JP6794791B2 - Electronic components - Google Patents

Description

The present invention relates to electronic components.

An electronic component having a body and a plurality of external electrodes arranged on the body is known (see, for example, Patent Document 1). The element body has a rectangular parallelepiped shape, and has a main surface and a pair of side surfaces facing each other and adjacent to the main surface. A plurality of external electrodes are arranged at both ends of the element body in the direction in which the pair of side surfaces face each other. Each external electrode has a first electrode portion arranged on the main surface and a second electrode portion arranged on the side surface. The main surface is a mounting surface facing an electronic device (for example, a circuit board or an electronic component) on which electronic components are solder-mounted.

JP-A-2010-192643

One aspect of the present invention is to provide an electronic component in which the occurrence of cracks in the element body is suppressed and the mounting strength is ensured.

As a result of the research conducted by the present inventors, the following matters were found. When an electronic component is solder-mounted on an electronic device, an external force acting on the electronic component from the electronic device may act as a stress on the element body from a solder fillet formed at the time of solder mounting through an external electrode. For example, when an electronic device is a substrate, an external force acts on an electronic component by bending the substrate. The stress acting on the element body tends to be concentrated on the edge of the external electrode, particularly on the edge in the direction in which the pair of side surfaces of the first electrode portion arranged on the main surface, which is the mounting surface, faces each other. Therefore, there is a possibility that cracks may occur in the element body starting from these edge edges.

The electronic component according to one aspect of the present invention has a rectangular shape, and has a main surface as a mounting surface and a pair of side surfaces facing each other and adjacent to the main surface. A plurality of electrodes are arranged at both ends of the body and the element body in the direction in which the pair of side surfaces face each other, and the first electrode portion arranged on the main surface and the second electrode portion arranged on the side surfaces are arranged. An external electrode having the above electrode and a resin film arranged on the main surface and having an electrically insulating property are provided, and the first electrode portion and the second electrode portion are arranged on the element body. The resin film includes a metal forming layer and a plating layer arranged on the sintered metal layer, and the resin film is formed in a direction in which a pair of side surfaces of the sintered metal layer included in the first electrode portion face each other. The plating layer that covers at least the edge and is in contact with the edge and is included in the first electrode portion is on the region exposed from the resin film in the sintered metal layer contained in the first electrode portion. It is located in.

In the electronic component according to the above one aspect of the present invention, the resin film functions as a solder resist when the electronic component is solder-mounted on the electronic device. Since the resin film at least covers the edges of the sintered metal layer included in the first electrode portion in the direction in which the pair of side surfaces face each other, the solder fillet is arranged on the main surface of the first electrode portion. Does not reach the edge in the direction in which the pair of side surfaces of the sintered metal layer contained in the above face each other. Therefore, even when an external force acts on the electronic component through the solder fillet, it is difficult for stress to concentrate on the edge, and the edge is unlikely to be the starting point of cracks. Therefore, the occurrence of cracks in the element body is suppressed.

Since the plating layer included in the first electrode portion is arranged on the region exposed from the resin film in the sintered metal layer included in the first electrode portion, not only the second electrode portion but also the first electrode portion is provided. The electrode portion is also connected to the electronic device via solder. Therefore, as compared with the electronic component in which the entire sintered metal layer included in the first electrode portion is covered with the resin film, the electronic component according to this embodiment is prevented from lowering the mounting strength.

The resin film may integrally cover the edge of the sintered metal layer included in the first electrode portion of at least two adjacent external electrodes. In this case, the resin film can be easily formed.

The resin film is provided for each external electrode, and may cover the edge of the sintered metal layer of the first electrode portion included in the corresponding external electrode. In this case, the amount of resin used to form the resin film is reduced.

The resin film covers the edge of the sintered metal layer included in the first electrode portion over the entire circumference, and may be in contact with the edge. In this case, stress is unlikely to be concentrated over the entire circumference of the edge of the sintered metal layer included in the first electrode portion, and the edge is unlikely to be the starting point of cracks over the entire circumference.

According to one aspect of the present invention, it is possible to provide an electronic component in which the occurrence of cracks in the element body is suppressed and the mounting strength is ensured.

It is a perspective view which shows the laminated common mode filter which concerns on one Embodiment. It is a top view which shows the laminated common mode filter which concerns on this embodiment. It is an exploded perspective view which shows the structure of the element body. It is a figure for demonstrating the cross-sectional structure of the 1st external electrode, the 2nd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of the 3rd external electrode, the 4th external electrode, and a resin layer. It is a figure for demonstrating the mounting structure of the laminated common mode filter which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the laminated common mode filter which concerns on this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of the 1st external electrode, the 3rd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of the 2nd external electrode, the 4th external electrode, and a resin layer. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same reference numerals are used for the same elements or elements having the same function, and duplicate description will be omitted.

The configuration of the laminated common mode filter CF according to the present embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view showing a laminated common mode filter according to the present embodiment. FIG. 2 is a plan view showing a laminated common mode filter according to the present embodiment. FIG. 3 is an exploded perspective view showing the configuration of the element body. FIG. 4 is a diagram for explaining the cross-sectional configuration of the first external electrode, the second external electrode, and the resin layer. FIG. 5 is a diagram for explaining the cross-sectional configuration of the third external electrode, the fourth external electrode, and the resin layer. In this embodiment, a laminated common mode filter CF will be described as an example of an electronic component.

As shown in FIGS. 1 to 3, the laminated common mode filter CF includes the element body 1 and the first external electrode 11, the second external electrode 12, and the third external electrode 13 arranged on the outer surface of the element body 1. , And a fourth external electrode 14. The laminated common mode filter CF is an electronic device (for example, a circuit board or a circuit board) so that the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are connected to the signal line, respectively. Solder mounted on electronic components, etc.).

The element body 1 has a rectangular parallelepiped shape. As its outer surface, the element body 1 has a first main surface 1a and a second main surface 1b facing each other, a first side surface 1c and a second side surface 1d facing each other, and a second surface facing each other. It has three side surfaces 1e and a fourth side surface 1f. The direction in which the first main surface 1a and the second main surface 1b face each other is the first direction D1, and the direction in which the first side surface 1c and the second side surface 1d face each other is the second direction D2. The direction in which the third side surface 1e and the fourth side surface 1f face each other is the third direction D3. In the present embodiment, the first direction D1 is the height direction of the element body 1, the second direction D2 is the longitudinal direction of the element body 1, and the third direction D3 is the width direction of the element body 1. The rectangular parallelepiped shape includes a rectangular parallelepiped shape in which the corners and ridges are chamfered, and a rectangular parallelepiped in which the corners and ridges are rounded.

The first side surface 1c and the second side surface 1d extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and also adjacent to the second main surface 1b. The first side surface 1c and the second side surface 1d also extend in the third direction D3 (the short side direction of the first main surface 1a and the second main surface 1b).

The third side surface 1e and the fourth side surface 1f extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and also adjacent to the second main surface 1b. The third side surface 1e and the fourth side surface 1f also extend in the second direction D2 (the long side direction of the first main surface 1a and the second main surface 1b).

The element body 1 has a non-magnetic body portion 3 and a pair of magnetic body portions 5 arranged so as to sandwich the non-magnetic body portion 3 in the first direction D1. The element body 1 is composed of a plurality of laminated insulator layers. In the non-magnetic material portion 3, a plurality of non-magnetic material layers 4 are laminated as an insulator layer. That is, the non-magnetic material portion 3 is composed of a plurality of laminated non-magnetic material layers 4. In each magnetic material portion 5, a plurality of magnetic material layers 6 are laminated as an insulator layer. That is, the magnetic material portion 5 is composed of a plurality of laminated magnetic material layers 6. The plurality of insulator layers include a plurality of non-magnetic material layers 4 and a plurality of magnetic material layers 6.

Each non-magnetic material layer 4 is composed of a sintered body of a ceramic green sheet containing, for example, a non-magnetic material (Cu—Zn-based ferrite material, dielectric material, glass ceramic material, or the like). Each magnetic material layer 6 is made of a ceramic green sheet sintered body containing, for example, a magnetic material (Ni-Cu-Zn-based ferrite material, Ni-Cu-Zn-Mg-based ferrite material, Ni-Cu-based ferrite material, etc.). It is composed.

In the actual element 1, each non-magnetic material layer 4 and each magnetic material layer 6 are integrated to the extent that the boundary between the layers cannot be visually recognized. In the first direction D1, that is, the direction in which the first main surface 1a and the second main surface 1b oppose each other, a plurality of insulator layers, that is, a plurality of non-magnetic material layers 4 and a plurality of magnetic material layers 6 are laminated. It coincides with the direction (hereinafter, simply referred to as "stacking direction").

As shown in FIG. 3, the laminated common mode filter CF includes a first coil conductor 21, a second coil conductor 22, a third coil conductor 23, and a fourth coil conductor 24 in the non-magnetic material portion 3. .. Each conductor 21-24 contains a conductive material (eg, Ag or Pd, etc.). Each conductor 21-24 is configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder).

The first coil conductor 21 has a spiral shape and is arranged between a pair of non-magnetic material layers 4 adjacent to each other in the stacking direction. One end (outer end) 21a of the first coil conductor 21 is exposed on the first side surface 1c. The other end (inner end) 21b of the first coil conductor 21 is connected to the first pad conductor 41 located in the same layer as the first coil conductor 21. In the present embodiment, the first coil conductor 21 and the first pad conductor 41 are integrally formed.

The second coil conductor 22 has a spiral shape and is arranged between a pair of non-magnetic material layers 4 adjacent to each other in the stacking direction. One end (outer end) 22a of the second coil conductor 22 is exposed on the second side surface 1d. The other end (inner end) 22b of the second coil conductor 22 is connected to the second pad conductor 42 located in the same layer as the second coil conductor 22. In the present embodiment, the second coil conductor 22 and the second pad conductor 42 are integrally formed.

The third coil conductor 23 has a spiral shape and is arranged between a pair of non-magnetic material layers 4 adjacent to each other in the stacking direction. One end (outer end) 23a of the third coil conductor 23 is exposed on the first side surface 1c. The other end (inner end) 23b of the third coil conductor 23 is connected to the third pad conductor 43 located in the same layer as the third coil conductor 23. In the present embodiment, the third coil conductor 23 and the third pad conductor 43 are integrally formed.

The fourth coil conductor 24 has a spiral shape and is arranged between a pair of non-magnetic material layers 4 adjacent to each other in the stacking direction. One end (outer end) 24a of the fourth coil conductor 24 is exposed on the second side surface 1d. The other end (inner end) 24b of the fourth coil conductor 24 is connected to the fourth pad conductor 44 located in the same layer as the fourth coil conductor 24. In the present embodiment, the fourth coil conductor 24 and the fourth pad conductor 44 are integrally formed.

The first coil conductor 21 and the third coil conductor 23 are adjacent to each other via the non-magnetic material layer 4 in the stacking direction, and the second coil conductor 22 and the fourth coil conductor 24 are laminated via the non-magnetic material layer 4. Adjacent to each other in direction. The third coil conductor 23 is located between the first coil conductor 21 and the second coil conductor 22 in the stacking direction. That is, the first to fourth coil conductors 21 to 24 are arranged in the order of the first coil conductor 21, the third coil conductor 23, the second coil conductor 22, and the fourth coil conductor 24 in the stacking direction. The first to fourth coil conductors 21 to 24 are wound in the same direction and are positioned so as to overlap each other when viewed from the stacking direction.

The first pad conductor 41 and the second pad conductor 42 are located so as to overlap each other when viewed from the stacking direction. Between the first pad conductor 41 and the second pad conductor 42, a fifth pad conductor 45 located in the same layer as the third coil conductor 23 is formed, and the first and second pad conductors 41, when viewed from the stacking direction, It is arranged so as to overlap with the 42. That is, the first pad conductor 41 and the fifth pad conductor 45 are adjacent to each other via the non-magnetic material layer 4 in the stacking direction, and the fifth pad conductor 45 and the second pad conductor 42 are non-magnetic material layers in the stacking direction. Adjacent to each other via 4.

The first pad conductor 41, the fifth pad conductor 45, and the second pad conductor 42 are connected via the first through-hole conductor 51, respectively. The first through-hole conductor 51 is a non-magnetic material layer 4 located between the first pad conductor 41 and the fifth pad conductor 45, and a non-magnetic material layer 4 located between the fifth pad conductor 45 and the second pad conductor 42. It penetrates the magnetic material layer 4.

The third pad conductor 43 and the fourth pad conductor 44 are located so as to overlap each other when viewed from the stacking direction. Between the third pad conductor 43 and the fourth pad conductor 44, a sixth pad conductor 46 located in the same layer as the second coil conductor 22 is formed, when viewed from the stacking direction, the third and fourth pad conductors 43, It is arranged so as to overlap with the 44. That is, the third pad conductor 43 and the sixth pad conductor 46 are adjacent to each other via the non-magnetic material layer 4 in the stacking direction, and the sixth pad conductor 46 and the fourth pad conductor 44 are non-magnetic material layers in the stacking direction. Adjacent to each other via 4.

The third pad conductor 43, the sixth pad conductor 46, and the fourth pad conductor 44 are connected via the second through-hole conductor 52, respectively. The second through-hole conductor 52 is a non-magnetic material layer 4 located between the third pad conductor 43 and the sixth pad conductor 46, and a non-magnetic material layer 4 located between the sixth pad conductor 46 and the fourth pad conductor 44. It penetrates the magnetic material layer 4.

The first coil conductor 21 and the second coil conductor 22 are electrically connected to each other through the first pad conductor 41, the fifth pad conductor 45, the second pad conductor 42, and the first through-hole conductor 51. The first coil conductor 21 and the second coil conductor 22 constitute the first coil C1. The third coil conductor 23 and the fourth coil conductor 24 are electrically connected to each other through the third pad conductor 43, the sixth pad conductor 46, the fourth pad conductor 44, and the second through-hole conductor 52. The third coil conductor 23 and the fourth coil conductor 24 constitute the second coil C2.

The laminated common mode filter CF includes a first coil C1 and a second coil C2 in the element body 1 (non-magnetic material portion 3). In the first coil C1 and the second coil C2, the first coil conductor 21 and the third coil conductor 23 are adjacent to each other in the stacking direction, and the third coil conductor 23 and the second coil conductor 22 are adjacent to each other in the stacking direction. The second coil conductor 22 and the fourth coil conductor 24 are arranged in the non-magnetic material portion 3 so as to be adjacent to each other in the stacking direction. The first coil C1 and the second coil C2 are magnetically coupled to each other.

The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 contain a conductive material (for example, Ag or Pd). The fifth and sixth pad conductors 45, 46 and the first and second through-hole conductors 51, 52 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). .. The first and second through-hole conductors 51 and 52 are formed by sintering the conductive paste filled in the through holes formed in the ceramic green sheet that constitutes the corresponding non-magnetic material layer 4. To.

The first external electrode 11 and the third external electrode 13 are arranged on the first side surface 1c side of the element body 1. That is, the first external electrode 11 and the third external electrode 13 are arranged at one end of the element body 1 in the second direction D2. The first external electrode 11 and the third external electrode 13 are formed so as to cover a part of the first side surface 1c along the first direction D1, and a part of the first main surface 1a and the second main surface. It is formed in a part of 1b. The first external electrode 11 is located closer to the third side surface 1e, and the third external electrode 13 is located closer to the fourth side surface 1f.

The second external electrode 12 and the fourth external electrode 14 are arranged on the second side surface 1d side of the element body 1. That is, the second external electrode 12 and the fourth external electrode 14 are arranged at the other end of the element body 1 in the second direction D2. The second external electrode 12 and the fourth external electrode 14 are formed so as to cover a part of the second side surface 1d along the first direction D1, and a part of the first main surface 1a and the second main surface. It is formed in a part of 1b. The second external electrode 12 is located closer to the third side surface 1e, and the fourth external electrode 14 is located closer to the fourth side surface 1f.

As shown in FIG. 4, the first external electrode 11 is arranged on the electrode portion 11a arranged on the first main surface 1a, the electrode portion 11b arranged on the second main surface 1b, and the first side surface 1c. It has an electrode portion 11c that is formed. The first external electrode 11 is not formed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, and 1c. The electrode portions 11a, 11b, and 11c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected to each other.

The electrode portion 11c covers all the end portions exposed on the first side surface 1c of the first coil conductor 21. The first coil conductor 21 is connected to the electrode portion 11c at an end portion exposed on the first side surface 1c. That is, the first external electrode 11 and the first coil conductor 21 are electrically connected. One end 21a of the first coil conductor 21 functions as a connecting conductor with the first external electrode 11.

As shown in FIG. 4, the second external electrode 12 is arranged on the electrode portion 12a arranged on the first main surface 1a, the electrode portion 12b arranged on the second main surface 1b, and the second side surface 1d. It has an electrode portion 12c that is formed. The second external electrode 12 is not formed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, and 1d. The electrode portions 12a, 12b, and 12c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected to each other.

The electrode portion 12c covers all the end portions exposed on the second side surface 1d of the second coil conductor 22. The second coil conductor 22 is connected to the electrode portion 12c at an end portion exposed on the second side surface 1d. That is, the second external electrode 12 and the second coil conductor 22 are electrically connected. One end 22a of the second coil conductor 22 functions as a connecting conductor with the second external electrode 12.

As shown in FIG. 5, the third external electrode 13 is arranged on the electrode portion 13a arranged on the first main surface 1a, the electrode portion 13b arranged on the second main surface 1b, and the first side surface 1c. It has an electrode portion 13c that is formed. The third external electrode 13 is not formed on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, and 1c. The electrode portions 13a, 13b, and 13c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected to each other.

The electrode portion 13c covers all the end portions exposed on the first side surface 1c of the third coil conductor 23. The third coil conductor 23 is connected to the electrode portion 13c at an end portion exposed on the first side surface 1c. That is, the third external electrode 13 and the third coil conductor 23 are electrically connected. One end 23a of the third coil conductor 23 functions as a connecting conductor with the third external electrode 13.

As shown in FIG. 5, the fourth external electrode 14 is arranged on the electrode portion 14a arranged on the first main surface 1a, the electrode portion 14b arranged on the second main surface 1b, and the second side surface 1d. It has an electrode portion 14c that is formed. The fourth external electrode 14 is not formed on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, and 1d. The electrode portions 14a, 14b, and 14c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected to each other.

The electrode portion 14c covers all the end portions exposed on the second side surface 1d of the fourth coil conductor 24. The fourth coil conductor 24 is connected to the electrode portion 14c at an end portion exposed on the second side surface 1d. That is, the fourth external electrode 14 and the fourth coil conductor 24 are electrically connected. One end 24a of the fourth coil conductor 24 functions as a connecting conductor with the fourth external electrode 14.

The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 include the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. That is, each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, 14a to 14c includes the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. The third electrode layer E3 constitutes the outermost layers of the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14, respectively.

The first electrode layer E1 is formed by applying a conductive paste to the surface of the element body 1 and baking it. The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer E1 is a sintered metal layer arranged on the element body 1. In the present embodiment, the first electrode layer E1 is a sintered metal layer made of Ag. The first electrode layer E1 may be a sintered metal layer made of Pd. As the conductive paste, a powder made of Ag or Pd mixed with a glass component, an organic binder, and an organic solvent is used.

The second electrode layer E2 is formed on the first electrode layer E1 by a plating method. In the present embodiment, the second electrode layer E2 is a Ni plating layer formed by Ni plating on the first electrode layer E1. The second electrode layer E2 may be a Cu plating layer.

The third electrode layer E3 is formed on the second electrode layer E2 by a plating method. In the present embodiment, the third electrode layer E3 is a Sn plating layer formed by Sn plating on the second electrode layer E2. The second electrode layer E2 and the third electrode layer E3 form a plating layer arranged on the first electrode layer E1. That is, in the present embodiment, the plating layer formed on the first electrode layer E1 has a two-layer structure.

The first electrode layer E1 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The second electrode layer E2 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is integrally formed. The third electrode layer E3 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, and 14a to 14c is also integrally formed.

In each of the electrode portions 11a, 12a, 13a, 14a, the edge of the first electrode layer E1 in the second direction D2 (the direction in which the first side surface 1c and the second side surface 1d face each other), that is, the first electrode The end of the layer E1 in the second direction D2 is exposed from the second electrode layer E2 and the third electrode layer E3. In each of the electrode portions 11a, 12a, 13a, 14a, only a part of the first electrode layer E1 is covered with a plating layer composed of the second electrode layer E2 and the third electrode layer E3. That is, the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a includes a portion covered with a plating layer composed of the second electrode layer E2 and the third electrode layer E3. It includes the part exposed from the plating layer. The portion of the first electrode layer E1 exposed from the plating layer includes an edge (end portion) of the first electrode layer E1 in the second direction D2.

In each of the electrode portions 11b, 11c, 12b, 12c, 13b, 13c, 14b, 14c, the entire first electrode layer E1 is covered with a plating layer composed of the second electrode layer E2 and the third electrode layer E3. ing.

The laminated common mode filter CF is solder-mounted on an electronic device (for example, a circuit board or an electronic component). In the laminated common mode filter CF, the first main surface 1a is a mounting surface facing the electronic device.

The laminated common mode filter CF includes a resin film I as shown in FIGS. 3 to 5. The resin film I has electrical insulation and is arranged on the first main surface 1a. The resin film I covers the end edge (end portion) of the first electrode layers E1 of each electrode portion 11a, 12a, 13a, 14a in the second direction D2, and is in contact with the end edge (end portion). .. That is, the resin film I covers the portion of the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a that is exposed from the plating layer, and is in contact with the portion. The plating layer (second electrode layer E2 and third electrode layer E3) is arranged on the region of the first electrode layer E1 exposed from the resin film I.

The resin film I is the edge (edge) of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a of the four first to fourth external electrodes 11, 12, 13, 14 adjacent to each other. Part) is covered integrally. The resin film I also covers the regions exposed from the electrode portions 11a, 12a, 13a, and 14a on the first main surface 1a, and is in contact with the regions. The resin film I covers a part of each of the third side surface 1e and the fourth side surface 1f, and is in contact with the part. That is, the resin film I is formed so as to wrap around not only on the first main surface 1a but also on the third side surface 1e and the fourth side surface 1f.

The resin film I is made of an insulating resin such as an epoxy resin. The resin film I is formed, for example, by applying an insulating resin coating agent and solidifying the resin film I. A screen printing method, a spray coating method, or the like can be used to apply the insulating resin coating agent. As the insulating resin coating agent, a thermosetting type insulating resin coating agent, an ultraviolet curable type insulating resin coating agent, or a coating agent containing both of these insulating resin coating agents can be used.

As shown in FIGS. 6 and 7, when the laminated common mode filter CF is solder-mounted on the electronic device ED, the resin film I functions as a solder resist. The electronic device ED is, for example, a circuit board or other electronic component. 6 and 7 are diagrams for explaining the mounting structure of the laminated common mode filter according to the present embodiment.

The resin film I covers the edge (end) of the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a in the second direction D2, and the edge (end) is plated. Since the layers (second electrode layer E2 and third electrode layer E3) are not arranged, the solder fillet SF is the end of each electrode portion 11a, 12a, 13a, 14a in the first electrode layer E1 in the second direction D2. It does not reach the edge. Therefore, even when an external force acts on the laminated common mode filter CF through the solder fillet SF, it is difficult for stress to concentrate on the edge (end) in the second direction D2 of the first electrode layer E1, and the edge (end). The end) is unlikely to be the starting point for cracks. Therefore, in the laminated common mode filter CF, the generation of cracks in the element body 1 is suppressed.

In the laminated common mode filter CF, the resin film I covers the end edge (end portion) of each of the electrode portions 11a, 12a, 13a, 14a in the first electrode layer E1 in the second direction D2. Therefore, in particular, the generation of cracks due to the external force (deflection stress) acting when the electronic device ED bends in the second direction D2 is suppressed.

In the present embodiment, since the entire electrode portions 11c, 12c, 13c, 14c are exposed from the resin film I, solder fillets are formed on the electrode portions 11c, 12c, 13c, 14c as shown in FIGS. 6 and 7. SF is formed. Therefore, the mounting strength of the laminated common mode filter CF is ensured.

The plating layers (second electrode layer E2 and third electrode layer E3) included in the electrode portions 11a, 12a, 13a, 14a are arranged on the region of the first electrode layer E1 exposed from the resin film I. There is. Therefore, in the laminated common mode filter CF, not only the electrode portions 11c, 12c, 13c, 14c but also the electrode portions 11a, 12a, 13a, 14a are connected to the electronic device ED via solder. Therefore, in the laminated common mode filter CF, the entire first electrode layer E1 included in the electrode portions 11a, 12a, 13a, 14a is covered with the resin film I, and the electrode portions 11a, 12a, 13a, 14a are plated layers. Compared with the laminated common mode filter CF that does not contain the above, the decrease in mounting strength is prevented.

In the laminated common mode filter CF, the first external electrode 11 and the third external electrode 13 are arranged on the first side surface 1c side of the element body 1. Therefore, the first external electrode 11 and the third external electrode 13 are not formed so as to cover the entire first side surface 1c, and the surface areas of the first external electrode 11 and the third external electrode 13 must be small. Do not get. Similarly, since the second external electrode 12 and the fourth external electrode 14 are arranged on the second side surface 1d side of the element body 1, the surface areas of the second external electrode 12 and the fourth external electrode 14 must be small. Do not get. On the other hand, in the laminated common mode filter CF, as described above, not only the electrode portions 11c, 12c, 13c, 14c but also the electrode portions 11a, 12a, 13a, 14a are connected to the electronic device ED via solder. Therefore, the mounting strength of the laminated common mode filter CF is ensured.

In the present embodiment, the resin film I is the first electrode layer E1 included in the electrode portions 11a, 12a, 13a, 14a of the four first to fourth external electrodes 11, 12, 13, 14 adjacent to each other. The end edge (end portion) is integrally covered. Therefore, in the laminated common mode filter CF, the resin film I can be easily formed.

Next, the configuration of the laminated common mode filter CF according to the modified example of the present embodiment will be described with reference to FIGS. 8 to 11. 8 to 11 are plan views of the laminated common mode filter according to this modification. In each modification, the shape of the resin film is different from that of the above-mentioned laminated common mode filter CF.

The laminated common mode filter CF shown in FIGS. 8 and 9 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated from each other in the second direction D2, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia has the edge (end) of the first electrode layer E1 included in the electrode portions 11a, 13a of the two first and third external electrodes 11, 13 adjacent to each other in the third direction D3. It covers all together. The resin film Ib forms the edge (end) of the first electrode layer E1 included in the electrode portions 12a, 14a of the two second and fourth external electrodes 12, 14 adjacent to each other in the third direction D3. It covers it all together.

The laminated common mode filter CF shown in FIG. 10 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated from each other in the third direction D3, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia has the edge (end) of the first electrode layer E1 included in the electrode portions 11a, 12a of the two first and second external electrodes 11 and 12 adjacent to each other in the second direction D2. It covers all together. The resin film Ib has the edge (end) of the first electrode layer E1 included in the electrode portions 13a and 14a of the two third and fourth external electrodes 13 and 14 adjacent to each other in the second direction D2. It covers it all together.

In the laminated common mode filter CF of each of the modified examples shown in FIGS. 8 to 10, the occurrence of cracks in the element body 1 is suppressed, the mounting strength is ensured, and the resin film I is easily formed. ..

The laminated common mode filter CF shown in FIG. 11 includes four resin films Ic, Id, Ie, and If. The four resin films Ic, Id, Ie, and If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14, and are separated from each other. The resin film Ic covers only the edge (end) of the first electrode layer E1 included in the electrode portion 11a of the first external electrode 11. The resin film Id covers only the edge (end) of the first electrode layer E1 included in the electrode portion 12a of the second external electrode 12. The resin film IE covers only the edge (end) of the first electrode layer E1 included in the electrode portion 13a of the third external electrode 13. The resin film If covers only the edge (end) of the first electrode layer E1 included in the electrode portion 14a of the fourth external electrode 14.

Even in the laminated common mode filter CF of the modified example shown in FIG. 11, the occurrence of cracks in the element body 1 is suppressed and the mounting strength is secured. In this modification, the resin films Ic, Id, Ie, and If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14, and the corresponding first to fourth external electrodes 11, 12, The end edge (end portion) of the first electrode layer E1 included in the electrode portions 11a, 12a, 13a, 14a of 13 and 14 is covered. Therefore, the amount of the resin used to form the resin films Ic, Id, Ie, and If is reduced.

Next, the configuration of the laminated common mode filter CF according to the modified example of the present embodiment will be described with reference to FIGS. 12 to 14. FIG. 12 is a plan view of the laminated common mode filter according to this modification. FIG. 13 is a diagram for explaining the cross-sectional configuration of the first external electrode, the third external electrode, and the resin layer. FIG. 14 is a diagram for explaining the cross-sectional structure of the second external electrode, the fourth external electrode, and the resin layer.

In the laminated common mode filter CF shown in FIG. 12, the edge of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a covers the entire circumference of the second electrode layer E2 and the third electrode. Exposed from layer E3. Also in this modification, in each of the electrode portions 11a, 12a, 13a, 14a, only a part of the first electrode layer E1 is covered with a plating layer composed of the second electrode layer E2 and the third electrode layer E3. There is. That is, the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a includes a portion covered with a plating layer composed of the second electrode layer E2 and the third electrode layer E3. It includes the part exposed from the plating layer. The portion of the first electrode layer E1 exposed from the plating layer includes the edge of the first electrode layer E1 and is located outside the plating layer when viewed from the first direction D1.

In this modification, as shown in FIGS. 13 and 14, in each of the electrode portions 11a, 12a, 13a, 14a, the third direction D3 (third side surface 1e and fourth side surface 1f) in the first electrode layer E1 is formed. The edge in the opposite direction), that is, both ends of the first electrode layer E1 in the third direction D3 are exposed from the second electrode layer E2 and the third electrode layer E3. Although a new illustration is omitted, in this modification, as shown in FIGS. 4 and 5, in the second direction D2 in the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a. The edge of the first electrode layer E1, that is, the end portion of the first electrode layer E1 in the second direction D2 is also exposed from the second electrode layer E2 and the third electrode layer E3.

The resin film I covers the edge of the first electrode layer E1 of each of the electrode portions 11a, 12a, 13a, 14a over the entire circumference and is in contact with the edge. That is, the resin film I covers the portion of the first electrode layer E1 of each electrode portion 11a, 12a, 13a, 14a that is exposed from the plating layer, and is in contact with the portion. The plating layer (second electrode layer E2 and third electrode layer E3) is arranged on the region of the first electrode layer E1 exposed from the resin film I.

In the laminated common mode filter CF of the modified example shown in FIGS. 12 to 14, the resin film I covers the entire circumference of the edge of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a. It covers and is in contact with the edge. Therefore, it is difficult for stress to concentrate over the entire circumference of the edge of the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a, and the edge is unlikely to be the starting point of cracks over the entire circumference.

In the laminated common mode filter CF of this modification, the resin film I covers the edges of the first electrode layers E1 of the electrode portions 11a, 12a, 13a, and 14a in the second direction D2 over the entire circumference. Therefore, not only the external force acting when the electronic device ED bends in the second direction D2, but also the generation of cracks due to the external force (deflection stress) acting when the electronic device ED bends in the third direction D3 occurs. It is suppressed.

In this modification as well, the plating layer (second electrode layer E2 and third electrode layer E3) included in the electrode portions 11a, 12a, 13a, 14a is a region exposed from the resin film I in the first electrode layer E1. It is placed on top. Therefore, also in this modification, the mounting strength of the laminated common mode filter CF is ensured as in the above-described embodiment.

Next, the configuration of the laminated common mode filter CF according to the modified example of the present embodiment will be described with reference to FIGS. 15 to 17. 15 to 17 are plan views of the laminated common mode filter according to this modification. In each modification, the shape of the resin film is different from that of the laminated common mode filter CF of the modification shown in FIGS. 12 to 14.

The laminated common mode filter CF shown in FIG. 15 includes four resin films Ic, Id, Ie, and If. The four resin films Ic, Id, Ie, and If are provided for each of the first to fourth external electrodes 11, 12, 13, and 14, and are separated from each other. The resin film Ic covers only the edge of the first electrode layer E1 included in the electrode portion 11a of the first external electrode 11 over the entire circumference. The resin film Id covers only the edge of the first electrode layer E1 included in the electrode portion 12a of the second external electrode 12 over the entire circumference. The resin film Ie covers only the edge of the first electrode layer E1 included in the electrode portion 13a of the third external electrode 13 over the entire circumference. The resin film If covers only the edge of the first electrode layer E1 included in the electrode portion 14a of the fourth external electrode 14 over the entire circumference.

The laminated common mode filter CF shown in FIG. 16 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated from each other in the second direction D2. The resin film Ia covers the entire circumference of the edge of the first electrode layer E1 included in the electrode portions 11a, 13a of the two first and third external electrodes 11, 13 adjacent to each other in the third direction D3. And it covers it integrally. The resin film Ib covers the entire circumference of the edge of the first electrode layer E1 included in the electrode portions 12a, 14a of the two second and fourth external electrodes 12, 14 adjacent to each other in the third direction D3. And it covers it integrally.

The laminated common mode filter CF shown in FIG. 17 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated from each other in the third direction D3. The resin film Ia covers the entire circumference of the edge of the first electrode layer E1 included in the electrode portions 11a and 12a of the two first and second external electrodes 11 and 12 adjacent to each other in the second direction D2. And it covers it integrally. The resin film Ib covers the entire circumference of the edge of the first electrode layer E1 included in the electrode portions 13a and 14a of the two third and fourth external electrodes 13 and 14 adjacent to each other in the second direction D2. And it covers it integrally.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the gist thereof.

The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 do not necessarily have the electrode portions 11b, 12b, 13b, 14b. That is, the first external electrode 11 and the third external electrode 11, 13 may be arranged only on the two surfaces 1a and 1c, and the second external electrode 12 and the fourth external electrode 12, 14 may be arranged on the two surfaces. It may be arranged only in 1a and 1d.

The first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are necessarily three layers composed of the first electrode layer E1, the second electrode layer E2, and the third electrode layer E3. It does not have to have a structure. For example, a conductive resin layer may be arranged between the first electrode layer E1 and the second electrode layer E2. That is, the second electrode layer E2 may be arranged on the first electrode layer E1 via the conductive resin layer. The conductive resin layer can be formed by curing the conductive resin applied on the first electrode layer E1. As the conductive resin, a mixture of a thermosetting resin, a metal powder, an organic solvent, or the like is used. As the metal powder, for example, Ag powder or the like is used. As the thermosetting resin, for example, a phenol resin, an acrylic resin, a silicone resin, an epoxy resin, a polyimide resin, or the like is used.

The plating layer arranged on the first electrode layer E1 does not necessarily have to have a two-layer structure including the second electrode layer E2 and the third electrode layer E3. The plating layer arranged on the first electrode layer E1 may be a single layer, or may have a laminated structure of three or more layers. For example, the plating layer arranged on the first electrode layer E1 has a three-layer structure consisting of a Ni plating layer, a Cu plating layer formed on the Ni plating layer, and a Sn plating layer formed on the Cu plating layer. Alternatively, it may have a three-layer structure including a Cu plating layer, a Ni plating layer formed on the Cu plating layer, and a Sn plating layer formed on the Ni plating layer.

The number of external electrodes arranged at the ends of the element 1 in the second direction D2 is not limited to "two". The number of external electrodes arranged at the ends of the element 1 in the second direction D2 may be "three" or more.

In the present embodiment and the modified examples, the laminated common mode filter CF has been described as an example of the electronic component, but the applicable electronic component is not limited to the laminated capacitor and the laminated common mode filter. Applicable electronic components are, for example, laminated electronic components such as laminated capacitors, laminated inductors, laminated varistor, laminated piezoelectric actuators, laminated thermistors, or laminated composite components, or electronic components other than laminated electronic components.

1 ... Elementary body, 1a ... First main surface, 1c ... First side surface, 1d ... Second side surface, 11 ... First external electrode, 11a, 11b, 11c ... Electrode portion included in the first external electrode, 12 ... Second external electrode, 12a, 12b, 12c ... Electrode portion of the second external electrode, 13 ... Third external electrode, 13a, 13b, 13c ... Electrode portion of the third external electrode, 14 ... Fourth external electrode, 14a, 14b, 14c ... Electrode portion of the fourth external electrode, CF ... Laminated common mode filter, D2 ... Second direction, E1 ... First electrode layer, E2 ... Second electrode layer , E3 ... Third electrode layer, I, Ia, Ib, Ic, Id, Ie, If ... Resin film.

Claims (4)

An element body having a rectangular parallelepiped shape and having a main surface as a mounting surface and a pair of side surfaces facing each other and adjacent to the main surface.
A plurality of a plurality of electrodes are arranged at both ends of the element body in a direction in which the pair of side surfaces face each other, and a first electrode portion arranged on the main surface and a second electrode arranged on the side surfaces are arranged. An external electrode that has a part and
One end of the element is exposed to the corresponding end of both ends of the element, and the other ends are arranged in the element so as not to be exposed to the element, and the plurality of external electrodes are arranged. Of the conductors that are electrically connected to the corresponding external electrodes,
A resin film which is arranged on the main surface and has electrical insulation is provided.
The first electrode portion and the second electrode portion include a sintered metal layer arranged on the element body and a plating layer arranged on the sintered metal layer.
The resin film does not cover the one end portion of the conductor exposed to the element body, and the pair of side surfaces of the sintered metal layer included in the first electrode portion face each other. At least covers the edge and is in contact with the edge
An electronic component in which the plating layer included in the first electrode portion is arranged on a region of the sintered metal layer included in the first electrode portion that is exposed from the resin film. The electronic component according to claim 1, wherein the resin film integrally covers the edge of the sintered metal layer included in the first electrode portion of at least two adjacent external electrodes. The first aspect of the present invention, wherein the resin film is provided for each of the external electrodes and covers the edge of the sintered metal layer included in the first electrode portion of the corresponding external electrode. Electronic components. The one according to any one of claims 1 to 3, wherein the resin film covers the edge of the sintered metal layer included in the first electrode portion over the entire circumference and is in contact with the edge. Electronic components.

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