JP2004039937A - Ceramic electronic part - Google Patents

Ceramic electronic part Download PDF

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Publication number
JP2004039937A
JP2004039937A JP2002196574A JP2002196574A JP2004039937A JP 2004039937 A JP2004039937 A JP 2004039937A JP 2002196574 A JP2002196574 A JP 2002196574A JP 2002196574 A JP2002196574 A JP 2002196574A JP 2004039937 A JP2004039937 A JP 2004039937A
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Japan
Prior art keywords
ceramic
electronic component
ceramic electronic
terminal electrodes
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2002196574A
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Japanese (ja)
Inventor
Taisuke Abiko
Kenji Shibata
Masaaki Togashi
安彦 泰介
富樫 正明
柴田 憲治
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Tdk Corp
Tdk株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tdk Corp, Tdk株式会社 filed Critical Tdk Corp
Priority to JP2002196574A priority Critical patent/JP2004039937A/en
Publication of JP2004039937A publication Critical patent/JP2004039937A/en
Pending legal-status Critical Current

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Abstract

A ceramic electronic component capable of reducing noise by suppressing mechanical vibration due to electrostriction.
A ceramic substrate has piezoelectric characteristics. The metal film includes at least two terminal electrodes 21 and 22 and is provided on the surface of the ceramic base 1. The insulating gap 51 separates the terminal electrodes 21 and 22 on the surface of the ceramic base 1, and the gap width α is a reduced width corresponding to an insulation withstand voltage required between the terminal electrodes 21-22. Is set to The entire surface of the ceramic base 1 except for the region where the insulating gap 51 is provided is covered with a metal film.
[Selection diagram] Fig. 1

Description

[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a ceramic electronic component. More specifically, the present invention relates to a ceramic electronic component such as a ceramic capacitor using a ceramic substrate having piezoelectric characteristics.
[0002]
[Prior art]
Known ceramic electronic components include ceramic capacitors, inductors, varistors, and composite components obtained by combining these components. Among them, ceramic electronic components including ceramic capacitors have been remarkably developed in thin-layer technology and multilayer technology, and products having high electrostatic capacity comparable to aluminum electrolytic capacitors have been commercialized.
[0003]
However, a ceramic material such as barium titanate used for a ceramic capacitor has piezoelectric characteristics, and generates a distortion when an electric field is applied. Therefore, when an AC electric field is applied to the ceramic capacitor, mechanical distortion occurs in synchronization with the frequency of the AC electric field. When this mechanical distortion is in the audible frequency band, the mechanical distortion of the ceramic capacitor appears as a vibration sound.
[0004]
For example, an audio device or the like has a circuit that is extremely sensitive to noise in the audio frequency band. Therefore, when vibration sound in the audio frequency band is generated from the ceramic capacitor, the performance and quality of the product are adversely affected.
[0005]
For this reason, the use of a conventional ceramic capacitor in a circuit sensitive to noise, while having a high electrostatic capacity comparable to that of an aluminum electrolytic capacitor, has been avoided.
[0006]
[Problems to be solved by the invention]
An object of the present invention is to provide a ceramic electronic component capable of reducing noise by suppressing mechanical vibration due to electrostriction.
[0007]
[Means for Solving the Problems]
In order to solve the above-described problems, a ceramic electronic component according to the present invention includes a ceramic base, a metal film, and an insulating gap. The ceramic base has a piezoelectric property. The metal film includes at least two terminal electrodes and is provided on a surface of the ceramic base. The insulating gap electrically separates the terminal electrodes on the surface of the ceramic base, and the gap width is set to a reduced width corresponding to an insulation withstand voltage required between the terminal electrodes. ing. The entire surface of the ceramic substrate except for the region where the insulating gap is provided is covered with the metal film.
[0008]
As described above, the ceramic electronic component according to the present invention includes the ceramic base, the metal film, and the insulating gap. The metal film includes at least two terminal electrodes and is provided on the surface of the ceramic base. The insulating gap electrically separates the terminal electrodes on the surface of the ceramic substrate. Therefore, a so-called chip-type ceramic electronic component can be obtained in which the two terminal electrodes are electrically insulated by the insulating gap, a voltage is applied to the two terminal electrodes, or electrical characteristics are extracted from the terminal electrodes.
[0009]
The ceramic substrate has piezoelectric properties. A typical example of such a ceramic material is barium titanate (BaTiO 3 ) -based ceramic, which is used as a ferroelectric material having a high dielectric constant for a ceramic capacitor or used as a voltage non-linear material for a varistor. .
[0010]
A ceramic substrate made of a ceramic material such as barium titanate has piezoelectric characteristics, and generates a distortion when an electric field is applied. For this reason, when an AC electric field is applied, the ceramic capacitor generates mechanical distortion synchronized with the frequency of the AC electric field, and when the mechanical distortion is in the audible frequency band, the mechanical distortion of the ceramic capacitor causes vibration noise. Appears as described above.
[0011]
As a means for solving this problem, in the present invention, the gap width of the insulating gap is set to a reduced width corresponding to the insulation withstand voltage required between the terminal electrodes. The entire surface of the surface of the ceramic substrate except for the region where the insulating gap is provided is covered with a metal film.
[0012]
According to the above structure, the ceramic substrate has a large surface area covered with the metal film, so that mechanical vibration due to electrostriction can be suppressed. It is presumed that this is because the overall rigidity including the metal film is increased. Since the gap width of the insulation gap is set to a width corresponding to the insulation withstand voltage required between the terminal electrodes, a necessary electric insulation withstand voltage can be secured between the terminal electrodes.
[0013]
In the ceramic electronic component according to the present invention, mechanical vibration due to electrostriction is suppressed, so that generation of noise is reduced. In particular, for example, vibration sound having an audible frequency of 20 Hz to 20 kHz is significantly reduced. For this reason, for example, it can be used for circuits sensitive to noise such as audio equipment.
[0014]
Specifically, the gap width of the insulating gap is set so as to satisfy 1> S1 / S ≧ 0.8, where S is the surface area of the ceramic base and S1 is the surface area of the metal film. It was confirmed that by satisfying this condition, mechanical vibration due to electrostriction could be reliably suppressed.
[0015]
BEST MODE FOR CARRYING OUT THE INVENTION
FIG. 1 is a perspective view showing a ceramic electronic component according to the present invention, FIG. 2 is an enlarged front sectional view of the ceramic electronic component shown in FIG. 1, and FIG. 3 is an exploded perspective view of the ceramic electronic component shown in FIG. In FIG. 3, the illustration of the metal film is omitted.
[0016]
The illustrated ceramic electronic component is a ceramic capacitor, and includes a ceramic base 1, a metal film, an insulating gap 51, and internal electrodes 31, 32. In this embodiment, the metal film is two terminal electrodes 21 and 22.
[0017]
The ceramic substrate 1 has piezoelectric characteristics. Since the illustrated embodiment is a ceramic capacitor, the ceramic substrate 1 is made of barium titanate (BaTiO 3 ) ceramic having a high dielectric constant. In the ceramic base 1, both side surfaces 11, 12 in the length direction X, both side surfaces 13, 14 in the width direction Y, and both side surfaces 15, 16 in the thickness direction Z intersect. That is, the ceramic base 1 has a substantially rectangular parallelepiped shape. Specifically, for example, the length direction X, the width direction Y, and the thickness direction Z are 3.2 mm × 2.5 mm × 2.5 mm.
[0018]
As shown in FIG. 2 and FIG. 3, the internal electrodes 31 and 32 are plural, provided in layers at intervals, and embedded in the ceramic base 1. Specifically, the internal electrodes 31 and 32 alternately overlap in the thickness direction Z. In the adjacent internal electrodes 31 and 32, one of the internal electrodes 31 has one end led out to one side surface 11 in the length direction X, and the other internal electrode 32 has one end connected to the other side surface 12 facing the one side surface 11. Derived.
[0019]
In this embodiment, the internal electrodes 31 and 32 have a rectangular shape with substantially the same area. However, the internal electrode patterns shown in FIGS. 2 and 3 are merely examples, and it goes without saying that the internal electrode patterns can take various other shapes. The number of the internal electrodes 31 and 32 is arbitrary.
[0020]
The laminated structure including the ceramic base 1 and the internal electrodes 31 and 32 can be realized by a known technique. For example, a laminated body is formed by laminating a predetermined number of ceramic green sheets (unfired ceramic sheets) on which the internal electrodes 31 and 32 are printed, and laminating (compressing and unifying the laminated body), then cutting and degreasing. Then, it can be manufactured through a firing step.
[0021]
The terminal electrodes 21 and 22 are formed on the surface of the ceramic base 1. In the illustrated terminal electrodes 21 and 22, Ni plating layers 212 and 222 are formed on base electrodes 213 and 223 containing Cu as a main component, and Sn plating layers 211 and 221 are formed thereon. However, the laminated structure of the metal films of the terminal electrodes 21 and 22 is not limited to that shown in the embodiment, and may be another structure.
[0022]
The terminal electrodes 21 and 22 are arranged to face each other in the length direction X of the ceramic base 1. Specifically, the terminal electrode 21 is provided on the entire surface of one side surface 11 in the length direction X of the ceramic base 1, and extends to a part of the surfaces 13, 14, 15, 16 adjacent to the one side surface 11. Provided. The terminal electrode 22 is provided on the entire surface of the other side surface 12 facing the one side surface 11, and is provided so as to extend on a part of the surfaces 13, 14, 15, 16.
[0023]
The thickness of the terminal electrodes 21 and 22 is, for example, 50 to 150 nm on the one side surface 11 and the other side surface 12, and 5 to 20 nm on the surfaces 13, 14, 15, and 16, for example. The terminal electrode 21 is connected to the internal electrode 31 led out to one side surface 11. The terminal electrode 22 is connected to the internal electrode 32 led out to the other side surface 12.
[0024]
The insulating gap 51 electrically separates the terminal electrodes 21 and 22 on the surface of the ceramic base 1, and the gap width α is reduced corresponding to an insulation withstand voltage required between the terminal electrodes 21 and 22. Is set to the determined gap width α. The specific gap width α is determined by the voltage applied to the terminal electrodes 21 and 22, and is a design matter. The illustrated insulating gap 51 is formed in an annular shape around the ceramic base 11.
[0025]
The entire surface of the ceramic substrate 1 except for the region where the insulating gap 51 is provided is covered with the metal films 21 and 22.
[0026]
As described above, the ceramic electronic component according to the present invention includes the ceramic base 1, the metal films 21, 22, and the insulating gap 51. The metal films 21 and 22 include at least two terminal electrodes 21 and 22 and are provided on the surface of the ceramic base 1. The insulating gap 51 electrically separates the terminal electrodes 21 and 22 on the surface of the ceramic base 1. Therefore, a so-called chip type in which the two terminal electrodes 21 and 22 are electrically insulated by the insulating gap 51 and a voltage is applied to the two terminal electrodes 21 and 22 or electrical characteristics are extracted from the terminal electrodes 21 and 22. Is obtained.
[0027]
The ceramic base 1 has piezoelectric characteristics. In the embodiment, the ceramic base 1 is made of barium titanate (BaTiO 3 ) -based ceramic which is a well-known ferroelectric material having a high dielectric constant. The ceramic substrate 1 made of barium titanate has piezoelectric characteristics, and is distorted when an electric field is applied. For this reason, when an AC electric field is applied, the ceramic capacitor generates mechanical distortion synchronized with the frequency of the AC electric field, and when the mechanical distortion is in the audible frequency band, the mechanical distortion of the ceramic capacitor causes vibration noise. Appears as described above.
[0028]
As a means for solving this problem, in the present invention, the gap width α of the insulating gap 51 is set to a reduced gap width α corresponding to the insulation withstand voltage required between the terminal electrodes 21 and 22. Then, the structure is such that the entire surface of the surface of the ceramic base 1 except for the region where the insulating gap 51 is provided is covered with the metal films 21 and 22.
[0029]
According to the above structure, the ceramic substrate 1 is covered with the metal films 21 and 22 over a wide area except for the gap width α indispensable for the electrical insulation of the terminal electrodes 21 and 22. Mechanical vibration due to distortion can be suppressed. It is presumed that this is because the overall rigidity including the metal films 21 and 22 is increased. Since the gap width α of the insulating gap 51 is set to the gap width α corresponding to the insulation withstand voltage required between the terminal electrodes 21 and 22, a necessary electric insulation withstand voltage is secured between the terminal electrodes 21 and 22. I can do it.
[0030]
In the ceramic electronic component according to the present invention, mechanical vibration due to electrostriction is suppressed, so that generation of noise is reduced. In particular, for example, vibration sound having an audible frequency of 20 Hz to 20 kHz is significantly reduced. For this reason, for example, it can be used for circuits sensitive to noise such as audio equipment.
[0031]
More specifically, when the surface area of the ceramic base 1 is S and the surface areas of the metal films 21 and 22 are S1, the gap width α of the insulating gap 51 is set so as to satisfy 1> S1 / S ≧ 0.8. Set. It was confirmed that by satisfying this condition, mechanical vibration due to electrostriction could be reliably suppressed.
[0032]
In particular, it was confirmed that in the range of 0.9 ≧ S1 / S ≧ 0.8, mechanical vibration due to electrostriction can be more reliably and stably suppressed.
[0033]
Next, the above effects of the ceramic electronic component according to the present invention will be described using specific data. In the following description, the percentage of the ratio (S1 / S) may be referred to as the coverage.
[0034]
FIG. 4 is a schematic diagram of a distortion detection device used for data measurement. In FIG. 4, the strain detector used for measuring data is a Doppler vibrometer. In this distortion detecting device, the laser light 44 emitted from the sensor unit 45 is applied to the ceramic capacitor 2, and the applied laser light 44 strikes the ceramic capacitor 2 and is reflected to be a reflected wave. The reflected wave is processed by the converter 46, and a waveform is output from the oscilloscope 49.
[0035]
When the ceramic capacitor 2 is vibrating, the frequency of the reflected wave changes due to the Doppler effect, so that the reflected wave is processed by the O / E 47, A / D, D / A 48, etc. The distortion amount Δx of the capacitor 2 is detected.
[0036]
The terminal electrode of the ceramic capacitor 2 to be measured is soldered to the conductor pattern 41 on the circuit board 4 by the solder 43. A sine wave of 5 kHz and an effective voltage of 1 Vrms is applied from the AC power supply 42 to the ceramic capacitor 2. As the ceramic capacitor 2, the ceramic electronic component according to the present invention shown in FIGS. 1 to 3 and the ceramic electronic component of the comparative example were used. The ceramic electronic component according to the present embodiment shown in FIGS. 1 to 3 and the ceramic electronic component of the comparative example have a length, width, and thickness of 3.2 mm × 2.5 mm × 2.5 mm and a capacitance of This is a 10 μF ceramic capacitor.
[0037]
FIG. 5 is a perspective view showing a ceramic electronic component of a comparative example. The ceramic electronic component of the comparative example includes a ceramic base 91, terminal electrodes 921 and 922, and an insulating gap 951. As shown in FIG. 5, the ceramic electronic component of the comparative example has a small terminal electrode coverage, which is less than 80%.
[0038]
Table 1 is a table showing dimensions, coverage, and gap width of conventional general ceramic electronic components. As shown in Table 1, the ceramic electronic component of the comparative example has the same small coverage as a conventional general ceramic electronic component.
FIG. 6 is a waveform diagram output from the oscilloscope, which is obtained by using the ceramic electronic component of this embodiment having a coverage of about 80%. FIG. 7 is a waveform diagram output from the oscilloscope, which is obtained by using the ceramic electronic component of the comparative example having a coverage of about 40%.
[0039]
FIG. 8 is a characteristic diagram showing the amount of distortion of the ceramic electronic component of the present example and the ceramic electronic component of the comparative example. In the figure, black circles indicate the characteristics of the ceramic electronic component of the present example, and white circles indicate the characteristics of the ceramic electronic component of the comparative example.
[0040]
As shown in FIG. 8, the point near the coverage of 80% is the critical point. When the coverage is less than 80%, the strain amount is a large value, whereas the coverage is 80% or more. In the case of, the distortion amount decreases and converges to a substantially constant value. In particular, in the range of 0.9 ≧ S1 / S ≧ 0.8, the distortion amount converges to a constant and stable value.
[0041]
Further, the ceramic electronic component according to the present invention is not limited to the length, width, and thickness of 3.2 mm × 2.5 mm × 2.5 mm, and the length, width, and thickness may be arbitrary. Needless to say, the effect of the invention can be obtained.
[0042]
In the ceramic electronic component according to the present embodiment, the terminal electrodes 21 and 22 are provided on the entire surface of the one side surface 11 or the other side surface 12 of the ceramic base 1 and are adjacent to the surfaces 13, 14, 15 and 16. Are formed continuously. Therefore, the terminal electrodes 21 and 22 can secure a sufficiently large soldering area.
[0043]
FIG. 9 is a perspective view showing another embodiment of the ceramic electronic component according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.
[0044]
In the figure, the ceramic electronic component according to the present embodiment differs from the embodiment illustrated in FIGS. 1 to 3 in the shape of the terminal electrodes 21 and 22. When the surface area of the ceramic base 1 is S and the surface areas of the terminal electrodes 21 and 22 are S1, 1> S1 / S ≧ 0.8, preferably 0.9 ≧ S1 / S ≧ 0.8. Thus, the gap width α of the insulating gap 51 is set.
[0045]
Since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3, the same operation and effect can be obtained.
[0046]
FIG. 10 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.
[0047]
In the figure, the ceramic electronic component according to the present embodiment differs from the embodiment illustrated in FIGS. 1 to 3 in the shape of the terminal electrodes 21 and 22. When the surface area of the ceramic base 1 is S and the surface areas of the terminal electrodes 21 and 22 are S1, 1> S1 / S ≧ 0.8, preferably 0.9 ≧ S1 / S ≧ 0.8. Thus, the gap width α of the insulating gap 51 is set.
[0048]
Since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3, the same operation and effect can be obtained.
[0049]
FIG. 11 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.
[0050]
In FIG. 11, the ceramic electronic component of this embodiment includes a ceramic base 1, a metal film, insulating gaps 511 and 512, and internal electrodes 31 and 32. In this embodiment, the metal films are two terminal electrodes 21 and 22 and one dummy electrode 23.
[0051]
The dummy electrodes 23 are electrodes provided on a part of the surfaces 13, 14, 15, and 16 adjacent to the one side surface 11, and the shape and the number are arbitrary. In the present embodiment, the dummy electrode 23 is insulated from the terminal electrodes 21 and 22 and the internal electrodes 31 and 32.
[0052]
In the ceramic electronic component according to the present embodiment, since the insulating gaps 511 and 512 are formed on both sides of the dummy electrode 23, the sum of the two insulating gaps 511 and 512 prevents a short circuit between the terminal electrodes 21 and 22. Is the gap width α required for
[0053]
Further, since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3, the same operation and effect can be obtained.
[0054]
FIG. 12 is a front sectional view showing still another embodiment of the ceramic electronic component according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.
[0055]
In FIG. 12, the ceramic electronic component of this embodiment includes a ceramic base 1, a metal film, an insulating gap 51, internal electrodes 31, 32, and an insulating layer 61. The insulating layer 61 is provided only on the insulating gap 51.
[0056]
In the ceramic electronic component according to the present embodiment, since the insulating layer 61 is provided between the two terminal electrodes 21 and 22, the insulating property is increased by that amount and the short circuit of the terminal electrodes can be reliably avoided. Can be.
[0057]
Further, since the ceramic electronic component according to the present embodiment has the insulating layer 61 between the two terminal electrodes 21 and 22, the rigidity is increased by that amount, and the mechanical vibration due to the electrostriction is more reliably prevented. Can be suppressed.
[0058]
Further, since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3, the same operation and effect can be obtained.
[0059]
FIG. 13 is a perspective view showing another embodiment of the ceramic electronic component according to the present invention, and FIG. 14 is a sectional view taken along the line 14-14 in FIG. In the drawings, the same components as those shown in FIGS. 1 to 3 are denoted by the same reference numerals.
[0060]
In the ceramic electronic component according to the present embodiment, as shown in FIGS. 13 and 14, the terminal electrode 21 is provided on the entire surface of one side surface 14 in the length direction Y of the ceramic base 1 and is adjacent to the one side surface 14. Are provided on some of the surfaces 11, 12, 15, and 16 which are to be mounted. The terminal electrode 22 is provided on the entire surface of the other side surface 13 facing the one side surface 14 and is provided on a part of the surfaces 11, 12, 15, 16 adjacent to the one side surface 14.
[0061]
The internal electrode 31 is led out to one side surface 14, and the internal electrode 32 is led out to the other side surface 13. Further, as shown in FIG. 14, the terminal electrode 21 is connected to the internal electrode 31 led out to one side surface 14. The terminal electrode 22 is connected to the internal electrode 32 led out to the other side surface 13.
[0062]
Since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3 and FIGS. 9 to 12, the same operation and effect can be obtained.
[0063]
FIG. 15 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention. In the drawings, the same components as those shown in FIGS. 1 to 14 are denoted by the same reference numerals.
[0064]
In FIG. 15, the ceramic electronic component of this embodiment includes a ceramic base 1, a metal film, insulating gaps 511 and 512, and internal electrodes 31 and 32. In this embodiment, the metal films are two terminal electrodes 21 and 22 and one dummy electrode 23.
[0065]
Since the ceramic electronic component according to the present embodiment includes the same configuration as the ceramic electronic component shown in FIGS. 1 to 3 and FIGS. 9 to 14, the same operation and effect can be obtained.
[0066]
In addition, the ceramic electronic component according to the present invention may be a jumper element, an inductor, a varistor, or a composite component that is a combination thereof, in addition to the ceramic capacitor.
[0067]
【The invention's effect】
As described above, according to the present invention, the following effects can be obtained.
By suppressing mechanical vibration due to electrostriction, a ceramic electronic component capable of reducing noise can be provided.
[Brief description of the drawings]
FIG. 1 is a perspective view showing a ceramic electronic component according to the present invention.
FIG. 2 is a front sectional view of the ceramic electronic component shown in FIG. 1;
FIG. 3 is an exploded perspective view of the ceramic electronic component shown in FIG.
FIG. 4 is a schematic diagram of a distortion detection device used for data measurement.
FIG. 5 is a perspective view showing a ceramic electronic component of a comparative example.
FIG. 6 is a waveform diagram output from an oscilloscope.
FIG. 7 is another waveform diagram output from the oscilloscope.
FIG. 8 is a characteristic diagram showing distortion amounts of the ceramic electronic component of the present example and the ceramic electronic component of the comparative example.
FIG. 9 is a perspective view showing another embodiment of the ceramic electronic component according to the present invention.
FIG. 10 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention.
FIG. 11 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention.
FIG. 12 is a front sectional view showing still another embodiment of the ceramic electronic component according to the present invention.
FIG. 13 is a perspective view showing another embodiment of the ceramic electronic component according to the present invention.
FIG. 14 is a sectional view taken along the line 14-14 in FIG. 13;
FIG. 15 is a perspective view showing still another embodiment of the ceramic electronic component according to the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Ceramic base 21, 22 Terminal electrode 31, 32 Internal electrode 51 Insulation gap

Claims (7)

  1. A ceramic electronic component including a ceramic base, a metal film, and an insulating gap,
    The ceramic substrate has piezoelectric properties,
    The metal film includes at least two terminal electrodes, and is provided on a surface of the ceramic base,
    The insulating gap, on the surface of the ceramic substrate, for separating the terminal electrodes, the gap width is set to a reduced width corresponding to the insulation withstand voltage required between the terminal electrodes,
    A ceramic electronic component, wherein the entire surface of the ceramic substrate except for a region where the insulating gap is provided is covered with the metal film.
  2. A ceramic electronic component including a ceramic base, a metal film, and an insulating gap,
    The ceramic substrate has piezoelectric properties,
    The metal film includes at least two terminal electrodes, and is provided on a surface of the ceramic base,
    The insulating gap is for separating the terminal electrode on the surface of the ceramic base,
    The entire surface of the ceramic substrate except for the region where the insulating gap is provided is covered with the metal film,
    When the surface area of the ceramic substrate is S and the surface area of the portion where the metal film is formed is S1,
    1> S1 / S ≧ 0.8
    Meet ceramic electronic components.
  3. It is a ceramic electronic component according to claim 2,
    Ceramic electronic component satisfying 0.9 ≧ S1 / S.
  4. The ceramic electronic component according to claim 1, wherein the ceramic base includes barium titanate (BaTiO 3 ) -based ceramic.
  5. 5. The ceramic electronic component according to claim 1, further comprising an internal electrode, wherein the internal electrode is embedded in the ceramic base and connected to the terminal electrode. 6. parts.
  6. The ceramic electronic component according to claim 1, wherein:
    The insulating gap is at least two;
    The ceramic electronic component, wherein the metal film includes at least one dummy electrode, and the dummy electrode is electrically insulated from the terminal electrode by the insulating gap.
  7. The ceramic electronic component according to claim 1, wherein the ceramic electronic component is a ceramic capacitor.
JP2002196574A 2002-07-04 2002-07-04 Ceramic electronic part Pending JP2004039937A (en)

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Cited By (11)

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WO2006110287A1 (en) * 2005-04-07 2006-10-19 Honeywell International Inc. Low esl and esr chip capacitor
JP2007273996A (en) * 2006-03-13 2007-10-18 Avx Corp Capacitor assembly
US7715171B2 (en) 2005-08-19 2010-05-11 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP2010129737A (en) * 2008-11-27 2010-06-10 Murata Mfg Co Ltd Electronic component, and electronic component built-in substrate
JP2012038917A (en) * 2010-08-06 2012-02-23 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing the same
JP2012080079A (en) * 2010-09-06 2012-04-19 Murata Mfg Co Ltd Electronic component
WO2012132726A1 (en) * 2011-03-29 2012-10-04 株式会社 村田製作所 Electronic component
JP2014203862A (en) * 2013-04-02 2014-10-27 パナソニック株式会社 Ceramic electronic component and method for manufacturing the same
JP2016009860A (en) * 2014-06-26 2016-01-18 サムソン エレクトロ−メカニックス カンパニーリミテッド. Board built-in type laminated ceramic electronic component, manufacturing method for the same and laminated ceramic electronic component built-in type print circuit board
JPWO2016084457A1 (en) * 2014-11-26 2017-09-07 株式会社村田製作所 Thermistor element and circuit board
JP2018523299A (en) * 2015-06-10 2018-08-16 クアルコム,インコーポレイテッド Capacitor structure for power delivery applications

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2006110287A1 (en) * 2005-04-07 2006-10-19 Honeywell International Inc. Low esl and esr chip capacitor
US7715171B2 (en) 2005-08-19 2010-05-11 Murata Manufacturing Co., Ltd. Multilayer ceramic capacitor
JP2007273996A (en) * 2006-03-13 2007-10-18 Avx Corp Capacitor assembly
JP2010129737A (en) * 2008-11-27 2010-06-10 Murata Mfg Co Ltd Electronic component, and electronic component built-in substrate
KR101098155B1 (en) 2008-11-27 2011-12-26 가부시키가이샤 무라타 세이사쿠쇼 Electronic component and electronic component built-in substrate
JP2012038917A (en) * 2010-08-06 2012-02-23 Murata Mfg Co Ltd Ceramic electronic component and method for manufacturing the same
JP2012080079A (en) * 2010-09-06 2012-04-19 Murata Mfg Co Ltd Electronic component
WO2012132726A1 (en) * 2011-03-29 2012-10-04 株式会社 村田製作所 Electronic component
JP5459567B2 (en) * 2011-03-29 2014-04-02 株式会社村田製作所 Electronic components
JPWO2012132726A1 (en) * 2011-03-29 2014-07-24 株式会社村田製作所 Electronic components
JP2014203862A (en) * 2013-04-02 2014-10-27 パナソニック株式会社 Ceramic electronic component and method for manufacturing the same
JP2016009860A (en) * 2014-06-26 2016-01-18 サムソン エレクトロ−メカニックス カンパニーリミテッド. Board built-in type laminated ceramic electronic component, manufacturing method for the same and laminated ceramic electronic component built-in type print circuit board
JPWO2016084457A1 (en) * 2014-11-26 2017-09-07 株式会社村田製作所 Thermistor element and circuit board
JP2018523299A (en) * 2015-06-10 2018-08-16 クアルコム,インコーポレイテッド Capacitor structure for power delivery applications

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