JP5441954B2 - 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法 - Google Patents

回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法 Download PDF

Info

Publication number
JP5441954B2
JP5441954B2 JP2011111490A JP2011111490A JP5441954B2 JP 5441954 B2 JP5441954 B2 JP 5441954B2 JP 2011111490 A JP2011111490 A JP 2011111490A JP 2011111490 A JP2011111490 A JP 2011111490A JP 5441954 B2 JP5441954 B2 JP 5441954B2
Authority
JP
Japan
Prior art keywords
circuit
adhesive layer
film
resin
circuit connection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2011111490A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012023025A (ja
Inventor
暁黎 杜
和也 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Showa Denko Materials Co Ltd
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to JP2011111490A priority Critical patent/JP5441954B2/ja
Priority to TW100120185A priority patent/TWI455152B/zh
Priority to KR1020110056866A priority patent/KR101313939B1/ko
Priority to CN201110162360.8A priority patent/CN102382581B/zh
Publication of JP2012023025A publication Critical patent/JP2012023025A/ja
Priority to KR1020130045936A priority patent/KR101380070B1/ko
Application granted granted Critical
Publication of JP5441954B2 publication Critical patent/JP5441954B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/35—Heat-activated
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/831—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus
    • H01L2224/83101—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector the layer connector being supplied to the parts to be connected in the bonding apparatus as prepeg comprising a layer connector, e.g. provided in an insulating plate member
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/0781—Adhesive characteristics other than chemical being an ohmic electrical conductor
    • H01L2924/07811—Extrinsic, i.e. with electrical conductive fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15788—Glasses, e.g. amorphous oxides, nitrides or fluorides

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Wire Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
  • Non-Insulated Conductors (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
JP2011111490A 2010-06-14 2011-05-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法 Active JP5441954B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2011111490A JP5441954B2 (ja) 2010-06-14 2011-05-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
TW100120185A TWI455152B (zh) 2010-06-14 2011-06-09 電路連接用接著膜及其用途、電路連接構造體及其製造方法、以及電路構件的連接方法
KR1020110056866A KR101313939B1 (ko) 2010-06-14 2011-06-13 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
CN201110162360.8A CN102382581B (zh) 2010-06-14 2011-06-13 电路连接用粘接膜及用途、结构体及制造方法和连接方法
KR1020130045936A KR101380070B1 (ko) 2010-06-14 2013-04-25 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2010135301 2010-06-14
JP2010135301 2010-06-14
JP2011111490A JP5441954B2 (ja) 2010-06-14 2011-05-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2012275608A Division JP2013101942A (ja) 2010-06-14 2012-12-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Publications (2)

Publication Number Publication Date
JP2012023025A JP2012023025A (ja) 2012-02-02
JP5441954B2 true JP5441954B2 (ja) 2014-03-12

Family

ID=45777099

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2011111490A Active JP5441954B2 (ja) 2010-06-14 2011-05-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP2012275608A Withdrawn JP2013101942A (ja) 2010-06-14 2012-12-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2012275608A Withdrawn JP2013101942A (ja) 2010-06-14 2012-12-18 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法

Country Status (4)

Country Link
JP (2) JP5441954B2 (ko)
KR (1) KR101380070B1 (ko)
CN (1) CN102382581B (ko)
TW (1) TWI455152B (ko)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI588237B (zh) * 2012-09-28 2017-06-21 住友金屬鑛山股份有限公司 導電性接著劑
JP2016011427A (ja) * 2015-09-07 2016-01-21 古河電気工業株式会社 接着フィルム、ウェハ加工用テープおよび接着フィルムの製造方法
CN105820769A (zh) * 2016-04-22 2016-08-03 合肥宝亿自动化科技有限公司 一种硅胶带无缝连接端结构
US10968373B2 (en) 2016-09-30 2021-04-06 Sekisui Chemical Co., Ltd. Epoxy adhesive composition
WO2018092671A1 (ja) * 2016-11-18 2018-05-24 古河電気工業株式会社 接合フィルム、ウエハ加工用テープ、接合体の製造方法および接合体
JP2020164722A (ja) * 2019-03-29 2020-10-08 デクセリアルズ株式会社 接着剤組成物
JP2023165190A (ja) * 2022-05-02 2023-11-15 株式会社レゾナック 積層体、積層体の製造方法、及び、接続構造体の製造方法
WO2024091839A1 (en) * 2022-10-26 2024-05-02 Ppg Industries Ohio, Inc. Coating composition for use in high efficiency applicators

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63193883U (ko) * 1987-05-29 1988-12-14
JP3477367B2 (ja) * 1998-05-12 2003-12-10 ソニーケミカル株式会社 異方導電性接着フィルム
JP4627125B2 (ja) * 2001-07-27 2011-02-09 三井化学株式会社 異方性導電ペースト
EP2180026A4 (en) * 2007-08-08 2012-05-30 Hitachi Chemical Co Ltd ADHESIVE COMPOSITION, FILM-TYPE LUBRICANT AND CONNECTING STRUCTURE FOR A SWITCHING ELEMENT
WO2009051067A1 (ja) * 2007-10-18 2009-04-23 Hitachi Chemical Company, Ltd. 接着剤組成物及びこれを用いた回路接続材料、並びに、回路部材の接続方法及び回路接続体
KR20110056555A (ko) * 2008-10-22 2011-05-30 히다치 가세고교 가부시끼가이샤 접착제 필름

Also Published As

Publication number Publication date
TW201222568A (en) 2012-06-01
KR20130051461A (ko) 2013-05-20
JP2012023025A (ja) 2012-02-02
CN102382581A (zh) 2012-03-21
JP2013101942A (ja) 2013-05-23
CN102382581B (zh) 2014-12-31
KR101380070B1 (ko) 2014-04-01
TWI455152B (zh) 2014-10-01

Similar Documents

Publication Publication Date Title
JP5441954B2 (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
TW200417576A (en) Curing resin composition, adhesive epoxy resin paste, adhesive epoxy resin sheet, conductive connection paste, conductive connection sheet, and electronic component joined body
JP2009194359A (ja) 回路接続用接着フィルム、これを用いた回路部材の接続構造及び回路部材の接続方法
JP2012021140A (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP6237855B2 (ja) 接着フィルム、回路部材の接続構造及び回路部材の接続方法
JP5485222B2 (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP5206840B2 (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
JP4631984B2 (ja) 回路部材接続用接着剤、回路板、及びその製造方法
JP2018104653A (ja) 接着剤組成物の選別方法、回路部材の接続方法、接続構造体、接着剤組成物及びフィルム状接着剤
KR20110136731A (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP5223946B2 (ja) 回路接続用接着フィルム、これを用いた回路接続構造体及び回路部材の接続方法
KR101314007B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101313972B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR101313939B1 (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
KR20110136732A (ko) 회로 접속용 접착 필름 및 그의 용도, 회로 접속 구조체 및 그의 제조 방법 및 회로 부재의 접속 방법
JP2015183115A (ja) 回路部材接続用接着剤

Legal Events

Date Code Title Description
A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20120418

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20120522

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20120709

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20121002

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20121218

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20121226

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20130125

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130913

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20131125

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131217

R150 Certificate of patent or registration of utility model

Ref document number: 5441954

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

Free format text: JAPANESE INTERMEDIATE CODE: R150

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

S533 Written request for registration of change of name

Free format text: JAPANESE INTERMEDIATE CODE: R313533

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350

S531 Written request for registration of change of domicile

Free format text: JAPANESE INTERMEDIATE CODE: R313531

R350 Written notification of registration of transfer

Free format text: JAPANESE INTERMEDIATE CODE: R350