JP6740874B2 - Electronic parts - Google Patents

Description

The present invention relates to electronic components.

An electronic component including an element body and an external electrode arranged on the surface of the element body is known (for example, see Patent Document 1). In the electronic component described in Patent Document 1, the external electrode includes a sintered metal layer arranged on the surface of the element body and a conductive resin layer arranged so as to cover the sintered metal layer. doing.

JP, 2014-143387, A

An aspect of the present invention is to provide an electronic component in which peeling of the conductive resin layer is suppressed.

As a result of the research conducted by the present inventors, the following matters were found. The conductive resin layer is in contact with the element body. In the electronic component described in Patent Document 1, since the conductive resin layer is arranged so as to cover the sintered metal layer, the edge of the conductive resin layer is in contact with the element body. Since the conductive resin layer generally contains a conductive material (for example, metal powder) and a resin (for example, a thermosetting resin), it is more bonded to the element body than a resin that does not contain the conductive material. Low strength.

When the electronic component is mounted on the electronic device, an external force acting on the electronic component from the electronic device may act on the external electrode as a stress. For example, when the electronic device is a substrate, the external force acts on the electronic component by bending the substrate. Since the stress acting on the external electrode tends to act particularly on the portion of the external electrode that is disposed on the main surface that is the mounting surface, the conductive resin layer included in the portion is removed from the element body. May peel off.

When the conductive resin layer is peeled off from the element body, the mounting strength of the electronic component may be reduced. In addition, water may enter between the element body and the conductive resin layer to deteriorate the electrical characteristics of the electronic component.

An electronic component according to one aspect of the present invention includes an element body having a main surface serving as a mounting surface and side surfaces adjacent to the main surface, and a first electrode portion arranged on the main surface. An external electrode having a second electrode portion disposed on a side surface, and a resin film disposed on the main surface so as to be in contact with the main surface and having electrical insulation, the first electrode The portion and the second electrode portion each include a conductive resin layer arranged on the element body, and the conductive resin layer included in the first electrode portion is arranged on the resin film so as to be in contact with the resin film. There is.

In the electronic component according to the above aspect of the present invention, the conductive resin layer included in the first electrode portion is in contact with the resin film in contact with the main surface of the element body. That is, the resin film is interposed between the conductive resin layer included in the first electrode portion and the main surface of the element body. Unlike the conductive resin layer, the resin film does not contain a conductive material and has a high adhesive strength with the element body. Like the resin film, the conductive resin layer contains a resin, and thus has high adhesive strength with the resin film. Therefore, according to this aspect, peeling of the conductive resin layer included in the first electrode portion is unlikely to occur.

The burner is further provided with an inner conductor arranged in the body and having an end exposed on the side surface, and the second electrode portion is connected to the end of the inner conductor and arranged on the side surface so as to be in contact with the side surface. The conductive resin layer including the binder metal layer and included in the second electrode portion may be disposed on the element body via the sintered metal layer. In this case, the inner conductor is electrically connected to the conductive resin layer via the sintered metal layer. Therefore, in the present embodiment, the connection strength between the inner conductor and the external electrode is higher than that in the configuration in which the inner conductor and the conductive resin layer are directly connected, and the inner conductor and the outer electrode are reliably electrically connected. Connected to.

The resin film may cover the edge of the sintered metal layer and be in contact with the edge. In this case, since the end portion of the resin film is sandwiched between the sintered metal layer and the conductive resin layer, peeling of the resin film does not easily occur.

The element body may further have a side surface facing the side surface, and a plurality of external electrodes may be arranged at both ends of the element body in a direction in which the pair of side surfaces face each other. When a plurality of external electrodes are arranged at both ends of the element body in the direction in which the pair of side surfaces face each other, the external electrodes are not formed so as to cover the entire side surfaces, and The area must be small. Therefore, the area of the conductive resin layer also becomes small, and the adhesive strength of the conductive resin layer may decrease. However, also in this embodiment, since the conductive resin layer included in the first electrode portion is in contact with the resin film in contact with the main surface of the element body, the conductive resin layer included in the first electrode portion is included. Peeling is unlikely to occur.

The resin film may be in contact with the conductive resin layer included in the first electrode portions of at least two adjacent external electrodes. In this case, it is easy to form the resin film.

The resin film is provided for each external electrode and may be in contact with the conductive resin layer included in the first electrode portion of the corresponding external electrode. In this case, the amount of resin used to form the resin film is reduced.

According to one aspect of the present invention, it is possible to provide an electronic component in which peeling of the conductive resin layer is suppressed.

It is a perspective view which shows the laminated common mode filter which concerns on one Embodiment. It is a top view which shows the laminated common mode filter which concerns on this embodiment. It is an exploded perspective view showing composition of an element body. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 2nd external electrode, and a resin film. It is a figure for demonstrating the cross-sectional structure of a 3rd external electrode, a 4th external electrode, and a resin film. It is a figure for demonstrating the mounting structure of the laminated common mode filter which concerns on this embodiment. It is a figure for demonstrating the mounting structure of the laminated common mode filter which concerns on this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a top view which shows the laminated common mode filter which concerns on the modification of this embodiment. It is a figure for demonstrating the cross-sectional structure of a 1st external electrode, a 2nd external electrode, and a resin layer. It is a figure for demonstrating the cross-sectional structure of a 3rd external electrode, a 4th external electrode, and a resin layer.

Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings. In the description, the same elements or elements having the same function will be denoted by the same reference symbols, without redundant description.

The configuration of the laminated common mode filter CF according to this embodiment will be described with reference to FIGS. 1 to 5. FIG. 1 is a perspective view showing a laminated common mode filter according to this embodiment. FIG. 2 is a plan view showing the laminated common mode filter according to the present embodiment. FIG. 3 is an exploded perspective view showing the structure of the element body. FIG. 4 is a diagram for explaining cross-sectional configurations of the first external electrode, the second external electrode, and the resin film. FIG. 5 is a diagram for explaining cross-sectional configurations of the third external electrode, the fourth external electrode, and the resin film. In the present embodiment, the laminated common mode filter CF will be described as an example of the electronic component.

As shown in FIGS. 1 to 3, the laminated common mode filter CF includes an element body 1, and a first outer electrode 11, a second outer electrode 12, and a third outer electrode 13 arranged on the outer surface of the element body 1. , And a fourth outer electrode 14. The laminated common-mode filter CF includes an electronic device (for example, a circuit board or a circuit board) so that the first external electrode 11, the second external electrode 12, the third external electrode 13, and the fourth external electrode 14 are connected to signal lines, respectively. Solder mounted on electronic parts).

The element body 1 has a rectangular parallelepiped shape. As the outer surface of the element body 1, the first main surface 1a and the second main surface 1b facing each other, the first side surface 1c and the second side surface 1d facing each other, and the first facing surface It has three side surfaces 1e and a fourth side surface 1f. The direction in which the first main surface 1a and the second main surface 1b face each other is a first direction D1, and the direction in which the first side surface 1c and the second side surface 1d face each other is a second direction D2, The direction in which the third side face 1e and the fourth side face 1f face each other is the third direction D3. In this embodiment, the first direction D1 is the height direction of the element body 1, the second direction D2 is the longitudinal direction of the element body 1, and the third direction D3 is the width direction of the element body 1. The rectangular parallelepiped shape includes a rectangular parallelepiped shape with chamfered corners and ridges, and a rectangular parallelepiped shape with rounded corners and ridges.

The first side surface 1c and the second side surface 1d extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and also to the second main surface 1b. The first side surface 1c and the second side surface 1d also extend in the third direction D3 (the short side direction of the first main surface 1a and the second main surface 1b).

The third side surface 1e and the fourth side surface 1f extend in the first direction D1 so as to connect the first main surface 1a and the second main surface 1b. The first side surface 1c and the second side surface 1d are adjacent to the first main surface 1a and also to the second main surface 1b. The third side surface 1e and the fourth side surface 1f also extend in the second direction D2 (the long side direction of the first main surface 1a and the second main surface 1b).

The element body 1 has a non-magnetic body portion 3 and a pair of magnetic body portions 5 arranged so as to sandwich the non-magnetic body portion 3 in the first direction D1. The element body 1 is composed of a plurality of laminated insulator layers. In the non-magnetic material part 3, a plurality of non-magnetic material layers 4 are laminated as an insulating layer. That is, the non-magnetic part 3 is composed of a plurality of stacked non-magnetic layers 4. In each magnetic body part 5, a plurality of magnetic body layers 6 are laminated as an insulating layer. That is, the magnetic body portion 5 is composed of a plurality of laminated magnetic body layers 6. The plurality of insulating layers include a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6.

Each nonmagnetic layer 4 is made of, for example, a sintered body of a ceramic green sheet containing a nonmagnetic material (Cu-Zn ferrite material, dielectric material, glass ceramic material, or the like). Each magnetic layer 6 is made of, for example, a ceramic green sheet sintered body containing a magnetic material (Ni-Cu-Zn-based ferrite material, Ni-Cu-Zn-Mg-based ferrite material, Ni-Cu-based ferrite material, or the like). Composed.

In the actual element body 1, each non-magnetic layer 4 and each magnetic layer 6 are integrated so that the boundary between layers cannot be visually recognized. In the first direction D1, that is, in the direction in which the first main surface 1a and the second main surface 1b oppose each other, a plurality of insulating layers, that is, a plurality of nonmagnetic layers 4 and a plurality of magnetic layers 6 are laminated. The same direction (hereinafter, simply referred to as “stacking direction”) is the same.

As shown in FIG. 3, the laminated common mode filter CF includes a first coil conductor 21, a second coil conductor 22, a third coil conductor 23, and a fourth coil conductor 24 in the non-magnetic body portion 3. .. The first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the fourth coil conductor 24 are internal conductors arranged in the element body 1. Each of the conductors 21 to 24 includes a conductive material (for example, Ag or Pd). Each of the conductors 21 to 24 is configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder).

The first coil conductor 21 has a spiral shape and is arranged between a pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 21a of the first coil conductor 21 is exposed on the first side face 1c. The other end (inner end) 21b of the first coil conductor 21 is connected to the first pad conductor 41 located in the same layer as the first coil conductor 21. In the present embodiment, the first coil conductor 21 and the first pad conductor 41 are integrally formed.

The second coil conductor 22 has a spiral shape and is arranged between the pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 22a of the second coil conductor 22 is exposed on the second side face 1d. The other end (inner end) 22b of the second coil conductor 22 is connected to the second pad conductor 42 located in the same layer as the second coil conductor 22. In the present embodiment, the second coil conductor 22 and the second pad conductor 42 are integrally formed.

The third coil conductor 23 has a spiral shape and is arranged between a pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 23a of the third coil conductor 23 is exposed on the first side face 1c. The other end (inner end) 23b of the third coil conductor 23 is connected to the third pad conductor 43 located in the same layer as the third coil conductor 23. In the present embodiment, the third coil conductor 23 and the third pad conductor 43 are integrally formed.

The fourth coil conductor 24 has a spiral shape and is arranged between the pair of nonmagnetic layers 4 adjacent to each other in the stacking direction. One end (outer end) 24a of the fourth coil conductor 24 is exposed on the second side face 1d. The other end (inner end) 24b of the fourth coil conductor 24 is connected to the fourth pad conductor 44 located in the same layer as the fourth coil conductor 24. In the present embodiment, the fourth coil conductor 24 and the fourth pad conductor 44 are integrally formed.

The first coil conductor 21 and the third coil conductor 23 are adjacent to each other in the stacking direction via the non-magnetic layer 4, and the second coil conductor 22 and the fourth coil conductor 24 are stacked via the non-magnetic layer 4. Are next to each other in the direction. The third coil conductor 23 is located between the first coil conductor 21 and the second coil conductor 22 in the stacking direction. That is, the first to fourth coil conductors 21 to 24 are arranged in the order of the first coil conductor 21, the third coil conductor 23, the second coil conductor 22, and the fourth coil conductor 24 in the stacking direction. The first to fourth coil conductors 21 to 24 are wound in the same direction and are positioned so as to overlap each other when viewed from the stacking direction.

The first pad conductor 41 and the second pad conductor 42 are located so as to overlap each other when viewed in the stacking direction. A fifth pad conductor 45 located in the same layer as the third coil conductor 23 is located between the first pad conductor 41 and the second pad conductor 42 when viewed from the stacking direction. 42 are arranged so as to overlap with each other. That is, the first pad conductor 41 and the fifth pad conductor 45 are adjacent to each other in the stacking direction with the non-magnetic layer 4 interposed therebetween, and the fifth pad conductor 45 and the second pad conductor 42 are stacked in the non-magnetic layer. 4 are adjacent to each other.

The first pad conductor 41, the fifth pad conductor 45, and the second pad conductor 42 are connected via the first through-hole conductor 51, respectively. The first through-hole conductor 51 includes a non-magnetic layer 4 located between the first pad conductor 41 and the fifth pad conductor 45, and a non-magnetic layer located between the fifth pad conductor 45 and the second pad conductor 42. The magnetic layer 4 is penetrated.

The third pad conductor 43 and the fourth pad conductor 44 are located so as to overlap each other when viewed in the stacking direction. Between the third pad conductor 43 and the fourth pad conductor 44, the sixth pad conductor 46 located in the same layer as the second coil conductor 22 is seen from the stacking direction, and the third and fourth pad conductors 43, 44 and 44. That is, the third pad conductor 43 and the sixth pad conductor 46 are adjacent to each other in the stacking direction via the non-magnetic layer 4, and the sixth pad conductor 46 and the fourth pad conductor 44 are stacked in the non-magnetic layer. 4 are adjacent to each other.

The third pad conductor 43, the sixth pad conductor 46, and the fourth pad conductor 44 are connected via the second through-hole conductor 52, respectively. The second through-hole conductor 52 is a non-magnetic layer 4 located between the third pad conductor 43 and the sixth pad conductor 46, and a non-magnetic layer located between the sixth pad conductor 46 and the fourth pad conductor 44. The magnetic layer 4 is penetrated.

The first coil conductor 21 and the second coil conductor 22 are electrically connected to each other through the first pad conductor 41, the fifth pad conductor 45, the second pad conductor 42, and the first through hole conductor 51. The first coil conductor 21 and the second coil conductor 22 form a first coil C1. The third coil conductor 23 and the fourth coil conductor 24 are electrically connected to each other through the third pad conductor 43, the sixth pad conductor 46, the fourth pad conductor 44, and the second through hole conductor 52. The third coil conductor 23 and the fourth coil conductor 24 form a second coil C2.

The laminated common mode filter CF includes a first coil C1 and a second coil C2 in the element body 1 (nonmagnetic body portion 3). In the first coil C1 and the second coil C2, the first coil conductor 21 and the third coil conductor 23 are adjacent to each other in the stacking direction, and the third coil conductor 23 and the second coil conductor 22 are adjacent to each other in the stacking direction. The second coil conductor 22 and the fourth coil conductor 24 are arranged in the non-magnetic body portion 3 so as to be adjacent to each other in the stacking direction. The first coil C1 and the second coil C2 are magnetically coupled to each other.

The fifth and sixth pad conductors 45 and 46 and the first and second through-hole conductors 51 and 52 include a conductive material (eg Ag or Pd). The fifth and sixth pad conductors 45 and 46 and the first and second through hole conductors 51 and 52 are configured as a sintered body of a conductive paste containing a conductive material (for example, Ag powder or Pd powder). .. The first and second through-hole conductors 51, 52 are formed by sintering the conductive paste filled in the through-holes formed in the ceramic green sheet that will form the corresponding non-magnetic layer 4. It

The first external electrode 11 and the third external electrode 13 are arranged on the first side face 1c side of the element body 1. That is, the first external electrode 11 and the third external electrode 13 are arranged at one end of the element body 1 in the second direction D2. The first outer electrode 11 and the third outer electrode 13 are arranged on the first side face 1c so as to cover a part of the first side face 1c along the first direction D1, and at the same time as the first main face 1a. It is arranged on the part and a part of the second main surface 1b. The first external electrode 11 is located near the third side surface 1e, and the third external electrode 13 is located near the fourth side surface 1f.

The second outer electrode 12 and the fourth outer electrode 14 are arranged on the second side face 1d side of the element body 1. That is, the second outer electrode 12 and the fourth outer electrode 14 are arranged at the other end of the element body 1 in the second direction D2. The second outer electrode 12 and the fourth outer electrode 14 are arranged on the second side face 1d so as to cover a part of the second side face 1d along the first direction D1, and also the first outer face 1a. It is arranged on the part and a part of the second main surface 1b. The second external electrode 12 is located near the third side surface 1e, and the fourth external electrode 14 is located near the fourth side surface 1f.

As shown in FIG. 4, the first external electrode 11 includes an electrode portion 11a arranged on the first main surface 1a, an electrode portion 11b arranged on the second main surface 1b, and a first side surface 1c. It has the electrode part 11c arrange|positioned above. The first external electrode 11 is not arranged on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, 1c. The electrode portions 11a, 11b, 11c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected.

The electrode portion 11c covers all the end portions exposed on the first side surface 1c of the first coil conductor 21. The first coil conductor 21 is connected to the electrode portion 11c at the end exposed on the first side surface 1c. That is, the first external electrode 11 and the first coil conductor 21 are electrically connected. One end 21a of the first coil conductor 21 functions as a connection conductor with the first external electrode 11.

As shown in FIG. 4, the second external electrode 12 includes an electrode portion 12a arranged on the first main surface 1a, an electrode portion 12b arranged on the second main surface 1b, and a second side surface 1d. It has the electrode part 12c arrange|positioned above. The second external electrode 12 is not arranged on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, 1d. The electrode portions 12a, 12b, 12c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected.

The electrode portion 12c covers all the end portions exposed on the second side face 1d of the second coil conductor 22. The second coil conductor 22 is connected to the electrode portion 12c at the end exposed on the second side face 1d. That is, the second external electrode 12 and the second coil conductor 22 are electrically connected. One end 22a of the second coil conductor 22 functions as a connection conductor with the second external electrode 12.

As shown in FIG. 5, the third external electrode 13 includes an electrode portion 13a arranged on the first main surface 1a, an electrode portion 13b arranged on the second main surface 1b, and a first side surface 1c. It has the electrode part 13c arrange|positioned above. The third external electrode 13 is not arranged on the second side surface 1d, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, 1c. The electrode portions 13a, 13b, 13c adjacent to each other are connected at the ridge portion of the element body 1 and are electrically connected.

The electrode portion 13c covers all the end portions of the third coil conductor 23 exposed on the first side surface 1c. The third coil conductor 23 is connected to the electrode portion 13c at the end exposed on the first side surface 1c. That is, the third external electrode 13 and the third coil conductor 23 are electrically connected. One end 23a of the third coil conductor 23 functions as a connection conductor with the third external electrode 13.

As shown in FIG. 5, the fourth external electrode 14 includes an electrode portion 14a arranged on the first main surface 1a, an electrode portion 14b arranged on the second main surface 1b, and a second side surface 1d. It has the electrode part 14c arrange|positioned above. The fourth external electrode 14 is not arranged on the first side surface 1c, the third side surface 1e, and the fourth side surface 1f. That is, the first external electrode 11 is arranged only on the three surfaces 1a, 1b, 1d. The electrode portions 14a, 14b, 14c adjacent to each other are connected to each other at the ridge portion of the element body 1 and are electrically connected.

The electrode portion 14c covers all the end portions of the fourth coil conductor 24 exposed on the second side face 1d. The fourth coil conductor 24 is connected to the electrode portion 14c at the end exposed on the second side face 1d. That is, the fourth outer electrode 14 and the fourth coil conductor 24 are electrically connected. One end 24a of the fourth coil conductor 24 functions as a connection conductor with the fourth outer electrode 14.

The first outer electrode 11, the second outer electrode 12, the third outer electrode 13, and the fourth outer electrode 14 are the first electrode layer E1, the second electrode layer E2, the third electrode layer E3, and the fourth electrode layer E4. Is included. In this embodiment, each electrode part 11c, 12c, 13c, 14c includes a first electrode layer E1, a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. Each electrode part 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b includes a second electrode layer E2, a third electrode layer E3, and a fourth electrode layer E4. That is, each electrode part 11a, 11b, 12a, 12b, 13a, 13b, 14a, 14b does not include the first electrode layer E1. The fourth electrode layer E4 constitutes the outermost layers of the first outer electrode 11, the second outer electrode 12, the third outer electrode 13, and the fourth outer electrode 14, respectively.

The first electrode layer E1 is formed by applying a conductive paste to the surfaces (in the present embodiment, the first and second side faces 1c and 1d) of the element body 1 and baking the paste. The first electrode layer E1 is a sintered metal layer formed by sintering a metal component (metal powder) contained in the conductive paste. That is, the first electrode layer E1 is a sintered metal layer arranged on the element body 1.

The first electrode layer E1 is included in the electrode portions 11c, 12c, 13c, 14c. The first electrode layer E1 included in the electrode portions 11c and 13c is arranged on the first side surface 1c so as to be in contact with the first side surface 1c. The first electrode layer E1 included in the electrode portions 12c and 14c is arranged on the second side face 1d so as to be in contact with the second side face 1d. In the present embodiment, the first electrode layer E1 is not arranged on the first and second main surfaces 1a and 1b.

The first electrode layer E1 included in the electrode portion 11c is connected to the one end 21a of the first coil conductor 21. The first electrode layer E1 included in the electrode portion 12c is connected to the one end 22a of the second coil conductor 22. The first electrode layer E1 included in the electrode portion 13c is connected to the one end 23a of the third coil conductor 23. The first electrode layer E1 included in the electrode portion 14c is connected to the one end 24a of the fourth coil conductor 24.

In this embodiment, the first electrode layer E1 is a sintered metal layer made of Ag. The first electrode layer E1 may be a sintered metal layer made of Pd. As the conductive paste, a mixture of a powder of Ag or Pd, a glass component, an organic binder, and an organic solvent is used.

The second electrode layer E2 is a conductive resin layer. As the conductive resin, a mixture of a thermosetting resin, a conductive material and an organic solvent is used. As the conductive material, for example, metal powder is used. As the metal powder, for example, Ag powder is used. As the thermosetting resin, for example, phenol resin, acrylic resin, silicone resin, epoxy resin, or polyimide resin is used.

The third electrode layer E3 is a plating layer and is formed on the second electrode layer E2 by a plating method. In the present embodiment, the third electrode layer E3 is a Ni plating layer formed on the second electrode layer E2 by Ni plating. The third electrode layer E3 may be a Cu plating layer.

The fourth electrode layer E4 is a plating layer and is formed on the third electrode layer E3 by a plating method. In the present embodiment, the fourth electrode layer E4 is a Sn plating layer formed by Sn plating on the third electrode layer E3. The third electrode layer E3 and the fourth electrode layer E4 form a plating layer arranged on the second electrode layer E2. That is, in this embodiment, the plating layer formed on the second electrode layer E2 has a two-layer structure.

The second electrode layer E2 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, 14a to 14c is integrally formed. The third electrode layer E3 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, 14a to 14c is integrally formed. The fourth electrode layer E4 included in each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, 14a to 14c is also integrally formed.

In each of the electrode portions 11a to 11c, 12a to 12c, 13a to 13c, 14a to 14c, the entire second electrode layer E2 is covered with a plating layer composed of a third electrode layer E3 and a fourth electrode layer E4. ing.

The laminated common mode filter CF is solder-mounted on an electronic device (for example, a circuit board or an electronic component). In the laminated common mode filter CF, the first main surface 1a is a mounting surface facing the electronic device.

The laminated common mode filter CF includes one resin film I, as shown in FIGS. 2, 4, and 5. The resin film I has electrical insulation. The resin film I is arranged on the first main surface 1a so as to be in contact with the first main surface 1a. In this embodiment, the resin film I covers the entire first major surface 1a.

The resin film I covers an end edge (end portion) of the first electrode layer E1 on the first main surface 1a side and is in contact with the end edge. That is, the end portion of the resin film I in the second direction D2 has a region I1 located on the first electrode layer E1 and overlapping with the first electrode layer E1. The region I1 of the resin film I is in contact with the first electrode layer E1.

The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is arranged on the resin film I so as to be in contact with the resin film I. The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is arranged on the first main surface 1a of the element body 1 via the resin film I. The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is not in contact with the element body 1 (first main surface 1a). The electrode portions 11a, 12a, 13a, 14a are formed on the resin film I and are located on the resin film I. The second electrode layer E2 included in each of the electrode portions 11b, 12b, 13b, 14b is arranged on the second main surface 1b so as to be in contact with the second main surface 1b.

The region I1 of the resin film I is located below the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a and overlaps with the second electrode layer E2. Therefore, the region I1 of the resin film I is sandwiched between the first electrode layer E1 and the second electrode layer E2. The region I1 of the resin film I is in contact with the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a.

The resin film I is in contact with the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a of the four first to fourth outer electrodes 11, 12, 13, 14 that are adjacent to each other. The resin film I is also in contact with the first electrode layer E1 included in each of the electrode portions 11a, 12a, 13a, 14a of the four first to fourth outer electrodes 11, 12, 13, 14 adjacent to each other.

The resin film I is made of, for example, an insulating resin such as an epoxy resin. The resin film I is formed, for example, by applying an insulating resin coating agent and solidifying it. A screen printing method, a spray coating method, or the like can be used to apply the insulating resin coating agent. As the insulating resin coating agent, a thermosetting insulating resin coating agent, an ultraviolet curing type insulating resin coating agent, or a coating agent containing both of these insulating resin coating agents can be used.

As shown in FIGS. 6 and 7, the laminated common mode filter CF is solder-mounted on the electronic device ED. The electronic device ED is, for example, a circuit board or an electronic component. The solder fillet SF is formed on the first outer electrode 11, the second outer electrode 12, the third outer electrode 13, and the fourth outer electrode 14 by solidifying the molten solder. 6 and 7 are diagrams for explaining the mounting structure of the laminated common mode filter according to the present embodiment.

When the laminated common mode filter CF is solder-mounted on the electronic device ED, the external force acting on the laminated common mode filter CF from the electronic device ED acts as stress on the element body 1 through the solder fillet SF and the external electrodes 11 to 14. Sometimes. At this time, the external force tends to act on the element body 1 from the electrode portions 11a, 12a, 13a, 14a.

In the laminated common mode filter CF, the electrode portions 11a, 12a, 13a, 14a include the second electrode layer E2. Therefore, even when an external force acts on the laminated common mode filter CF, the external force is relieved by the second electrode layer E2, so that stress is unlikely to occur in the element body 1. Therefore, generation of cracks in the element body 1 is suppressed.

In the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is in contact with the resin film I in contact with the first main surface 1a. That is, the resin film I is interposed between the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a and the first main surface 1a. Unlike the second electrode layer E2, the resin film I does not contain a conductive material (metal powder) and has a high adhesive strength with the element body 1. Like the resin film I, the second electrode layer E2 contains a resin and therefore has a high adhesive strength with the resin film I. Therefore, in the laminated common mode filter CF, even when an external force acts on the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is unlikely to peel off.

The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is in contact with the resin film I as a whole. Therefore, the adhesive strength between the second electrode layer E2 and the resin film I is much higher.

The second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a may be partially in contact with the resin film I. An end edge (end portion) of the second electrode layer E2 in the second direction D2 may be a starting point of peeling of the second electrode layer E2. Therefore, if the edge of the second electrode layer E2 in the second direction D2 is in contact with the resin film I, the peeling of the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is suppressed. The effect is secured.

The laminated common mode filter CF is arranged in the element body 1 and has the ends exposed on the corresponding side faces 1c and 1d, the first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the first coil conductor 21. It has four coil conductors 24. The electrode portions 11c, 12c, 13c, 14c include the first electrode layer E1. The second electrode layer E2 included in the electrode portions 11c, 12c, 13c, 14c is arranged on the element body 1 via the first electrode layer E1. The first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the fourth coil conductor 24 are electrically connected to the second electrode layer E2 via the first electrode layer E1. Therefore, in the laminated common mode filter CF, compared to the configuration in which the first coil conductor 21, the second coil conductor 22, the third coil conductor 23, and the fourth coil conductor 24 are directly connected to the second electrode layer E2. Thus, the connection strength between each coil conductor 21-24 and the corresponding external electrode 11-14 is high, and each coil conductor 21-24 is reliably electrically connected to the corresponding external electrode 11-14.

The resin film I covers the edge of the first electrode layer E1 on the first major surface 1a side and is in contact with the edge. Therefore, the end portion (region I1) of the resin film I is sandwiched between the first electrode layer E1 and the second electrode layer E2, so that the resin film I is unlikely to peel off.

In the laminated common mode filter CF, the first outer electrode 11 and the third outer electrode 13 are arranged on the first side face 1c side of the element body 1. Therefore, the first external electrode 11 and the third external electrode 13 are not formed so as to cover the entire first side surface 1c, and the surface areas of the first external electrode 11 and the third external electrode 13 must be small. I don't get. Similarly, since the second outer electrode 12 and the fourth outer electrode 14 are arranged on the second side face 1d side of the element body 1, the surface areas of the second outer electrode 12 and the fourth outer electrode 14 must be small. I don't get. Therefore, the area of the second electrode layer E2 also becomes small, and the adhesive strength of the second electrode layer E2 may decrease. However, in the laminated common mode filter CF, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is in contact with the resin film I in contact with the first main surface 1a, and therefore the electrode portion 11a is not included. , 12a, 13a, 14a contained in the second electrode layer E2 is unlikely to peel off.

In the present embodiment, the resin film I includes the second electrode layer E2 included in each of the electrode portions 11a, 12a, 13a, 14a of the four first to fourth external electrodes 11, 12, 13, 14 adjacent to each other. Touching. Therefore, in the laminated common mode filter CF, the resin film I can be easily formed.

Next, the configuration of the laminated common mode filter CF according to the modified example of the present embodiment will be described with reference to FIGS. 8 to 10. 8 to 10 are plan views of the laminated common mode filter according to this modification. In each modification, the shape of the resin film is different from that of the above-described laminated common mode filter CF.

The laminated common mode filter CF shown in FIG. 8 includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the second direction D2, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia is in contact with the second electrode layer E2 included in the electrode portions 11a and 13a of the two first and third external electrodes 11 and 13 that are adjacent to each other in the third direction D3. The resin film Ib is in contact with the second electrode layer E2 included in the electrode portions 12a and 14a of the two second and fourth external electrodes 12 and 14 that are adjacent to each other in the third direction D3.

The laminated common mode filter CF shown in FIG. 9 also includes two resin films Ia and Ib. The two resin films Ia and Ib are separated in the third direction D3, and the first main surface 1a is exposed between the resin film Ia and the resin film Ib. The resin film Ia is in contact with the second electrode layer E2 included in the electrode portions 11a and 12a of the two first and second external electrodes 11 and 12 that are adjacent to each other in the second direction D2. The resin film Ib is in contact with the second electrode layer E2 included in the electrode portions 13a and 14a of the two third and fourth external electrodes 13 and 14 that are adjacent to each other in the second direction D2.

In the laminated common mode filter CF of each modified example shown in FIGS. 8 and 9, the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a hardly peels off, and the resin film I is not peeled off. Easy to form.

The laminated common mode filter CF shown in FIG. 10 includes four resin films Ic, Id, Ie, If. The four resin films Ic, Id, Ie, If are provided for each of the first to fourth external electrodes 11, 12, 13, 14 and are separated from each other. The resin film Ic is in contact with the second electrode layer E2 included in the electrode portion 11a of the first external electrode 11. The resin film Id is in contact with the second electrode layer E2 included in the electrode portion 12a of the second external electrode 12. The resin film Ie is in contact with the second electrode layer E2 included in the electrode portion 13a of the third outer electrode 13. The resin film If is in contact with the second electrode layer E2 included in the electrode portion 14a of the fourth outer electrode 14.

Even in the laminated common mode filter CF of the modified example shown in FIG. 10, peeling of the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, and 14a is unlikely to occur. In this modification, the resin films Ic, Id, Ie, If are provided for each of the first to fourth outer electrodes 11, 12, 13, 14 and the corresponding first to fourth outer electrodes 11, 12, The electrode portions 11a, 12a, 13a, 14a of 13, 14 are in contact with the second electrode layer E2 included therein. Therefore, the amount of resin used to form the resin films Ic, Id, Ie, If is reduced.

Next, the configuration of the laminated common mode filter CF according to the modified example of the present embodiment will be described with reference to FIGS. 11 to 13. FIG. 11 is a plan view of a laminated common mode filter according to this modification. FIG. 12 is a diagram for explaining cross-sectional configurations of the first external electrode, the second external electrode, and the resin layer. FIG. 13 is a diagram for explaining cross-sectional configurations of the third external electrode, the fourth external electrode, and the resin layer.

As shown in FIGS. 11 to 13, the resin film I does not have to be in contact with the first electrode layer E1. In this modification, the entire resin film I is in contact with the first major surface 1a. Also in this modification, since the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is in contact with the resin film I in contact with the first main surface 1a, an external force is applied to the laminated common mode filter CF. Even when the above action occurs, peeling of the second electrode layer E2 included in the electrode portions 11a, 12a, 13a, 14a is unlikely to occur.

Although the embodiments of the present invention have been described above, the present invention is not necessarily limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention.

The laminated common mode filter CF includes not only the resin film I arranged on the first main surface 1a but also a resin film arranged on the second main surface 1b so as to be in contact with the second main surface 1b. May be. The second electrode layer E2 included in each of the electrode portions 11b, 12b, 13b, 14b may be arranged on the resin film so as to be in contact with the resin film arranged on the second main surface 1b. In this case, peeling of the second electrode layer E2 included in the electrode portions 11b, 12b, 13b, 14b is unlikely to occur.

The resin film arranged on the second main surface 1b may cover an edge of the first electrode layer E1 on the second main surface 1b side and be in contact with the edge. In this case, since the end portion of the resin film is sandwiched between the first electrode layer E1 and the second electrode layer E2, peeling of the resin film is unlikely to occur. The resin film arranged on the second main surface 1b may not be in contact with the first electrode layer E1.

The first outer electrode 11, the second outer electrode 12, the third outer electrode 13, and the fourth outer electrode 14 do not necessarily have to have the electrode portions 11b, 12b, 13b, 14b. That is, the first external electrode 11 and the third external electrodes 11, 13 may be arranged only on the two surfaces 1a, 1c, and the second external electrode 12 and the fourth external electrodes 12, 14 may be arranged on the two surfaces. It may be arranged only in 1a and 1d.

The plating layer arranged on the second electrode layer E2 does not necessarily have to have the two-layer structure including the third electrode layer E3 and the fourth electrode layer E4. The plating layer arranged on the second electrode layer E2 may be a single layer or may have a laminated structure of three or more layers. For example, the plating layer disposed on the second electrode layer E2 has a three-layer structure including a Ni plating layer, a Cu plating layer formed on the Ni plating layer, and an Sn plating layer formed on the Cu plating layer, Alternatively, it may have a three-layer structure including a Cu plating layer, a Ni plating layer formed on the Cu plating layer, and an Sn plating layer formed on the Ni plating layer.

The number of external electrodes arranged at each end of the element body 1 in the second direction D2 is not limited to “two”. The number of external electrodes arranged at each end of the body 1 in the second direction D2 may be “three” or more.

Although the multilayer common mode filter CF is described as an example of the electronic component in the present embodiment and the modification, the applicable electronic component is not limited to the multilayer capacitor and the multilayer common mode filter. The applicable electronic component is, for example, a laminated electronic component such as a laminated capacitor, a laminated inductor, a laminated varistor, a laminated piezoelectric actuator, a laminated thermistor, or a laminated composite component, or an electronic component other than the laminated electronic component.

DESCRIPTION OF SYMBOLS 1... Element body, 1a... 1st main surface, 1c... 1st side surface, 1d... 2nd side surface, 11... 1st external electrode, 11a, 11c... Electrode part which a 1st external electrode has, 12... Two external electrodes, 12a, 12c... Electrode part included in the second external electrode, 13... Third external electrode, 13a, 13c... Electrode part included in the third external electrode, 14... Fourth external electrode, 14a, 14c... Electrode part of the fourth external electrode, 21... First coil conductor, 22... Second coil conductor, 23... Third coil conductor, 24... Fourth coil conductor, CF... Multilayer common mode filter , D2... Second direction, E1... First electrode layer, E2... Second electrode layer, E3... Third electrode layer, E4... Fourth electrode layer, I, Ia, Ib, Ic, Id, Ie, If... Resin film.

Claims (6)

An element body having a main surface to be a mounting surface and a side surface adjacent to the main surface,
An external electrode having a first electrode portion arranged on the main surface and a second electrode portion arranged on the side surface,
A resin film disposed on the main surface so as to be in contact with the main surface and having an electrically insulating property,
The first electrode portion and the second electrode portion each include a conductive resin layer disposed on the element body,
The conductive resin layer included in the first electrode portion is disposed on the resin film so as to be in contact with the resin film, and the conductive resin layer and the element included in the first electrode portion. An electronic component in which the resin film is interposed between the resin film and the main surface of the body . Further provided is an internal conductor which is disposed in the body and has an end exposed on the side surface,
The second electrode portion is connected to the end of the inner conductor, and includes a sintered metal layer arranged on the side surface so as to be in contact with the side surface,
The electronic component according to claim 1, wherein the conductive resin layer included in the second electrode portion is arranged on the element body via the sintered metal layer. The electronic component according to claim 2, wherein the resin film covers an edge of the sintered metal layer and is in contact with the edge. The element body further has a side surface facing the side surface,
The electronic component according to claim 1, wherein a plurality of the external electrodes are arranged at both ends of the element body in a direction in which the pair of side surfaces face each other. The electronic component according to claim 4, wherein the resin film is in contact with the conductive resin layer included in the first electrode portions of at least two adjacent external electrodes. The electronic component according to claim 4, wherein the resin film is provided for each of the external electrodes and is in contact with the conductive resin layer included in the first electrode portion of the corresponding external electrode.

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