JP5420640B2 - 複数基板の処理装置及びその方法 - Google Patents

複数基板の処理装置及びその方法 Download PDF

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Publication number
JP5420640B2
JP5420640B2 JP2011507379A JP2011507379A JP5420640B2 JP 5420640 B2 JP5420640 B2 JP 5420640B2 JP 2011507379 A JP2011507379 A JP 2011507379A JP 2011507379 A JP2011507379 A JP 2011507379A JP 5420640 B2 JP5420640 B2 JP 5420640B2
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Japan
Prior art keywords
substrate
cutting
station
unit
substrates
Prior art date
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Expired - Fee Related
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JP2011507379A
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English (en)
Japanese (ja)
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JP2011520256A5 (cg-RX-API-DMAC7.html
JP2011520256A (ja
Inventor
ジュン・ジョンジェ
ジャン・ドクチュン
ハ・シャンフワン
リム・チョンチェン
ベク・スンホ
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Rokko Ventures Pte Ltd
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Rokko Ventures Pte Ltd
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Publication of JP2011520256A publication Critical patent/JP2011520256A/ja
Publication of JP2011520256A5 publication Critical patent/JP2011520256A5/ja
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Publication of JP5420640B2 publication Critical patent/JP5420640B2/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Dicing (AREA)
  • Laser Beam Processing (AREA)
JP2011507379A 2008-05-02 2009-05-04 複数基板の処理装置及びその方法 Expired - Fee Related JP5420640B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200803452-2 2008-05-02
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
PCT/SG2009/000158 WO2009134212A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing

Publications (3)

Publication Number Publication Date
JP2011520256A JP2011520256A (ja) 2011-07-14
JP2011520256A5 JP2011520256A5 (cg-RX-API-DMAC7.html) 2012-02-16
JP5420640B2 true JP5420640B2 (ja) 2014-02-19

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507379A Expired - Fee Related JP5420640B2 (ja) 2008-05-02 2009-05-04 複数基板の処理装置及びその方法

Country Status (6)

Country Link
US (1) US20110036339A1 (cg-RX-API-DMAC7.html)
JP (1) JP5420640B2 (cg-RX-API-DMAC7.html)
KR (1) KR20110013440A (cg-RX-API-DMAC7.html)
CN (1) CN102046344A (cg-RX-API-DMAC7.html)
SG (1) SG142402A1 (cg-RX-API-DMAC7.html)
WO (1) WO2009134212A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

Also Published As

Publication number Publication date
KR20110013440A (ko) 2011-02-09
JP2011520256A (ja) 2011-07-14
SG142402A1 (en) 2009-11-26
US20110036339A1 (en) 2011-02-17
CN102046344A (zh) 2011-05-04
WO2009134212A1 (en) 2009-11-05

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