JP5423475B2 - 光半導体装置の製造方法 - Google Patents

光半導体装置の製造方法 Download PDF

Info

Publication number
JP5423475B2
JP5423475B2 JP2010043727A JP2010043727A JP5423475B2 JP 5423475 B2 JP5423475 B2 JP 5423475B2 JP 2010043727 A JP2010043727 A JP 2010043727A JP 2010043727 A JP2010043727 A JP 2010043727A JP 5423475 B2 JP5423475 B2 JP 5423475B2
Authority
JP
Japan
Prior art keywords
optical semiconductor
semiconductor device
resin
groove
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2010043727A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010232644A5 (enrdf_load_stackoverflow
JP2010232644A (ja
Inventor
倫英 三木
寛人 玉置
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2010043727A priority Critical patent/JP5423475B2/ja
Publication of JP2010232644A publication Critical patent/JP2010232644A/ja
Publication of JP2010232644A5 publication Critical patent/JP2010232644A5/ja
Application granted granted Critical
Publication of JP5423475B2 publication Critical patent/JP5423475B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/301—Electrical effects
    • H01L2924/3025—Electromagnetic shielding

Landscapes

  • Led Device Packages (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
JP2010043727A 2009-03-06 2010-03-01 光半導体装置の製造方法 Expired - Fee Related JP5423475B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2010043727A JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2009052789 2009-03-06
JP2009052789 2009-03-06
JP2010043727A JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2013245523A Division JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置

Publications (3)

Publication Number Publication Date
JP2010232644A JP2010232644A (ja) 2010-10-14
JP2010232644A5 JP2010232644A5 (enrdf_load_stackoverflow) 2013-04-18
JP5423475B2 true JP5423475B2 (ja) 2014-02-19

Family

ID=43048132

Family Applications (3)

Application Number Title Priority Date Filing Date
JP2010043727A Expired - Fee Related JP5423475B2 (ja) 2009-03-06 2010-03-01 光半導体装置の製造方法
JP2013245523A Active JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置
JP2015064042A Active JP6060994B2 (ja) 2009-03-06 2015-03-26 光半導体装置

Family Applications After (2)

Application Number Title Priority Date Filing Date
JP2013245523A Active JP5720759B2 (ja) 2009-03-06 2013-11-28 光半導体装置
JP2015064042A Active JP6060994B2 (ja) 2009-03-06 2015-03-26 光半導体装置

Country Status (1)

Country Link
JP (3) JP5423475B2 (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049494B2 (ja) 1997-12-26 2000-06-05 京都機械工具株式会社 可搬型電動式パイプベンダー

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5423475B2 (ja) * 2009-03-06 2014-02-19 日亜化学工業株式会社 光半導体装置の製造方法
JP5760379B2 (ja) * 2010-10-25 2015-08-12 日立化成株式会社 光半導体装置の製造方法及び光半導体装置
JP2013062416A (ja) * 2011-09-14 2013-04-04 Toshiba Corp 半導体発光装置およびその製造方法
JP6323217B2 (ja) * 2013-07-10 2018-05-16 日亜化学工業株式会社 発光装置
JP6181523B2 (ja) * 2013-11-05 2017-08-16 京セラ株式会社 多数個取り配線基板、配線基板および電子部品
DE102014102183A1 (de) 2014-02-20 2015-08-20 Osram Opto Semiconductors Gmbh Herstellung optoelektronischer Bauelemente
CN107994109A (zh) * 2016-10-27 2018-05-04 佛山市国星光电股份有限公司 一种cob显示模组及其制造方法
DE102017117150A1 (de) * 2017-07-28 2019-01-31 Osram Opto Semiconductors Gmbh Verfahren zur Herstellung von optoelektronischen Halbleiterbauteilen und optoelektronisches Halbleiterbauteil
JP6485503B2 (ja) * 2017-08-01 2019-03-20 日亜化学工業株式会社 発光装置の製造方法
JP7177336B2 (ja) * 2018-07-20 2022-11-24 日亜化学工業株式会社 発光装置
US11056624B2 (en) 2018-10-31 2021-07-06 Nichia Corporation Method of manufacturing package and method of manufacturing light-emitting device
JP7474770B2 (ja) * 2019-09-18 2024-04-25 泉州三安半導体科技有限公司 発光ダイオードパッケージアセンブリ
JP7196813B2 (ja) * 2019-10-14 2022-12-27 豊田合成株式会社 発光装置およびその製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH08274378A (ja) * 1995-03-30 1996-10-18 Kyocera Corp 発光素子収納用パッケージ
JP3613041B2 (ja) * 1998-12-16 2005-01-26 日亜化学工業株式会社 発光装置及びその製造方法
JP2006339362A (ja) * 2005-06-01 2006-12-14 Ngk Spark Plug Co Ltd 発光素子実装用配線基板
JP2010093185A (ja) * 2008-10-10 2010-04-22 Showa Denko Kk ランプおよびランプの製造方法
JP5423475B2 (ja) * 2009-03-06 2014-02-19 日亜化学工業株式会社 光半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3049494B2 (ja) 1997-12-26 2000-06-05 京都機械工具株式会社 可搬型電動式パイプベンダー

Also Published As

Publication number Publication date
JP6060994B2 (ja) 2017-01-18
JP2015127834A (ja) 2015-07-09
JP5720759B2 (ja) 2015-05-20
JP2010232644A (ja) 2010-10-14
JP2014039071A (ja) 2014-02-27

Similar Documents

Publication Publication Date Title
JP5423475B2 (ja) 光半導体装置の製造方法
KR102117909B1 (ko) 발광 장치
US8080436B2 (en) Light emitting device and method of manufacturing the light emitting device
KR101811885B1 (ko) 발광장치 및 그 제조방법
TWI442594B (zh) 發光裝置及發光裝置之製造方法
JP2011181655A (ja) 発光装置及びその製造方法
JP6521032B2 (ja) 光半導体装置及びその製造方法
JP5482293B2 (ja) 光半導体装置及びその製造方法
JP5493549B2 (ja) 発光装置及びその製造方法
JP5359662B2 (ja) 発光装置及びその製造方法
JP5229115B2 (ja) 発光装置
JP6701711B2 (ja) 発光装置
JP2011060801A (ja) 発光装置及びその製造方法
JP5381684B2 (ja) 発光装置の製造方法
JP5402264B2 (ja) 発光装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130301

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20130301

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20131025

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131029

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131111

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

Ref document number: 5423475

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees