JP5427222B2 - 外観検査装置 - Google Patents

外観検査装置 Download PDF

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Publication number
JP5427222B2
JP5427222B2 JP2011236314A JP2011236314A JP5427222B2 JP 5427222 B2 JP5427222 B2 JP 5427222B2 JP 2011236314 A JP2011236314 A JP 2011236314A JP 2011236314 A JP2011236314 A JP 2011236314A JP 5427222 B2 JP5427222 B2 JP 5427222B2
Authority
JP
Japan
Prior art keywords
wiring board
inspection
light beam
camera
printed wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2011236314A
Other languages
English (en)
Japanese (ja)
Other versions
JP2013092508A (ja
JP2013092508A5 (enrdf_load_stackoverflow
Inventor
正人 内海
精二 長谷部
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
WIT CO., LTD.
Original Assignee
WIT CO., LTD.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by WIT CO., LTD. filed Critical WIT CO., LTD.
Priority to JP2011236314A priority Critical patent/JP5427222B2/ja
Priority to PCT/JP2012/077245 priority patent/WO2013061927A1/ja
Priority to CN201280038252.2A priority patent/CN103718027B/zh
Publication of JP2013092508A publication Critical patent/JP2013092508A/ja
Publication of JP2013092508A5 publication Critical patent/JP2013092508A5/ja
Application granted granted Critical
Publication of JP5427222B2 publication Critical patent/JP5427222B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components

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  • Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • General Physics & Mathematics (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
JP2011236314A 2011-10-27 2011-10-27 外観検査装置 Expired - Fee Related JP5427222B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2011236314A JP5427222B2 (ja) 2011-10-27 2011-10-27 外観検査装置
PCT/JP2012/077245 WO2013061927A1 (ja) 2011-10-27 2012-10-22 外観検査装置
CN201280038252.2A CN103718027B (zh) 2011-10-27 2012-10-22 外观检查装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011236314A JP5427222B2 (ja) 2011-10-27 2011-10-27 外観検査装置

Publications (3)

Publication Number Publication Date
JP2013092508A JP2013092508A (ja) 2013-05-16
JP2013092508A5 JP2013092508A5 (enrdf_load_stackoverflow) 2013-06-27
JP5427222B2 true JP5427222B2 (ja) 2014-02-26

Family

ID=48167758

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011236314A Expired - Fee Related JP5427222B2 (ja) 2011-10-27 2011-10-27 外観検査装置

Country Status (3)

Country Link
JP (1) JP5427222B2 (enrdf_load_stackoverflow)
CN (1) CN103718027B (enrdf_load_stackoverflow)
WO (1) WO2013061927A1 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101893831B1 (ko) * 2016-10-20 2018-08-31 주식회사 고영테크놀러지 기판 검사장치 및 이를 이용한 기판 검사방법
CN108801921A (zh) * 2018-08-02 2018-11-13 佛山市坦斯盯科技有限公司 一种用于线路板的cis相机和光源模组
CN116261918B (zh) * 2020-10-05 2025-07-15 雅马哈发动机株式会社 基板作业装置
JP2025043962A (ja) * 2023-09-19 2025-04-01 株式会社東芝 光学装置、光学検査システム、および、物体の撮像方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4240750A (en) * 1978-10-02 1980-12-23 Hurd William A Automatic circuit board tester
JPH0739996B2 (ja) * 1988-09-02 1995-05-01 日本電気株式会社 半田付検査装置
JPH06331563A (ja) * 1993-05-19 1994-12-02 Matsushita Electric Ind Co Ltd ビジュアルチェッカー
JP2002312766A (ja) * 2001-04-17 2002-10-25 Mitsubishi Electric Corp 半田付け状態検査装置
US7492449B2 (en) * 2004-04-12 2009-02-17 Georgia Tech Research Corporation Inspection systems and methods
US7486274B2 (en) * 2005-08-18 2009-02-03 Mitsubishi Electric Research Laboratories, Inc. Method for stabilizing and precisely locating pointers generated by handheld direct pointing devices
JP2009153119A (ja) * 2007-11-30 2009-07-09 Sanyo Electric Co Ltd 撮像／映像補助装置およびそれを備える撮像／映像装置
JP2010139461A (ja) * 2008-12-15 2010-06-24 Toppan Printing Co Ltd 目視検査システム

Also Published As

Publication number Publication date
CN103718027B (zh) 2015-12-23
JP2013092508A (ja) 2013-05-16
WO2013061927A1 (ja) 2013-05-02
CN103718027A (zh) 2014-04-09

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