JP5459567B2 - Electronic components - Google Patents

Description

  The present invention relates to an electronic component, and more particularly to an electronic component having external electrodes on the back surface and side surfaces.

  Conventionally, various electronic components having external electrodes on the back and side surfaces have been provided. For example, the external electrodes 66 to 69 of the electronic component 51 shown in the perspective view of FIG. 7 are formed on the back surface (not shown) of the multilayer body 70, the front surface, and the side surfaces between the front surface and the back surface. Are connected at the corners (see, for example, Patent Document 1).

JP 2000-323901 A

  Along with the miniaturization of electronic components, the area of the external electrode becomes smaller and the film thickness tends to become thinner. When the area of the external electrode is reduced, the adhesion with the electronic component main body is deteriorated and the external electrode is easily peeled off. Therefore, by arranging the external electrode so as to cover the back surface to the side surface, the adhesion area is increased by increasing the adhesion area between the external electrode and the electronic component main body. However, in this case, since the external electrode tends to be particularly thin at the corners on the back and side surfaces of the external electrode, the corners, in particular, the end portions of the corners, are easily peeled off and easily broken.

  Further, with the miniaturization, the gap (gap) between adjacent external electrodes tends to be reduced. In an electronic component such as an LC filter, it is desirable to reduce a gap between adjacent external electrodes in order to improve electromagnetic shielding properties.

  However, if the gap between adjacent external electrodes is reduced, a solder bridge that connects the solders of adjacent external electrodes is likely to occur when electronic components are mounted using solder.

  In view of such circumstances, the present invention intends to provide an electronic component capable of suppressing destruction of external electrodes and solder bridges.

  In order to solve the above problems, the present invention provides an electronic component configured as follows.

The electronic component is (a) a rectangular parallelepiped body in which four rectangular side surfaces extend between a rectangular front surface and a back surface facing each other, and (b) the main body is continuously formed from the back surface to the side surface. A plurality of external electrodes; (c) a first gap between the external electrodes adjacent to each other on the back surface and the side surface of the main body; and a first gap between the back surface and the side surface of the main body. And an insulating layer including a first portion formed to cover the first end of the external electrode along the outer peripheral edge of the external electrode. The external electrode is exposed to the outside from the first end of the portion formed on the side surface of the main body. In the side surface of the main body, the insulating layer protrudes outward in the normal direction of the side surface from the external electrode. On the back surface of the main body, the insulating layer and the external electrode are formed flush with each other.

  According to the above configuration, since the first end portion of the external electrode is covered with the first portion of the insulating layer, it is difficult for the external electrode to peel off from the back surface and the side surface of the main body. Furthermore, since the first portion of the insulating layer covers the first end portions at the corners of the back surface and the side surface of the external electrode, the external electrode is applied to the corner portion and the external electrode is peeled off from the corner portion. Can be suppressed. Thereby, destruction of an external electrode can be suppressed.

Moreover, since the 1st edge part is covered with the 1st part of an insulating layer, the space | interval of the part exposed outside can be extended, and a solder bridge can be suppressed. Since the insulating layer protrudes from the external electrode on the side surface of the electronic component, the external electrodes on the side surfaces of the adjacent electronic components are in contact with each other even if the distance between the adjacent electronic components is reduced when the electronic component is mounted The risk of short circuiting is reduced. Since the insulating layer and the external electrode are formed flush with each other on the back surface of the electronic component, the bonding strength at the time of mounting on the external electrode can be increased.

  Preferably, the at least two external electrodes are formed continuously from the side surface of the main body to the surface. The insulating layer includes a second gap between the external electrodes adjacent to each other on the surface of the main body, and the external portion along the outer peripheral edge of the external electrode adjacent to the second gap on the surface of the main body. A second portion formed to cover the second end of the electrode; The external electrode is exposed to the outside from the second end of the portion formed on the surface of the main body.

  In this case, at least two external electrodes are also formed from the side surface to the surface of the main body, and the insulating layer is also formed on the surface of the main body so as to cover the end portions of the adjacent external electrodes. As a result, the external electrode is difficult to peel off on the surface of the main body in addition to the back and side surfaces of the main body. Furthermore, destruction of the external electrode can be suppressed also at the corners of the side surface and the surface.

  Moreover, by forming the external electrode up to the surface of the main body, it is possible to block electromagnetic waves and improve electromagnetic shielding properties, or to further increase the adhesion strength of the external electrode to the main body.

  Preferably, the insulating layer includes a third portion formed continuously on the four side surfaces of the main body so as to make a round around the side surface with a space between the insulating layer and the back surface.

  In this case, an unnecessary wetting of the solder can be suppressed when the electronic component is mounted by the third portion of the insulating layer that goes around the side surface.

  According to the present invention, destruction of the external electrode and solder bridge can be suppressed. Since the gap between the adjacent external electrodes can be reduced, the electronic component can be easily downsized and the electromagnetic shielding property can be improved.

It is a perspective view of an electronic component. Example 1 It is principal part sectional drawing of an electronic component. Example 1 It is a perspective view of an electronic component. (Example 2) It is a perspective view of an electronic component. (Example 3) It is a perspective view of an electronic component. Example 4 It is a perspective view of an electronic component. (Example 5) It is a perspective view of an electronic component. (Conventional example)

  Embodiments of the present invention will be described below with reference to FIGS.

  <Example 1> The electronic component 10 of Example 1 is demonstrated referring FIG.1 and FIG.2.

  FIGS. 1A and 1B are perspective views showing the appearance of the electronic component 10. Fig.2 (a) is principal part sectional drawing cut | disconnected along line AA of Fig.1 (a). FIG. 2B is a cross-sectional view of the main part taken along the line BB in FIG.

  As shown in FIGS. 1A and 1B, the electronic component 10 is formed in a rectangular parallelepiped body 18 in which four rectangular side surfaces 13 to 16 extend between a rectangular front surface 11 and a back surface 12 facing each other. External electrodes 21 to 29 and an insulating layer 40 are formed.

  As the main body 18, for example, a multilayer ceramic substrate formed by laminating a plurality of ceramic layers and wiring layers can be used. As the wiring layer, capacitor electrodes, coil electrodes, and other wiring patterns are formed.

  The external electrodes 21 to 28 are formed independently of each other, and are continuously formed on the back surface 12 and the side surfaces 13 to 16, respectively. The external electrodes 21 to 28 are connected to a wiring layer formed inside the main body.

  That is, the external electrode 21 is continuously formed so that the portions formed on the back surface 12 and the side surfaces 13 and 16 are connected to each other. The external electrode 22 is continuously formed so that the portions formed on the back surface 12 and the side surface 13 are connected to each other. The external electrode 23 is continuously formed so that the portions formed on the back surface 12 and the side surfaces 13 and 14 are connected to each other. The external electrode 24 is continuously formed so that the portions formed on the back surface 12 and the side surface 14 are connected to each other. The external electrode 25 is continuously formed so that the portions formed on the back surface 12 and the side surfaces 14 and 15 are connected to each other. The external electrode 26 is continuously formed so that the portions formed on the back surface 12 and the side surface 15 are connected to each other. The external electrode 27 is formed continuously so that the portions formed on the back surface 12 and the side surfaces 15 and 16 are connected to each other. The external electrode 28 is continuously formed so that the portions formed on the back surface 12 and the side surface 16 are connected to each other.

  The external electrode 29 is formed at the center of the back surface 12.

  The insulating layer 40 includes a portion 42 formed on the back surface 12, a portion 44 formed on the back surface 12 side of the side surfaces 13 to 16, a portion 46 formed on the surface 11 side of the side surfaces 13 to 16, and the surface 11. Each part 42, 44, 46, 48 is continuously formed and connected. The portions 42, 44, 46, and 48 may be separated from each other.

  Of the insulating layer 40, the portion 44 formed on the back surface 12 side of the side surfaces 13 to 16 is the first portion of the insulating layer according to the present invention, and the side surfaces 13 to 16 are arranged between the adjacent external electrodes 21 to 28. The gap 1 and the ends of the external electrodes 21 to 28 that are adjacent to the gap 1 and extend along the outer periphery of the external electrodes 21 to 28 are formed. In the external electrodes 21 to 28, the inner part of the end part is exposed to the outside.

  Of the insulating layer 40, the portion 46 formed on the side of the surface 11 of the side surfaces 13 to 16 is the third portion of the insulating layer of the present invention, and is spaced from the back surface 12 to form the side surfaces 13 to 16. It is continuously formed so as to go around the circumference. This portion 46 can suppress unnecessary solder wetting. That is, when the electronic component 10 is mounted on the mounting substrate so that the back surface 12 of the electronic component 10 faces the mounting substrate (not shown), the solder attached to the external electrodes 21 to 28 on the side surfaces 13 to 16 is the front surface 11. Stop spreading to the side.

  As shown in FIG. 2A, the external electrodes 21 to 28 and the insulating layer 40 on the side surfaces 13 to 16 are so projected that the insulating layer 40 protrudes outside the external electrodes 21 to 28 in the normal direction of the side surfaces 13 to 16. It is preferable to form. For example, the insulating layer 40 is formed on the external electrodes 21 to 28 formed on the side surfaces 13 to 16 by, for example, dipping. In this case, when the electronic component 10 is mounted on the mounting substrate so that the back surface 12 of the electronic component 10 faces the mounting substrate (not shown), it is adjacent even if the distance between the adjacent electronic components 10 is reduced. The risk that the external electrodes 21 to 28 on the side surfaces 13 to 16 of the electronic component 10 are in contact with each other and short-circuited is reduced. The insulating layer 40 may be formed substantially flush with the external electrodes 21 to 28.

  In the insulating layer 40, the portion 42 formed on the back surface 12 is also a first portion of the present invention, and the external electrodes 21 to 28 adjacent to each other are formed similarly to the portion 44 formed on the back surface 12 side of the side surfaces 13 to 16. And the end portions of the external electrodes 21 to 28 that are adjacent to the gap and that extend along the outer peripheral edge of the external electrodes 21 to 28.

  The insulating layer 40 is connected to the portion 44 formed on the back surface of the side surfaces 13 to 16 at least at the corners between the side surfaces 13 to 16 and the back surface 12 of the main body 18 in the portion 42 formed on the back surface 12. The external electrode 29 formed independently only on the back surface may have a portion where the insulating layer 40 is not formed.

  Of the external electrodes 21 to 29 on the back surface 12 and the insulating layer 40, the portion 42 formed on the back surface 12 is made of, for example, another ceramic green sheet on the ceramic green sheet on which the external electrodes 21 to 29 and the insulating layer 40 are formed. It is formed by laminating and firing the sheets. In this case, since the laminated ceramic green sheets are pressed and pressure-bonded, as shown in FIG. 2B, the external electrodes 21 to 29 on the back surface 12 and the portion 42 formed on the back surface 12 of the insulating layer 42 are It becomes almost the same. This formation is preferable because it can increase the bonding strength of the external electrodes 21 to 29 during mounting, but the portion 42 formed on the back surface 12 of the insulating layer 40 is more on the back surface 12 than the external electrodes 21 to 29. It may be formed so as to protrude outward in the normal direction.

  Of the insulating layer 40, the portion 48 formed on the surface 11 covers the surface 11 so that the central portions of the connection electrodes 31 to 36 for mounting other electronic components on the electronic component 10 are exposed.

  In the external electrodes 21 to 28, the end portions of the portions formed on the back surface 12 are covered with the portions 42 formed on the back surface 12 of the insulating layer 40, and the end portions of the portions formed on the side surfaces 13 to 16 are formed. Since the insulating layer 40 is covered with the portion 44 formed on the back surface 12 side of the side surfaces 13 to 16, it is difficult to peel off from the back surface 12 and the side surfaces 13 to 16 of the main body 18. Further, the end portions of the corners of the external electrodes 21 to 28 at the corners of the back surface 12 and the side surfaces 13 to 16 of the main body 18 are the portions 42 formed on the back surface 12 of the insulating layer 40 and the back surfaces 12 of the side surfaces 13 to 16. By covering with the portion 44 formed on the side, peeling or destruction of the external electrodes 21 to 28 starting from the end portions of the corners can be suppressed.

  Moreover, since the external electrodes 21 to 28 are covered with the portions 44 formed on the back surface 12 side of the side surfaces 13 to 16 of the insulating layer 40, the end portions of the portions formed on the side surfaces 13 to 16 are covered with the external electrodes 21. The width | variety of the part exposed to the outside in the side surface among -28 can be expanded, and a solder bridge can be suppressed.

  The electronic component 10 is a multilayer component such as a multilayer capacitor, a multilayer coil, or an LC filter, and can be manufactured in substantially the same process as the multilayer component.

  For example, after firing a laminated body in which ceramic green sheets having wiring patterns such as through conductors (via conductors) and in-plane conductors are laminated and press-bonded, the fired laminated body is divided into pieces, and external electrodes and An insulating layer is formed. The main body of the electronic component is not limited to ceramic, but may be one generally used as an insulating layer or dielectric layer of an electronic component such as resin or glass.

  The external electrode on the side surface may be formed by printing and applying a paste-like conductive material, or may be formed by a thin film such as sputtering, or may be formed by a method such as inkjet or dipping. Is not limited.

  The external electrode can be easily formed by forming the front and back surfaces by printing and forming the side surfaces by dipping.

  For the external electrode on the side surface, a through hole is provided in advance on the boundary line of the part to be a piece on a green sheet including a plurality of pieces, and a conductive paste is filled in the through hole. Alternatively, after the green sheets are laminated, the conductive paste filled may be divided and exposed so as to be divided.

  The external electrode may be formed on the ceramic green sheet before lamination, after the ceramic green sheet is laminated, or after the ceramic green sheet laminate is divided into individual pieces, either before or after firing. You may form at the timing of.

  The insulating layer may be formed anytime after the external electrode is formed. As with the external electrode, the insulating layer may be formed by printing and applying a paste-like insulating material, or may be formed by a thin film such as sputtering, or may be formed by a method such as inkjet or dipping, In particular, the forming method is not limited.

  Example 2 An electronic component 10a of Example 2 will be described with reference to FIG.

  3A and 3B are perspective views showing the appearance of the electronic component 10a. As shown in FIGS. 3A and 3B, the electronic component 10a according to the second embodiment is configured in substantially the same manner as the first embodiment, and includes external electrodes 21a to 26a, an insulating layer 40a, and connection electrodes 31 to 36. And are formed.

  Of the insulating layer 40a, the portion 42a formed on the back surface 12 and the portion 44a formed on the back surface 12 side of the side surfaces 13 to 16 are adjacent external electrodes 21a to 26a on the back surface 12 and the side surfaces 13 to 16. It is formed so as to cover the gap between them and the ends of the external electrodes 21a to 26a that are adjacent to the gap and are along the outer peripheral edge of the external electrodes 21a to 26a. In the external electrodes 21a to 26a, portions inside the end portions are exposed to the outside.

  Of the insulating layer 40a, the portion 44a formed on the back surface 12 side of the side surfaces 13 to 16 is the first portion of the insulating layer of the present invention.

  Of the insulating layer 40a, a portion 46a formed on the side of the surface 11 of the side surfaces 13 to 16 is a third portion of the insulating layer of the present invention, and is formed so as to go around the side surfaces 13 to 16. This portion 46a can suppress unnecessary solder wetting.

  Of the insulating layer 40a, the portion 48 formed on the surface 11 covers the surface 11 so that the central portions of the connection electrodes 31 to 36 are exposed.

  In the electronic component 10a, since the end portions of the external electrodes 21a to 26a are covered with the insulating layer 40a, the external electrodes 21a to 26a are hardly peeled off from the main body, and start from the end portions of the corner portions of the external electrodes 21a to 26a. It is possible to suppress peeling and destruction of the external electrodes 21a to 26a. Also, solder bridges can be suppressed.

  <Example 3> The electronic component 10b of Example 3 is demonstrated referring FIG.

  FIG. 4A is a perspective view showing an appearance of the electronic component 10b. FIG. 4B is a perspective view showing a state where the insulating layer 40b is removed from the electronic component 10b. As shown in FIGS. 4A and 4B, in the electronic component 10b of the third embodiment, the external electrodes 21b to 26b and the insulating layer 40b are formed in substantially half of the back surface 12 side, as in the second embodiment. Has been.

  That is, the insulating layer 40b is formed on the back surface 12 and the side surfaces 13 to 16 with the gaps 2 and 4 between the external electrodes 21b to 26b adjacent to each other, and along the outer peripheral edge of the external electrodes 21b to 26b adjacent to the gaps 2 and 4. It includes portions 42b and 44b (first portions of the insulating layer of the present invention) formed so as to cover the end portions of the external electrodes 21b to 26b. In the external electrodes 21b to 26b, portions inside the end portions are exposed to the outside. The insulating layer 40b includes a portion 46b (a first portion of the insulating layer of the present invention) formed so as to go around the side surfaces 13 to 16 at the center of the side surfaces 13 to 16.

  Unlike the second embodiment, the electronic component 10b is formed so that one external electrode 22b covers approximately half of the main body 18 on the surface 11 side. A substantially half portion of the main body 18 on the surface 11 side is covered with the external electrode 22b without a gap, so that the electromagnetic shielding can be improved by blocking electromagnetic waves. Moreover, since the external electrode 22b is formed so as to go around the side surfaces 13 to 16, the adhesion strength to the main body can be further increased.

  In the electronic component 10b, since the end portions of the external electrodes 21b to 26b are covered with the insulating layer 40b, the external electrodes 21b to 26b are hardly peeled off from the main body, and start from the end portions of the corner portions of the external electrodes 21b to 26b. The external electrodes 21b to 26b can be prevented from peeling or breaking. Also, solder bridges can be suppressed.

  <Example 4> The electronic component 10c of Example 4 is demonstrated referring FIG.

  FIG. 5A is a perspective view showing an appearance of the electronic component 10c. FIG. 5B is a perspective view showing a state in which the insulating layer 40c is removed from the electronic component 10c. 5 (a) and 5 (b), the back surface 12 and the side surfaces 13 and 14 are visible, but the back surface 11 and the side surfaces 15 and 16 are also configured in the same manner as in FIGS. 5 (a) and 5 (b).

  That is, in the external electrode 21c, the portions formed on the front surface 11, the back surface 12, and the side surfaces 13 and 16 are connected to each other. In the external electrode 22c, portions formed on the front surface 11, the back surface 12, and the side surface 13 are connected to each other. In the external electrode 23c, the portions formed on the front surface 11, the back surface 12, and the side surfaces 13 and 14 are connected to each other. In the external electrode 24c, portions formed on the front surface 11, the back surface 12, and the side surfaces 14 and 15 are connected to each other. In the external electrode 25c, the portions formed on the front surface 11, the back surface 12, and the side surface 15 are connected to each other. In the external electrode 26c, the portions formed on the front surface 11, the back surface 12, and the side surfaces 15 and 16 are connected to each other.

  The insulating layer 40c includes gaps 1c to 3c that circulate around the main body 18 between the adjacent external electrodes 21c to 26c, and external electrodes 21c to 26c that are adjacent to the gaps 1c to 3c and extend along the outer periphery of the external electrodes 21c to 26c. It is formed so as to cover the end. That is, the insulating layer 40c includes band-shaped portions 41c to 43c formed so as to go around the main body 18 along the gaps 1c to 3c. The external electrodes 21c to 26c are exposed to the outside at their inner portions than the ends.

  Among the insulating layer 40c, the gaps 1c to 3c between the external electrodes 21c to 26c adjacent to each other on the side surfaces 13 to 16, and the external electrodes 21c to 26c adjacent to the gaps 1c to 3c and along the outer peripheral edge of the external electrodes 21c to 26c. The portion covering the end portion of the insulating layer is the first portion of the insulating layer of the present invention.

  In the insulating layer 40c, the gaps 1c to 3c between the external electrodes 21c to 26c adjacent to each other on the surface 11 and the ends of the external electrodes 21c to 26c adjacent to the gaps 1c to 3c and along the outer peripheral edges of the external electrodes 21c to 26c. The portion covering the portion is the second portion of the insulating layer of the present invention.

  The external electrodes 21c to 26c are also formed from the side surfaces 13 to 16 of the main body 18 to the surface 11, and the insulating layer 40c is formed from the side surfaces 13 to 16 so as to cover the ends of the adjacent external electrodes 21c to 26c. 11 is formed. Therefore, the external electrodes 21c to 26c are difficult to peel off on the surface 11 in addition to the side surfaces 13 to 16, and the destruction of the external electrodes 21c to 26c can be suppressed also at the side surfaces 13 to 16 and the corners of the surface 11.

  Moreover, by forming the external electrodes 21c to 26c up to the surface 11 of the main body 18, the electromagnetic shielding property can be improved by blocking the electromagnetic waves, or the adhesion strength of the external electrodes 21c to 26c to the main body 18 can be further increased. it can.

  In the electronic component 10c, since the end portions of the external electrodes 21c to 26c are covered with the insulating layer 40c, the external electrodes 21c to 26c are hardly peeled off from the main body, and start from the end portions of the corner portions of the external electrodes 21c to 26c. It is possible to suppress peeling and destruction of the external electrodes 21c to 26c. Moreover, solder bridge can be suppressed.

  <Example 5> An electronic component 10d of Example 5 will be described with reference to FIG.

  FIG. 6A is a perspective view showing the appearance of the electronic component 10d. FIG. 6B is a perspective view showing a state in which the insulating layer 40d is removed from the electronic component 10d. 6 (a) and 6 (b), the back surface 12 and the side surfaces 13 and 14 are visible, but the back surface 11 and the side surfaces 15 and 16 are also configured in the same manner as in FIGS. 6 (a) and 6 (b).

  The electronic component 10d includes two external electrodes 21d and 22d and an insulating layer 40d.

  In the external electrode 21d, portions formed on the front surface 11, the rear surface 12, and the side surfaces 13, 15, 16 are connected to each other. In the external electrode 22d, portions formed on the front surface 11, the back surface 12, and the side surfaces 13, 14, and 15 are connected to each other.

  The insulating layer 40d includes a gap 1d that goes around the main body 18 between the adjacent external electrodes 21d and 22d, and ends of the external electrodes 21d and 22d that are adjacent to the gap 1d and extend along the outer periphery of the external electrodes 21d and 22d. It is formed so as to cover. The insulating layer 40d is formed in a band shape so as to go around the main body 18 along the gap 1d. In the external electrodes 21d and 22d, portions inside the end portions are exposed to the outside.

  Of the insulating layer 40d, the gap 1d between the external electrodes 21d and 22d adjacent to each other on the side surfaces 13 to 16, and the end portions of the external electrodes 21d and 22d adjacent to the gap 1d and along the outer peripheral edge of the external electrodes 21d and 22d The portion covering the first portion is the first portion of the insulating layer of the present invention.

  Of the insulating layer 40d, the gap 1d between the external electrodes 21d and 22d adjacent to each other on the surface 11 and the ends of the external electrodes 21d and 22d adjacent to the gap 1d and along the outer peripheral edges of the external electrodes 21d and 22d are covered. The part is the second part of the insulating layer of the present invention.

  The external electrodes 21d and 22d are also formed from the side surfaces 13 to 16 of the main body 18 to the surface 11, and the insulating layer 40d is formed from the side surfaces 13 to 16 so as to cover the ends of the adjacent external electrodes 21d and 22d. 11 is formed. Therefore, the external electrodes 21d and 22d are difficult to peel off on the surface 11 in addition to the side surfaces 13 to 16, so that the destruction of the external electrodes 21d and 22d can be suppressed also at the corners of the side surfaces 13 to 16 and the surface 11.

  Further, by forming the external electrodes 21d and 22d as far as the surface 11 of the main body 18, it is possible to block electromagnetic waves and improve electromagnetic shielding properties, or to further increase the adhesion strength of the external electrodes 21d and 22d to the main body 18. it can.

  In the electronic component 10d, since the end portions of the external electrodes 21d and 22d are covered with the insulating layer 40d, the external electrodes 21d and 22d are hardly peeled off from the main body, and start from the end portions of the corner portions of the external electrodes 21d and 22d. It is possible to suppress peeling and destruction of the external electrodes 21d and 22d. Moreover, solder bridge can be suppressed.

  <Summary> As described above, by forming an insulating layer so as to cover the gap between the adjacent external electrodes and the end of the external electrode adjacent to the gap and along the outer peripheral edge of the external electrode, It becomes difficult to peel off the electrode, and by covering the end of the corner of the external electrode with an insulating layer, it is possible to suppress peeling or breakage of the external electrode starting from the end of the corner.

  Moreover, since the edge part is covered with the insulating layer, the part formed in the side surface of the main body among the external electrodes can widen the space | interval of the parts exposed outside, and can suppress a solder bridge.

  Furthermore, since the gap between adjacent external electrodes can be reduced, the electronic component can be easily downsized, and the electromagnetic shielding property can be improved.

  The present invention is not limited to the above embodiment, and can be implemented with various modifications.

10, 10a to 10d Electronic component 11 Front surface 12 Back surface 13 to 16 Side surface 18 Main body 21, 21a to 21d External electrode 22, 22a to 22d External electrode 23, 23a to 23c External electrode 24, 24a to 24c External electrode 25, 25a to 25c External electrode 26, 26a-26c External electrode 27 External electrode 28 External electrode 29 External electrode 31-36 Connection electrode 40, 40a-40d Insulating layer

Claims (3)

A rectangular parallelepiped body in which four rectangular side surfaces extend between a rectangular front surface and a back surface facing each other;
A plurality of external electrodes formed continuously from the back surface of the main body to the side surface;
The first gap between the external electrodes adjacent to each other on the back surface and the side surface of the main body, and the outer surface of the back surface and the side surface of the main body adjacent to the first gap and along the outer peripheral edge of the external electrode. An insulating layer including a first portion formed to cover the first end of the external electrode;
With
The external electrode is exposed to the outside from the first end of the portion formed on the side surface of the main body ,
In the side surface of the main body, the insulating layer protrudes outside the external electrode in the normal direction of the side surface,
The electronic component , wherein the insulating layer and the external electrode are formed flush with each other on the back surface of the main body . At least two of the external electrodes are formed continuously from the side surface of the main body to the surface;
The insulating layer includes a second gap between the external electrodes adjacent to each other on the surface of the main body, and the external portion along the outer peripheral edge of the external electrode adjacent to the second gap on the surface of the main body. A second portion formed to cover the second end of the electrode;
2. The electronic component according to claim 1, wherein an inner side of the external electrode is exposed to the outside of the second end portion of a portion formed on the surface of the main body.   The insulating layer includes a third portion continuously formed on the four side surfaces of the main body so as to make a round around the side surface with a space between the back surface and the back surface. The electronic component according to claim 1.

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