JP2018181815A5 - - Google Patents

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Publication number
JP2018181815A5
JP2018181815A5 JP2017084729A JP2017084729A JP2018181815A5 JP 2018181815 A5 JP2018181815 A5 JP 2018181815A5 JP 2017084729 A JP2017084729 A JP 2017084729A JP 2017084729 A JP2017084729 A JP 2017084729A JP 2018181815 A5 JP2018181815 A5 JP 2018181815A5
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Japan
Prior art keywords
flexible
support substrate
layered structure
vacuum chuck
film
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JP2017084729A
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English (en)
Japanese (ja)
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JP6888812B2 (ja
JP2018181815A (ja
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Priority to JP2017084729A priority Critical patent/JP6888812B2/ja
Priority claimed from JP2017084729A external-priority patent/JP6888812B2/ja
Priority to TW107112748A priority patent/TWI744517B/zh
Priority to CN201810361332.0A priority patent/CN108735918B/zh
Priority to KR1020180046170A priority patent/KR102499047B1/ko
Publication of JP2018181815A publication Critical patent/JP2018181815A/ja
Publication of JP2018181815A5 publication Critical patent/JP2018181815A5/ja
Application granted granted Critical
Publication of JP6888812B2 publication Critical patent/JP6888812B2/ja
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JP2017084729A 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法 Active JP6888812B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2017084729A JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法
TW107112748A TWI744517B (zh) 2017-04-21 2018-04-13 可撓性元件之製造裝置及製造方法
CN201810361332.0A CN108735918B (zh) 2017-04-21 2018-04-20 柔性器件的制造装置及制造方法
KR1020180046170A KR102499047B1 (ko) 2017-04-21 2018-04-20 플렉시블 디바이스의 제조 장치 및 제조 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2017084729A JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法

Publications (3)

Publication Number Publication Date
JP2018181815A JP2018181815A (ja) 2018-11-15
JP2018181815A5 true JP2018181815A5 (cg-RX-API-DMAC7.html) 2020-03-12
JP6888812B2 JP6888812B2 (ja) 2021-06-16

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JP2017084729A Active JP6888812B2 (ja) 2017-04-21 2017-04-21 フレキシブルデバイスの製造装置及び製造方法

Country Status (4)

Country Link
JP (1) JP6888812B2 (cg-RX-API-DMAC7.html)
KR (1) KR102499047B1 (cg-RX-API-DMAC7.html)
CN (1) CN108735918B (cg-RX-API-DMAC7.html)
TW (1) TWI744517B (cg-RX-API-DMAC7.html)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20250130438A (ko) * 2018-12-21 2025-09-01 도쿄엘렉트론가부시키가이샤 기판 처리 방법 및 기판 처리 장치
CN112026331B (zh) * 2019-06-03 2022-05-13 万向一二三股份公司 一种泡棉离型纸剥离机构及其剥离方法
CN114334779A (zh) * 2021-12-28 2022-04-12 深圳市华星光电半导体显示技术有限公司 激光剥离设备以及激光剥离方法

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004306191A (ja) * 2003-04-07 2004-11-04 Seiko Epson Corp テーブル装置、成膜装置、光学素子、半導体素子及び電子機器
KR101149433B1 (ko) 2009-08-28 2012-05-22 삼성모바일디스플레이주식회사 플렉서블 표시 장치 및 그 제조 방법
KR101097344B1 (ko) * 2010-03-09 2011-12-23 삼성모바일디스플레이주식회사 플렉서블 디스플레이 장치의 제조 방법
JP2011233426A (ja) * 2010-04-28 2011-11-17 Tazmo Co Ltd 有機膜の焼成装置及び該装置によって焼成された有機膜を有する有機素子
JP2012069557A (ja) * 2010-09-21 2012-04-05 Covalent Materials Corp ポーラスチャック及びその製造方法
JP2013191746A (ja) * 2012-03-14 2013-09-26 Toshiba Corp 半導体装置の製造方法、半導体製造装置
JP2013251191A (ja) * 2012-06-01 2013-12-12 Dainippon Printing Co Ltd 有機エレクトロルミネッセンス素子
JP2014048619A (ja) * 2012-09-04 2014-03-17 Panasonic Corp フレキシブルデバイスの製造方法
KR102025704B1 (ko) * 2012-09-14 2019-09-27 삼성디스플레이 주식회사 필름 검사 장치
KR20140062368A (ko) * 2012-11-14 2014-05-23 엘지디스플레이 주식회사 플렉서블 표시장치의 제조방법
KR102158971B1 (ko) * 2013-03-11 2020-09-24 삼성디스플레이 주식회사 기판 박리 장치, 기판 박리 방법 및 플렉서블 표시 장치 제조 방법
KR102113174B1 (ko) * 2013-04-30 2020-05-21 삼성디스플레이 주식회사 플렉시블 디스플레이 장치의 제조방법
KR102135933B1 (ko) * 2013-12-31 2020-07-21 엘지디스플레이 주식회사 플렉서블 유기발광다이오드 표시장치의 제조방법
US9437839B2 (en) * 2014-06-19 2016-09-06 Panasonic Intellectual Property Management Co., Ltd. Method for manufacturing electronic device and electronic device manufactured thereby
JP5954549B2 (ja) * 2014-08-01 2016-07-20 日東電工株式会社 可撓性薄膜構造の表示セルを取り扱う方法

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