JP2010114339A - Component mounting machine and method of mounting component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a component mounting machine and a method of mounting components, capable of checking the state, where paste adheres to components, even if the components and the paste have similar colors, and capable of preventing the components from being mounted erroneously. <P>SOLUTION: Images of a transfer table 4, before and after the component P abuts against a paste film (b), are captured for comparison. When there is a portion where the contrast change exists between both the images, it is determined that the paste B has been transferred to the component P in a normal fashion. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a component mounter and a component mounting method.

The component mounting machine picks up the component by picking it up on the mounting head, and mounts the component on the substrate positioned in the substrate positioning unit. A paste such as a solder paste or an adhesive is used to fix the component to the substrate, and such a paste is supplied as a paste film that is leveled to a certain thickness by a squeegee that is moved relative to the transfer stage. . The transfer of the paste to the component is performed by bringing the component adsorbed on the mounting head into contact with the paste film from above (Patent Document 1). Then, after the paste is transferred to the part, the part is imaged using a camera, and image recognition based on the image is performed to check whether the paste is normally transferred to the part.
JP 2008-108884 A

  However, some parts have the same color as the paste, and it is not possible to confirm whether the paste is attached to such parts by image recognition after the paste is transferred. There is a problem that a component mounting error may occur when the component is mounted on the substrate without the paste adhering to the component.

  Therefore, the present invention can confirm the state where the paste is attached to the component even when the component and the paste have the same color, and can prevent the occurrence of component mounting errors. An object is to provide a mounting machine and a component mounting method.

  The component mounting machine according to claim 1 is a transfer table to which a paste is supplied, a squeegee that is moved relative to the transfer table and forms a paste film on the upper surface of the transfer table, and a film that is formed on the upper surface of the transfer table. A transfer mounting unit for transferring the paste by bringing the component into contact with the paste film, an imaging unit for imaging the transfer table before and after the component is brought into contact with the paste film by the transfer mounting unit, and a paste film imaged by the imaging unit Transfer that determines that the paste has been successfully transferred to the part when there is a contrast change between the comparison part that compares the images on the transfer table before and after the part is in contact with both images compared by the comparison part And a state determining unit, and the transfer mounting unit mounts on the substrate a component that has been determined that the paste has been normally transferred by the transfer state determining unit.

  3. The component mounting method according to claim 2, wherein a squeegee is moved relative to the transfer table supplied with the paste to form a paste film on the upper surface of the transfer table, and a transfer table on which the paste film is formed. A first imaging step of imaging the image, a step of transferring the paste by bringing the component into contact with the paste film formed on the upper surface of the transfer table, and a second image of the transfer table after contacting the component with the paste film There is a portion where the contrast has changed between the imaging step, the step of comparing the images of the transfer table before and after the part is brought into contact with the paste film imaged in the first imaging step and the second imaging step, and the compared images. In this case, the method includes a step of determining that the paste is normally transferred to the component and a step of mounting the component determined to have the paste transferred normally on the substrate.

  In the present invention, the images of the transfer table before and after the component is brought into contact with the paste film are compared, and when there is a portion where the contrast changes between these images, it is determined that the paste has been transferred normally to the component. Thus, it is possible to confirm that the paste is properly attached to the component without recognizing the image of the component after the paste is transferred. For this reason, even when the component and the paste have the same color, it is possible to confirm the state where the paste is attached to the component, and it is possible to prevent occurrence of component mounting errors.

  Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a configuration diagram of a component mounting machine according to an embodiment of the present invention, FIGS. 2A and 2B are perspective views of a squeegee according to an embodiment of the present invention, and FIGS. 3A and 3B. FIGS. 4A and 4C are diagrams showing a procedure for forming a paste film in one embodiment of the present invention, and FIGS. 4A and 4B are images of images taken by a transfer table imaging camera in one embodiment of the present invention. FIGS. 5A, 5B, and 5C are diagrams illustrating an example, FIG. 5A is a diagram illustrating a procedure for transferring paste to a component according to an embodiment of the present invention, and FIG. 6 is a component according to an embodiment of the present invention. FIG. 7 is a flowchart showing the procedure of the component mounting method according to the embodiment of the present invention.

  In FIG. 1, a component mounter 1 that mounts a component P on a substrate PB is supplied with a substrate positioning unit 2 that positions the substrate PB, a component supply unit 3 that supplies the component P, and a paste (for example, solder paste) B. A flat plate-shaped transfer table 4 and a squeegee 5 that is moved relative to the transfer table 4, and a film forming unit 6 that forms a paste film b having a constant thickness t on the upper surface 4 a of the transfer table 4. The transfer table imaging camera 7 for imaging the transfer table 4 (and thus the paste film b) disposed above the table 4 and having the paste film b formed thereon, picks up the component P supplied by the component supply unit 3 The component P is brought into contact with the paste film b formed by the film forming unit 6 to transfer the paste B to the component P, and then the component P is positioned on the substrate positioning unit 2. And a control unit 9 for transferring the mounting portion 8 and the operation control of these facilities mounted on the plate PB.

  The substrate positioning unit 2 includes a pair of belt conveyors 2a that are driven in synchronization with one direction in a horizontal plane (a direction orthogonal to the paper surface of FIG. 1), and a conveyor driving mechanism 11 that is controlled by a control device 9. To carry the substrate PB and position it at a predetermined work position.

  The component supply unit 3 operates under the control of the control device 9 and supplies the component P to a predetermined component supply position. In this embodiment, the component P includes a rectangular protrusion H protruding downward at the center of the lower surface, and a plurality of solder bumps SB disposed on both sides in the width direction of the protrusion H. It is assumed that the electronic component is mounted on the substrate PB with the paste B attached only to the SB.

  The squeegee 5 constituting the film forming unit 6 is moved relative to the transfer table 4 in the horizontal direction by a squeegee operating mechanism 12 whose operation is controlled by the control device 9. In the present embodiment, the squeegee 5 includes two types of squeegees (first squeegee 5a and second squeegee 5b) shown in FIGS.

  2A and 2B, the first squeegee 5a and the second squeegee 5b are both plate-like members extending in the left-right direction, and the first squeegee 5a extends from the left and right end portions so as to protrude downward. It has a squeegee edge M formed between the left and right end projections T1 and the left and right end projections T1 (FIG. 2A), and the second squeegee 5b extends downward from both the left and right ends. Left and right end projections T1, a central projection T2 extending downward from the central portion, and left and right squeegee edges M formed between the three projections T1 and T2 (FIG. 2B). )).

  In the formation of the paste film b by the film forming unit 6, the control device 9 first performs squeezing with the first squeegee 5a. When the left and right end projections T1 of the first squeegee 5a are brought into contact with the upper surface 4a of the transfer table 4 from above, the squeegee edge M of the first squeegee 5a becomes parallel to the upper surface 4a of the transfer table 4, and A gap G1 (gap) is formed between the upper surface 4a of the transfer table 4 (FIG. 2A). When the first squeegee 5a is moved relative to the transfer table 4 to which the paste B is supplied (FIG. 3 (a), arrow A1 in the figure), a part of the paste B corresponds to the gap G1 due to the squeegee edge M. Since the both ends are scraped off by the left and right end projections T1, the paste film b having a constant thickness is formed at the center of the upper surface 4a of the transfer table 4. A film region S0 is formed, and non-film-forming regions S1 where the paste film b is not formed are formed on the left and right ends thereof.

  When squeezing by the first squeegee 5a is completed, squeezing by the second squeegee 5b is then performed. When the left and right end projections T1 of the second squeegee 5b are brought into contact with the upper surface 4a of the transfer table 4 from above, the central projection T2 of the second squeegee 5b is also brought into contact with the upper surface 4a of the transfer table 4 from above and left and right The squeegee edge M is parallel to the upper surface 4a of the transfer table 4, and a gap G2 having the same height as that of the first squeegee 5a is formed between the left and right squeegee edges M and the upper surface 4a of the transfer table 4. (FIG. 2 (b)). When the second squeegee 5b is moved relative to the transfer table 4 (FIG. 3 (b), arrow A2 in the figure), the central portion of the paste film b that is leveled by the first squeegee 5a becomes the central portion. Since it is scraped off by the protrusion T2, the upper surface 4a of the transfer table 4 has two film forming regions S0 corresponding to the movement locus portions of the left and right squeegee edges M, and the movement locus of the left and right end protrusions T1 and the central protrusion T2. Three non-deposition regions S1 corresponding to the portions are formed (FIG. 3C).

  Note that the method of forming the paste film b is not limited to the above method, and other methods may be used. For example, the squeegee is moved by moving the first squeegee 5a with little (or no) gap G1 from one end side to the other end side of the transfer table 4, and almost all the paste B on the transfer table 4 is transferred to the transfer table 4. The two film formation regions S0 and 3 as described above are squeezed by scraping the paste B scraped to the other end side to the one end side by the second squeegee 5b. Two non-deposition regions S1 may be formed.

  Of the three non-film forming regions S1, the left and right non-film forming regions S1 are inevitably formed because the gaps G1 and G2 need to be provided in the squeegee 5, but the central non-film forming region S1 is When the paste B is transferred to the part P, the protrusion H is positioned in the non-film-forming region S1 so as to prevent the paste B from adhering. For this reason, the width of the non-film-forming region S1 is larger than the width of the protrusion H of the component P.

  In FIG. 1, the transfer table imaging camera 7 is controlled by the control device 9 and includes a predetermined portion including at least one part of each of the two film forming regions S0 and the three non-film forming regions S1 formed on the upper surface 4a of the transfer table 4. Image the area. The image (FIG. 4A) of the transfer table 4 (FIG. 4A) captured by the transfer table imaging camera 7 is sent to the film formation state determination unit 9a and the comparison unit 9b of the control device 9 (FIG. 1).

  The color of the upper surface 4a of the transfer table 4 is such that the paste film b is formed in the film formation region S0 in which the paste film b is formed in the image of the transfer table 4 obtained by imaging by the transfer table imaging camera 7. The color is such that the contrast with the color of the paste film b (of the paste B) is high enough to be distinguished from the non-deposition region S1. Therefore, for example, if the color of the paste B is dark (for example, black), the color of the upper surface 4a of the transfer table 4 is light (for example, white).

  The film formation state determination unit 9 a of the control device 9 determines pass / fail of the film formation state of the paste film b based on the image of the transfer table 4 obtained by imaging with the transfer table imaging camera 7. Specifically, whether the film formation state of the paste film b is good or bad is detected by detecting a region having a high contrast with respect to the non-film formation region S1 on the upper surface 4a of the transfer table 4 as the film formation region S0 (FIG. 4A). I do.

  The transfer mounting unit 8 includes a mounting head 15 having a plurality of suction nozzles 14 for sucking the component P, a head moving guide 16 that serves as a guide for moving the mounting head 15 in a horizontal plane, and the head moving guide 16 for moving the mounting head 15. And a nozzle operating mechanism 18 for causing each suction nozzle 14 to move up and down with respect to the mounting head 15 and suction operation of the component P. The head actuating mechanism 17 is controlled by the control device 9 to move the mounting head 15 in the horizontal direction along the head moving guide 16, and the nozzle actuating mechanism 18 is controlled by the control device 9 so that each suction nozzle 14 is moved to the mounting head 15. The parts P are vacuum-sucked by each suction nozzle 14. Then, the component P is positioned above the paste film b determined to be good by the film formation state determination unit 9a (FIG. 5A), and then the component P is moved (with the suction nozzle 14). The solder bumps SB are brought into contact with the paste film b from above (FIG. 5B). At this time, as shown in FIG. 5B, the protrusion H of the component P is positioned in the non-film formation region S1. When the solder bump SB is brought into contact with the upper surface 4a of the transfer table 4, the component P is lifted (the suction nozzle 14) (FIG. 5C). As a result, the paste B does not adhere to the protrusion H of the component P, and the paste B adheres only to the solder bump SB (see also FIG. 6).

  On the other hand, in the film-forming region S0 on the upper surface 4a of the transfer stage 4, the portion S2 (FIG. 5C) where the solder bumps SB of the component P are in contact has no paste B, or the thickness is reduced.

  The transfer table imaging camera 7 is controlled by the control device 9 to image the transfer table 4 after the component P is brought into contact with the paste film b. The image (FIG. 4B) of the transfer table 4 obtained in this way is sent to the comparison unit 9b (FIG. 1) of the control device 9.

  The comparison unit 9b of the control device 9 obtains an image (in the predetermined area) of the transfer table 4 before the component P is brought into contact with the paste film b, which is obtained by imaging with the transfer table imaging camera 7 (FIG. 4A). And an image (FIG. 4B) of the transfer table 4 after the component P is brought into contact with the paste film b (FIG. 4B). Then, the transfer state determination unit 9c of the control device 9 determines that the paste B is normally transferred to the component P when there is a portion where the contrast has changed between both images compared by the comparison unit 9b. 4A and 4B, there is a portion where the contrast has changed before and after the component P is brought into contact with the paste film b (this portion is a portion S2 where the solder bump SB of the component P is in contact with the paste film b). In this case, the transfer state determination unit 9c determines that the paste B is normally transferred to the component P. After transferring the paste B to the component P, the transfer mounting unit 8 mounts the component P on the substrate PB when the transfer state determining unit 9c determines that the paste B has been normally transferred to the component. .

Next, a component mounting procedure by the component mounter 1 will be described with reference to the flowchart of FIG. The component mounting procedure shown here includes the procedure of the component mounting method in the present embodiment. In FIG. 7, the control device 9 of the component mounting machine 1 first controls the operation of the conveyor drive mechanism 11 to operate the board positioning unit 2, and sends it from another device arranged on the upstream side of the component mounting machine 1. The obtained board PB is carried into the component mounting machine 1 and positioned at a predetermined position (board positioning process of step ST1). When positioning the substrate PB, an image recognition of a positioning mark (not shown) provided on the substrate PB is performed by the substrate camera 19 (FIG. 1) attached to the mounting head 15 and having the imaging surface facing downward. The positional deviation from the reference position of PB is obtained. After positioning the substrate PB, the control device 9 controls the operation of the component supply unit 3 to supply the component P to a predetermined component supply position (component supply process of step ST2).

  When the control device 9 supplies the component P to the component supply position, the control device 9 controls the operation of the head operating mechanism 17, moves the mounting head 15 above the component supply position, and causes the suction nozzle 14 to pick up the component P ( Step ST3 for picking up components). The pickup of the component P is performed by controlling the operation of the nozzle operating mechanism 18 to lower the suction nozzle 14 and vacuum-suck the component P to the lower end portion of the suction nozzle 14.

  When the control device 9 causes the suction nozzle 14 to pick up the component P, the squeegee 5 (the first squeegee 5a and the second squeegee 5b) is moved relative to the transfer table 4 to which the paste B is supplied to thereby move the upper surface of the transfer table 4. A paste film b having a constant thickness is formed on 4a (deposition step of step ST4). As a result, a film formation region S0 and a non-film formation region S1 are formed on the upper surface of the transfer table 4.

  When the film forming process in step ST4 is completed, the control device 9 images the transfer table 4 on which the paste film b is formed in the film forming process (first image capturing process in step ST5).

  The image of the transfer table 4 obtained in the first imaging step of step ST5 is sent to the film formation state determination unit 9a and the comparison unit 9b of the control device 9, and the film formation state determination unit 9a of the control device 9 performs the above-described procedure. Then, the pass / fail state of the paste film b is determined (deposition state determination step of step ST6). When the film formation state determination unit 9a determines that the film formation state of the paste film b is defective, the control device 9 returns to step ST4 and re-executes the film formation of the paste film b.

  When the film formation state determination unit 9a determines that the film formation state of the paste film b is good in the film formation state determination step in step ST6, the control device 9 controls the operation of the head operating mechanism 17. Then, the mounting head 15 is moved, and component recognition is performed by the component camera 20 (FIG. 1) installed with the imaging surface facing upward between the transfer table 4 and the substrate positioning unit 2 (component recognition step of step ST7). Then, in this component recognition, a positional shift (suction shift) of the component P with respect to the suction nozzle 14 is obtained.

  When the component recognition process of step ST7 is completed, the control device 9 performs the operation control of the head operation mechanism 17 to move the mounting head 15, and also performs the operation control of the nozzle operation mechanism 18 to apply the component P to the paste film b. And the paste B is transferred to the component P in the manner described above (transfer process in step ST8).

  When the transfer process of step ST8 is completed, the control device 9 images the transfer table 4 with the transfer table imaging camera 7 (second imaging process of step ST9). The image of the transfer table 4 obtained by imaging of the transfer table imaging camera 7 is sent to the comparison unit 9b of the control device 9, and the comparison unit 9b displays the image of the transfer table 4 obtained in the first imaging process of step ST5 ( The image of the transfer table 4 before the part P is brought into contact with the paste film b) and the image of the transfer table 4 obtained in the second imaging step at step ST9 (transfer after the part P is brought into contact with the paste film b) The image in Table 4) is compared (comparison step in step ST10). The transfer state determination unit 9c determines that the paste B has been transferred normally to the component P when there is a portion where the contrast has changed between the two images compared by the comparison unit 9b (transfer of step ST11). State judgment process). In this determination step, when the control device 9 determines that the transfer state of the paste B to the component P is defective, the control device 9 returns to step ST4 and re-executes the formation of the paste film b.

  When it is determined in the transfer state determination step that the paste B is normally transferred to the component P, the control device 9 transfers the component P on which the paste B has been transferred by the transfer mounting unit 8 to the substrate positioning unit 2. Is mounted at the target mounting position on the substrate PB positioned at (step ST12 mounting step). Here, when the component P is mounted at the target mounting position on the substrate PB, the positional deviation from the reference position of the substrate PB obtained in the substrate positioning step in step ST1 and the suction nozzle 14 obtained in the component recognition step in step ST7. The position of the suction nozzle 14 is corrected so that the position shift of the component P with respect to is canceled.

  When the mounting of the component P on the substrate PB is completed, the control device 9 determines whether or not the mounting of all the components P to be mounted on the substrate PB has been completed (end determination process of step ST13). . As a result, when the mounting of all the components P on the substrate PB has not been completed, the process returns to step ST2, and mounting of the components P not yet mounted on the substrate PB is performed. On the other hand, when all the components P have been mounted on the board PB, the board positioning unit 2 is operated to carry out the board PB to the outside of the component mounter 1 (board carrying process in step ST14).

  As described above, the component mounting machine 1 in the present embodiment is moved relative to the transfer table 4 to which the paste B is supplied and the transfer table 4, and the paste film b is formed on the upper surface 4 a of the transfer table 4. The transfer squeegee 5, the transfer mounting portion 8 for transferring the paste B by bringing the component P into contact with the paste film b formed on the upper surface 4 a of the transfer table 4, and before and after the component P is brought into contact with the paste film b by the transfer mounting portion 8. Comparison of a transfer table imaging camera 7 as an imaging unit for imaging the transfer table 4 and a control device 9 for comparing images of the transfer table 4 before and after the component P is brought into contact with the paste film b imaged by the transfer table imaging camera 7 If there is a portion where the contrast has changed between the two images compared by the portion 9b and the comparison portion 9b, it is determined that the paste B is normally transferred to the component P A transfer state determining section 9c of the control device 9 that, the transfer mounting portion 8 is adapted to mount the component P paste B is judged to have been transferred correctly by the transfer state determination unit 9c to the substrate PB.

  In the component mounting method in the present embodiment, the paste film b is formed on the upper surface 4a of the transfer table 4 by moving the squeegee 5 relative to the transfer table 4 to which the paste B is supplied (in step ST4). Film forming step), a first imaging step (step ST5) for imaging the transfer table 4 on which the paste film b is formed, and the component P is brought into contact with the paste film b formed on the upper surface 4a of the transfer table 4 to paste In the process of transferring B (transfer process of step ST8), the second imaging process (step ST9) of imaging the transfer table 4 after the component P is brought into contact with the paste film b, the first imaging process and the second imaging process A step of comparing the images of the transfer table 4 before and after the component P is brought into contact with the imaged paste film b (comparison step of step ST10), and a contrast between the compared images. If there is a changed part, the process of determining that the paste B has been transferred normally to the component P (transfer state determining process of step ST11) and the component P for which the paste B has been transferred normally are mounted on the substrate PB. The process (mounting process of step ST12) to be performed is included.

  Thus, in the component mounting machine 1 (component mounting method) in the present embodiment, the images of the transfer table 4 before and after transferring the component P to the paste film b are compared, and the contrast changes between these images. When there is a portion, it is determined that the paste B has been transferred normally to the component P, and the paste B is normally transferred to the component P without recognizing an image of the component P after the paste B is transferred. Confirmation of adhesion can be performed. For this reason, even when the component P and the paste B have the same color, it is possible to confirm the state where the paste B adheres to the component P, and to prevent the occurrence of component mounting errors. it can.

Although the embodiments of the present invention have been described so far, the present invention is not limited to the above-described embodiments. For example, in the above-described embodiment, the component P to be mounted on the board PB by the component mounting machine 1 includes the rectangular protrusion H protruding downward at the center of the lower surface, and on both sides of the protrusion H in the width direction. The electronic component provided with a plurality of arranged solder bumps SB is merely an example, and the component targeted by the component mounting machine and the component mounting method of the present invention is such an electronic component. It is not limited to. In the above-described embodiment, an example in which the paste B is a solder paste is shown, but the paste may be another paste such as an adhesive.

  Even if the component and paste have the same color, the component mounting machine and component mounting that can confirm the state that the paste is attached to the component and prevent occurrence of component mounting errors Provide a method.

The block diagram of the component mounting machine in one embodiment of this invention (A) (b) The perspective view of the squeegee in one embodiment of this invention (A) (b) (c) The figure which shows the film-forming procedure of the paste film in one embodiment of this invention (A) (b) The figure which shows an example of the image by the imaging | photography of the transfer table imaging camera in one embodiment of this invention (A) (b) (c) The figure which shows the transfer procedure of the paste to the components in one embodiment of this invention The perspective view which looked at the components in one embodiment of the present invention from the lower part The flowchart which shows the procedure of the component mounting method in one embodiment of this invention

Explanation of symbols

1 Component mounting machine 4 Transfer table 5 Squeegee 7 Transfer table imaging camera (imaging unit)
8 Transfer mounting portion 9b Comparison portion 9c Transfer state determination portion PB substrate P component B paste b paste film

Claims (2)

A transfer table supplied with paste;
A squeegee that is moved relative to the transfer table and forms a paste film on the upper surface of the transfer table;
A transfer mounting part for transferring the paste by bringing the part into contact with the paste film formed on the upper surface of the transfer table;
An imaging unit that images the transfer table before and after the component is brought into contact with the paste film by the transfer mounting unit;
A comparison unit for comparing images of the transfer table before and after contacting the component with the paste film imaged by the imaging unit;
A transfer state determination unit that determines that the paste has been successfully transferred to the component when there is a portion where the contrast has changed between both images compared by the comparison unit;
A transfer mounting unit mounts a component on which a paste is normally transferred by a transfer state determination unit on a substrate. Forming a paste film on the upper surface of the transfer table by moving the squeegee relative to the transfer table supplied with the paste;
A first imaging step of imaging a transfer table on which a paste film is formed;
A step of bringing the part into contact with the paste film formed on the upper surface of the transfer table and transferring the paste;
A second imaging step of imaging the transfer table after bringing the component into contact with the paste film;
A step of comparing images of the transfer table before and after contacting the component with the paste film imaged in the first imaging step and the second imaging step;
A step of determining that the paste has been successfully transferred to the part when there is a portion where the contrast has changed between the two images compared; and
Mounting a component on which a paste has been successfully transferred to a substrate;
A component mounting method comprising:

Images