JP5436550B2 - 流体計量のためのマイクロフルイディック箔構造体 - Google Patents
流体計量のためのマイクロフルイディック箔構造体 Download PDFInfo
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- JP5436550B2 JP5436550B2 JP2011510902A JP2011510902A JP5436550B2 JP 5436550 B2 JP5436550 B2 JP 5436550B2 JP 2011510902 A JP2011510902 A JP 2011510902A JP 2011510902 A JP2011510902 A JP 2011510902A JP 5436550 B2 JP5436550 B2 JP 5436550B2
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- B29C66/814—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps
- B29C66/8141—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined
- B29C66/81411—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the design of the pressing elements, e.g. of the welding jaws or clamps characterised by the surface geometry of the part of the pressing elements, e.g. welding jaws or clamps, coming into contact with the parts to be joined characterised by its cross-section, e.g. transversal or longitudinal, being non-flat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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- B29C66/8181—General aspects of the pressing elements, i.e. the elements applying pressure on the parts to be joined in the area to be joined, e.g. the welding jaws or clamps characterised by the cooling constructional aspects, or by the thermal or electrical insulating or conducting constructional aspects of the welding jaws or of the clamps ; comprising means for compensating for the thermal expansion of the welding jaws or of the clamps characterised by the cooling constructional aspects
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- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
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Description
したがって、本発明の目的は、マイクロフルイディック構造体の作製方法及びこの作製方法により経済的に作製できるマイクロフルイディック構造体を提供することにある。
曲げ中、チャネル又はチャンバの断面積は、曲げの数学的符号に応じて、小さくなり又は大きくなる。チャネル又はチャンバ内の流れをこのようにして故意に絞ることができる。
マイクロフルイディック構造体は、基板(1)によって形成され、この基板は、ボアの形態をした切れ目又は開口部(8)を有する。
フィルム(2)が基板キャリヤ(1)に少なくとも部分的に又は別々の領域で取り付けられている。
フィルム部分は、好ましくは、チャンバ(6)を環境から流体密状態に密封する。
2 フィルム
3 カバーフィルム
4 密封フィルム
5 チャネル
6 チャンバ
7 液体
8 ボア/貫流開口部
9 メニスカス
10 アクチュエータ
11 材料のウェッジ
12 段部/縁部
13 頂点
15 血小板
16 赤血球
17 血漿
20 チャネル端部
21 支持体平面
22 凹部/切欠き
23 接触点
24 取り付け領域
25 非取り付け領域
26 支持部材
27 疎水性ベント
28 容器/ブリスタ
29 粘着性層
30 圧縮空気
31 加圧ダイ
32 支持板
33 ベント
34 針
35 入口
36 出口
Claims (16)
- 基板(1)と、非取り付け部分(25)を備えた状態で前記基板(1)に平らに取り付けられたフィルム(2)とを有するマイクロフルイディック構造体であって、壁を有するチャンバ(6)又はチャネル(5)が前記非取り付け部分(25)内において前記基板の平面(21)の上方に形成されるようになっている、マイクロフルイディック構造体において、
前記フィルム(2)は、多層フィルムであり、前記フィルム(2)は、前記基板に被着された密封層(4)と、前記密封層の上方に配置された被覆層(3)とから成り、前記密封層(4)は、前記被覆層(3)よりも低い融解温度及び/又は軟化温度を有し、前記フィルム(2)を前記基板(1)に結合しているときに前記フィルム材料の粘性流れによって材料のウェッジ(11)が前記非取り付け部分(25)と取り付け部分(24)との間のエッジゾーンに形成され、前記材料ウェッジ(11)は、前記チャンバの壁と前記基板(1)との間の移行部となり、前記チャンバの壁を持ち上げて前記基板平面(21)から離している、
ことを特徴とするマイクロフルイディック構造体。 - 前記密封層(4)の軟化温度は、60℃〜200℃であり、前記被覆層(3)の軟化温度は、150℃〜350℃である、
請求項1記載のマイクロフルイディック構造体。 - 前記密封層(4)の軟化温度は、85℃〜110℃であり、前記被覆層(3)の軟化温度は、200℃〜300℃である、
請求項2記載のマイクロフルイディック構造体。 - 前記チャンバ(6)及び/又は前記チャネル(5)によってマイクロフルイディックネットワークが前記基板平面の上方に形成されている、
請求項1記載のマイクロフルイディック構造体。 - チャネル(5)の形態をした凹部(22)が前記基板(1)に形成され、前記フィルムで形成されたチャンバ(6)又はチャネル(5)が前記基板内のチャネル区分(5)の一端部を覆うように位置し、前記基板(1)の前記チャネル区分の壁は、前記フィルム(2)で形成された前記チャンバ(6)又は前記チャネル(5)に対して段部を形成している、
請求項1記載のマイクロフルイディック構造体。 - 前記チャンバ(6)又は前記チャネル(5)は、前記基板(1)を貫通した横方向ボア(8)に被さるように位置し、前記チャンバ(6)の外縁部は、1〜20μmの毛管隙間が前記チャンバの壁と前記段部の縁(12)との間に作られるよう前記横方向ボア(8)の上方に配置されると共に/或いはチャネル(5)は、前記横方向ボア(8)内に頂部及び底部のところで開口すると共に/或いは前記フィルム(2)は、前記基板の頂部及び底部に被着されている、
請求項4又は5記載のマイクロフルイディック構造体。 - 前記チャンバ(6)及び/又は前記チャネル(5)は、断面が円板の形をしており、その断面幅は、断面高さの少なくとも20倍であり、前記断面の縁領域の前記チャンバの壁と前記基板平面(21)とのなす角度は、1°〜20°である、
請求項1記載のマイクロフルイディック構造体。 - 前記チャンバ高さは、前記チャンバの頂点(13)のところの第1の断面領域では10〜15ミクロンであり、前記頂点(13)と前記縁部との間の第2の断面領域では5〜10μmであり、第3の縁領域では0.1μm〜5μmであり、断面高さが変化している結果として、互いに異なるサイズの血液流体粒子がこれら自体互いに異なる流れ領域内に位置するようになり、主として赤血球が前記第1の断面領域中を流れ、主として血小板が前記第2の断面領域中を流れ、主として血漿が前記第3の縁領域中を流れる、
請求項7記載のマイクロフルイディック構造体。 - 前記基板の平面(21)に対するキュポラ又はドームの中心(13)は、前記ドームの前記中心からの前記基板平面(21)の距離が前記ドームと前記基板平面(21)との間の最大垂直距離の半分未満であるよう外側領域に対して下げられ、貫流開口部(8)が前記チャンバドーム(13)の下に配置され、前記ドームの前記下げられている中心は、毛管作用開始箇所として働く、
請求項7記載のマイクロフルイディック構造体。 - 前記段部の縁(12)は、毛管作用停止部を形成し、柔軟性の前記チャンバの壁の作動により、前記チャンバの壁と前記段部の前記縁との間の隙間間隔を変更することができ、前記隙間を湿潤させるようにする、
請求項5記載のマイクロフルイディック構造体。 - 前記基板に形成された少なくとも2つのチャネル端部は、前記ドーム形チャンバによって覆われ、前記基板(1)は、前記フィルムから見て遠くに位置する前記非取り付け状態のフィルム部分の下の領域に、基板の底部に設けられた凹部(22)を有し、前記凹部(22)は、くさび形、球形、半球形、又は長方形である、
請求項7記載のマイクロフルイディック構造体。 - 前記基板(1)は、柔軟性であり、曲げ応力を受けることができ、前記くさび領域について可逆的に弾性的に曲げ可能であり、前記基板(1)は、機械的クランプ手段を有し、前記クランプ手段は、ガイド及び接触点(23)である、
請求項11記載のマイクロフルイディック構造体。 - 前記基板材料は、弾性であり、前記基板厚さは、チャンバ及び/又はチャネルの広がりの一部分に沿って減少しており、この領域は、小さな曲げ力を受けて変形し、前記フィルム内の前記流体チャンバ又は流体チャネルの断面の変化を生じさせるようになっており、厚さの減少した基板を支持するための支持部材(26)が前記基板(1)の下に配置され、前記流体チャネルは、前記マイクロフルイディック構造体を曲げることによって調節できる絞りを形成している、
請求項1記載のマイクロフルイディック構造体。 - 請求項1ないし13のいずれか1項に記載のマイクロフルイディック構造体を作製する方法であって、平べったい平面状フィルム(2)を平べったいシート状基板(1)に積層する方法において、
前記積層のため、少なくとも1つの凹部(22)又は開口部を備えたマスク(31)を圧力下で且つ/或いは熱の作用下で前記基板上の前記フィルム(2)に押し付け、それにより、前記フィルムを少なくとも前記凹部又は前記開口部の付近へのフィルム及び/又は基板媒体の粘性流れが生じる温度に至らせて材料のウェッジを形成すると共にフィルムを凹部の付近で膨出させてチャンバを形成するようにする、
ことを特徴とする方法。 - 少なくとも二層フィルム(2)を前記フィルム層が前記基板に隣接した状態で前記基板に積層し、前記密封層(4)は、外側被覆フィルム(3)よりも低い軟化温度及び/又は融解温度を有し、前記積層中、前記密封フィルム(4)の前記融解温度及び/又は前記軟化温度に近い温度を設定し、前記積層温度は、70℃〜350℃である、
請求項14記載の方法。 - ローラダイ及び/又は板状マスク(31)の形態をしたマスクを用いて前記フィルム(2)を前記基板(1)上に積層すると共に/或いは前記フィルムを積層のためのダイの形態をしたマスクによって前記基板上に積層する、
請求項14又は15記載の方法。
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CN102112229A (zh) | 2011-06-29 |
RU2010154517A (ru) | 2012-07-20 |
CN102112229B (zh) | 2014-08-06 |
KR20110021999A (ko) | 2011-03-04 |
MX2010013204A (es) | 2011-02-25 |
BRPI0913340A2 (pt) | 2015-11-24 |
CA2726219C (en) | 2016-03-15 |
IL209405A (en) | 2016-07-31 |
CA2726219A1 (en) | 2009-12-30 |
JP2011524815A (ja) | 2011-09-08 |
AU2009262555B2 (en) | 2015-05-07 |
BRPI0913340B1 (pt) | 2019-06-25 |
WO2009156045A2 (en) | 2009-12-30 |
KR101566182B1 (ko) | 2015-11-05 |
NZ589466A (en) | 2013-08-30 |
AU2009262555A1 (en) | 2009-12-30 |
EP2138233A1 (de) | 2009-12-30 |
DE502008001596D1 (de) | 2010-12-02 |
ZA201008267B (en) | 2011-07-27 |
ES2352581T3 (es) | 2011-02-21 |
US20110135546A1 (en) | 2011-06-09 |
CL2010001328A1 (es) | 2011-06-10 |
ATE485101T1 (de) | 2010-11-15 |
IL209405A0 (en) | 2011-01-31 |
EP2138233B1 (de) | 2010-10-20 |
DK2138233T3 (da) | 2011-01-31 |
RU2515287C2 (ru) | 2014-05-10 |
WO2009156045A3 (en) | 2010-03-18 |
US8580209B2 (en) | 2013-11-12 |
WO2009156045A4 (en) | 2010-05-20 |
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