JP5461431B2 - 回路基板を試験する並列テスター用モジュール - Google Patents
回路基板を試験する並列テスター用モジュール Download PDFInfo
- Publication number
- JP5461431B2 JP5461431B2 JP2010543471A JP2010543471A JP5461431B2 JP 5461431 B2 JP5461431 B2 JP 5461431B2 JP 2010543471 A JP2010543471 A JP 2010543471A JP 2010543471 A JP2010543471 A JP 2010543471A JP 5461431 B2 JP5461431 B2 JP 5461431B2
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- module
- contact
- contacts
- grid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
- G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
- G01R31/2808—Holding, conveying or contacting devices, e.g. test adapters, edge connectors, extender boards
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Tests Of Electronic Circuits (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Description
2 モジュール要素
3 回路基板
4 側端
5 平坦面
6 接触領域
7 導体路
8 中間領域
9 接触ピン
10 部材
11 部材
12 接触ピン9又は接点の端面
13 条片
14 電子部材
15 コンポーネント
16 孔あき格子基板
17 多極コネクタ
18 端面
19 金属支持プレート
20 タブ
Claims (8)
- 複数のモジュール要素(2)を備える回路基板を試験する並列テスター用モジュールであって、
各モジュール要素(2)は、
第1平坦面(5/1)と第2平坦面(5/2)とを表裏に有し、導体路(7)を備える回路基板(3)と、
前記回路基板(3)の側端(4)の領域において、前記第1平坦面(5/1)上に等間隔に形成される第1接触領域(6/1)と、
前記回路基板(3)の側端(4)の領域において、前記第2平坦面(5/2)上に等間隔に形成され、前記第1接触領域(6/1)と交互に配置される第2接触領域(6/2)と、
前記第1接触領域(6/1)上および前記第2接触領域(6/2)上に配列され、前記導体路(7)と接続される接触ピン(9)と、を含み、
前記接触ピン(9)は、前記側端(4)に対して直角であり、かつ、少なくとも前記側端(4)まで延びていることを特徴とする並列テスター用モジュール。 - 前記接触ピン(9)は、前記側端(4)の近傍で突出することを特徴とする請求項1に記載のモジュール。
- 前記接触ピン(9)は円筒形状であり、
前記回路基板(3)から突出している部材(11)は、前記回路基板の上に位置する部材(10)よりも大きな直径を有することを特徴とする請求項2に記載のモジュール。 - 前記第1平坦面(5/1)と前記第2平坦面(5/2)に設けられる前記接触ピン(9)は、互い違いに配置されていることを特徴とする請求項1乃至3のいずれかに記載のモジュール。
- 前記回路基板(3)は、細長い条片(13)と前記条片と一体になった電子部材(14)を備え、
前記電子部材(14)は、前記条片(13)の長さ方向において一部分のみに延び、前記導体路(7)を介して接触ピン(9)に接続される電子コンポーネント(15)を含む請求項1乃至4のいずれかに記載のモジュール。 - 前記モジュール要素(2)は、前記電子部材(14)が間隔を空けて互いに隣り合うように配置されることを特徴とする請求項5に記載のモジュール。
- 前記回路基板は、4層の回路基板を含むことを特徴とする請求項1乃至6のいずれかに記載のモジュール。
- 前記接触ピン(9)は前記導体路(7)によって、互いに電気的に接続されていることを特徴とする請求項1乃至7のいずれかに記載のモジュール。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102008006130.1 | 2008-01-25 | ||
DE102008006130A DE102008006130A1 (de) | 2008-01-25 | 2008-01-25 | Modul für einen Paralleltester zum Prüfen von Leiterplatten |
PCT/EP2009/050561 WO2009092694A1 (de) | 2008-01-25 | 2009-01-19 | Modul für einen paralleltester zum prüfen von leiterplatten |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011510314A JP2011510314A (ja) | 2011-03-31 |
JP5461431B2 true JP5461431B2 (ja) | 2014-04-02 |
Family
ID=40677551
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010543471A Expired - Fee Related JP5461431B2 (ja) | 2008-01-25 | 2009-01-19 | 回路基板を試験する並列テスター用モジュール |
Country Status (9)
Country | Link |
---|---|
US (1) | US7982481B2 (ja) |
EP (1) | EP2238461B1 (ja) |
JP (1) | JP5461431B2 (ja) |
KR (1) | KR101207957B1 (ja) |
CN (1) | CN101925824B (ja) |
DE (1) | DE102008006130A1 (ja) |
HK (1) | HK1152990A1 (ja) |
TW (1) | TWI421520B (ja) |
WO (1) | WO2009092694A1 (ja) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102046294B1 (ko) * | 2012-09-11 | 2019-11-20 | 엘지디스플레이 주식회사 | 엘이디모듈 및 그 제조방법과 엘이디모듈을 포함하는 액정표시장치 |
CN104442010B (zh) * | 2014-12-01 | 2016-06-22 | 珠海艾派克微电子有限公司 | 修复芯片、墨盒、打印机及修复芯片连接稳定性检测方法 |
EP3377875A4 (en) | 2015-11-20 | 2019-07-31 | EMD Millipore Corporation | IMPROVED STABILITY FILTER INTEGRITY TEST |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3564408A (en) | 1968-08-12 | 1971-02-16 | Bendix Corp | Test device for an electrical circuit card |
DE3013215A1 (de) | 1980-04-03 | 1981-10-15 | Luther & Maelzer Gmbh, 3050 Wunstorf | Adapter fuer ein selbstprogrammierbares leiterplattenpruefgeraet |
US4465972A (en) * | 1982-04-05 | 1984-08-14 | Allied Corporation | Connection arrangement for printed circuit board testing apparatus |
DE3240916C2 (de) | 1982-11-05 | 1985-10-31 | Luther, Erich, Ing.(Grad.), 3003 Ronnenberg | Vorrichtung zum Prüfen von elektrischen Leiterplatten |
DE3340180C1 (de) | 1983-11-07 | 1985-05-15 | MANIA Elektronik Automatisation Entwicklung und Gerätebau GmbH | Kontaktfeldanordnung fuer ein rechnergesteuertes Leiterplattenpruefgeraet |
DE3630548A1 (de) * | 1986-09-08 | 1988-03-10 | Mania Gmbh | Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster |
DE8806064U1 (de) | 1988-05-06 | 1989-09-07 | atg electronic GmbH, 6980 Wertheim | Testgerät |
US4939454A (en) * | 1988-07-26 | 1990-07-03 | Hewlett-Packard Company | Connector system for printed circuit board test facility |
US5485096A (en) * | 1994-04-05 | 1996-01-16 | Aksu; Allen | Printed circuit board tester having a test bed with spring probes and easily replaceable switch cards |
US6154863A (en) | 1996-10-28 | 2000-11-28 | Atg Test Systems Gmbh | Apparatus and method for testing non-componented printed circuit boards |
DE19718637A1 (de) | 1997-05-02 | 1998-11-05 | Atg Test Systems Gmbh | Vorrichtung und Verfahren zum Prüfen von Leiterplatten |
WO1999042850A1 (de) | 1998-02-18 | 1999-08-26 | Luther & Maelzer Gmbh | Verfahren und vorrichtung zum prüfen von gedruckten leiterplatten |
DE19943388B4 (de) | 1999-09-10 | 2010-04-08 | Atg Luther & Maelzer Gmbh | Vorrichtung zum Prüfen von Leiterplatten |
DE10043728C2 (de) * | 2000-09-05 | 2003-12-04 | Atg Test Systems Gmbh | Verfahren zum Prüfen von Leiterplatten und Verwendung einer Vorrichtung zum Ausführen des Verfahrens |
DE10049301A1 (de) * | 2000-10-04 | 2002-05-02 | Atg Test Systems Gmbh | Modul für eine Prüfvorrichtung zum Testen von Leiterplatten |
JP4496456B2 (ja) * | 2001-09-03 | 2010-07-07 | 軍生 木本 | プローバ装置 |
US7498826B2 (en) * | 2006-08-25 | 2009-03-03 | Interconnect Devices, Inc. | Probe array wafer |
DE102006059429A1 (de) | 2006-12-15 | 2008-06-26 | Atg Luther & Maelzer Gmbh | Modul für eine Prüfvorrichtung zum Testen von Leiterplatten |
DE102007047269A1 (de) | 2007-10-02 | 2009-04-09 | Atg Luther & Maelzer Gmbh | Vollrasterkassette für einen Paralleltester zum Testen einer unbestückten Leiterplatte, Federkontaktstift für eine solche Vollrasterkassette sowie Adapter für einen Paralleltester zum Testen einer unbestückten Leiterplatte |
-
2008
- 2008-01-25 DE DE102008006130A patent/DE102008006130A1/de not_active Withdrawn
-
2009
- 2009-01-19 EP EP09704390A patent/EP2238461B1/de not_active Not-in-force
- 2009-01-19 KR KR1020107018652A patent/KR101207957B1/ko active IP Right Grant
- 2009-01-19 WO PCT/EP2009/050561 patent/WO2009092694A1/de active Application Filing
- 2009-01-19 JP JP2010543471A patent/JP5461431B2/ja not_active Expired - Fee Related
- 2009-01-19 CN CN200980102922.0A patent/CN101925824B/zh not_active Expired - Fee Related
- 2009-01-19 US US12/863,739 patent/US7982481B2/en not_active Expired - Fee Related
- 2009-01-21 TW TW098102317A patent/TWI421520B/zh not_active IP Right Cessation
-
2011
- 2011-06-14 HK HK11106078.9A patent/HK1152990A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE102008006130A8 (de) | 2009-12-03 |
WO2009092694A1 (de) | 2009-07-30 |
CN101925824A (zh) | 2010-12-22 |
CN101925824B (zh) | 2013-05-15 |
TW201000926A (en) | 2010-01-01 |
KR101207957B1 (ko) | 2012-12-04 |
HK1152990A1 (en) | 2012-03-16 |
JP2011510314A (ja) | 2011-03-31 |
US20100327895A1 (en) | 2010-12-30 |
EP2238461B1 (de) | 2012-07-04 |
US7982481B2 (en) | 2011-07-19 |
KR20100120667A (ko) | 2010-11-16 |
TWI421520B (zh) | 2014-01-01 |
EP2238461A1 (de) | 2010-10-13 |
DE102008006130A1 (de) | 2009-07-30 |
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