JP5429113B2 - Component mounting method - Google Patents

Description

  The present invention relates to a component mounting method for mounting a component sucked by a suction nozzle on a substrate.

  Conventionally, when a component mounting process for mounting an electronic component on a board is performed by the component mounting apparatus, the electronic component is imaged from below before mounting the electronic component sucked by the suction nozzle on the board. By grasping the outer shape or the position of the electrode on the lower surface of the electronic component, the position of the component in the image is grasped, thereby detecting the positional deviation of the electronic component with respect to the suction nozzle so that the positional deviation is corrected. In addition, the electronic component is aligned with the substrate (for example, Patent Document 1).

JP 2003-60398 A

  However, the components mounted on the substrate by the component mounting device are not limited to electronic components. For example, a component made of a transparent material such as an LED diffusing lens provided to cover an LED (electronic component) mounted on the substrate is mounted on the substrate. You may need to In this case, since the component sucked by the suction nozzle transmits illumination light and does not have an electrode, the position of the component in the image cannot be easily grasped, and the position of the component cannot be detected accurately. Therefore, there is a problem that it is difficult to mount the component on the board with high accuracy.

Therefore, the present invention accurately detects the position of a component when mounting a component made of a transparent material that does not have an electrode and has a plurality of projecting portions projecting downward on the substrate. It is an object of the present invention to provide a component mounting method capable of mounting a component on a board with high accuracy.

The component mounting method according to claim 1 is a component mounting method for mounting on a top surface of a substrate a component made of a transparent material that does not have an electrode and has a plurality of protruding portions provided to protrude downward. there are the steps of picking up the upper surface of the component suction to the suction nozzle, the projection of the component adsorbed by the suction nozzle into the paste film paste is formed by forming a thin film for bonding the component to the substrate adhering a paste to the protruding portion parts contacting the the steps of imaging the component the paste is deposited from below the protrusion, the position of a plurality of paste obtained from an image obtained by the imaging Based on the position of the component in the image based on the detected position of the component, thereby detecting the position of the component, and the portion sucked by the suction nozzle based on the detected position of the component And a step of aligning with respect to the substrate, and a step of mounting the components were positioned with respect to the substrate on the substrate.

The component mounting method according to claim 2 is the component mounting method according to claim 1, wherein the component is formed in a curved surface shape whose upper surface is convex upward, and the lower surface is flat. to have a plurality of protrusions on the lower surface.

In the present invention, the paste is attached to the protruding portion of the component sucked by the suction nozzle, the part is imaged from below, and the position of the component in the image is determined based on the positions of the plurality of pastes obtained from the obtained image. Since the position of the part is detected by this, the position of the protruding part of the part in the image can be easily grasped from the position of the paste in the image, and the position of the part is accurately determined. It is possible to detect and mount the component on the board with high accuracy.

The simplified block diagram of the component mounting apparatus in one embodiment of this invention The partial expanded partial sectional view of the mounting head with which the component mounting apparatus in one embodiment of this invention is equipped The flowchart which shows the procedure of the component mounting process performed with the component mounting apparatus in one embodiment of this invention (A) (b) (c) The figure explaining the process of picking up components with the suction nozzle in the component mounting method which the component mounting apparatus in one embodiment of this invention performs (A) (b) (c) The figure explaining the process of picking up components with the suction nozzle in the component mounting method which the component mounting apparatus in one embodiment of this invention performs (A) (b) (c) The figure explaining the process of attaching a paste to the protrusion part of the lower surface of the component in the component mounting method which the component mounting apparatus in one embodiment of this invention performs (A) The figure which shows the state which is imaging the electronic component attracted | sucked by the suction nozzle with the imaging camera with which the component mounting apparatus in one embodiment of this invention is equipped. (B) The component mounting apparatus in one embodiment of this invention The figure which shows an example of the image obtained by imaging the electronic component adsorbed | sucked to the suction nozzle by the imaging camera with which it is equipped (A) The figure which shows the state which is imaging the electronic component attracted | sucked by the suction nozzle with the imaging camera with which the component mounting apparatus in one embodiment of this invention is equipped. (B) The component mounting apparatus in one embodiment of this invention The figure which shows an example of the image obtained by imaging the electronic component adsorbed | sucked to the suction nozzle by the imaging camera with which it is equipped (A) (b) (c) The figure explaining the process of mounting | wearing a board | substrate with the electronic component in the component mounting method which the component mounting apparatus in one embodiment of this invention performs

  Embodiments of the present invention will be described below with reference to the drawings. A component mounting apparatus 1 shown in FIG. 1 is a device for mounting a component 4 made of a transparent material (for example, an LED diffuser lens when the electronic component 2 is an LED) on a substrate 3 on which an electronic component 2 is mounted. Therefore, it can also be used as a component mounting apparatus for mounting the electronic component 2 on the substrate 3.

  The component mounting apparatus 1 includes a substrate transport unit 11 that transports and positions the substrate 3 on which the electronic component 2 is mounted, a component supply unit 12 that supplies the component 4, and a paste P for bonding the component 4 to the substrate 3. A paste supply unit 13, an imaging camera 14 with an imaging field of view upward, and a mounting head 15.

  In FIG. 1, the board transport unit 11 includes a pair of belt conveyors 11a, and the pair of belt conveyors 11a are controlled by a control device 16 included in the component mounting apparatus 1 to move the board 3 in a certain direction (here Then, the sheet is conveyed in a direction perpendicular to the paper surface of FIG.

  In FIG. 1, the component supply part 12 consists of a table-shaped member, and supplies the component 4 in the state which mounted the some component 4 on the upper surface.

  In FIG. 1, the component 4 is formed in a curved shape whose upper surface is convex upward, and a plurality of (here, three) protruding (projecting) portions 4 a extending downward are provided on the flat lower surface. It has been. The plurality of protrusions 4 a are portions that directly contact the upper surface of the substrate 3, and data indicating the relationship between the center position of the component 4 and the position of each protrusion 4 a is stored in advance in a storage device 16 a connected to the control device 16. Has been.

  In FIG. 1, the paste supply part 13 consists of a plate-shaped member, and forms the thin paste film Pm by equalizing the accommodated paste P to uniform thickness with a squeegee which is not illustrated.

  In FIG. 1, the imaging camera 14 is composed of a CCD camera, for example, and performs an imaging operation in response to a command from the control device 16. Image data obtained by the imaging operation of the imaging camera 14 is transmitted to the control device 16.

  The control device 16 detects the position of the paste P attached to the protruding portion 4a of the component 4 from the image data obtained by the imaging operation of the imaging camera 14, and based on the detected position of the paste P, the component in the image 4 is provided. The control device 16 holds the grasped position of the component 4 as a “position shift amount” with respect to the suction nozzle 21 and uses it for controlling the mounting head moving mechanism 31 in the alignment process. In the control device 16, “position displacement amount” is used as data for specifying the “position” of the component 4, but the position of the component 4 is specified by a relative distance from a reference coordinate other than the suction nozzle 21. You may do.

  In FIG. 1, the mounting head 15 has a suction nozzle 21 extending downward. As shown in FIG. 2, the suction nozzle 21 extends downward from the lower end of the cylindrical portion 22 a and the cylindrical portion 22 a that are externally fitted to the suction nozzle 21, and is conically lowered in a region below the lower end of the suction nozzle 21. A suction pad 22 having a skirt 22b extending in the direction is attached. As shown in FIG. 2, a disk-shaped reflecting plate 23 is attached to the upper part of the suction nozzle 21 (above the suction pad 22).

  The mounting head 15 is three-dimensionally moved by a mounting head moving mechanism 31 formed of a three-axis orthogonal robot whose operation is controlled by the control device 16, and enters the suction nozzle 21 by the suction mechanism 32 whose operation is controlled from the control device 16. The suction and release of the component 4 are performed by supplying and stopping the vacuum pressure.

  The procedure of the component mounting process for mounting the component 4 on the substrate 3 by the component mounting apparatus 1 will be described. First, the control device 16 included in the component mounting apparatus 1 operates the substrate transport unit 11 to place the electronic component 2 on the upper surface. The mounted substrate 3 is transported (carried in) and positioned at a predetermined work position (substrate loading positioning process in step ST1 shown in FIG. 3).

  When the control device 16 positions the substrate 3 at a predetermined work position, the control device 16 controls the operation of the mounting head moving mechanism 31 to move the mounting head 15 above the component supply unit 12. Then, the mounting head 15 is lowered to bring the suction nozzle 21 into contact with the upper surface of the component 4, and the operation of the suction mechanism 32 is controlled to supply a vacuum pressure into the suction nozzle 21 to raise the mounting head 15. As a result, the component 4 is picked up by the suction nozzle 21 via the suction pad 22 (pickup step of step ST2 shown in FIG. 3).

  In the pick-up process of step ST2, the suction pad 22 attached to the suction nozzle 21 of the mounting head 15 has the bottom portion 22b that extends downward in a conical shape as described above, so that the upper surface is convex upward. The part 4 formed in the curved surface shape can be reliably picked up by the suction nozzle 21. Here, as shown in FIG. 4, when the component 4 is adsorbed by the adsorption nozzle 21 in a state where the vertical center axis J1 of the adsorption nozzle 21 and the vertical center axis J2 of the component 4 coincide with each other in the horizontal plane direction. (FIG. 4 (a) → FIG. 4 (b)), the component 4 sucked by the suction nozzle 21 through the suction pad 22 is maintained in a horizontal posture (FIG. 4 (c)). There is no positional shift with respect to the suction nozzle 21.

  On the other hand, as shown in FIG. 5, when the component 4 is attracted to the suction nozzle 21 in a state where the vertical center axis J1 of the suction nozzle 21 does not coincide with the vertical center axis J2 of the component 4 (FIG. 5 ( a) → FIG. 5B), the component 4 sucked by the suction nozzle 21 through the suction pad 22 is inclined from the horizontal posture (FIG. 5C), and in many cases, the suction nozzle of the component 4 Thus, a positional deviation with respect to 21 occurs.

  When the control device 16 picks up the component 4 with the suction nozzle 21, it controls the operation of the mounting head moving mechanism 31 to move the mounting head 15 above the paste supply unit 13 (FIG. 6A). Then, the control device 16 lowers the mounting head 15 so that the protrusion 4 a on the lower surface of the component 4 sucked by the suction nozzle 21 comes into contact with the paste film Pm formed in the paste supply unit 13. (FIG. 6B), the mounting head 15 is raised (FIG. 6C). As a result, the paste P is transferred to the plurality of protrusions 4a of the component 4, and the paste P is attached to each protrusion 4a (paste attachment step of step ST3 shown in FIG. 3).

  When the control device 16 attaches the paste P to the plurality of protrusions 4 a of the component 4, the control device 16 controls the operation of the mounting head moving mechanism 31 to move the mounting head 15 directly above the imaging camera 14. Then, the components 4 sucked by the suction nozzle 21 are directly irradiated with light by a plurality of illuminations LT (see also FIG. 1) shown in FIGS. 7A and 8A provided on both sides of the imaging camera 14. (FIG. 7 (a)), or light is applied to the reflection plate 23, which is the background of the component 4 (FIG. 8 (a)), and the component 4 is imaged from below by the imaging camera 14 (steps shown in FIG. 3). ST4 imaging process).

  When the control device 16 images the component 3 from below, as shown in FIGS. 7A and 7B, the lower surface of the component 4 in the image obtained by imaging (hereinafter referred to as the captured image SR). The position WG of the center of the component 4 in the captured image SR is grasped from the positions of the paste P attached to the plurality of protrusions 4a (FIGS. 7B and 8B). The center position NG of the suction nozzle 21 is grasped from the position of the suction nozzle 21 on the control data, and the center position WG of the component 4 in the captured image SR and the position of the suction nozzle 21 are compared, so that suction is performed. The position shift (position shift amount) of the component 4 with respect to the nozzle 21 is detected (position detection step of step ST5 shown in FIG. 3).

  7B shows the case where the center position WG of the component 4 in the captured image SR matches the center position NG of the suction nozzle 21 (when there is no position shift of the component 4 with respect to the suction nozzle 21). FIG. 8B shows a case where the center position WG of the component 4 in the captured image SR does not match the center position NG of the suction nozzle 21 (the position of the component 4 with respect to the suction nozzle 21). An example of a case where there is a deviation is shown.

  Here, as shown in FIG. 7A, when the component 4 picked up by the suction nozzle 21 is directly irradiated with light in step ST4 to image the component 4, the paste P is not transparent ( In this case, it is desirable to use a white color in consideration of the improvement of the light emission efficiency of the LED that is the electronic component 2, so that the portion to which the paste P adheres, that is, the lower surface of the component 4 is used. The protruding portion 4a of the picked-up image SR becomes the brightest part in the picked-up image SR, and is picked up by the pick-up nozzle 21 from the positions of the brightest parts (three in this case) in the picked-up image SR. The center position WG of the part 4 is obtained. Specifically, the center of gravity of the triangle determined from the three brightest positions in the captured image SR is calculated, or the center position of the component 4 and the position of each protrusion 4a stored in the storage device 16a are calculated. Based on the relation data, the center position WG of the component 4 is obtained.

  On the other hand, as shown in FIG. 8A, in step ST4, the component 4 sucked by the suction nozzle 21 is not directly irradiated with light, but the reflector 23 attached to the suction nozzle 21 is irradiated with light. When imaging the component 4, the paste P colored in a dark color (for example, black) is used so that the portion to which the paste P adheres, that is, the protrusion 4a on the lower surface of the component 4 is included in the captured image SR. The center position WG of the component 4 sucked by the suction nozzle 21 is obtained from the positions of the darkest portions (here, three locations) in the captured image. Specifically, the center of gravity of a triangle determined from the three darkest positions in the captured image SR is calculated, or the center position of the component 4 and the position of each protrusion 4a stored in the storage device 16a are calculated. Based on the relation data, the center position WG of the component 4 is obtained.

  When the control device 16 detects the position shift (position shift amount) of the component 4 with respect to the suction nozzle 21 in the position detection step of step ST5, the control device 16 controls the operation of the mounting head moving mechanism 31 and moves the mounting head 15 to the substrate transport section 11. Is positioned directly above the electronic component 2 mounted on the substrate 3 positioned by the step 3, and the component 4 is aligned with the substrate 3 (FIG. 9A). Positioning step of step ST6 shown in FIG. ). In the alignment of the component 4 with respect to the substrate 3, the control device 16 controls the mounting head moving mechanism 31 based on the positional deviation amount detected in step ST5, and corrects the stop position of the mounting head 15.

  When the positioning process of step ST6 is completed, the control device 16 lowers the mounting head 15 and brings the plurality of protrusions 4a on the lower surface of the component 4 sucked by the suction nozzle 21 into contact with the upper surface of the substrate 3 ( 9B), the mounting head 15 is raised (FIG. 9C). Thereby, each protrusion 4a is adhered to the upper surface of the substrate 3 via the paste P attached to the lower surface thereof, and the component 4 is mounted on the substrate 3 (component mounting step of step ST7 shown in FIG. 3). ).

  When the component 4 is mounted on the substrate 3, the control device 16 operates the substrate transport path 11 to unload the substrate 3 (substrate unloading step in step ST8 shown in FIG. 3). Then, it is determined whether or not there is another substrate 3 on which the component 4 is to be mounted (determination step in step ST9 shown in FIG. 3). If there is another substrate 3 on which the component 4 is to be mounted, the step is performed. Returning to ST1, the above steps are repeated. On the other hand, when there is no other board 3 on which the component 4 is to be mounted, the series of component mounting steps is completed.

  In addition, the board | substrate 3 carried out from this component mounting apparatus 1 is sent to the reflow furnace which is not shown in figure, the board | substrate 3 whole is heated, and the thermosetting of the paste P is performed.

As described above, in the component mounting method according to the present embodiment, the component 4 made of a transparent material that does not have an electrode and includes a plurality of projecting portions 4 a that project downward is provided on the substrate 3. This is a component mounting method for mounting on the upper surface, in which the upper surface of the component 4 is sucked and picked up by the suction nozzle 21 (pickup step in step ST2) and the paste P for bonding the component 4 to the substrate 3 is formed into a thin film. A step of bringing the protruding portion 4a of the component 4 sucked by the suction nozzle 21 into contact with the formed paste film Pm and attaching the paste P to the protruding portion 4a (paste attaching step of step ST3), and a paste on the protruding portion 4a step of taking a part 4 which P is attached from below (the imaging process of step ST4), a plurality of the paste P obtained from an image obtained by the imaging A step of grasping the position of the component 4 in the image (captured image SR) based on the position and thereby detecting the position of the component 4 (a positional deviation amount with respect to the suction nozzle 21) (position detection step of step ST5); Based on the detected position of the component 4, the step of aligning the component 4 sucked by the suction nozzle 21 with respect to the substrate 3 (positioning step of step ST 6), and the component 4 that has been aligned with respect to the substrate 3 as the substrate 3 includes a step of mounting (component mounting step of step ST7).

In the component mounting method in the present embodiment, the paste P is attached to the protruding portion 4a of the component 4 sucked by the suction nozzle 21, and the component 4 is imaged from below, and is obtained from the obtained image (captured image SR). Since the position of the component 4 in the captured image SR is grasped based on the positions of the plurality of pastes P, and the position of the component 4 is detected thereby, the imaging is performed from the position of the paste P in the captured image SR. The position of the protruding portion 4a of the component 4 in the image SR can be easily grasped, and the position of the component 4 can be accurately detected and the component 4 can be mounted on the substrate 3 with high accuracy.

When mounting a component made of a transparent material that does not have an electrode and that has a plurality of projecting portions that protrude downward, on the substrate, the position of the component is accurately detected and the component is placed on the substrate with high accuracy. Provided is a component mounting method that can be mounted on a machine.

3 Substrate 4 Component 4a Protrusion 21 Adsorption nozzle P Paste Pm Paste film SR Captured image (image)

Claims (2)

A component mounting method for mounting a component made of a transparent material having a plurality of protrusions provided not projecting on an electrode and projecting downward on an upper surface of a substrate,
A process of adsorbing and picking up the upper surface of the component by an adsorption nozzle;
Adhering a paste to the projecting portion in contact with the projecting portion of the component adsorbed by the suction nozzle into the paste film paste for bonding the component to the substrate, which are formed into a thin film,
Imaging the component with the paste attached to the protrusion from below;
Grasping the position of the part in the image based on the position of a plurality of pastes obtained from the image obtained by imaging, thereby detecting the position of the part;
A step of aligning the component sucked by the suction nozzle with respect to the substrate based on the detected position of the component;
Mounting the component that has been aligned with the substrate on the substrate. The part lower surface is flat is formed on the curved surface the upper surface is convex upward, the component mounting method according to claim 1, characterized in that to have a plurality of protrusions on the flat lower surface .

Images