JP5427888B2 - プラズマ処理チャンバ内のストライクステップを検出するための容量結合静電(cce)プローブ構成、それに関連する方法、及び、その方法を実行するコードを格納するプログラム格納媒体 - Google Patents
プラズマ処理チャンバ内のストライクステップを検出するための容量結合静電(cce)プローブ構成、それに関連する方法、及び、その方法を実行するコードを格納するプログラム格納媒体 Download PDFInfo
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- JP5427888B2 JP5427888B2 JP2011517510A JP2011517510A JP5427888B2 JP 5427888 B2 JP5427888 B2 JP 5427888B2 JP 2011517510 A JP2011517510 A JP 2011517510A JP 2011517510 A JP2011517510 A JP 2011517510A JP 5427888 B2 JP5427888 B2 JP 5427888B2
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- measurement results
- plasma
- characteristic parameter
- processing chamber
- parameter measurement
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-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
- H05H1/0081—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature by electric means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
- H05H1/00—Generating plasma; Handling plasma
- H05H1/0006—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature
- H05H1/0012—Investigating plasma, e.g. measuring the degree of ionisation or the electron temperature using electromagnetic or particle radiation, e.g. interferometry
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Electromagnetism (AREA)
- General Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Plasma Technology (AREA)
- Drying Of Semiconductors (AREA)
- Chemical Vapour Deposition (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US7873908P | 2008-07-07 | 2008-07-07 | |
| US61/078,739 | 2008-07-07 | ||
| PCT/US2009/049757 WO2010005930A2 (en) | 2008-07-07 | 2009-07-07 | Capacitively-coupled electrostatic (cce) probe arrangement for detecting strike step in a plasma processing chamber and methods thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2011527521A JP2011527521A (ja) | 2011-10-27 |
| JP2011527521A5 JP2011527521A5 (enExample) | 2013-04-11 |
| JP5427888B2 true JP5427888B2 (ja) | 2014-02-26 |
Family
ID=41504145
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2011517510A Expired - Fee Related JP5427888B2 (ja) | 2008-07-07 | 2009-07-07 | プラズマ処理チャンバ内のストライクステップを検出するための容量結合静電(cce)プローブ構成、それに関連する方法、及び、その方法を実行するコードを格納するプログラム格納媒体 |
Country Status (6)
| Country | Link |
|---|---|
| US (1) | US8164349B2 (enExample) |
| JP (1) | JP5427888B2 (enExample) |
| KR (1) | KR20110039239A (enExample) |
| CN (2) | CN102084473B (enExample) |
| TW (1) | TWI467623B (enExample) |
| WO (1) | WO2010005930A2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7829468B2 (en) * | 2006-06-07 | 2010-11-09 | Lam Research Corporation | Method and apparatus to detect fault conditions of plasma processing reactor |
| US8849585B2 (en) * | 2008-06-26 | 2014-09-30 | Lam Research Corporation | Methods for automatically characterizing a plasma |
| JP5643198B2 (ja) * | 2008-07-07 | 2014-12-17 | ラム リサーチ コーポレーションLam Research Corporation | プラズマ処理チャンバ内の膜を特徴付けるためのrfバイアス容量結合静電(rfb−cce)プローブ構成、それに関連する方法、及び、その方法を実行するコードを格納するプログラム格納媒体 |
| TWI511622B (zh) | 2008-07-07 | 2015-12-01 | Lam Res Corp | 用來偵測電漿處理腔室中之原位電弧事件的被動電容耦合靜電探針裝置 |
| KR101606736B1 (ko) | 2008-07-07 | 2016-03-28 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버에서 플라즈마 불안정성을 검출하기 위한 패시브 용량성-결합된 정전식 (cce) 프로브 장치 |
| WO2010005931A2 (en) * | 2008-07-07 | 2010-01-14 | Lam Research Corporation | Capacitively-coupled electrostatic (cce) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof |
| WO2010005932A2 (en) * | 2008-07-07 | 2010-01-14 | Lam Research Corporation | Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber |
| US9017513B2 (en) | 2012-11-07 | 2015-04-28 | Lam Research Corporation | Plasma monitoring probe assembly and processing chamber incorporating the same |
| JP6195528B2 (ja) * | 2014-02-19 | 2017-09-13 | 東京エレクトロン株式会社 | プラズマ処理装置及びその運転方法 |
| JP7175239B2 (ja) * | 2018-06-22 | 2022-11-18 | 東京エレクトロン株式会社 | 制御方法、プラズマ処理装置、プログラム及び記憶媒体 |
| CN120152129B (zh) * | 2025-03-14 | 2025-09-23 | 济南东汉半导体设备有限公司 | 面向离子工艺系统的射频等离子体综合测试装置及方法 |
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| JP2001144071A (ja) | 1999-11-10 | 2001-05-25 | Toshiba Corp | プラズマ処理方法及びその装置 |
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| WO2010005931A2 (en) | 2008-07-07 | 2010-01-14 | Lam Research Corporation | Capacitively-coupled electrostatic (cce) probe arrangement for detecting dechucking in a plasma processing chamber and methods thereof |
| TWI511622B (zh) | 2008-07-07 | 2015-12-01 | Lam Res Corp | 用來偵測電漿處理腔室中之原位電弧事件的被動電容耦合靜電探針裝置 |
| WO2010005932A2 (en) | 2008-07-07 | 2010-01-14 | Lam Research Corporation | Plasma-facing probe arrangement including vacuum gap for use in a plasma processing chamber |
| KR101606736B1 (ko) | 2008-07-07 | 2016-03-28 | 램 리써치 코포레이션 | 플라즈마 프로세싱 챔버에서 플라즈마 불안정성을 검출하기 위한 패시브 용량성-결합된 정전식 (cce) 프로브 장치 |
| JP5643198B2 (ja) | 2008-07-07 | 2014-12-17 | ラム リサーチ コーポレーションLam Research Corporation | プラズマ処理チャンバ内の膜を特徴付けるためのrfバイアス容量結合静電(rfb−cce)プローブ構成、それに関連する方法、及び、その方法を実行するコードを格納するプログラム格納媒体 |
-
2009
- 2009-07-07 US US12/498,936 patent/US8164349B2/en active Active
- 2009-07-07 CN CN200980126807.7A patent/CN102084473B/zh not_active Expired - Fee Related
- 2009-07-07 KR KR1020117000347A patent/KR20110039239A/ko not_active Abandoned
- 2009-07-07 WO PCT/US2009/049757 patent/WO2010005930A2/en not_active Ceased
- 2009-07-07 JP JP2011517510A patent/JP5427888B2/ja not_active Expired - Fee Related
- 2009-07-07 TW TW98122920A patent/TWI467623B/zh not_active IP Right Cessation
- 2009-07-07 CN CN201410422254.2A patent/CN104320899A/zh active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN104320899A (zh) | 2015-01-28 |
| US20100006417A1 (en) | 2010-01-14 |
| CN102084473A (zh) | 2011-06-01 |
| JP2011527521A (ja) | 2011-10-27 |
| TW201003717A (en) | 2010-01-16 |
| WO2010005930A2 (en) | 2010-01-14 |
| US8164349B2 (en) | 2012-04-24 |
| CN102084473B (zh) | 2014-10-22 |
| KR20110039239A (ko) | 2011-04-15 |
| WO2010005930A3 (en) | 2010-04-22 |
| TWI467623B (zh) | 2015-01-01 |
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