JP4507837B2 - Manufacturing method of multilayer electronic component - Google Patents

Manufacturing method of multilayer electronic component Download PDF

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JP4507837B2
JP4507837B2 JP2004323384A JP2004323384A JP4507837B2 JP 4507837 B2 JP4507837 B2 JP 4507837B2 JP 2004323384 A JP2004323384 A JP 2004323384A JP 2004323384 A JP2004323384 A JP 2004323384A JP 4507837 B2 JP4507837 B2 JP 4507837B2
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electrode
laminate
electronic component
shield electrode
multilayer electronic
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JP2006135141A (en
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一郎 亀山
研治 野添
明雄 平澤
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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Description

本発明は、各種電子機器に用いられる積層型電子部品の製造方法に関するものである。   The present invention relates to a method for manufacturing a multilayer electronic component used in various electronic devices.

一般に積層体の内層部分において内部電極により高周波回路などの電子回路を形成する積層型電子部品は、図４に示されるように積層体１の内部において内部電極２によって所定の電子回路を形成し、この積層体１の内部で形成された電子回路を積層体１の外側面に設けられた端子電極３によって外部に導出する構造となっている。   In general, a multilayer electronic component that forms an electronic circuit such as a high-frequency circuit with an internal electrode in an inner layer portion of a multilayer body forms a predetermined electronic circuit with the internal electrode 2 inside the multilayer body 1 as shown in FIG. The electronic circuit formed inside the laminate 1 is led out to the outside by a terminal electrode 3 provided on the outer surface of the laminate 1.

そして、このような積層型電子部品においては内部電極２によって形成される電子回路に対して外部からの影響を防止するため、積層体１の下層領域すなわち電子回路を形成する内部電極領域より下層側にシールド電極４を配置し、このシールド電極４をビアホール５を介して積層体１の下面に設けられた外部接続用の端子電極３に接続していた。   In such a multilayer electronic component, in order to prevent external influence on the electronic circuit formed by the internal electrode 2, the lower layer region of the multilayer body 1, that is, the lower layer side than the internal electrode region forming the electronic circuit The shield electrode 4 is disposed on the outer surface of the laminated body 1 and the shield electrode 4 is connected to the terminal electrode 3 for external connection provided on the lower surface of the multilayer body 1 through the via hole 5.

なお、この出願の発明に関する先行技術文献情報としては、例えば、特許文献１が知られている。
特開２００３−２７３２７５号公報 As prior art document information relating to the invention of this application, for example, Patent Document 1 is known.
JP 2003-273275 A

しかしながら、シールド電極４は端子電極３を介して接地することでそのシールド性を確保するのであるが、柱状導体における部分的な接続手法であるビアホール５は必然的にインピーダンスが高くなってしまうため、シールド電極４から端子電極３に至る電荷の流れが阻害されてしまうため、結果的に積層型電子部品において高いシールド性を確保することが困難なものとなっていた。   However, although the shield electrode 4 is grounded via the terminal electrode 3 to ensure its shielding property, the via hole 5 which is a partial connection method in the columnar conductor inevitably increases the impedance. Since the flow of charge from the shield electrode 4 to the terminal electrode 3 is hindered, it is difficult to ensure high shielding performance in the multilayer electronic component as a result.

そこで、本発明はこのような問題を解決し、積層型電子部品におけるシールド性向上を目的とする。   Therefore, the present invention aims to solve such problems and improve the shielding performance in multilayer electronic components.

この目的を達成するために本発明は、シールド電極及びこのシールド電極を外部接続する端子電極を有する積層型電子部品において、誘電体層を形成するグリーンシート上に所定の電極を形成し、この電極が形成されたグリーンシートをシールド電極が表面に露出するように適宜積み重ね、この積層体の表面に露出したシールド電極上の外部接続領域となる部分を除き絶縁被膜層を形成するグリーンシートを設け、この絶縁被膜層を設けた積層体を加圧成形した後に焼成し、絶縁被膜層から露出したシールド電極部分を外部接続用の端子電極としたのである。 In order to achieve this object, the present invention provides a laminated electronic component having a shield electrode and a terminal electrode to which the shield electrode is externally connected, by forming a predetermined electrode on a green sheet for forming a dielectric layer. The green sheet is formed by appropriately stacking so that the shield electrode is exposed on the surface, and provided with a green sheet that forms an insulating coating layer except for a portion to be an external connection region on the shield electrode exposed on the surface of the laminate, The laminate provided with the insulating coating layer was pressure-molded and then fired, and the shield electrode portion exposed from the insulating coating layer was used as a terminal electrode for external connection .

このような構成とすることで、シールド電極内に端子電極が形成されるので、実質的にシールド電極が直接接地される構造となるので、積層型電子部品のシールド性を向上させることができるのである。   With such a configuration, since the terminal electrode is formed in the shield electrode, the shield electrode is substantially directly grounded, so that the shielding property of the multilayer electronic component can be improved. is there.

以下、本発明の一実施形態について図を用いて説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１は本発明の積層型電子部品を模式的に示した断面図であり、複数の誘電体層で形成された積層体６の内層部分において図２に示されるようなコンデンサ７やストリップライン８を用いた高周波フィルタ回路などの電子回路が内部電極９によって形成されるとともに、破線で囲まれた電子回路を形成する回路形成領域１０の下方に積層型電子部品のシールド性を確保するシールド電極１１が配置された構造となっている。   FIG. 1 is a cross-sectional view schematically showing a multilayer electronic component according to the present invention. In the inner layer portion of a multilayer body 6 formed of a plurality of dielectric layers, capacitors 7 and strip lines 8 as shown in FIG. An electronic circuit, such as a high-frequency filter circuit using, is formed by the internal electrode 9, and a shield electrode 11 that secures the shielding property of the multilayer electronic component below the circuit forming region 10 that forms the electronic circuit surrounded by a broken line The structure is arranged.

また、積層体６を構成する誘電体層は、フィラーとなる誘電体セラミックスにガラスを添加した低温焼成材料により形成され、内部電極９を形成する銀系電極ペーストと同時焼成できるものとなっており、後に詳述するが、未焼結の誘電体層を形成するグリーンシート上に適宜内部電極９を形成し、それらを積み重ね同時焼成することにより形成されるものである。   The dielectric layer constituting the laminate 6 is formed of a low-temperature fired material in which glass is added to dielectric ceramic as a filler, and can be fired simultaneously with the silver-based electrode paste forming the internal electrode 9. As will be described in detail later, the internal electrode 9 is appropriately formed on a green sheet for forming an unsintered dielectric layer, and these are stacked and fired simultaneously.

そして、この積層型電子部品はその実装面となる下面側の構成が、積層体６の下面の略全面にシールド電極１１が設けられ、このシールド電極１１における外部接続領域、つまり端子電極１２となる領域を除いて絶縁被膜層１３が形成された構成となっている。   In this multilayer electronic component, the configuration on the lower surface side which is the mounting surface is provided with a shield electrode 11 on substantially the entire lower surface of the multilayer body 6, and becomes an external connection region in this shield electrode 11, that is, a terminal electrode 12. The insulating coating layer 13 is formed except for the region.

すなわち、この構成によればシールド電極１１に対して直接的に端子電極１２が形成された構成となるので、図４に示される従来の積層型電子部品のように端子電極３とシールド電極４を接続するためのビアホール５を必要とせず、このビアホール５のインピーダンスが高いことに起因したシールド性の低下を防止できるので、結果的に積層型電子部品のシールド性を向上させることができるのである。   That is, according to this configuration, since the terminal electrode 12 is formed directly on the shield electrode 11, the terminal electrode 3 and the shield electrode 4 are connected as in the conventional multilayer electronic component shown in FIG. Since the via hole 5 for connection is not required, and the deterioration of the shielding property due to the high impedance of the via hole 5 can be prevented, the shielding property of the multilayer electronic component can be improved as a result.

また、この積層型電子部品を形成する場合、図３に示されるように支持フィルム１４上に形成されたグリーンシート１５に電極形成し、この電極形成されたグリーンシート１５を積み重ねて支持フィルム１４を剥離させ、これを繰り返すことにより積層体６を形成し、この積層体６をプレス機１６を用いて所定の厚みに加圧成形し、その後焼成炉にて焼成するという一般的な積層工程をもって形成される。   Further, when forming this multilayer electronic component, as shown in FIG. 3, electrodes are formed on the green sheet 15 formed on the support film 14, and the green sheets 15 formed with the electrodes are stacked to form the support film 14. The laminate 6 is formed by peeling and repeating, and the laminate 6 is formed by a general lamination process in which the laminate 6 is pressure-molded to a predetermined thickness using a press 16 and then fired in a firing furnace. Is done.

なお、シールド電極１１は全てのグリーンシート１５を積層した後に、この積層体６上にシールド電極１１を印刷し、さらにこのシールド電極１１の表面に積層体６を形成するグリーンシート１５と同様の材料を主成分とする絶縁被膜層１３となる誘電体ペースト１８を印刷し、その後、先に述べたように加圧成形及び焼成を施すことにより形成している。なお、絶縁被膜層は絶縁ペースト１８を用いるのではなく、グリーンシート状のものを用いることもできる。   The shield electrode 11 is made of the same material as that of the green sheet 15 in which all the green sheets 15 are laminated and then the shield electrode 11 is printed on the laminate 6 and the laminate 6 is formed on the surface of the shield electrode 11. It is formed by printing the dielectric paste 18 that becomes the insulating coating layer 13 whose main component is, and then performing pressure molding and baking as described above. Note that the insulating coating layer may be a green sheet instead of the insulating paste 18.

そして、このような積層型電子部品においては、シールド電極１１が先にも述べたように積層型電子部品のシールド性を確保するためのものであることから、グリーンシート１５の略全面にわたって設けられるものであるため、図４に示されるような従来の構造であれば、積層体１を形成するグリーンシート間の接合がシールド電極４の外方領域つまり積層体１の外周端領域となってしまう。   In such a multilayer electronic component, since the shield electrode 11 is for ensuring the shielding property of the multilayer electronic component as described above, it is provided over substantially the entire surface of the green sheet 15. Therefore, in the conventional structure as shown in FIG. 4, the bonding between the green sheets forming the laminate 1 becomes the outer region of the shield electrode 4, that is, the outer peripheral end region of the laminate 1. .

そして、このような状態でシールド電極４の厚みを大きくしてしまうとグリーンシートを積み重ねた際シールド電極４の端部周辺において接合されるグリーンシート間に空隙が生じてしまうためグリーンシート間の接合強度が確保し難く、このためこのグリーンシートにおける支持フィルムの剥離が難しくなるので、この空隙を小さくすることが重要となることからシールド電極４の厚みを薄く設定しなければならなくなる。   If the thickness of the shield electrode 4 is increased in such a state, when the green sheets are stacked, a gap is generated between the green sheets joined around the end of the shield electrode 4. Since it is difficult to ensure the strength and, therefore, it is difficult to peel off the support film on the green sheet, it is important to reduce the gap, and thus the thickness of the shield electrode 4 must be set thin.

しかしながら、シールド電極４の厚みを薄く設定した場合、シールド電極４の端部が非常に鋭角に形成されてしまうためその部分に電荷集中してしまい、この場合においてもシールド電極４の内部における電荷の流れが悪くなりシールド性の低下を招く要因となるのであるが、図１に示される積層型電子部品のように積層体６の下面にシールド電極１１を形成しその表面に、別途、絶縁被膜層１３を形成するといった構成とすることにより、シールド電極１１はグリーンシート１５間に挟まれる構成とはならないのでシールド電極１１の厚みを大きく設定することが可能となりシールド電極１１内部における電荷集中を防止でき、積層型電子部品のシールド性をより向上できるものとなっている。   However, when the thickness of the shield electrode 4 is set to be thin, the end portion of the shield electrode 4 is formed at a very acute angle, so that the charge is concentrated on that portion. In this case as well, the charge inside the shield electrode 4 is reduced. Although the flow becomes worse and causes a reduction in shielding performance, a shield electrode 11 is formed on the lower surface of the multilayer body 6 as in the multilayer electronic component shown in FIG. By forming the shield 13, the shield electrode 11 is not sandwiched between the green sheets 15, so that the thickness of the shield electrode 11 can be set large, and charge concentration inside the shield electrode 11 can be prevented. Thus, the shielding property of the multilayer electronic component can be further improved.

そして、先にも述べたように積層体６を形成するグリーンシート１５を積み重ねその表面に絶縁被膜層１３を形成し加圧成形することにより、シールド電極１１における端子電極１２の領域を除く部分が積層体６に埋設され、積層体６の下面において積層体６の表面と端子電極１２の表面と絶縁被膜層１３の表面が同一平面内となるように形成されるので、積層型電子部品の実装面の平坦度が向上し、結果として積層型電子部品の実装性を高めることができるのである。   Then, as described above, the green sheets 15 forming the laminated body 6 are stacked, and the insulating coating layer 13 is formed on the surface and pressure-molded, so that the portion excluding the region of the terminal electrode 12 in the shield electrode 11 is formed. Since the surface of the multilayer body 6, the surface of the terminal electrode 12, and the surface of the insulating coating layer 13 are formed in the same plane on the lower surface of the multilayer body 6, the multilayer electronic component is mounted. The flatness of the surface is improved, and as a result, the mountability of the multilayer electronic component can be improved.

なお、この実施形態においては積層型電子部品で形成する電子回路を高周波フィルタ回路を挙げて説明したのであるが、本発明はこの構成に限定されるものではなく、積層体６の内層部分において所定の電子回路の全て或いは部分的に形成したもので、そのシールド性を確保するシールド電極１１を要する形態であれば同様の効果を奏するものである。   In this embodiment, the electronic circuit formed by the multilayer electronic component has been described by taking a high frequency filter circuit as an example. However, the present invention is not limited to this configuration, and a predetermined amount is provided in the inner layer portion of the multilayer body 6. The electronic circuit is formed in whole or in part, and the same effect can be obtained as long as the shield electrode 11 that secures the shielding property is required.

また、積層体６を形成する材料として誘電体にガラスを添加し低温焼成を実現した、いわゆる低温焼成誘電体を挙げて説明したが、他の材料として酸化ビスマスなどの低融点酸化物を主成分とする低温焼成材料を用いた誘電体を使用しても同様の効果を奏するものである。   In addition, as a material for forming the laminated body 6, a so-called low-temperature fired dielectric material in which glass is added to the dielectric material to achieve low-temperature firing has been described. Even if a dielectric using a low-temperature fired material is used, the same effect can be obtained.

本発明における積層型電子部品の製造方法によれば、積層型電子部品のシールド性を向上できるという効果を有し、特に電子回路として高周波回路を形成する積層型電子部品に有用である。   The method for manufacturing a multilayer electronic component according to the present invention has an effect of improving the shielding property of the multilayer electronic component, and is particularly useful for a multilayer electronic component that forms a high-frequency circuit as an electronic circuit.

本発明の一実施形態における積層型電子部品を模式的に示す断面図Sectional drawing which shows typically the multilayer electronic component in one Embodiment of this invention 同積層型電子部品によって形成される電子回路の一例を示す回路図Circuit diagram showing an example of an electronic circuit formed by the multilayer electronic component 同積層型電子部品の製造方法を示す模式図Schematic diagram showing the method for manufacturing the same multilayer electronic component 従来の積層型電子部品を模式的に示す断面図Sectional view schematically showing a conventional multilayer electronic component

符号の説明Explanation of symbols

６ 積層体
９ 内部電極
１１ シールド電極
１２ 端子電極
１３ 絶縁被膜層 6 Laminate 9 Internal electrode 11 Shield electrode 12 Terminal electrode 13 Insulating coating layer

Claims (1)

複数の誘電体層からなる積層体と、この積層体内に設けられ所定の電子回路を形成する内部電極と、前記積層体において前記内部電極より電子回路を形成する領域より下側に設けられるシールド電極とを備え、前記積層体は、誘電体層を形成するグリーンシート上に所定の電極を形成し、この電極が形成されたグリーンシートを適宜積み重ね、この積層体の表面に形成された前記シールド電極上の外部接続領域となる部分を残し絶縁被膜層を形成し、この絶縁被膜層を設けた積層体を加圧成形した後に焼成し、前記絶縁被膜層から露出した前記シールド電極部分を外部接続用の端子電極とすることを特徴とした積層型電子部品の製造方法。 A laminate comprising a plurality of dielectric layers, an internal electrode provided in the laminate and forming a predetermined electronic circuit, and a shield electrode provided below a region in the laminate that forms an electronic circuit from the internal electrode with the door, the laminate forms a predetermined electrode on the green sheet for forming the dielectric layer, stacked green sheet the electrode is formed properly, the shield electrode formed on the surface of the laminate An insulating coating layer is formed , leaving a portion to be an external connection region above, and the laminate provided with this insulating coating layer is pressure-molded and fired, and the shield electrode portion exposed from the insulating coating layer is externally connected. A method for manufacturing a multilayer electronic component, characterized in that a terminal electrode is formed.
JP2004323384A 2004-11-08 2004-11-08 Manufacturing method of multilayer electronic component Expired - Fee Related JP4507837B2 (en)

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DE102007020783A1 (en) * 2007-05-03 2008-11-06 Epcos Ag Electrical multilayer component
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US7545626B1 (en) 2008-03-12 2009-06-09 Samsung Electro-Mechanics Co., Ltd. Multi-layer ceramic capacitor
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JP2001196253A (en) * 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd Method for manufacturing laminated type electronic component

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JP2001196253A (en) * 2000-01-14 2001-07-19 Matsushita Electric Ind Co Ltd Method for manufacturing laminated type electronic component

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