherent Lasersystems Gmbh & Co. Kg Polarization-controlled laser line-projector
KR102679073B1 (ko) * 2018-09-11 2024-07-02 삼성디스플레이 주식회사 레이저 박리 장치 및 표시 장치의 제조 방법
WO2021023792A1 (en) * 2019-08-07 2021-02-11 Asml Holding N.V. Laser module assembly for alignment system, metrology system, and lithographic apparatus
JP7583571B2 (ja) * 2020-10-15 2024-11-14 Ｊｓｗアクティナシステム株式会社 レーザ照射装置、レーザ照射方法、及び半導体装置の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW523791B (en) * 2000-09-01 2003-03-11 Semiconductor Energy Lab Method of processing beam, laser irradiation apparatus, and method of manufacturing semiconductor device
JP2003287706A (ja) * 2002-03-28 2003-10-10 Mitsubishi Electric Corp レーザビーム均一照射光学系
JP3947065B2 (ja) * 2002-08-30 2007-07-18 住友重機械工業株式会社 均一化レーザビーム照射装置
JP2004200497A (ja) * 2002-12-19 2004-07-15 Sony Corp 光照射装置及びレーザアニール装置
JP2006253571A (ja) * 2005-03-14 2006-09-21 Ishikawajima Harima Heavy Ind Co Ltd レーザ照射装置及び方法、並びにレーザアニール装置及び方法
JP2007080894A (ja) * 2005-09-12 2007-03-29 Mitsubishi Electric Corp レーザ結晶化方法
JP2007110064A (ja) 2005-09-14 2007-04-26 Ishikawajima Harima Heavy Ind Co Ltd レーザアニール方法及び装置

Also Published As

Publication number Publication date
JP2009231528A (ja) 2009-10-08
US7864823B2 (en) 2011-01-04
US20090238223A1 (en) 2009-09-24

Similar Documents

Publication Publication Date Title
JP5467730B2 (ja) レーザ照射装置
US8629522B2 (en) Laser annealing method and device
TWI580507B (zh) Laser processing device and laser processing method
JP6587115B1 (ja) レーザー加工装置及びレーザー加工方法
JP7034621B2 (ja) レーザ加工装置
KR102382862B1 (ko) 레이저광 조사 장치
JP6867762B2 (ja) 発散角調整装置及び発散角調整方法
JP7023629B2 (ja) レーザー加工装置
JP2018507437A (ja) 放射源
JP4640029B2 (ja) 波長変換光学系、レーザ光源、露光装置、被検物検査装置、及び高分子結晶の加工装置
CN107924827A (zh) 用于非晶硅衬底的均匀结晶的基于光纤激光器的系统
JP6391764B2 (ja) レーザ照射装置
JP2014123754A (ja) 半導体装置の作製方法
JP5106130B2 (ja) レーザビーム照射方法およびレーザビーム照射装置
JP2016076721A (ja) レーザ照射装置
US20240120194A1 (en) Wafer processing system
US9954339B2 (en) Laser unit and extreme ultraviolet light generating system
KR20220007139A (ko) 반도체 재료를 처리하기 위한 방법 및 광학 시스템(mehtod and optical system for processing a semiconductor material)
KR102933257B1 (ko) 레이저 조사 장치와 그에 사용되는 편광 제어 모듈 및 방법
WO2012046541A1 (ja) 露光装置
US12566144B2 (en) Semiconductor inspection apparatus
JP5147220B2 (ja) 多結晶半導体膜の作製方法
JP7706060B2 (ja) レーザ加工装置
JP2006100567A (ja) レーザ照射方法及びレーザ照射装置並びにレーザアニール方法
JP2020126244A (ja) 光変調装置及び光変調方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20110215

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20110215

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130415

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130423

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130612

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20140107

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20140128

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5467730

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees