JP2011520256A5 - - Google Patents

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Publication number
JP2011520256A5
JP2011520256A5 JP2011507379A JP2011507379A JP2011520256A5 JP 2011520256 A5 JP2011520256 A5 JP 2011520256A5 JP 2011507379 A JP2011507379 A JP 2011507379A JP 2011507379 A JP2011507379 A JP 2011507379A JP 2011520256 A5 JP2011520256 A5 JP 2011520256A5
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JP
Japan
Prior art keywords
substrate
station
cutting
substrates
moving
Prior art date
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Application number
JP2011507379A
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English (en)
Japanese (ja)
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JP2011520256A (ja
JP5420640B2 (ja
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Publication date
Priority claimed from SG200803452-2A external-priority patent/SG142402A1/en
Application filed filed Critical
Publication of JP2011520256A publication Critical patent/JP2011520256A/ja
Publication of JP2011520256A5 publication Critical patent/JP2011520256A5/ja
Application granted granted Critical
Publication of JP5420640B2 publication Critical patent/JP5420640B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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JP2011507379A 2008-05-02 2009-05-04 複数基板の処理装置及びその方法 Expired - Fee Related JP5420640B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
SG200803452-2 2008-05-02
SG200803452-2A SG142402A1 (en) 2008-05-02 2008-05-02 Apparatus and method for multiple substrate processing
PCT/SG2009/000158 WO2009134212A1 (en) 2008-05-02 2009-05-04 Apparatus and method for multiple substrate processing

Publications (3)

Publication Number Publication Date
JP2011520256A JP2011520256A (ja) 2011-07-14
JP2011520256A5 true JP2011520256A5 (cg-RX-API-DMAC7.html) 2012-02-16
JP5420640B2 JP5420640B2 (ja) 2014-02-19

Family

ID=41255265

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2011507379A Expired - Fee Related JP5420640B2 (ja) 2008-05-02 2009-05-04 複数基板の処理装置及びその方法

Country Status (6)

Country Link
US (1) US20110036339A1 (cg-RX-API-DMAC7.html)
JP (1) JP5420640B2 (cg-RX-API-DMAC7.html)
KR (1) KR20110013440A (cg-RX-API-DMAC7.html)
CN (1) CN102046344A (cg-RX-API-DMAC7.html)
SG (1) SG142402A1 (cg-RX-API-DMAC7.html)
WO (1) WO2009134212A1 (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101310765B1 (ko) * 2012-02-29 2013-09-25 주식회사 에스에프에이 가요성 기판 절단장치
KR200472836Y1 (ko) * 2012-07-06 2014-05-27 프로브 테크놀로지 코포레이션 절삭 유닛 및 그 응용설비
JP6218511B2 (ja) * 2013-09-02 2017-10-25 Ｔｏｗａ株式会社 切断装置及び切断方法

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR900001232B1 (ko) * 1984-12-27 1990-03-05 가부시끼 가이샤 디스코 반도체 웨이퍼 방형절단기
US6826986B2 (en) * 2001-05-05 2004-12-07 Ah Beng Lim Bi-directional singulation system and method
US7267037B2 (en) * 2001-05-05 2007-09-11 David Walter Smith Bidirectional singulation saw and method
JP2003124155A (ja) * 2001-10-12 2003-04-25 Disco Abrasive Syst Ltd 切削装置
JP3765265B2 (ja) * 2001-11-28 2006-04-12 株式会社東京精密 ダイシング装置
JP4201564B2 (ja) * 2001-12-03 2008-12-24 日東電工株式会社 半導体ウエハ搬送方法およびこれを用いた半導体ウエハ搬送装置
KR100497506B1 (ko) * 2003-04-08 2005-07-01 한미반도체 주식회사 반도체 스트립 소잉장치 및 이를 구비한 반도체 패키지의싱귤레이션 장치
JP4315788B2 (ja) * 2003-11-26 2009-08-19 アピックヤマダ株式会社 半導体装置の製造方法及び製造装置
JP2005347421A (ja) * 2004-06-01 2005-12-15 Apic Yamada Corp 半導体装置の製造方法及び装置

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