JP6962178B2 - Electronic components - Google Patents

Description

One aspect of the present invention relates to electronic components.

For example, Patent Document 1 describes an electronic device including a substrate, an encapsulation portion, and an electromagnetic protective layer. In this electronic device, an electromagnetic protective layer covers the sides of the substrate and the encapsulation. As a result, the influence of electromagnetic waves from the outside can be suppressed. The electromagnetic protective layer is grounded by being electrically connected to a contact provided on the side surface of the substrate.

Japanese Patent Application Laid-Open No. 2013-534366

By the way, in an electronic component provided with an element body and a terminal electrode provided on the surface of the element body, a metal shield film is provided on the surface of the element body at a distance from the terminal electrode, and the metal shield film and the terminal electrode are provided. It is conceivable to connect with an inner conductor. In this case, there is a requirement to form a plating film on the surface of the terminal electrode, but if the plating process is performed before the formation of the metal shield film, between the end of the terminal electrode exposed on the surface of the element body and the element body. There is a risk that the plating solution will infiltrate into the body through the gaps between the two.

One aspect of the present invention provides an electronic component capable of suppressing the infiltration of the plating solution into the body.

The electronic component according to one aspect of the present invention includes the element body, the terminal electrode provided on the surface of the element body, the metal shield film provided on the surface of the element body separated from the terminal electrode, and the element body. A connecting conductor having a first end surface arranged inside and connected to a terminal electrode and a second end surface connected to a metal shield film, and a second end surface provided on the second end surface and a metal shield film. It comprises a connecting plating film, and the element body has a covering portion that covers the edge portion of the second end surface.

In this electronic component, the element body has a covering portion that covers the edge portion of the second end face. Therefore, even if the plating treatment is performed before the formation of the metal shield film, the edge portion of the second end surface is covered with the covering portion of the element body, so that the plating solution is prevented from entering the inside of the element body. can.

The second end surface may be arranged inside the element body with respect to the surface of the element body. In this case, it is possible to prevent the formation of a step between the surface of the plating film provided on the second end surface and the surface of the element body.

The plating film may also be provided on the surface of the covering portion. In this case, the contact area between the plating film and the metal shield film increases. As a result, it is possible to suppress interfacial peeling in which the plating film and the metal shield film are peeled off at the interface between each other due to thermal expansion or contraction.

The metal shield film may be thicker than the plating film. In this case, even if the plating film is formed so as to protrude from the surface of the element body, it is possible to suppress the formation of a step on the surface of the metal shield film.

The element body has a rectangular parallelepiped shape, and as its surface, between the first surface to be a mounting surface, the second surface facing the first surface, and the first surface and the second surface. The terminal electrode may be provided on the first surface, and the metal shield film may be provided on the second and third surfaces, including a third surface extending so as to be connected. In this case, since the metal shield film covers the surfaces other than the first surface, the influence from the outside can be effectively suppressed.

One aspect of the present invention provides an electronic component capable of suppressing the infiltration of the plating solution into the body.

FIG. 1 is a perspective view showing an electronic component according to an embodiment. FIG. 2 is a cross-sectional view of the metal shield film, the connecting conductor, the terminal electrode, and the plating film along the line II-II of FIG. FIG. 3 is an enlarged cross-sectional view showing a peripheral portion of the second end face. FIG. 4 is an exploded perspective view of the element body. FIG. 5 is a perspective view showing the configuration inside the element body. FIG. 6 is a diagram showing an equivalent circuit of electronic components.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description of the drawings, the same or equivalent elements are designated by the same reference numerals, and duplicate description will be omitted.

FIG. 1 is a perspective view showing an electronic component according to an embodiment. FIG. 2 is a diagram showing a cross-sectional configuration of a metal shield film, a connecting conductor, a terminal electrode, and a plating film along the line II-II of FIG.
As shown in FIGS. 1 and 2, the electronic component 1 includes a body 2, a metal shield film 3, a pair of connecting conductors 4, a terminal electrode 5, a terminal electrode 6, a terminal electrode 7, and a mark. 8 and. The electronic component 1 is, for example, a laminated electronic component in which a plurality of insulator layers are laminated. In the present embodiment, the electronic component 1 will be described by taking a laminated high-pass filter as an example. In FIG. 2, the element body 2 is shown by a alternate long and short dash line.

The element body 2 has a rectangular parallelepiped shape. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded. As its outer surface, the element body 2 extends so as to connect between a pair of main surfaces 2a and 2b facing each other and a pair of main surfaces 2a and 2b, and a pair of side surfaces facing each other. It has 2c and 2d and a pair of side surfaces 2e and 2f extending so as to connect between the pair of main surfaces 2a and 2b and facing each other. The main surface 2a is defined as a surface (mounting surface) facing the other electronic device when, for example, the electronic component 1 is mounted on another electronic device (for example, a circuit board, an electronic component, etc.) (not shown).

The direction D1 in which the pair of main surfaces 2a and 2b face each other, the direction D2 in which the pair of side surfaces 2c and 2d face each other, and the direction D3 in which the pair of side surfaces 2e and 2f face each other They are almost orthogonal to each other. The length of the direction D1 of the element body 2 is, for example, 0.8 mm, the length of the direction D2 of the element body 2 is, for example, 2 mm, and the length of the direction D3 of the element body 2 is, for example, 1. It is 25 mm.

The element body 2 is formed by laminating a plurality of insulator layers 10 (see FIG. 4). Each insulator layer 10 is laminated in the direction D1. That is, the stacking direction of each insulator layer 10 coincides with the direction D1. Each insulator layer 10 has a substantially rectangular shape in a plan view. In the actual element body 2, each insulator layer 10 is integrated so that the boundary between the layers cannot be visually recognized. Each insulator layer 10 is a ceramic containing, for example, a dielectric material (BaTiO ₃ material, Ba (Ti, Zr) O ₃ material, (Ba, Ca) TiO ₃ material, glass material, alumina material, etc.). It is composed of a sintered body of green sheet.

The metal shield film 3 is provided on the main surface 2b and the side surfaces 2c, 2d, 2e, 2f. The metal shield film 3 is provided so as to be separated from the terminal electrodes 5 to 7 and the main surface 2a on which the terminal electrodes 5 to 7 are provided. The terminal electrodes 5 to 7 and the main surface 2a are not covered with the metal shield film 3 and are exposed from the metal shield film 3. The metal shield film 3 covers the main surface 2b and the side surfaces 2c, 2d, 2e, and 2f other than the main surface 2a, which is the mounting surface, without gaps. Therefore, the electronic component 1 can effectively suppress the influence of electromagnetic waves and the like from the outside.

The metal shield film 3 is a metal film made of a metal (for example, Cu or Ag). In the present embodiment, the metal shield film 3 has a layer structure composed of a SUS (stainless steel) layer that functions as an underlayer, a Cu layer that functions as the main body of the metal shield film 3, and a SUS layer that functions as a protective layer. Have. The thickness of the Cu layer on the main surface 2b is, for example, 4 μm. The thickness of the Cu layer on the side surfaces 2c, 2d, 2e, and 2f is, for example, 2 μm. The thickness of the base layer (SUS layer) on the main surface 2b is, for example, 0.4 μm. The thickness of the base layer (SUS layer) on the side surfaces 2c, 2d, 2e, and 2f is, for example, 0.2 μm. The thickness of the protective layer (SUS layer) on the main surface 2b is, for example, 0.4 μm. The thickness of the protective layer (SUS layer) on the side surfaces 2c, 2d, 2e, and 2f is, for example, 0.2 μm.

The connecting conductor 4 is arranged inside the element body 2. The connecting conductor 4 has a first end surface 4a and a second end surface 4b. The first end surface 4a is exposed from the main surface 2a and is connected to the terminal electrode 6. The second end surface 4b is exposed from the side surface 2e or the side surface 2f and is connected to a portion of the metal shield film 3 provided on the side surface 2e or the side surface 2f.

FIG. 3 is an enlarged cross-sectional view showing a peripheral portion of the second end face. As shown in FIGS. 1 to 3, the second end surface 4b is arranged inside the element body 2 with respect to the side surfaces 2e and 2f. The second end surface 4b has an edge portion 4c and a central portion 4d. The edge portion 4c has a frame shape and surrounds the central portion 4d. The central portion 4d is located inside the edge portion 4c. The central portion 4d is exposed from the side surfaces 2e and 2f. The second end surface 4b has, for example, a rectangular shape having a long side of 100 μm and a short side of 10 μm. The width of the edge portion 4c (the length in the direction orthogonal to the extending direction of the edge portion 4c) is, for example, 1 μm or more and 3 μm or less.

The element body 2 has a covering portion 2m that covers the edge portion 4c. When viewed from the direction orthogonal to the side surfaces 2e and 2f (direction D3), the covering portion 2m has the same shape as the edge portion 4c and overlaps with the edge portion 4c. Since the element body 2 has the covering portion 2 m, the edge of the second end surface 4b is in a state of being closed by the element body 2.

The terminal electrodes 5 to 7 are provided on the main surface 2a of the element body 2. The terminal electrodes 5 to 7 are separated from each other in the direction D2. On the main surface 2a, the terminal electrode 6 is located at the center of the direction D2, the terminal electrode 5 is located on the side surface 2c side of the terminal electrode 6, and the terminal electrode 7 is located on the side surface 2d side of the terminal electrode 6. positioned. Each of the terminal electrodes 5 to 7 has a rectangular shape when viewed from a direction (direction D1) orthogonal to the main surface 2a. The lengths of the directions D3 of the terminal electrodes 5 to 7 are equal to each other. The length of the direction D2 of the terminal electrode 5 is equivalent to the length of the direction D2 of the terminal electrode 7. The length of the direction D2 of the terminal electrode 6 is longer than the length of the direction D2 of the terminal electrode 5 and the terminal electrode 7. The length of the direction D2 of the terminal electrode 6 is about twice the length of the direction D2 of the terminal electrode 5 and the terminal electrode 7. The terminal electrodes 5 to 7 are separated from the outer edge of the main surface 2a. Therefore, for example, when the electronic component 1 is solder-mounted, it is possible to prevent the solder from wrapping around from the main surface 2a to the side surfaces 2c, 2d, 2e, and 2f.

Each terminal electrode 5 to 7 contains a conductive material (for example, Ag or Pd). Each terminal electrode 5 to 7 is composed of a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). The conductive paste is applied to the main surface 2a by, for example, screen printing.

The mark 8 is provided to identify the mounting direction of the electronic component 1. The mark 8 is provided on the main surface 2b. The mark 8 is provided on the side surface 2c side of the central portion of the direction D2 of the main surface 2b. The mark 8 is made of a material different from that of the element body 2, for example, and has a surface roughness different from that of the element body 2. The metal shield film 3 is formed so as to follow the surface roughness of the element body 2 and the mark 8. Therefore, in the metal shield film 3, the portion formed on the surface of the element body 2 and the portion formed on the surface of the mark 8 have different light reflection states. Thereby, the mark 8 can be identified even from the outside of the metal shield film 3. The thickness of the mark 8 is set to a thickness that is not removed by barrel polishing described later, for example.

As shown in FIG. 3, the electronic component 1 includes a plating film 11 and a plating film 12. The plating film 11 is provided on the surface of each of the terminal electrodes 5 to 7. The plating film 12 is provided at the central portion 4d of the second end surface 4b. The plating film 12 is also provided on the surface of the covering portion 2 m of the element body 2. The plating film 12 is integrally provided on the central portion 4d and the coating portion 2m and covers them. The plating film 12 is in contact with the central portion 4d, the covering portion 2m, and the metal shield film 3, respectively. The plating film 12 connects the central portion 4d and the metal shield film 3. The plating film 12 is thinner than, for example, the metal shield film 3.

The plating films 11 and 12 are made of, for example, the same material. The plating films 11 and 12 have, for example, a layer structure composed of a Ni plating layer and an Au plating layer, a layer structure composed of a Ni plating layer and a Sn plating layer, or a layer structure composed of a Cu plating layer, a Ni plating layer, and a Sn plating layer. have. The plating films 11 and 12 are formed by, for example, electrolytic plating or electroless plating. The plating films 11 and 12 may be made of different materials.

FIG. 4 is an exploded perspective view of the element body. FIG. 5 is a perspective view showing the configuration inside the element body. As shown in FIGS. 4 and 5, the electronic component 1 has a plurality of coil conductors 21 to 28 and a connecting conductor 29. The coil conductors 21, 22, 23, 24 are arranged at different positions (layers) from each other in the direction D1. The coil conductors 21, 22, 23, 24 are connected to each other through through-hole conductors to form the inductor L1. The coil conductors 25, 26, 27, and 28 are arranged at different positions (layers) from each other in the direction D1. The coil conductors 25, 26, 27, and 28 are connected to each other through through-hole conductors to form the inductor L2.

The connecting conductor 29 connects the inductor L1 and the inductor L2 by connecting the coil conductor 24 and the coil conductor 28. When viewed from the direction D1, the connecting conductor 29 is arranged at the center of the direction D2, the inductor L1 is arranged on the side surface 2c side of the connecting conductor 29, and the inductor L2 is arranged on the side surface 2d side of the connecting conductor 29. There is. The connecting conductor 29 is connected to the terminal electrode 6 through a through-hole conductor.

The coil conductors 21 and 25 are arranged at the same positions (layers) as each other in the direction D1. The coil conductors 22 and 26 are arranged at the same position (layer) as each other in the direction D1. The coil conductors 23 and 27 are arranged at the same positions (layers) as each other in the direction D1. The coil conductors 24 and 28 and the connecting conductor 29 are arranged at the same position (layer) as each other in the direction D1.

The electronic component 1 has internal electrodes 31 to 47 and connecting conductors 48 to 50. The internal electrodes 35, 37, 39, 41, and 43 are arranged so as to face each other with the insulator layer 10 interposed therebetween, and constitute the capacitor C1. The internal electrodes 36, 38, 40, 42, 44, 46, 47 are arranged so as to face each other with the insulator layer 10 interposed therebetween, forming the capacitor C2. The internal electrodes 31, 33, 35, 43, and 45 are arranged so as to face each other with the insulator layer 10 interposed therebetween, and constitute the capacitor C3. The internal electrodes 32, 34, and 36 are arranged so as to face each other with the insulator layer 10 interposed therebetween, forming the capacitor C4.

The internal electrodes 31 and 32 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 33 and 34 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 35 and 36 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 37 and 38 and the connecting conductor 48 are arranged at the same positions (layers) as each other in the direction D1.

The internal electrodes 39, 40 and the connecting conductors 49, 50 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 41 and 42 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 43 and 44 are arranged at the same positions (layers) as each other in the direction D1. The internal electrodes 45 and 46 are arranged at the same positions (layers) as each other in the direction D1.

Internal electrodes 31, 32, internal electrodes 33, 34, internal electrodes 35, 36, internal electrodes 37, 38, internal electrodes 39, 40, internal electrodes 41, 42, internal electrodes 43, 44, and internal electrodes. The electrodes 45 and 46 and the internal electrodes 47 are arranged at different positions (layers) in the direction D1.

The internal electrodes 31, 35, 39, 43 are connected to the terminal electrode 5 through a through-hole conductor. The internal electrodes 32, 36, 40, 44, 47 are connected to the terminal electrode 7 through a through-hole conductor. The internal electrodes 37 and 41 are connected to each other through a through-hole conductor. The internal electrodes 38, 42, 46 are connected to each other through a through-hole conductor.

The connecting conductor 48 connects the capacitor C1 and the capacitor C2 by connecting the internal electrode 37 and the internal electrode 38. The connecting conductor 49 is exposed on the side surface 2e and has one end connected to the metal shield film 3 and the other end connected to the terminal electrode 6 through the through-hole conductor. The connecting conductor 50 is exposed on the side surface 2f and has one end connected to the metal shield film 3 and the other end connected to the terminal electrode 6 through the through-hole conductor. The metal shield film 3 and the terminal electrode 6 are connected to each other through connecting conductors 49 and 50 and through-hole conductors.

The connection conductor 4 (see FIG. 2) described above is composed of connection conductors 49 and 50 and through-hole conductors. The first end surface 4a (see FIG. 2) of the connecting conductor 4 is composed of end surfaces of through-hole conductors. The second end surface 4b (see FIG. 2) of the connecting conductor 4 is composed of end surfaces of one ends of the connecting conductors 49 and 50.

The internal electrodes 33 and 45 and the ends of the coil conductor 21 are connected to each other through a through-hole conductor. The internal electrode 34 and the end of the coil conductor 25 are connected to each other through a through-hole conductor.

The coil conductors 21 to 28, the connecting conductor 29, the internal electrodes 31 to 47, the connecting conductors 48 to 50, and the through-hole conductor include a conductive material (for example, Ag or Pd). The coil conductors 21 to 28, the connecting conductors 29, the internal electrodes 31 to 47, the connecting conductors 48 to 50, and the through-hole conductor are fired from a conductive paste containing a conductive material (for example, Ag powder or Pd powder). It is composed of a body.

FIG. 6 is a diagram showing an equivalent circuit of electronic components. As shown in FIG. 6, in the electronic component 1, the terminal electrode 5 _{constitutes an input terminal T IN} to which a signal is input, the terminal electrode 6 constitutes a ground terminal G, and the terminal electrode 7 has a signal. The output terminal T _OUT to be output is configured. Capacitors C1 and C2 are connected in series between _{the input terminal T IN} and the output terminal T _OUT. One end of the capacitor C1 is connected to the _{input terminal T IN.} The other end of the capacitor C1 is connected to one end of the capacitor C2. The other end of the capacitor C2 is connected to the _{output terminal T OUT.}

The capacitor C3, the inductor L1, the inductor L2, and the capacitor C4 are connected in series in this order. The capacitor C3, the inductor L1, the inductor L2, and the capacitor C4 are connected in parallel with the capacitor C1 and the capacitor C2. One end of the capacitor C3 is connected to the _{input terminal T IN.} The other end of the capacitor C3 is connected to one end of the inductor L1. The other end of the inductor L1 is connected to one end of the inductor L2. The other end of the inductor L2 is connected to one end of the capacitor C4. The other end of the capacitor C4 is connected to the _{output terminal T OUT.} The other end of the inductor L1 and one end of the inductor L2 are connected to the ground terminal G.

Subsequently, an example of the manufacturing method of the electronic component 1 will be described.

First, a green sheet is created and the binder is removed. Next, a conductive paste containing a conductive material (for example, Ag powder or Pd powder) and a constituent material of the element body 2 as a co-material is applied (coated) on the green sheet, and the terminal electrodes 5 to 7 and the coil are formed. Conductor patterns corresponding to conductors 21 to 28, connecting conductors 29, internal electrodes 31 to 47, connecting conductors 48 to 50, and through-hole conductors are formed. On the other hand, a paste containing the constituent material of the mark 8 is applied (coated) on the green sheet to form a pattern corresponding to the mark 8. Subsequently, the green sheets are laminated to prepare a laminated green. Next, while heating the laminate green at a predetermined temperature, it is pressed at a predetermined pressure in the lamination direction to obtain a laminate substrate. Subsequently, the laminated substrate is cut into chip units. As a result, a plurality of green chips can be obtained. In the obtained green chip, the end surfaces of the conductor patterns that serve as the first end surface 4a and the second end surface 4b of the connecting conductor 4 form, for example, the same plane as the surface of the green chip.

Next, the green chips are chamfered by polishing the green chips. Subsequently, the green chips are fired under predetermined conditions. As a result, the element body 2 in which the terminal electrodes 5 to 7 and the mark 8 are arranged on the surface and the connecting conductor 4 and the like are arranged inside can be obtained. When the heat shrinkage rate of the conductive paste is larger than the heat shrinkage rate of the green chip, the first end surface 4a and the second end surface 4b of the connecting conductor 4 are retracted inside the element body 2 from the surface of the element body 2. As described above, the conductive paste contains the constituent material of the element body 2 as a common material. The constituent material of the element body 2 moves toward the element body 2 at the time of firing. As a result, the covering portion 2m is formed on the edge portion 4c.

Subsequently, the plating films 11 and 12 are formed by electrolytic plating or electroless plating. Next, for example, the metal shield film 3 is formed on the main surface 2b and the side surfaces 2c, 2d, 2e, and 2f by sputtering, for example. As a result, the electronic component 1 is formed.

As described above, the element body 2 has a covering portion 2m that covers the edge portion 4c of the second end surface 4b. Therefore, even if the plating treatment is performed before the formation of the metal shield film 3, the plating solution does not penetrate into the element body 2 unless it passes through the gap between the edge portion 4c and the coating portion 2m. I can't. Therefore, according to the electronic component 1, it is possible to prevent the plating solution from entering the inside of the element body 2. The metal shield film 3 is connected to the terminal electrode 6 by a connecting conductor 4 arranged inside the element body 2. It is conceivable to connect the metal shield film 3 to the terminal electrode 6 on the surface of the element body 2 without using the connection conductor 4, but in that case, when the electronic component 1 is solder-mounted, the metal shield film 3 and the terminal electrode are connected. There is a possibility that the solder wraps around from the main surface 2a to the side surfaces 2c, 2d, 2e, and 2f through the connecting portion with 6. In the electronic component 1, by using the connecting conductor 4, the metal shield film 3 can be provided on the surface of the element body 2 at a distance from the terminal electrode 6, so that the solder wraparound when the electronic component 1 is solder-mounted can be prevented. It can be suppressed.

The second end surface 4b is arranged inside the element body 2 with respect to the side surfaces 2e and 2f. Therefore, it is possible to prevent the formation of a step between the surface of the plating film 12 provided on the second end surface 4b and the side surfaces 2e and 2f. For example, when the metal shield film 3 is formed by sputtering, if there is a step between the surface of the plating film 12 and the side surfaces 2e and 2f, the metal shield film 3 may not be formed at the step portion. In the electronic component 1, since the step is suppressed, the metal shield film 3 can be formed without a gap.

Since the plating film 12 is also provided on the surface of the covering portion 2 m, the contact area between the plating film 12 and the metal shield film 3 increases. Therefore, it is possible to suppress interfacial peeling in which the plating film 12 and the metal shield film 3 are peeled off at the interface between the plating film 12 and the metal shield film 3 due to thermal expansion or contraction.

The metal shield film 3 is thicker than the plating film 12. Therefore, even if the plating film 12 is formed so as to protrude from the side surfaces 2e and 2f, it is possible to suppress the formation of a step on the surface of the metal shield film 3.

The element body 2 has a rectangular parallelepiped shape, and has main surfaces 2a and 2b and side surfaces 2c, 2d, 2e and 2f as its surfaces. The terminal electrodes 5 to 7 are provided on the main surface 2a, and the metal shield film 3 is provided on the main surface 2b and the side surfaces 2c, 2d, 2e, 2f other than the main surface 2a. As described above, in the electronic component 1, since the metal shield film 3 covers the main surface 2b and the side surfaces 2c, 2d, 2e, and 2f other than the main surface 2a, which are the mounting surfaces, without gaps, the influence of electromagnetic waves from the outside and the like. Can be effectively suppressed.

The present invention is not necessarily limited to the above-described embodiment, and various modifications can be made without departing from the gist thereof.

In the above embodiment, the high-pass filter has been described as an example, but the electronic component 1 may be a high-frequency LC module such as a diplexer or a triplexer, and the number of terminal electrodes is not limited to three. Further, the present invention may be applied to electronic components such as capacitors, inductors, varistor, and thermistors.

In the above embodiment, the pattern corresponding to the sintered metal layer of the terminal electrodes 5 to 7 and the pattern corresponding to the mark 8 are formed before laminating the green sheet, but may be formed after laminating the green sheet. , It may be formed after the chamfering step, or it may be formed after the step of firing the element body 2. The sintered metal layers and marks 8 of the terminal electrodes 5 to 7 are formed by applying a conductive paste and a paste containing the constituent materials of marks 8 to the main surfaces 2a and 2b after the step of firing the element body 2 and baking them. It may be formed.

In the above embodiment, the conductive paste to which the constituent material of the element body 2 is added as a co-material is fired to form the covering portion 2m of the element body 2 together with the connecting conductor 4, but the covering portion 2m is formed. The method is not limited to this. For example, in the state of a green chip, a portion that becomes a covering portion 2 m by firing may be formed on the end face of a conductor pattern that becomes a connecting conductor 4 by firing.

The electronic component 1 may include at least one connecting conductor 4. The connecting conductor 4 is not limited to the side surfaces 2e and 2f, but is exposed on the main surface 2b or the side surfaces 2c and 2d, and is connected to the portion of the metal shield film 3 provided on the main surface 2b or the side surfaces 2c and 2d. May be good. The metal shield film 3 is provided on the five surfaces of the main surface 2b and the side surfaces 2c, 2d, 2e, and 2f, but is provided on at least one of the main surface 2b and the side surfaces 2c, 2d, 2e, and 2f. Just do it.

1 ... Electronic component, 2 ... Elementary body, 2a ... Main surface (first surface), 2b ... Main surface (second surface), 2c, 2d, 2e, 2f ... Side surface (third surface), 2m ... Covering part, 3 ... Metal shield film, 4 ... Connecting conductor, 4a ... First end face, 4b ... Second end face, 5, 6, 7 ... Terminal electrodes, 11, 12 ... Plating film.

Claims (5)

With the body
The terminal electrodes provided on the surface of the element body and
A metal shield film provided on the surface of the element body, separated from the terminal electrode,
A connecting conductor having a first end surface arranged inside the element body and connected to the terminal electrode and a second end surface connected to the metal shield film.
A plating film provided on the second end surface and connecting the second end surface and the metal shield film is provided.
The element body is an electronic component having a covering portion covering the edge portion of the second end surface. The electronic component according to claim 1, wherein the second end surface is arranged inside the element body with respect to the surface of the element body. The electronic component according to claim 1 or 2, wherein the plating film is also provided on the surface of the covering portion. The electronic component according to any one of claims 1 to 3, wherein the metal shield film is thicker than the plating film. The element body has a rectangular parallelepiped shape, and its surfaces are a first surface to be mounted, a second surface facing the first surface, and the first surface and the second surface. Includes a third surface that extends to connect with and
The terminal electrode is provided on the first surface, and the terminal electrode is provided on the first surface.
The electronic component according to any one of claims 1 to 4, wherein the metal shield film is provided on the second surface and the third surface.

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