JP5414486B2 - Semiconductor manufacturing equipment - Google Patents

Description

  The present invention relates to a semiconductor manufacturing apparatus that picks up semiconductor chips from a semiconductor wafer, and more particularly to a semiconductor manufacturing apparatus that picks up semiconductor chips from a semiconductor wafer on which a large number of semiconductor chips are formed by dicing and arranges them in a matrix.

  Currently, the semiconductor chip formed on a semiconductor wafer has an extremely small external dimension of about 0.24 × 0.42 mm. For example, there are as many as 60,000 to 80,000 on a 4-inch semiconductor wafer. A large number of semiconductor chips are formed. In order to take out a semiconductor chip from the semiconductor wafer and mount it on a circuit board, first, the semiconductor wafer is divided by dicing to form an aggregated body of semiconductor chips.

Then, as a method of mounting the semiconductor chip in close contact with the circuit board, a method of picking up and mounting the semiconductor chips one by one, and widening the space between the close semiconductor chips to change the arrangement into a matrix-like assembly. In addition, there is a so-called assembly mounting method in which an assembly of the matrix-like semiconductor chips is collectively mounted on a circuit board.
Since the method of collectively mounting semiconductor chips on a circuit board is excellent in mass productivity, various apparatuses and manufacturing methods for arranging and converting an assembly of semiconductor chips in close contact with each other in a matrix form have been proposed.

As a manufacturing method of such a prior art, a manufacturing method is disclosed in which an assembly in which the above-described semiconductor chips are in close contact with each other is widened in a matrix to perform assembly mounting. (For example, patent document 1).
The prior art manufacturing method will be briefly described below with reference to FIG.

  As shown in FIG. 11A, the large-diameter semiconductor wafer 112 is attached to the adhesive film 109 in a state where the scribe line 108 is formed by scribe processing. The large-diameter semiconductor wafer 112 containing the scribe line 108 is expanded in the direction of the arrow A that is the X-axis direction while maintaining parallelism, and after having a predetermined interval with respect to the X-axis, the Y-axis direction Expand in the direction of arrow B. Alternatively, the expansion to the X and Y axes is performed simultaneously. Therefore, the large-diameter semiconductor wafer 112 is separated by the scribe line 108, and the semiconductor chips 101 on the adhesive film 109 are maintained in parallel and are spread in a matrix in the same direction at equal intervals vertically and horizontally. At this time, since the film is expanded in the X and Y axis directions while maintaining parallelism, the surface of the adhesive film 109 is parallel to the adsorption surface of the adsorption collet 113 and the adhesion surface of the large-diameter circuit board 114. .

  In this way, by expanding in the X-axis and Y-axis directions, each semiconductor chip 101 on the adhesive film 109 is parallel to the suction collet 113 and the circuit board 114 as shown in FIG. The pitch of each semiconductor chip 101 is equal to the pitch of each collet of the suction collet 113, and this pitch corresponds to each lattice-shaped chip formed by the dicing line 111 on the large-diameter circuit board 114.

As shown in FIG. 11C, the suction collet 113 vacuum-sucks the semiconductor chips 101 arranged at equal intervals in the vertical and horizontal directions and adheres them to the circuit board 114. Thereafter, the chips are separated for each chip along the dicing line 111 of the circuit board 114 by dicing or the like.
As a result, the method for assembling the semiconductor device with respect to the semiconductor chip 101 formed on the large-diameter semiconductor wafer 112 can be implemented all at once or in arbitrary blocks.

  Since the configuration and process are as described above, a large number of semiconductor chips can be bonded to the circuit board as an assembly mounting at a time, and thus it is necessary to arrange the semiconductor chips on a chip tray as in the conventional assembly. There is no need to assemble every chip, and the work time is shortened and the work becomes easy.

On the other hand, there has been disclosed a pickup device in which a technique for picking up a semiconductor chip from a diced semiconductor wafer is devised. (For example, patent document 2).
This prior art pickup device will be briefly described below with reference to FIG.

  In FIG. 12, the pickup device of the prior art pushes up a semiconductor chip 202 obtained by separating by dicing from a semiconductor wafer adhered on an adhesive film 204 using a temperature active adhesive, through the adhesive film 204. The pickup device is pushed up by a pin 207 and is vacuum-adsorbed by a pickup chuck 208, and includes a push-up mechanism 206 that drives the push-up pin 207 and a cooling pipe 209 incorporated in the push-up mechanism 206. The cooling pipe 209 is connected to the cooling device 210 and circulates a cooling medium so as to cool the adhesive film 204 directly below the semiconductor chip 202.

  Therefore, this pickup apparatus cools the adhesive film 204 directly below the semiconductor chip 202 via the cooling pipe 209, weakens the adhesive force of the adhesive film 204, and pushes the push-up pin 207 with a small force. The semiconductor chip 202 is adsorbed and separated from the adhesive film 204 by a pickup chuck 208 while reducing mechanical stress applied.

  Since it is configured as described above, the mechanical force and stress applied to the semiconductor chip when separating the semiconductor chip from the adhesive film can be reduced, and the adhesive residue can be prevented from remaining on the back surface of the semiconductor chip. In addition, the semiconductor chip can be prevented from cracking and the reliability can be prevented from being lowered due to the remaining mechanical stress. As a result, the yield of the semiconductor product can be improved.

  Further, as another conventional technique for picking up a semiconductor chip, a pickup chuck is disclosed in which an inclined surface is formed on a suction surface for vacuum-sucking a semiconductor chip. (For example, patent document 3).

  FIG. 13A shows a state where the pickup chuck 315 is transposed. A nozzle 331 is provided at the center of the block 330 of the pickup chuck 315, and the tip of the nozzle 331 is a suction hole 332 for vacuum-sucking a semiconductor chip. On the outside of the nozzle 331, a block 330 is processed to provide a concave portion on a substantially quadrangular pyramid. This concave portion is formed by four inclined surfaces 333A, 333B, 334A, and 334B, and two opposite sides, that is, inclined surfaces 333A and 333B, 334A and 334B, are symmetrical.

  As shown in FIG. 13B, the flat surface of the upper surface of the semiconductor chip 309A and the nozzles in a state where each side of the rectangular semiconductor chip 309A that requires positioning is in contact with the inclined surfaces 333A, 333B, 334A, and 334B of the block 330. Vacuum suction is performed from the suction hole 332 in a state where the gap G with the lower end of the 331 is equal to or less than a predetermined gap. Therefore, the semiconductor chip 309A is vacuum-sucked while being positioned by the inclined surfaces 333A, 333B, 334A, 334B. The predetermined gap G is set as an upper limit gap for preventing an excessive vacuum leak that makes it impossible to hold the semiconductor chip 309A by suction.

  As shown in FIG. 13C, the semiconductor chip 309B is brought into direct contact with the suction hole 332 of the nozzle 331 and is vacuum-sucked. Thus, in order to vacuum-suck by the suction hole 332, the semiconductor chip 309B can be brought into contact with the tip of the suction hole 332 without contacting the inclined surfaces 333A and 333B of the block 330 (the same applies to 334A and 334B). -Any shape is acceptable. In other words, the pickup chuck 315 has a flat portion and can be brought into contact with the flat portions of a group of semiconductor chips having such specific dimensions and shapes and vacuum-sucked.

  The pickup chuck 315 is a single unit of a group of rectangular semiconductor chips 309A having specific dimensions and shapes that satisfy the above conditions and another group of semiconductor chips 309B having specific ends having a flat end on the upper surface. It can be held by vacuum suction with a pickup chuck.

  Therefore, a plurality of types of semiconductor chips can be pushed up by a push-up pin (not shown) and picked up by the same pickup chuck. Therefore, even when a plurality of types of semiconductor chips are bonded, a multi-type movement having a plurality of suction tools is provided. Efficient bonding can be performed using a single transfer head without using a head.

JP-A-6-77317 (page 4, FIG. 2) Japanese Patent Laid-Open No. 9-167779 (first page, FIG. 1) Japanese Patent No. 3451958 (page 3-4, FIG. 2)

  However, in the prior art shown in Patent Document 1, the semiconductor chip of the close assembly adhered to the adhesive film is expanded in the direction of the arrow A and the direction of the arrow B, and the array is arranged at equal intervals in a matrix shape. As the purpose, tension is applied in the direction different by 90 ° between the arrow A and the arrow B, so that the adhesive film forming the flat surface is distorted, and the semiconductor chips are not easily aligned and arranged at a constant interval. There was a problem that the semiconductor chips could not be aligned and arranged at a pitch interval of a desired dimension due to the elongation limit of the film.

  Patent Document 2 and Patent Document 3 form a structure including a push-up pin and a pickup chuck. It forms an assembly in which the semiconductor chips formed on the diced semiconductor wafer are in close contact with each other, and there is interference and friction on the rough dicing surface between adjacent close-contact semiconductor chips. It is impossible to pick up only by suction force. Therefore, the semiconductor wafer is attached to the adhesive film, the adhesive film is expanded to form a gap between adjacent semiconductor chips, the interference and friction of the dicing surface is eliminated, and the semiconductor chip is pushed up and pulled from the adhesive film. A structure for peeling and picking up is formed. Therefore, since a small semiconductor chip is picked up one by one, assembly man-hours are required and there is a problem in mass productivity.

  In addition, the conventional technique shown in Patent Document 2 has a structure in which a push-up pin having a cooling mechanism breaks through an adhesive film, pushes up a semiconductor chip, and adsorbs the semiconductor chip with a pickup chuck. There is a problem that a structure is required and the force by the push-up pin applies stress to the semiconductor chip as an external force, which affects the quality and reliability of the semiconductor chip. Furthermore, when the semiconductor chip becomes minute, the deformation of the adhesive film pierced by the push-up pin disturbs the alignment of the surrounding semiconductor chips, which causes a problem in push-up position accuracy and pickup position accuracy. Since only one semiconductor chip can be picked up by one set of the push-up pin and the pick-up chuck, the number of assembling steps is increased and there is a problem in mass productivity.

  In addition, since the prior art shown in Patent Document 3 forms a structure composed of a push-up pin and a pickup chuck, as in Patent Document 2, the semiconductor chips are attracted and arranged one by one. It took man-hours and there was a problem with mass productivity. The four slopes formed in the recesses inside the pickup hole of the pickup chuck have the function of sucking semiconductor chips of different sizes one by one, but the function of cleaving and separating the semiconductor chips on the slope and pickup There was no function and it did not contribute to mass productivity.

  SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and a semiconductor chip without a pickup after sticking an expanded assembly of a large number of semiconductor chips formed on a diced semiconductor wafer to a pressure-sensitive adhesive film and expanding it. Provided is a semiconductor manufacturing apparatus having a mass production capability having a pickup chuck capable of easily picking up a plurality of semiconductor chips for one column or one row directly from the end of a tightly assembled assembly. It is intended.

In a semiconductor manufacturing apparatus for cleaving and separating a semiconductor wafer on which a large number of semiconductor chips are formed by dicing and aligning the semiconductor chips, the semiconductor is placed from the end of the semiconductor wafer on the first plate and the first plate on which the semiconductor wafer is placed. A pick-up chuck that cleaves and separates the chip and vacuum-sucks;
A second plate for aligning and mounting the semiconductor chips vacuum-adsorbed on the pickup chuck;
A pickup chuck moving means for moving the pickup chuck to the second plate;
The suction surface of the pickup chuck forms a slope, and the slope shape is such that the gap near the dicing line that is cleaved and separated is narrow with the semiconductor chip, and the gap opens as the distance from the dicing line increases.
It is characterized by that.

  The pick-up chuck moving means may include a moving means for pulling up the pick-up chuck after the semiconductor chip is vacuum-sucked in a diagonally upward direction away from the dicing line to be cleaved and separated.

  The number of semiconductor chips that are picked up simultaneously by vacuum pick-up by the pickup chuck may be one row consisting of a plurality.

  The semiconductor wafer may be cut by stealth dicing to form a large number of the semiconductor chips.

  The first and second plates may be porous plates and may be capable of vacuum-sucking semiconductor chips.

  As described above, according to the present invention, because the pickup surface of the pickup chuck that sucks the semiconductor chip is formed with an inclined surface, the portion separated by cleavage along the dicing line of the semiconductor chip sucked by the pickup chuck is A wedge-shaped gap corresponding to the angle of the slope is formed, and interference between the semiconductor chips hardly occurs. And by moving the pick-up chuck in a direction that moves diagonally upward from the dicing line that has been cleaved and separated, the adsorbed semiconductor chip does not interfere with the wedge-shaped tip portion of the gap, and there is no friction or catching, There is no pick-up failure or misalignment. Furthermore, since an external force that applies stress to the semiconductor chip such as a push-up pin does not act, the quality and reliability of the semiconductor chip are guaranteed.

  In addition, the slope of the suction surface of the pickup chuck is formed so as to suck a plurality of semiconductor chips at a time, so that a plurality of semiconductor chips in the column direction and the row direction can be picked up at a time. Therefore, it is easy to form a matrix-like assembly of semiconductor chips, and it is possible to greatly reduce the number of assembly steps.

It is the perspective view which shows the external appearance of the semiconductor manufacturing apparatus of this invention, and is the figure by which the plate slide part was fixed to the left end. It is the perspective view which shows the external appearance of said semiconductor manufacturing apparatus, and is the figure by which the plate slide part was fixed to the right end. It is the perspective view which shows the external appearance of the pick-up part of said semiconductor manufacturing apparatus, an exploded perspective view, and the partial expansion perspective view of the front-end | tip part. It is a right view for demonstrating the column direction pick-up of the said semiconductor manufacturing apparatus, and a row direction pick-up. In the semiconductor manufacturing apparatus, as a diagram for explaining the pickup operation, FIG. FIG. 6 is a partially enlarged view for explaining a pickup operation continued from FIG. 5. It is a top view for demonstrating the manufacturing process which forms a semiconductor chip row | line | column from the semiconductor chip contact | adherence aggregate | assembly in Example 1 of this invention. FIG. 8 is a plan view for explaining a manufacturing process for forming a matrix-like aggregate from a semiconductor chip row in the manufacturing process continued from FIG. 7 in Example 1 of the present invention. It is a top view for demonstrating the manufacturing process which forms a semiconductor chip row | line | column from the semiconductor chip contact | adherence aggregate | assembly in Example 2 of this invention. FIG. 10 is a plan view for explaining a manufacturing process for forming a matrix-like assembly from a semiconductor chip row in the manufacturing process continued from FIG. 9 according to the second embodiment of the present invention. It is a perspective view for demonstrating the prior art shown in patent document 1. FIG. It is a side view for demonstrating the prior art shown in patent document 2. FIG. FIG. 4 is a perspective view and a cross-sectional view for explaining a pickup chuck according to the prior art shown in Patent Document 3.

Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.
1 to 4 are drawings for explaining a configuration of a semiconductor manufacturing apparatus according to a first embodiment of the present invention. FIG. 1 is a perspective view showing an external appearance of a semiconductor manufacturing apparatus, in which a plate slide portion is fixed to the left end. FIG. 2 is a perspective view showing an external appearance of the semiconductor manufacturing apparatus, and the plate slide portion is fixed to the right end. FIG. FIG. 3 is a perspective view, an exploded perspective view, and a partially enlarged view of the pickup unit of the semiconductor manufacturing apparatus. FIG. 4 is a right side view in which the pickup unit and the plate support of the semiconductor manufacturing apparatus are extracted for explaining the column direction pickup and the row direction pickup.
In each figure, the same component is given the same number, and the overlapping description is omitted.

Example 1
[Overall Configuration and Function of Embodiment 1: FIGS. 1 to 4]
As shown in FIG. 1, the semiconductor manufacturing apparatus 1 includes a base plate part 2, a camera part 3, a plate slide part 4, and a pickup part 5.

First, the functions of the above-described components will be outlined, and details will be described later.
The base plate portion 2 forms a base of the semiconductor manufacturing apparatus 1 and is configured by a member that supports and guides the camera portion 3, the plate slide portion 4, and the pickup portion 5.
The camera unit 3 provides an image for initializing a diced semiconductor wafer, that is, an assembly of semiconductor chips in close contact (hereinafter referred to as a semiconductor chip contact assembly) at a predetermined position.

  The plate slide unit 4 can alternately switch a source plate and a destination plate for converting the arrangement from a semiconductor chip contact assembly to a matrix-like assembly directly below a pickup unit 5 for picking up a semiconductor chip. It has a mechanism.

  The pickup unit 5 includes a pressing unit and a pickup unit. The pressing unit has a mechanism for exposing and pressing one column or one row for picking up a semiconductor chip. The pickup unit includes a plurality of semiconductor chips. It has a mechanism that picks up and picks up one column or one row.

  In the present embodiment, it is desirable to use stealth dicing as a dicing method for dicing a semiconductor wafer to form a semiconductor chip adhesion assembly. In other words, stealth dicing does not damage the surface layer of the wafer compared to conventional dicing, there is no thermal effect or debris contamination on the active area, and it prevents the deterioration of reliability such as the reduction in bending strength due to the occurrence of microcracks at the chip edge. Is possible

Hereinafter, each component which comprises the semiconductor manufacturing apparatus 1 is demonstrated in detail.
In FIG. 1, the base plate portion 2 includes a base plate 21, a slide guide 22 positioned and screwed on the base plate 21, and a right stopper 23 and a left stopper 24 installed at the left and right ends of the base plate 21. Yes.

  The camera unit 3 includes a camera column 31, a camera column stay 32, and a camera 33. The lower end of the camera column 31 is fixed to the base plate 21 and a camera column stay 32 is positioned and arranged at the upper end. The camera 33 is fixed to the camera support stay 32 and displays an image of the semiconductor wafer placed on the first plate 43.

[Description of Plate Slide 4 of Example 1]
As shown in FIGS. 1 and 2, the plate slide portion 4 includes a slide base 41, a stopper stay 49, a first plate support base 42, a second plate support base 44, a first plate 43, and a second plate. And a plate 45.

  And the plate slide part 4 moves the 1st plate 43 and the 2nd plate 45 to the fixed position directly under the pick-up part 5, and moves a semiconductor chip from the 1st plate 43 to the 2nd plate 45, and arranges it. The X-axis stage of the first plate support base 42 and the second plate support base 44 on which the first plate 42 and the second plate 45 are placed allows an arrangement with high positional accuracy in the column and row directions. It is possible.

  The slide base 41 is screwed and fixed to a block (not shown) of the slide guide 22 installed on the base plate 21 so as to be able to move in the X-axis direction (left-right direction) along the slide guide 22. . The moving direction of the plate slide portion 4 is the reference of the semiconductor manufacturing apparatus of the first embodiment as the X axis of the coordinate axis shown in FIG.

  Further, the slide base 41 is provided with a first plate support 42 and a second plate support 44 at the left and right ends of the upper surface thereof. The first plate support 42 includes an XYθ axis stage, on which a first plate 43 that is a movement source of the semiconductor chip is installed. The second plate support 44 includes an X-axis stage, on which a second plate 45 that is a movement destination of the semiconductor chip is installed. The first plate 43 and the second plate 45 are made of porous plates, and the position of the mounted semiconductor chip is fixed by vacuum suction, and the fixed position is released by stopping vacuum suction. And can be moved and picked up. In addition, although the pipe which vacuum-sucks is provided, illustration is abbreviate | omitted in a present Example. In the first embodiment, an example of a porous plate will be described. However, even if a weak adhesive film is formed on the plate, it is possible to prevent the position from shifting.

  The XYθ axis stage of the first plate support base 42 performs initial setting of the dicing line of the semiconductor chip contact assembly, the parallelism adjustment in the X axis direction, and the initial position setting based on the output image of the semiconductor chip by the camera unit 3 as an initial setting. In addition, the pickup unit 5 has a function of moving the first plate 43 to a position for picking up a plurality of semiconductor chips for one column or one row by feeding in the X-axis direction. The X-axis stage of the second plate support 44 sets a feed amount for placing a plurality of semiconductor chips for one column or one row picked up by the pickup unit 5 on the second plate 45 at regular intervals. It has a function.

  The first plate 43 and the second plate 45 are detachable and compatible with the first plate support base 42 and the second plate support base 44, and have a structure that can be attached and detached even if rotated 90 ° on the plate plane. Forming.

  As a mechanism for fixing the linear movement of the plate slide portion 4 in the left-right (X-axis) direction, a stopper stay 49 is screwed to the side surface of the slide base 41 and the groove portion is engaged with the clamp 48. By tightening the screw of the clamp 48, the stopper stay 49 is fixed to the base plate 21, and the slide base 41 can be fixed to the base plate 21.

  Therefore, the base slide part 4 is fixed at both the left and right ends by abutting the right stopper 23 and the left stopper 24 disposed at the left and right ends of the base plate 21 with the slide base 41 and tightening the screws of the clamps 48. It is possible to fix it at a predetermined position.

In FIG. 1, the slide base 41 is fixed and positioned by a clamp 48 at a position where the slide base 41 is in contact with the left stopper 24, the camera unit 3 is directly above the first plate 43, and the pickup unit 5 is the destination. It is positioned directly above the second plate 45.
In FIG. 2, the slide base 41 abuts on the right stopper 23 and is fixed and positioned by the clamp 48, and the pickup unit 5 is positioned directly above the first plate 43 that is the movement source.

  Therefore, the pickup unit 5 does not have a means for moving the picked-up one column or one row of semiconductor chips from the first plate to the second plate, but instead, the plate slide unit 4 has the pickup unit 5. Means for moving the first plate and the second plate, and means for moving one column or one row of semiconductor chips from the first plate to the second plate.

  That is, at the left end position (shown in FIG. 1) and the right end position (shown in FIG. 2) of the plate slide portion 4, the initial position setting of the semiconductor chip contact assembly is performed under the camera portion 3 at the left end position (see FIG. 1). At the right end position (see FIG. 2), the pickup unit 5 picks up the semiconductor chips for one row from the semiconductor chip contact assembly on the first plate 43, cleaves and picks them up, and moves to the left end position (see FIG. 1). Returning, the semiconductor chips for one row are placed on the second plate 45 and fixed by vacuum suction, and the semiconductor chips are picked up at the right end position (see FIG. 2), and the semiconductor chips are picked up at the left end position. A plurality of rows of semiconductor chips aligned at a constant interval are aligned from the semiconductor chip contact assembly by repeatedly placing them on the upper surface of the substrate and vacuum-adsorbing and fixing them.

[Description of Pickup Unit 5 of Example 1]
As shown in FIG. 1, the pickup unit 5 is screwed and fixed to the pickup base plate 53 via a pickup column 51 and a pickup column stay 52 raised from the base plate 21, and the first plate 43 of the plate slide unit 4. Alternatively, it is attached at a position where it directly hits the second plate 45.

The structure of the pickup unit 5 will be described with reference to FIG.
3A is a perspective view of the appearance of the pickup unit 5 taken out from the semiconductor manufacturing apparatus 1 and viewed from the rear side of the right side. FIG. 3B is an enlarged exploded perspective view of the pickup unit 5 in FIG. FIG. 3C is a partially enlarged perspective view in which the tip of the pickup chuck of the pickup unit 5 is further enlarged.

  As shown in FIG. 3A, the pickup unit 5 includes a pickup slide unit 6, a pickup chuck unit 7, and a semiconductor chip presser unit 8. The pickup slide portion 6 and the semiconductor chip pressing portion 8 are fixed to the pickup base plate 53 with screws via slide guides described later. The pickup chuck portion 7 is fixed to the pickup slide portion 6 with screws via a slide guide, which will be described later.

  The function of each part of the pick-up part 5 is demonstrated roughly. The pickup slide unit 6 has a function of moving the pickup chuck unit 7 in the vertical (Z-axis) direction to dispose the semiconductor chip at the suction position and the retracted position, and moving the pickup chuck unit 7 in the Y-axis direction for one column. The function of switching the adsorption of the semiconductor chips or the adsorption of the semiconductor chips for one row is provided.

  The pickup chuck portion 7 forms a structure that is the main focus of the present invention. That is, it has two types of column chucks and row chucks for sucking and mounting a plurality of semiconductor chips for one column or one row, and an inclined surface 54 is formed at the tips of the column chuck 71a and the row chuck 71b. A suction hole 55 is formed in the inclined surface 54, and a mechanism that allows the column chuck 71a and the row chuck 71b to move up and down in an oblique 45 ° direction is formed.

  The semiconductor chip presser 8 holds the semiconductor chip on the first (second) plate from which it is moved in a plane so as not to float, and the semiconductor chip is arranged even if the vacuum suction of the first plate is released. It has a function to fix the position. Further, the pickup chuck portion 7 is in a positional relationship in which one row or one row of semiconductor chips adsorbed by the pickup chuck portion 7 are exposed, and the other semiconductor chips are covered and pressed.

  Hereinafter, in the exploded perspective view of FIG. 3B, the configuration of the pickup slide portion 6, the pickup chuck portion 7, and the semiconductor chip pressing portion 8 will be described in detail.

[Description of Pickup Slide 6 of Example 1]
The pickup slide unit 6 includes a Z-axis slide guide 61, a Z-axis slide guide block 62, a Z-axis slide plate 63, a Z-axis micrometer head stay 64, a Z-axis micrometer 65, a row / column switching slide guide 66, It is composed of a row switching slide guide block 67 and a chuck slide base 68.

  The Z-axis slide guide 61 is fixed to the pickup base plate 53 with screws, and a block 62 of the Z-axis slide guide that slides linearly is movable in parallel with the Z-axis direction. The Z-axis slide plate 63 has a Z-axis micrometer head stay 64 having a Z-axis micrometer 65 attached to the upper end surface thereof, and is fixed with screws. Accordingly, the Z-axis slide plate 63 can be linearly moved with high accuracy in the Z-axis direction (vertical direction) by the feed of the Z-axis micrometer 65.

  The Z-axis slide plate 63 forms a surface inclined at 45 ° with respect to the plane of the front surface 63a at the lower end (an inclined surface with a Y-axis of 45 ° with respect to the YZ surface). A column switching slide guide 66 and a block 67 are attached. The right side stopper 69a and the left side stopper 69b are fixed by screws to both ends of the row / column switching slide guide 66, that is, to both end surfaces of the Z-axis slide plate 63. Therefore, the block 67 of the row / column switching slide guide 66 is configured to be linearly movable in the Y-axis direction with an inclination of 45 ° with respect to the front surface 63a of the Z-axis slide plate 63.

  The chuck slide base 68 is fixed to the block 67 of the row / column switching slide guide with screws. Therefore, the chuck slide base 68 is configured to be movable in the Y-axis direction while maintaining the front surface 68a of the Z-axis slide plate at a 45 ° inclination with respect to the front surface 63a. Further, the standby position of the chuck slide base 68 is fixed in contact with one of the left and right side stoppers 69a and 69b. Details will be described with reference to FIG.

  Two chuck slide guides 77 are attached in parallel to the front surface 68a of the chuck slide base 68 by screws for the column pickup chuck portion 7a and the row pickup chuck portion 7b, and a block 78 of the chuck slide guide 77 is attached to the chuck slide base 77. The slide base 68 is installed so as to be linearly movable in a direction perpendicular to the linear movement direction of the slide base 68. Accordingly, the block 78 is installed so as to be linearly movable with an inclination of 45 ° with respect to the front surface 63a of the Z-axis slide plate.

[Description of Pickup Chuck 7 of Example 1]
The pickup chuck portion 7 is composed of a column pickup chuck portion 7a and a row pickup chuck portion 7b.
The column pickup chuck portion 7a and the row pickup chuck portion 7b have the same six parts: a miniature fitting 73, a chuck slider 74, a micrometer head stay 75, a pickup micrometer 76, a chuck slide guide 77, and a chuck slide guide block 78. The column pickup chuck portion 7a is formed by adding the column chuck 71a and the column chuck stay 72a at the tip portion, and the row pickup chuck portion 7b is formed by adding the row chuck 71b and the row chuck stay 72b.

  The chuck slider 74 has a micrometer head stay 75 having a pick-up micrometer 76 attached to the upper end thereof, and is fixed with screws, and a column and row chuck stay having column and row chucks 71 a and 71 b and miniature fittings 73 at the lower end. 72a and 72b are fixed with screws. Further, the chuck slider 74 is fixed to the block 78 of the chuck slide guide with screws, and can be linearly moved with high accuracy by feeding the pickup micrometer 76 along the chuck slide guide 77.

  Accordingly, since the chuck slide guide 77 is mounted on and fixed to the chuck slide base 68, the column and row pickup chuck portions 7a and 7b have an inclination of 45 ° with respect to the front surface 63a of the Z-axis slide plate 63. With the feed of the meter 76, it is possible to move up and down with high accuracy.

  In the column pickup chuck portion 7a, the leading end of the column chuck 71a is α ° = 7 ° to 11 ° with respect to the upper surface of the first or second plate (see FIGS. 1 and 2), as shown in FIG. A slope 54 having an inclination is formed, and a plurality of suction holes 55 corresponding to the number of semiconductor chips in the column direction are formed on the slope 54. The inclined direction of the inclined surface 54 is such that the gap between the semiconductor chip and the dicing line that is cleaved and separated when adsorbing the semiconductor chip is narrow, and the gap opens as the distance from the dicing line increases.

  The row chuck 71a is fixed to the tip of the row chuck stay 72a by bonding, and the row miniature fitting 73 and the suction hole 55 (see FIG. 3C) are vacuum-piped. The miniature fitting 73 is provided with a vacuum suction pipe, which is not shown in this embodiment.

  The suction holes 55 arranged in the row chuck 71 a suck a plurality of semiconductor chips for one row to the inclined surface 54 by vacuum suction from the miniature fitting 73. By adsorbing to the inclined surface 54, the column chuck 71a adsorbs and cleaves and separates one row of semiconductor chips along the dicing line from the semiconductor chip contact assembly.

  Therefore, after the column chuck 71a adsorbs and cleaves and separates one row of semiconductor chips, the column chuck 71a is moved obliquely upward away from the dicing line by feeding the pickup micrometer 76. Since it moves obliquely upward at an angle of 45 °, it becomes possible to pick up without contacting and interfering with the remaining semiconductor chip along the dicing line.

As described above, the row pickup chuck portion 7b is different from the column pickup chuck portion 7a only in the row chuck 71b and the row chuck stay 72b. Since the functions are also the same, the description thereof is omitted.
Similarly to the front end of the row chuck 71a, the front end (not shown) of the row chuck 71b is also formed with a slope having an inclination of α ° = 7 ° to 11 ° with respect to the upper surface of the first or second plate. A plurality of suction holes corresponding to the number of semiconductor chips in the row direction are formed on the slope.
The positional relationship between the column pickup chuck portion 7a and the row pickup chuck portion 7b will be described in detail with reference to FIGS.

  Therefore, similarly to the column pickup chuck portion 7a, one row of semiconductor chips are cleaved from the assembly of semiconductor chips aligned in the row direction by adsorbing one row of semiconductor chips along the dicing line to the inclined surface 54. By separating and picking up at an angle of 45 °, pick-up is possible without contacting and interfering with the remaining semiconductor chip along the dicing line.

[Description of Semiconductor Chip Presser 8 of Example 1]
The semiconductor chip presser 8 includes a chip presser 81, a chip press stay 82, a press slide plate 83, an upper plate 84, a level plate 85, a press slide guide 86, and a block 87 of a press slide guide.

  The push slide guide 86 is juxtaposed in parallel with the Z-axis slide guide 61 and fixed to the pickup base plate 53 with screws, and the push slide guide block 87 is the first plate in the same manner as the Z-axis slide guide block 62. 43 or the second plate 45 (see FIGS. 1 and 2).

  The push slide plate 83 fixed by screws to the block 87 of the push slide guide is installed on a level plate 85 having an upper plate 84 fixed to the upper end surface by screws and fixed to the upper end surface of the pickup base plate 53 by screws. It is in contact with a feed screw (not shown). The upper plate 84 can be moved up and down by rotating the feed screw, and the push slide plate 83 can be moved directly in the Z-axis direction (up and down direction).

  Further, a tip press stay 82 is fixed to the lower end portion of the press slide plate 83 with screws, and a tip presser 81 is fixed to the end surface of the arm of the tip press stay 82 with screws. The lower surface of the chip retainer 81 is formed in a plane parallel to the upper surfaces of the first plate 43 and the second plate 45 (see FIGS. 1 and 2), and the semiconductor chip placed on the first and second plates. The area is sufficient to hold the assembly of.

  Accordingly, the lower surface of the chip presser 81 can be moved in the Z-axis direction (vertical direction) parallel to the upper surfaces of the first and second plates by rotating a feed screw installed on the level plate 85. . That is, by holding the semiconductor chip placed on the first and second plates in a plane so as not to float on the lower surface of the chip presser 81, the vacuum suction of the first and second plates is stopped, and 1 Even if an external force for cleaving and separating the semiconductor chips for one column or one row is applied, it is possible to prevent the positional deviation of the pressed semiconductor chips.

  The stop of vacuum suction of the first and second plates made of porous plates is to release the suction force that fixes the semiconductor chip to the first and second plates. Or it becomes easy to adsorb | suck and cleave-separate several semiconductor chips for 1 row along a dicing line.

  As is clear from the description of the configuration of each part described above, the coordinate axes (XYZ axes) of the semiconductor manufacturing apparatus 1 indicate that the movement direction of the base plate part 2 is the X-axis direction, the Z-axis slide plate 63 of the pickup part 5 and The moving direction of the slide plate is the Z-axis direction, and the moving direction of the chuck slide base 68 is the Y-axis direction.

[Description of Column and Row Pickup Chuck 7a, 7b Switching Mechanism of Example 1]
FIG. 4 is a right side view showing the switching mechanism of the column and row pickup chuck portions 7a and 7b of the semiconductor manufacturing apparatus, and FIG. 4 (a) is a pick column up chuck portion for picking up semiconductor chips for one column. FIG. 4B is a diagram for explaining the positional relationship between 7a and the second plate support, and FIG. 4B shows the position between the row pickup chuck portion 7b for picking up one row of semiconductor chips and the second plate support. It is a figure for demonstrating a relationship.

  FIG. 4A shows the arrangement of the column pickup chuck portion 7a with respect to the second plate 45 in the manufacturing process of picking up a plurality of semiconductor chips for one column and rearranging them. A chuck slide base 68 on which the column and row pickup chuck portions 7a and 7b are mounted is moved to the right by the guide of the row / column switching slide guide 66, and is in contact with and fixed to the right side stopper 69a. The column pickup chuck chuck portion 7a is disposed at an appropriate position where the center line 44a of the second plate 45 coincides with the center line of the column pickup chuck chuck portion 7a and sucks a plurality of semiconductor chips for one column. Will be.

  FIG. 4B shows the arrangement of the row pickup chuck portion 7b with respect to the second plate 45 in a manufacturing process in which a plurality of semiconductor chips for one row are picked up and rearranged. The chuck slide base 68 is moved to the left by the guide of the row / column switching slide guide 66, and is in contact with and fixed to the left side stopper 69b. The row pickup chuck chuck portion 7b is disposed at an appropriate position where the center line 44a of the second plate 45 coincides with the center line of the column pickup chuck chuck portion 7b and sucks a plurality of semiconductor chips for one row. Will be.

  In this way, the pickup chuck portion 7 is mounted on the column and row pickup chuck portions 7a and 7b in the same semiconductor manufacturing apparatus, and the column and row pickup can be switched with a simple switching mechanism. It is possible to form a semiconductor chip matrix aggregate (hereinafter referred to as a semiconductor chip matrix aggregate) from the semiconductor chip adhesion aggregate.

  Note that the width of the column chuck 71a has a width for picking up and picking up one column of the semiconductor chip close assembly, and the row chuck 71b has a width of one row of semiconductor chip columns aligned at a predetermined interval. Since it has a suction pickup width, it is formed wider than the column chuck 71a. Therefore, when picking up a semiconductor chip having an aspect ratio close to 1, the row chuck 71b can be used as a common chuck or instead of the column chuck 71a, and the column pickup chuck portion 7a and the row pickup chuck portion are used. Switching of 7b becomes unnecessary.

Next, a manufacturing process for manufacturing a semiconductor chip matrix-like assembly from a semiconductor chip adhesion assembly by the semiconductor manufacturing apparatus 1 of Example 1 will be described.
In the following, the operation of the pick-up chuck and the pressing portion and the function of the inclined surface of the row chuck will be described first in the embodiment for picking up one row as the pick-up operation, and then the manufacturing process will be explained.

[Production Method of Example 1: FIGS. 5 to 8]
FIG. 5 is a partially enlarged view in which the tip of the pickup chuck portion is enlarged as a diagram for explaining the pickup operation in the first embodiment, and FIG. 6 is a partially enlarged view for explaining the pickup operation subsequent to FIG. FIG.

7 and 8 show that the pickup operation described in FIGS. 5 and 6 is applied to the semiconductor chip for one column and one row, and the manufacturing process of picking up, moving, and placing is repeated to make the semiconductor chip contact. It is a top view for demonstrating the manufacturing process which forms a semiconductor chip matrix-like aggregate from an aggregate. In particular, FIG. 7 is a plan view for explaining a manufacturing process for forming a semiconductor chip row from a semiconductor chip contact assembly, and FIG. 8 is a continuation of FIG. It is a top view for demonstrating the manufacturing process which forms a shape assembly.
The outer shapes of the semiconductor chip of FIGS. 5 to 8 and the first, second, and third plates are schematically shown, and the number of semiconductor chips is the same.

[Description of Pickup Operation of Multiple Semiconductor Chips for One Row]
In ST01 and ST02 of FIG. 5, the first step of the column direction pressing step will be described.
As shown in ST01, the initial set semiconductor chip contact assembly 9 is fixed to the set position when the vacuum suction is ON on the upper surface of the movement source first plate 43, and the chip presser 81 and the row chuck 71a of the pickup unit 5 are fixed. Is located immediately above the semiconductor chip contact assembly 9 and is in a standby position (the semiconductor manufacturing apparatus 1 is in the state of FIG. 2).

  Next, as shown in ST02, the chip presser 81 is lowered and the semiconductor chip contact assembly 9 is pressed by the chip presser 81. The position to be pressed is such that one row of semiconductor chips 91a and its dicing line 92a at the end of the semiconductor chip contact assembly 9 are exposed, and the remaining semiconductor chip contact assembly 9 is pressed from the next row. It is adjusted and set by the feed of the X-axis micrometer of the XYθ stage of the first plate support 42 (see FIG. 1). Then, the semiconductor chip adhesion assembly 9 is fixed to the upper surface of the first plate 43 by the vacuum suction ON. The row chuck 71a is in the standby position.

Next, in ST03 and ST04 of FIG. 5, the second step of the column direction pickup step will be described.
As shown in ST03, the row chuck 71a is lowered to one row of semiconductor chips 91a exposed from the chip presser 81 by the feed of the Z-axis micrometer 65 (see FIG. 3), and the inclined surface 54 of the row chuck 71a is The semiconductor chips 91a for one row are arranged at substantially matching positions along the dicing lines 92a. The first plate 43 that is the movement source continues to adhere the semiconductor chip contact assembly 9 when the vacuum suction is ON.

Then, as shown in ST04, the vacuum suction of the semiconductor chip contact assembly 9 by the first plate 43 is turned off and stopped, and the semiconductor chip for one column is stopped by the vacuum suction force of the suction hole 55 of the column chuck 71a. 91a is adsorbed on the inclined surface 54 of the row chuck 71a along the dicing line and is cleaved and separated. The chip presser 81 continuously presses the remaining semiconductor chip contact assembly 9 on the first plate 43 to prevent the position shift of the semiconductor chip contact assembly 9 from which the vacuum suction is released.
As shown in the partial enlarged view of ST04, a wedge-shaped gap 56 corresponding to the angle α ° (= 7 ° to 11 °) of the inclined surface 54 is formed in the cleaved and separated portion.

Next, the third step of the column direction pickup chuck moving step will be described in ST05 and ST06 of FIG.
As shown in ST05, the row chuck 71a moves obliquely upward by 45 ° of the arrow W by the feed of the row pickup micrometer 76 (see FIG. 3) of the pickup chuck portion 7. By moving diagonally upward rather than directly above, one row of the cleaved and separated semiconductor chips 91a interferes with the dicing line portion at the tip of the wedge-shaped gap 56 (see the partially enlarged view of ST04 in FIG. 5). Easy to separate. Then, the semiconductor chip contact assembly 9 left on the first plate 43 is pressed by the chip presser 81, and vacuum suction is again turned ON on the upper surface of the first plate 43, and the initial setting position is maintained. It is fixed.

  Then, as shown in ST06, the chip presser 81 retracts upward and returns to the standby position, and the column chuck 71a holds the Z-axis micrometer 65 in a state where the semiconductor chip 91a for one column is attracted to the inclined surface 54. As in the case of the chip presser 81, it is retracted upward and waits at the workpiece standby position. Even if the chip presser 81 returns to the standby position, the semiconductor chip contact assembly 9 left on the upper surface of the first plate 43 remains fixed at the initial position because the vacuum suction is ON.

Next, in ST07 to ST09, the fourth step of the column direction placement step will be described.
In ST07, the first plate 43 in the previous ST06 is replaced with the second plate 45. That is, in ST07, the plate slide part 4 is moved and fixed from the right end position (see FIG. 1) to the left end position (see FIG. 2), thereby attracting the semiconductor chips 91a for one row to the inclined surface 54 and waiting for the work. The second plate 45 is moved and fixed immediately below the row chuck 71a at the position.

  Next, as shown in ST08, the semiconductor chips 91a for one row attracted by the row chuck 71a are determined on the second plate 45 as the movement destination by the feed of the Z-axis micrometer 65 (see FIG. 3). It is lowered to the position. The semiconductor chips 91a for one row are attracted and placed on the upper surface of the second plate away from the inclined surface 54 of the row chuck 71a by the suction force of the second plate 45 due to the vacuum suction ON and the vacuum suction OFF of the row chuck 71a. The

  Next, as shown in ST09, the chip presser 81 is in the standby position, and the row chuck 71a is again retracted upward and returned to the standby position directly above the second plate 45. One row of semiconductor chips 91a is sucked and placed on the upper surface of the second plate 45 and held at a predetermined position.

  Next, the second plate 45 is replaced with the first plate 43, and the first plate 43 is moved and fixed to a position immediately below the chip presser 81 and the row chuck 71a at the standby position. That is, as in the semiconductor manufacturing apparatus 1 in FIG. 2, the plate slide portion 4 moves directly to the right end portion and comes into contact with the right stopper 23 to be fixed, and the process returns to ST01 and enters a standby state.

  Therefore, by repeating the first to fourth steps of the manufacturing process of ST01 to ST09 described with reference to FIGS. 5 and 6, the semiconductor chip adheres from the first plate 43 to the second plate 45 to the destination. It is possible to align and arrange the semiconductor chips for one row of the assembly 9 one row at a time.

  As described above, according to the first embodiment of the present invention, the stealth-diced semiconductor wafer is formed on the slope 54 formed at the tips of the column chuck 71a and the row chuck 71b for one column or one row of semiconductor chips. Is cleaved and separated by a dicing line, and a wedge-shaped gap 56 having the same angle as the inclined surface 54 is formed in the cleaved and separated portion. The wedge-shaped gap has very little interference with the adjacent portion when picking up, and there is no pick-up failure due to friction or catching. Furthermore, since the column chuck 71a and the row chuck 71b have a mechanism capable of moving in a direction diagonally away from the dicing line, the tip of the cleaved wedge-shaped gap can be separated without any interference and pickup failure Will not occur.

The manufacturing process for picking up and aligning semiconductor chips for one column has been described, but the manufacturing process for picking up and aligning semiconductor chips for one row can also be arranged in the same manufacturing process. That is, the fifth step of the row direction pressing step corresponds to the first step of the column direction pressing step, and the sixth step of the row direction pickup step corresponds to the second step of the column direction pickup step. The seventh step of the moving step corresponds to the third step of the column direction pickup chuck moving step, and the eighth step of the row direction placing step corresponds to the fourth step of the column direction placing step. Detailed description will be omitted because it overlaps.
Next, the manufacturing process for forming the semiconductor chip matrix-like assembly from the semiconductor chip adhesion assembly 9 by repeating the above manufacturing process will be described in detail.

[Description of Manufacturing Process of Semiconductor Chip Matrix Assembly]
Next, a manufacturing process for forming a semiconductor chip matrix-like assembly from the semiconductor chip contact assembly 9 by repeating the above-described pickup operation will be described in detail.
In FIG. 7, the semiconductor chip contact assembly 9 on the first plate 43 is aligned at regular intervals on the second plate 45 based on the manufacturing process for aligning the semiconductor chips for one row described in FIGS. As the first half of the manufacturing process for forming the semiconductor chip array, the first to fourth processes and the repeated manufacturing processes thereof will be described. In FIG. 8, the semiconductor chip array aligned on the second plate 45 at a predetermined interval is used as the first manufacturing process. As the latter half of the manufacturing process for forming the semiconductor chip matrix aggregate on the three plates 46, the fifth to eighth processes and the repeated manufacturing processes will be described.

  7 and FIG. 8 are plan views of the first plate 43, the second plate 45, and the third plate 46 of the semiconductor manufacturing apparatus 1, and each column or one column by the column chuck 71a, the row chuck 71b, and the chip presser 81 is shown. It is a figure for demonstrating the manufacturing process which picks up and aligns the several semiconductor chip for a line. Other components are omitted.

  Accordingly, in FIG. 7, the first plate 43, the semiconductor chip contact assembly 9 disposed on the first plate 43, the second plate 45, the row chuck 71a (indicated by a two-dot chain line), the chip presser 81 (indicated by a two-dot chain line).

FIG. 7A is a plan view on which the semiconductor wafer stealth-diced, that is, the semiconductor chip contact assembly 9 is placed on the movement-source first plate 43.
FIG. 7B is a plan view in which the picked-up first row semiconductor chips are placed on the second plate 45 of the movement destination.
FIG. 7C is a plan view showing a state in which the second row of semiconductor chips are picked up on the movement-source first plate 43.
FIG. 7D is a plan view on which the first row and second row semiconductor chips picked up on the second plate 45 of the movement destination are placed.
FIG. 7E is a plan view showing a state in which the last row of semiconductor chips is picked up on the movement-source first plate 43.
FIG. 7F is a plan view in which all the picked-up semiconductor chip rows are placed on the second plate 45 that is the movement destination.
Each semiconductor chip is numbered from 1 to 20 to indicate the correspondence between the semiconductor chip on the first plate of the movement source and the semiconductor chip on the second plate 45 of the movement destination.

  As shown in FIG. 7A, the semiconductor chip adhesion assembly 9 on the first plate 43 is formed by dicing lines 92a, 92b, and 92c in the column direction and dicing lines 94a, 94b, and 94c in the row direction by stealth dicing. , 94d are formed. By cleaving and separating along the dicing line, semiconductor chips No. 1 to No. 20 are formed.

  The first row of semiconductor chips 91a is composed of semiconductor chips Nos. 1, 2, 3, 4, and 5, and the second row of semiconductor chips 91b is composed of semiconductor chips No. 6, 7, 8, 9, and 10, and the third row. The semiconductor chip 91c is composed of semiconductor chips No11, 12, 13, 14, and 15, and the fourth row of semiconductor chips 91d is composed of semiconductor chips No16, 17, 18, 19, and 20.

  With the initial position setting, the dicing lines 94 a, 94 b, 94 c, 94 d in the row direction of the semiconductor chip contact assembly 9 are adjusted in parallel to the X axis of the coordinate axis of the first plate 43 so that the set position on the first plate 43 is reached. It is fixed by vacuum suction. The semiconductor chip 91a in the first row is disposed immediately below the row chuck 71a (indicated by a two-dot chain line) in a standby state by feeding in the X-axis direction of the XYθ axis stage of the first plate support 42. The tip presser 81 is also in a standby state at a position indicated by a two-dot chain line.

  In the first step of the row direction pressing step described above, the chip retainer 81 (two-dot chain line) exposes the first row of semiconductor chips 91a (semiconductor chips No 1, 2, 3, 4, 5) and the row direction dicing line 92a. Then, the entire remaining semiconductor chip contact assembly 9 is pressed from the next row 91b (semiconductor chip Nos. 6, 7, 8, 9, 10).

  Next, in the second step of the above-described column direction pick-up step, the semiconductor chip 91a in the first column is attracted to the column chuck 71a (two-dot chain line) lowered to the semiconductor chip contact assembly 9, and the column direction dicing line 92a. And cleaved along. A wedge-shaped gap 56 (see a partially enlarged view of ST04 in FIG. 5) is formed between the first row of semiconductor chips 91a and the second row of semiconductor chips 91b.

  Next, in the third step of the above-described row direction pickup chuck moving step, the first row of semiconductor chips 91a adsorbed by the row chuck 71a is fed by the pickup micrometer 76 (see FIG. 3) to the row direction dicing line 92a. As a result, the semiconductor chips 91b in the second row adjacent to each other and the tips of the wedge-shaped gaps are separated without interference. The chip presser 81 returns to the standby position, and the row chuck 71a retracts to the workpiece standby position by feeding the Z-axis micrometer 65 while adsorbing the first row of semiconductor chips 91a (see ST06 in FIG. 6).

Next, in the fourth step of the row direction mounting step described above, the slide base 41 (see FIG. 1) is moved from the right end to the left end and fixed, and the first plate 43 directly below the row chuck 71a is fixed to the second plate. Switch to 45.
Then, as shown in FIG. 7B, the second plate 45 is moved by the feed of the X-axis stage of the second plate support (see FIG. 1), and the position immediately below the row chuck 71a and the first row are moved. The position where the semiconductor chip 91a is placed is matched.

  Next, the row chuck 71a is lowered by the feed of the Z-axis micrometer 65, and the semiconductor chip 91a in the first row is moved to the second plate by the suction force by the vacuum suction OFF of the row chuck 71a and the vacuum suction ON of the second plate 45. It is placed at a predetermined position on 45 and fixed by suction.

  Next, the row chuck 71a is returned to the standby position, and the pickup unit together with the chip presser 81 returns to the standby state. Then, the slide base 41 moves straight from the left end to the right end and is fixed by a stopper, and the second plate 45 immediately below the row chuck 71 a is switched to the first plate 43. And it continues to the next manufacturing process which picks up a semiconductor chip row | line | column.

  Next, returning to the first step, as shown in FIG. 7C, the first plate 43 is sent a distance equal to the distance between the column-direction dicing lines in the X-axis direction, and the second row of semiconductor chips 91b ( Semiconductor chips No. 6, 7, 8, 9, 10) are positioned immediately below the row chuck 71a.

  The chip presser 81 indicated by a two-dot chain line exposes the second row of semiconductor chips 91b and the column direction dicing lines 92b, and the remaining rows from the next row 91c (semiconductor chips No. 11, 12, 13, 14, 15). The entire semiconductor chip contact assembly 9 is pressed.

  Next, in the second step, similarly to the first row, the second row of semiconductor chips 91b are attracted to the row chuck 71a and cleaved and separated by the row direction dicing line 92b. A wedge-shaped gap is formed between the second row of semiconductor chips 91b and the third row of semiconductor chips 91c.

  Next, in the third step, as in the first row, the semiconductor chips 91b in the second row are adjacent to each other by being moved obliquely upward from the column-direction dicing line 92b by the pickup micrometer 76 (see FIG. 3). The semiconductor chips 91c in the third row and the tips of the wedge-shaped gaps are separated without interference. The chip presser 81 returns to the standby position, and the row chuck 71a is retracted to the workpiece standby position.

  Next, as shown in FIG. 7D, in the fourth step, as in the first row, the slide base 41 is moved from the right end to the left end and fixed, and the first plate 43 directly below the row chuck 71a is fixed. Switch to the second plate 45. In order to place the second row of semiconductor chips 91b at a position spaced apart from the first row of semiconductor chips 91a, the second plate 45 is moved at regular intervals on the X-axis stage of a second plate support (not shown). To do. Then, the row chuck 71 a is lowered, and the semiconductor chip 91 b in the second row is placed at a predetermined position on the second plate 45 and fixed by suction.

  Next, the row chuck 71a is retracted upward to return to the standby position, and the slide base 41 is linearly moved from the left end to the right end and fixed, and the second plate 45 immediately below the row chuck 71a is attached to the first plate 43. Switch to continue to the next manufacturing process to pick up the semiconductor chip row.

  As shown in FIG. 7E, the first to fourth manufacturing steps are repeated on the first plate 43, and the last semiconductor chip row 91d (semiconductor chip Nos. 16, 17, 18, 19, and 20). Is positioned immediately below the row chuck 71a, and shows a pickup state by the row chuck 71a.

In FIG. 7F, the second plate 45 shows a state where the last semiconductor chip row 91d has been picked up and placed and fixed at a predetermined position of the second plate 45.
As a result, the semiconductor chip contact assembly 9 shown in FIG. 7A is rearranged into the semiconductor chip columns 91a, 91b, 91c, 91d arranged in the row direction at regular intervals on the second plate 45. The process ends.

Next, the latter half of the manufacturing process in which the semiconductor chip array is further rearranged to form a semiconductor chip matrix assembly will be described.
The initial setting of the latter half of the manufacturing process is performed by rotating the second plate 45 in which the semiconductor chip rows are arranged at regular intervals in the row direction in the first half of the manufacturing process by rotating the first plate support 42 (FIG. 1). In this case, the third plate 46 is newly mounted on the second plate support 44 (see FIG. 1) at the movement destination.

  FIG. 8 is a manufacturing process subsequent to FIG. 7, and similarly to FIG. 7, the second plate 45, the semiconductor chip row arranged on the second plate 45, the third plate 46, and the row chuck 71b. (Indicated by a two-dot chain line) and a tip presser 81 (indicated by a two-dot chain line).

FIG. 8A is a plan view in which semiconductor chip columns aligned at a constant interval in the row direction are placed on the second plate 45 as the movement source.
FIG. 8B is a plan view on which the first row of semiconductor chips picked up by the third plate 46 as the movement destination is placed.
FIG. 8C is a plan view showing a state in which the semiconductor chips in the second row are picked up on the second plate 45 as the movement source.
FIG. 8D is a plan view on which the semiconductor chips in the first and second rows picked up by the third plate 46 as the movement destination are placed.
FIG. 8E is a plan view showing a state in which the semiconductor chip in the last row is picked up on the second plate 45 as the movement source.
FIG. 8F is a plan view in which a semiconductor chip matrix-like assembly is formed on the third plate 46 of the movement destination.

  8A, in the semiconductor chip row of the second plate 45, the semiconductor chip 93a in the first row is composed of semiconductor chips No5, 10, 15, and 20, and the semiconductor chip 93b in the second row is semiconductor chip No4. 9, 14, and 19, the third row semiconductor chip 93 c is composed of semiconductor chips No 3, 8, 13, and 18, and the fourth row semiconductor chip 93 d is composed of semiconductor chips No 2, 7, 12, and 17. The semiconductor chip 93e in the fifth row is composed of semiconductor chips No. 1, 6, 11, and 16.

  A dicing line 94a is formed between the first and second row semiconductor chips, a dicing line 94b is formed between the second and third row semiconductor chips, and the dicing lines 94c and 94d are similarly connected to the semiconductor chip. Formed in rows.

In the following, referring to FIG. 8, a manufacturing process for converting the arrangement of the semiconductor chip columns and aligning them in the row direction will be described following the previous manufacturing process described in FIG.
As shown in FIG. 8A, in the fifth step of the row direction pressing step, as in the first step of the column direction pressing step, the chip presser 81 shown by a two-dot chain line is a semiconductor chip on the second plate 45. The first row of semiconductor chips 93a composed of Nos. 5, 10, 15, and 20 and the row direction dicing lines 94a are exposed, and the entire remaining semiconductor chip columns from the next row 93b (semiconductor chips No. 4, 9, 14, and 19) are exposed. Press.

  Next, in the sixth step of the row direction pickup step, the semiconductor chip 93a in the first row is attracted to the row chuck 71b indicated by a two-dot chain line, as in the second step of the column direction pickup step, and the row direction dicing line is obtained. It is cleaved and separated at 94a. A wedge-shaped gap is formed between the semiconductor chip 93a in the first row and the semiconductor chip 93b in the second row.

  Next, in the seventh step of the row direction pickup chuck moving step, as in the third step of the column direction pickup chuck moving step, the semiconductor chip 93a in the first row is moved obliquely upward from the row direction dicing line 94a. The adjacent semiconductor chips 93b in the second row are separated from the tips of the wedge-shaped gaps without interference. The row chuck 71b retreats to the workpiece standby position while adsorbing the semiconductor chip 93a in the first row.

Next, in the eighth step of the row direction placement step, as in the fourth step of the column direction placement step, the slide base 41 is moved and fixed from the right end to the left end, and the second step directly below the row chuck 71b. The plate 45 is switched to the third plate 46.
As shown in FIG. 8B, the X-axis stage of the second plate support (not shown) is fed to the mounting position of the first row of semiconductor chips defined on the third plate 46, The row chuck 71b (two-dot chain line) is made to coincide and lowered, and the semiconductor chip 93a in the first row is placed at a predetermined position on the third plate 46 and fixed by suction.

  The row chuck 71b returns to the standby position, and the pickup unit together with the chip presser 81 returns to the standby state. Then, the slide base 41 moves straight from the left end to the right end and is fixed by the stopper, the third plate 46 just below the row chuck 71b is switched to the second plate 45, and the semiconductor chip for one row returns to a state where it can be picked up. .

  Next, as shown in FIG. 8C, returning to the fifth step, the second plate 45 is sent a distance equal to the distance between the row dicing lines in the X-axis direction, and the semiconductor just below the row chuck 71b. The semiconductor chip 93b in the second row composed of chip Nos. 4, 9, 14, and 19 is positioned.

  Then, the chip presser 81 indicated by a two-dot chain line exposes the semiconductor chip 93b and the row direction dicing line 94b in the second row, and the remaining semiconductor chips from the next row 93c (semiconductor chips No. 3, 8, 13, 18). Press the entire row.

  Next, in the sixth step, the second row semiconductor chips 93b are attracted to the row chuck 71b, cleaved and separated by the row direction dicing lines 94b, and the second row semiconductor chips 93b and the third row semiconductor chips are obtained. A wedge-shaped gap is formed between the gap 93c.

  Next, in the seventh step, the semiconductor chip 93b in the second row moves obliquely upward from the row direction dicing line 94b, so that the adjacent third row semiconductor chip 93c and the tip of the wedge-shaped gap do not interfere with each other. Separated by a directional dicing line 94b. The chip presser 81 returns to the standby position, and the row chuck 71b retracts to the workpiece standby position while adsorbing the semiconductor chip 93b in the second row.

  As shown in FIG. 8D, in the eighth step, the slide base 41 is moved from the right end to the left end and fixed, and the second plate 45 directly below the row chuck 71b is switched to the third plate 46. In order to place the semiconductor chip 93b in the second row at a position spaced apart from the semiconductor chip 93a in the first row, the third plate 46 is moved at regular intervals on the X-axis stage of the second plate support (not shown). To do. Then, the row chuck 71b is lowered, and the semiconductor chip 93b in the second row is placed on the third plate 46 and fixed by suction.

  Next, the row chuck 71b is retracted upward and returned to the standby position, and the slide base 41 is moved and fixed from the left end to the right end, and the third plate 46 just below the row chuck 71b is fixed to the second plate 45. To the next manufacturing process for picking up one row of semiconductor chips.

  As shown in FIG. 8E, the manufacturing steps from the fifth step to the eighth step are repeated, and the second plate 45 has the last row of semiconductor chips 93e (semiconductor chips No. 1, 6, 11, and 16) chucked. The pick-up state by the row chuck 71b is shown just below 71b.

In FIG. 8F, the third plate 46 shows a state in which the semiconductor chip 93e in the last row is picked up and placed and fixed at a predetermined position of the third plate 46.
As a result, the semiconductor chip array on the second plate 45 shown in FIG. 8A is rearranged at regular intervals on the third plate 46 to form a semiconductor chip matrix assembly, and all the manufacturing steps are completed. To do.

  As described above, according to the manufacturing method of the present invention, a plurality of semiconductor chips for one column and one row are picked up at a time to form a matrix-like assembly, and the assembly is mounted on the circuit board. Therefore, compared with a manufacturing process in which semiconductor chips are picked up one by one and aligned, the manufacturing process can be significantly reduced and a manufacturing method with excellent mass productivity can be provided. Furthermore, since the arrangement accuracy of the semiconductor chip matrix assembly is high accuracy of micrometer feed of the XY axis stage, in the assembly mounting with the circuit board in the next process, the alignment accuracy is good. Aggregate implementation with very few defects can be provided.

(Example 2)
Next, the manufacturing method of Example 2 of the semiconductor manufacturing apparatus according to the present invention will be described.
The second embodiment has the same structure as that of the first embodiment, except that the first plate, the second plate, and the third plate on which the semiconductor chip is placed are the same shared plate, and the moving plate is moved. Also serves as a plate.
That is, on the shared plate placed on the first plate support, the semiconductor chip adhesion aggregate is converted into a semiconductor chip matrix aggregate. In the second embodiment, the same constituent members as those in the first embodiment are denoted by the same reference numerals, and redundant description is omitted. The outer shapes of the semiconductor chip and the shared plate and the number of semiconductor chips in FIGS. 9 and 10 are schematically shown as in the first embodiment.

[Production Method of Example 2: FIGS. 9 and 10]
FIG. 9 is a plan view for explaining a manufacturing process for forming a semiconductor chip row from a semiconductor chip contact assembly in Example 2 of the present invention. More specifically, FIG. It is the top view on which the semiconductor wafer stealth-diced on the upper side, ie, the semiconductor chip contact | adherence aggregate | assembly 9, was mounted.
FIG. 9B is a plan view in which the first row of semiconductor chips are arrayed on the shared plate 47.
FIG. 9C is a plan view showing a state in which the second row of semiconductor chips are picked up.
FIG. 9D is a plan view in which the second row of semiconductor chips are arrayed on the shared plate 47.
FIG. 9E is a plan view showing a state in which the third row of semiconductor chips are picked up.
FIG. 9F is a plan view in which the semiconductor chip contact assembly 9 is arrayed and converted into a semiconductor chip row on the shared plate 47.

  Unlike the 1st, 2nd, 3rd plate which consists of a porous plate of Example 1, the shared plate 47 is a plate in which the weak adhesion film | membrane is formed in the upper surface. The weak adhesive film is weak in resistance to vacuum suction of the semiconductor chip by the column chuck or the row chuck, and has an adhesive force that can stably hold the position of the mounted semiconductor chip. Therefore, in the manufacturing process of the first embodiment, the column direction and the row direction pressing process for preventing the displacement of the semiconductor chip when the suction of the first plate is released is necessary. And the row direction pressing step is unnecessary, and the semiconductor chip pressing portion 8 is also unnecessary. The semiconductor chip contact assembly 9 has the same configuration as that shown in FIGS. 7 and 8, and the same reference numerals are given, and duplicate descriptions are omitted.

  As shown in FIG. 9A, in the semiconductor chip contact assembly 9, the dicing lines 94a, 94b, 94c, and 94d in the row direction are adjusted in parallel to the X axis of the coordinate axis of the common plate 47, and a weak adhesive film is formed. The fixed position on the shared plate 47 is fixed. Then, the first row of semiconductor chips 91a on the shared plate 47 coincides with the row chuck 71a indicated by the two-dot chain line by the feed in the X-axis direction of the XYθ-axis stage (not shown) of the first plate support 42. Set to position and in standby.

  In the first step of the column direction pickup step, the first row of semiconductor chips 91a is attracted to the column chuck 71a (two-dot chain line) and cleaved and separated by the column direction dicing line 92a. A wedge-shaped gap 56 (see a partially enlarged view of ST04 in FIG. 5) is formed between the first row of semiconductor chips 91a and the second row of semiconductor chips 91b.

  Next, in the second step of the column direction pick-up chuck moving step, the first row of semiconductor chips 91a adsorbed by the column chuck 71a (two-dot chain line) moves obliquely upward from the column direction dicing line 92a, so that The combined semiconductor chips 91b in the second row and the tips of the wedge-shaped gaps are separated without interference. The row chuck 71a retreats to the workpiece standby position while adsorbing the first row of semiconductor chips 91a.

  Next, as shown in FIG. 9B, in the third step of the column direction mounting step, the common plate 47 is fed by feeding in the X axis direction of the XYθ axis stage (not shown) of the first plate support 42. , The column chuck 71a is made to coincide with the predetermined mounting position, and the semiconductor chip 91a (semiconductor chip Nos. 1, 2, 3, 4, 5) in the first column is moved to the common plate 47. Placed on top. After placement, in order to securely fix the first row of semiconductor chips 91a to the weak adhesive film of the shared plate 47, it is desirable that the row chuck 71a be slightly pressed.

  Next, as shown in FIG. 9C, in the first step of the column direction pickup step, the shared plate 47 is sent in the X axis direction by the XYθ axis stage of the first plate support 42, and the second column. The column chuck 71a is set so as to be positioned right above the semiconductor chip 91b.

  Next, the second row of semiconductor chips 91b (semiconductor chips No. 6, 7, 8, 9, 10) are attracted to the row chuck 71a and cleaved and separated by the row direction dicing line 92b. A wedge-shaped gap is formed between the second row of semiconductor chips 91b and the third row of semiconductor chips 91c.

  Next, in the second step of the column direction pickup chuck moving step, the second row of semiconductor chips 91b adsorbed by the column chuck 71a (two-dot chain line) are located adjacent to each other by moving obliquely upward from the column direction dicing line 92b. Further, the third row of semiconductor chips 91c and the tips of the wedge-shaped gaps are separated without interference. The row chuck 71a retreats to the workpiece standby position while adsorbing the second row of semiconductor chips 91b.

  Next, as shown in FIG. 9 (d), in the third step of the column direction placement step, the common plate 47 is fed by feeding the XYθ axis stage (not shown) of the first plate support 42 in the X axis direction. , The column chuck 71a is made to coincide with a predetermined placement position of the second row, and the second row semiconductor chip 91b (semiconductor chips No. 6, 7, 8, 9, 10) is shared. It is placed on the plate 47.

  Next, as shown in FIG. 9 (e), in the first step of the column direction pickup step, the shared plate 47 is sent in the X axis direction by the XYθ axis stage of the first plate support 42, and the third column. The column chuck 71a is set so as to be positioned directly above the semiconductor chip 91c.

  Next, the third row of semiconductor chips 91c (semiconductor chips No. 11, 12, 13, 14, 15) are attracted to the row chuck 71a and cleaved and separated by the row direction dicing line 92c. A wedge-shaped gap is formed between the third row of semiconductor chips 91c and the fourth row of semiconductor chips 91d.

  Hereinafter, similarly, the manufacturing steps from the first step to the third step are repeated, and as shown in FIG. 9F, from the semiconductor chip adhesion assembly 9 (shown in FIG. 9A) on the same shared plate 47. The semiconductor chip columns 91a, 91b, 91c, 91d are rearranged at regular intervals in the row direction, and the first half of the manufacturing process is completed.

  The first half of the manufacturing process of picking up one row of semiconductor chips on the shared plate 47 and changing the arrangement of the semiconductor chips to the semiconductor chip rows at a fixed interval has been described. With respect to the latter half of the manufacturing process to be aligned, it is possible to align in the same manufacturing process. That is, the next row direction pickup step is a fourth step corresponding to the column direction pickup step (first step), and the next row direction pickup chuck moving step is equivalent to the column direction pickup chuck moving step (second step). This is the fifth step, and the next row direction placement step is a sixth step corresponding to the column direction placement step (third step). Detailed description will be omitted because it overlaps.

  FIG. 10 is a manufacturing process subsequent to FIG. 9, and in FIG. 9F, the common plate 47 in which the semiconductor chip columns are arranged at a constant interval in the row direction is rotated by 90 ° coordinates to correspond to one row. It is a top view for demonstrating the manufacturing process which mounts and rearranges a semiconductor chip at a fixed space | interval, and forms a semiconductor chip matrix-like aggregate | assembly.

FIG. 10A is a plan view obtained by rotating the shared plate 47 of FIG. 9F by 90 ° coordinates and is an initial state diagram of the latter half of the manufacturing process.
FIG. 10B is a plan view in which the semiconductor chips in the first row are converted on the shared plate 47.
FIG. 10C is a plan view showing a state where the semiconductor chip in the second row is picked up.
FIG. 10D is a plan view in which the semiconductor chips in the second row are converted on the shared plate 47.
FIG. 10E is a plan view showing a state where the semiconductor chip in the third row is picked up.
FIG. 10F is a plan view in which all semiconductor chip rows are rearranged on the shared plate 47 to form a semiconductor chip matrix aggregate.

  As shown in FIG. 10A, in the fourth step of the row direction pickup step, the first row of semiconductor chips 93a (semiconductor chips No. 5, 10) on the shared plate 47, as in the first step of the column direction pickup step. , 15, 20) are attracted to the row chuck 71b indicated by a two-dot chain line, and are cleaved and separated by the row direction dicing line 94a. A wedge-shaped gap is formed between the semiconductor chip 93a in the first row and the semiconductor chip 93b in the second row.

  Next, in the fifth step of the row direction pickup chuck moving step, as in the second step of the column direction pickup chuck moving step, the semiconductor chip 93a in the first row is moved obliquely upward from the column direction dicing line 94a. The adjacent semiconductor chips 93b in the second row are separated from the tips of the wedge-shaped gaps without interference. The row chuck 71b retreats to the workpiece standby position while adsorbing the semiconductor chip 93a in the first row.

  Next, as shown in FIG. 10B, in the sixth step of the row direction placement step, the XYθ-axis stage (not shown) of the first plate support 42 is shown, as in the third step of the column direction placement step. 1), the common plate 47 is moved to lower the row chuck 71b to a predetermined mounting position, and the semiconductor chip 93a in the first row is determined on the common plate 47. Placed in position.

  Next, as shown in FIG. 10C, returning to the fourth step, the shared plate 47 is sent in the X-axis direction by the XYθ-axis stage of the first plate support 42, and the second row of semiconductor chips 93b ( It is set so that the row chuck 71b is located directly above the semiconductor chips No. 4, 9, 14, 19).

  The semiconductor chip 93b in the second row is attracted to the row chuck 71b and cleaved and separated by the row direction dicing line 94b. A wedge-shaped gap is formed between the semiconductor chip 93b in the second row and the semiconductor chip 93c in the third row.

  Next, in a fifth step, the second row of semiconductor chips 93b adsorbed by the row chuck 71b is moved away from the row direction dicing line 94b by 45 ° obliquely, so that the adjacent third row of semiconductor chips 93c and the wedge-shaped semiconductor chip 93b are wedge-shaped. The tip of the gap is separated without interference. Then, the row chuck 71b retreats to the workpiece standby position while adsorbing the semiconductor chip 93b in the second row.

  Next, as shown in FIG. 10D, in the sixth step of the row direction mounting step, the common plate 47 is fed by feeding in the X axis direction of the XYθ axis stage (not shown) of the first plate support 42. , The row chuck 71b is brought to coincide with a predetermined placement position of the second row, and the semiconductor chip 93b of the second row is placed at a predetermined position on the shared plate 47. .

  Next, as shown in FIG. 10E, returning to the fourth step, the shared plate 47 is sent in the X-axis direction by the XYθ-axis stage of the first plate support 42, and the third row of semiconductor chips 93c ( It is set so that the row chuck 71b is located immediately above the semiconductor chip No. 2, 7, 12, 17).

  Hereinafter, similarly, the manufacturing steps from the fourth step to the sixth step are repeated, and as shown in FIG. 10F, the semiconductor chips for one row are aligned and fixed on the common plate 47 at a constant interval, and 1 The semiconductor chips 93 a, 93 b, 93 c, 93 d, 93 e for the rows are mounted and fixed at predetermined positions on the common plate 47 to form a semiconductor chip matrix aggregate.

  As described above, according to the manufacturing method of the present invention, a plurality of semiconductor chips for one column and one row are picked up at a time, and a source plate and a destination plate on which the semiconductor chips are placed are placed. Since it is possible to form a matrix-like assembly even on the same plate, the amount of movement of the plate is small, man-hours can be reduced, and semiconductor chips are moved on the same plate. The position accuracy of the semiconductor chip can be improved. Therefore, even in the assembly mounting on the circuit board, it is possible to provide assembly mounting with good alignment accuracy and extremely few defects.

  The preferred embodiments of the present invention have been described above. However, the present invention is not limited to the above-described embodiments, and it is not necessary to perform all of them. The scope of the contents described in each claim of the claims. It goes without saying that various changes and omissions can be made.

1: Semiconductor manufacturing apparatus 2: Base plate unit 3: Camera unit 4: Plate slide unit 5: Pickup unit 6: Pickup slide unit 7: Pickup chuck unit 7a: Column pickup chuck unit 7b: Row pickup chuck unit 8: Semiconductor chip pressing unit 9: Semiconductor chip adhesion assembly 21: Base plate 22: Slide guide 23: Right stopper 24: Left stopper 33: Camera 41: Slide base 42: First plate support 43: First plate 44: Second plate support 45: Second plate 46: Third plate 47: Shared plate 48: Clamp 49: Stopper stay 53: Pickup base plate 54: Slope 55: Suction hole 56: Wedge-shaped gap 61: Z-axis slide guide 65: Z-axis micrometer 66: Row -Row switching slide guide 71a: Row Jack 71b: Line Chuck 76: pickup Micrometer 81: chip presser

Claims (5)

In a semiconductor manufacturing apparatus for cleaving and separating a semiconductor wafer on which a plurality of semiconductor chips are formed by dicing and aligning the semiconductor chips, a first plate on which the semiconductor wafer is placed and an end of the semiconductor wafer on the first plate A pick-up chuck for cleaving and separating the semiconductor chip from the part, and vacuum suction;
A second plate for aligning and mounting the semiconductor chip vacuum-adsorbed on the pickup chuck;
A pickup chuck moving means for moving the pickup chuck to the second plate;
The suction surface of the pick-up chuck forms an inclined surface, and the inclined surface has a narrow gap with the semiconductor chip on the side close to the dicing line to be cleaved and separated, and the gap opens with increasing distance from the dicing line. Semiconductor manufacturing equipment.   2. The pick-up chuck moving means is a moving means for lifting the pick-up chuck after the semiconductor chip is vacuum-sucked in a diagonally upward direction away from a dicing line to be cleaved and separated. Semiconductor manufacturing equipment.   3. The semiconductor manufacturing apparatus according to claim 1, wherein the number of semiconductor chips that are picked up simultaneously by vacuum pick-up by the pickup chuck is one row composed of a plurality.   4. The semiconductor manufacturing apparatus according to claim 1, wherein the semiconductor wafer is cut by stealth dicing to form a plurality of the semiconductor chips. 5. The semiconductor manufacturing apparatus according to claim 1, wherein the first and second plates are porous plates and can vacuum-suck semiconductor chips.

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