JP2005056901A - Apparatus and process for manufacturing semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an apparatus and process for manufacturing a semiconductor device in which residual balls in transfer mounting can be removed surely and efficiency. <P>SOLUTION: The apparatus for manufacturing a semiconductor device comprises a section 5 for supplying conductive balls 4, a mounting head 3 having a holding surface for suction holding the conductive balls 4 at a plurality of suction holes, a mounting section 7 for supporting an article 23 mounting the conductive balls 4, and a mechanism 1 for moving the mounting head 3 relatively between the supplying section 5 and the mounting section 7. The manufacturing apparatus mounts the conductive balls 4 held by the mounting head 3 at the supplying section 5 on the mounting article 23 at the mounting section 7. A means 6 for removing unnecessary conductive balls 4 or contaminations being left on the mounting head 3 after the conductive balls 4 are mounted on the mounting article 23 is provided in the relative movement passage of the mounting head 3 between the supplying section 5 and the mounting section 7. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a semiconductor device manufacturing apparatus and manufacturing method, and more particularly, to a semiconductor device manufacturing apparatus and a semiconductor suitable for forming bumps on electrode terminals of a semiconductor device wafer or the like using conductive balls such as solder balls. The present invention relates to a device manufacturing method.
[0002]
[Prior art]
In recent years, a bump forming technique using a fine metal ball made of a conductive ball such as a solder ball (hereinafter referred to as a solder ball) is used for electrical connection of a semiconductor device chip. In this case, generally, an under bump metal (UBM) is first formed on the electrode at the bump forming position of the semiconductor device wafer to ensure the reliability of the electrical connection, and the flux is further applied. Apply. On the other hand, after aligning a large number of conductive balls adsorbed and arranged on a ball arrangement plate having holes at positions corresponding to the bump formation positions, the bonding force of the flux applied on each UBM is used as a batch. And transfer it. Thereafter, the solder balls are reflowed and melted, and then cooled and solidified to form bumps. Subsequently, a semiconductor device chip on which bumps are formed is completed through a dicing process of cutting the semiconductor device wafer into individual chips.
[0003]
By the way, when a large number of solder balls adsorbed and arranged on the ball arrangement plate are transferred and mounted, not all the solder balls are transferred and mounted on the semiconductor device wafer. For example, if the solder ball is deformed, it is strongly digged into the hole, fixed by dirt on the hole or the solder ball, and becomes larger than the fixing force due to the contact between the flux and the solder ball. Balls remaining on the plate are generated. In particular, due to the recent demand for higher density of semiconductor mounting, the diameter of solder balls used for bump formation is generally 150 μm or less, so even if light bite or very small amount of dirt is left, it becomes a residual ball. easy. When such residual balls are generated, defects such as surplus balls and missing balls occur in the next adsorption arrangement, which in turn causes bump defects. Therefore, it is necessary to completely remove the residual balls every time.
[0004]
On the other hand, a simple and efficient method for removing residual balls has not been proposed.
[0005]
[Problems to be solved by the invention]
Therefore, as a result of examination by the inventors of the present application, for example, after detecting the position of the residual ball, a method of removing the nozzle that jets or sucks the gas directly close to the residual ball, or by bringing the residual ball into contact with the nozzle or the like I devised a method to remove it. However, in such a method, the position of the remaining ball must first be detected. In recent semiconductor device wafers, 400,000 or more bumps are often formed on a single wafer, so the number of remaining ball detection target positions is inevitably increased to 400,000 locations, and a large amount of time is required only for position detection. Cost. Further, the method of removing gas by jetting from the nozzle or the method of removing gas by sucking the gas has a problem that a sufficient force is not applied as the solder ball diameter becomes smaller and cannot be removed. On the other hand, in the method in which the nozzle or the like is brought into direct contact with the ball, if there is a residual ball close to the ball, it may unnecessarily come into contact with the residual ball that is not the object of removal, which may cause biting that cannot be removed.
[0006]
The present invention has been made in view of the above circumstances, and an object of the present invention is to provide a semiconductor device manufacturing apparatus and a semiconductor device manufacturing method capable of reliably and efficiently removing residual balls generated during transfer mounting.
[0007]
[Means for Solving the Problems]
The gist of the present invention is as follows.
(1) A conductive ball supply unit, a mounting head having a holding surface that holds the conductive ball by suction in a plurality of suction holes, a mounting unit that supports an object on which the conductive ball is mounted, and the supply And a moving mechanism for relatively moving the mounting head between the mounting portion and the mounting portion, and a conductive ball for mounting the conductive ball held in the supply portion by the mounting head on the mounted object of the mounting portion In the manufacturing apparatus of a semiconductor device for mounting, an adhesion removing means for removing unnecessary conductive balls or foreign matters left on the mounting head after mounting the conductive balls on the mounted object includes the supply unit and the mounting An apparatus for manufacturing a semiconductor device, which is provided in a relative movement path of the mounting head between parts.
[0008]
(2) The apparatus for manufacturing a semiconductor device according to (1), wherein the sticking removal means is means for removing unnecessary conductive balls or foreign matters by sticking to a film.
[0009]
(3) The semiconductor device manufacturing apparatus according to (2), wherein the film is a film including a base material and an adhesive layer.
[0010]
(4) The apparatus for manufacturing a semiconductor device according to (2), wherein the film is a film composed of a thermoplastic resin or a base material and a layer that is softened by heating and generates adhesiveness.
[0011]
(5) The apparatus for manufacturing a semiconductor device according to (2), wherein the film is a film made of cloth or cloth impregnated with a solvent.
[0012]
(6) The sticking and removing means includes a mechanism for supplying the film, a mechanism for bringing the film into contact with a holding surface on which a conductive ball is adsorbed and held, and a mechanism for winding the film. The semiconductor device manufacturing apparatus according to any one of (2) to (5).
[0013]
(7) The adhering removal means includes a mechanism for supplying the film, a mechanism for bringing the conductive ball into contact with the holding surface while heating the film, and a film on the holding surface until the film is cooled. The apparatus for manufacturing a semiconductor device according to any one of (2) to (5), further comprising: a mechanism for contacting and a mechanism for winding the film.
[0014]
(8) In a semiconductor device manufacturing method in which a conductive ball is mounted on an electrode portion of an object to be mounted such as a semiconductor device or a substrate to form a bump, the ball of the ball array plate provided corresponding to the electrode position A method of manufacturing a semiconductor device, comprising: a step of fixing and removing unnecessary balls or foreign matters remaining on an array plate after the balls are arrayed in the array holding holes and transferred and bonded to the electrode portion of the mounted object.
[0015]
(9) The method of manufacturing a semiconductor device according to (8), wherein the step of fixing and removing is a step of removing unnecessary balls or foreign matters remaining on the array plate by fixing them to a film.
[0016]
(10) The method for manufacturing a semiconductor device according to (9), wherein the film is a film including a base material and an adhesive layer.
[0017]
(11) The method for manufacturing a semiconductor device according to (9), wherein the film is a film composed of a thermoplastic resin or a base material and a layer that is softened by heating and generates adhesiveness.
[0018]
(12) The method for manufacturing a semiconductor device according to (9), wherein the film is a film or a film made of a cloth impregnated with a solvent.
[0019]
(13) The step of removing and fixing includes a step of supplying the film, and a step of bringing the film into contact with a holding surface on which a conductive ball is adsorbed and held, and winding the film ( 8) A method for manufacturing a semiconductor device according to any one of (12).
[0020]
(14) The step of removing the sticking includes the step of supplying the film, the step of contacting the ball array plate while heating the film, the step of bringing the film into contact with a holding surface until the film is cooled, The method for manufacturing a semiconductor device according to any one of (8) to (12), further comprising a step of winding the film.
[0021]
According to the semiconductor device manufacturing apparatus and semiconductor device manufacturing method of the present invention, it is possible to reliably and efficiently remove residual solder balls and the like generated at the time of transfer mounting, thereby enabling highly efficient and inexpensive bump formation. become.
[0022]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a semiconductor device manufacturing apparatus and method according to embodiments of the present invention will be described in detail with reference to the drawings.
[0023]
(First embodiment)
First, a first embodiment of the present invention will be described. FIG. 1 is a schematic diagram showing an overview of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention.
[0024]
In the first embodiment, as shown in FIG. 1, an X-axis moving device (moving mechanism) 1 that moves the mounting head 3 in a specific direction, for example, a horizontal direction (X-axis direction), and the mounting head 3 as X A Z-axis moving device 2 that moves in a direction perpendicular to the axial direction, for example, a vertical direction (Z-axis direction) is provided. In the mounting head 3, the ball array plate 24 is adsorbed on its adsorption holding surface (not shown). Below the X-axis moving device 1, a ball supply device (supply unit) 5 that supplies solder balls (conductive balls) 4 to the mounting head 3, and a Y-θ table (on which a wafer 23 is placed) (Mounting portion) 7 is disposed, and a remaining ball removing device (adhering removing means) 6 is disposed between the ball supply device 5 and the Y-θ table 7.
[0025]
In the residual ball removing device 6, a film 27 made of a polyimide base material and an adhesive layer made of an epoxy adhesive is stretched from the film supply unit 8 through the film contact mechanism 10 to the film winding unit 9. . The width of the film 27 is, for example, about 200 mm.
[0026]
Next, a method for manufacturing a semiconductor device using the manufacturing apparatus according to the first embodiment configured as described above will be described.
[0027]
First, the solder balls 4 are supplied to the mounting head 3 by the ball supply device 5, and the solder balls 4 are attracted to the suction holding surface (not shown) via the ball array plate 24 by the mounting head 3. Next, the mounting head 3 is moved onto the Y-θ table 7 by using the X-axis moving device 1 to align the solder balls 4 in the X direction. Note that a plurality of holes having a diameter of, for example, about 70 μm are formed in the ball array plate 24. As the solder balls 4, for example, those having a diameter of about 100 μm and made of 63Sn-37Pb eutectic are used.
[0028]
Next, the Y-θ table 7 on which the wafer 23 is placed is translated in the Y direction (direction perpendicular to the X direction and the Z direction), and the Y-θ table 7 is further rotated to move the solder balls 4. Align to the bump forming position of the wafer 23. Then, the solder ball 4 is transferred and mounted on the wafer 23 using the Z-axis moving device 2. For example, a wafer 23 having a diameter of 8 inches (about 200 mm) provided with 385,000 bump forming positions is used. Further, it is preferable to apply a flux to the wafer 23 in advance.
[0029]
Thereafter, the mounting head 3 is moved onto the ball supply device 5 using the X-axis moving device 1. If the solder ball 4 remains on the suction holding surface after the solder ball 4 is mounted, the mounting head 3 When passing over the residual ball removing device 6, as shown in FIG. 3, the remaining solder balls 4 (hereinafter referred to as residual solder balls 22) are brought into contact with the film 27 of the residual ball removing device 6. Further, regarding the residual ball removing device 6, the film winding unit 9 starts to wind the film 27 before the mounting head 3 passes over the residual ball removing device 6.
[0030]
By performing such an operation, the residual solder balls 22 are removed from the mounting head 3 by the residual ball removing device 6 as shown in FIG.
[0031]
Then, after the mounting head 3 is moved onto the ball supply device 5, the ball suction for mounting the next ball is performed, and these operations are repeated a predetermined number of times.
[0032]
Actually, when the present inventor has mounted the solder balls 4 ten times and detected the residual solder balls 22, the residual solder balls 22 occurred on average at 16 locations immediately after mounting. Here, the flux-coated wafer 23 in which 385,000 bump forming positions are set was used, and the solder ball 4 made of 63Sn-37Pb eutectic having a diameter of 100 μm was used. The diameter of the holes formed in the ball array plate 24 was 70 μm.
[0033]
However, after the mounting, the position of the film contact mechanism 10 is adjusted and the mounting head 3 is moved while the residual solder balls 22 are in contact with the film 27. As a result, the residual solder balls 22 are completely removed from the mounting head 3. There was no residual solder ball 22 when shifting to the ball adsorption for mounting the ball.
[0034]
Further, when 10 wafers on which the solder balls 4 were mounted were reflowed at a maximum temperature of 230 ° C. and then washed and inspected, no defects were found in the bumps.
[0035]
As the film 27, a film having a width of 200 mm, a base having a thickness of 50 μm, and an adhesive layer having a thickness of 10 μm is used. It was adjusted to be equal to the moving speed of 3. The distance between the film 27 and the ball array plate 24 was set to 70 μm.
[0036]
(Second Embodiment)
Next, a second embodiment of the present invention will be described. FIG. 5 is a schematic view showing a residual ball removing device 6 according to the second embodiment of the present invention.
[0037]
In the second embodiment, as shown in FIG. 5, a film 28 composed of a polyimide base material and a resin layer made of an epoxy thermoplastic resin and softened by heating to cause adhesion is obtained from the film supply unit 8. It is stretched up to the film take-up section 9 through the film contact mechanism 11 with heating function and the film contact mechanism 10. The width of the film 28 is, for example, about 200 mm. Since other configurations are the same as those of the first embodiment, details thereof are omitted.
[0038]
Next, a semiconductor device manufacturing method using the manufacturing apparatus according to the second embodiment configured as described above will be described.
[0039]
First, the solder balls 4 are supplied to the mounting head 3 by the ball supply device 5, and the solder balls 4 are attracted to the suction holding surface (not shown) via the ball array plate 24 by the mounting head 3. Next, the mounting head 3 is moved onto the Y-θ table 7 by using the X-axis moving device 1 to align the solder balls 4 in the X direction. Note that a plurality of holes having a diameter of, for example, about 70 μm are formed in the ball array plate 24. As the solder balls 4, for example, those having a diameter of about 100 μm and made of 63Sn-37Pb eutectic are used.
[0040]
Next, the Y-θ table 7 on which the wafer 23 is placed is translated in the Y direction (direction perpendicular to the X direction and the Z direction), and the Y-θ table 7 is further rotated to move the solder balls 4. Align to the bump forming position of the wafer 23. Then, the solder ball 4 is transferred and mounted on the wafer 23 using the Z-axis moving device 2. For example, a wafer 23 having a diameter of 8 inches (about 200 mm) provided with 385,000 bump forming positions is used. Further, it is preferable to apply a flux to the wafer 23 in advance.
[0041]
Thereafter, the mounting head 3 is moved onto the ball supply device 5 using the X-axis moving device 1, but when the mounting head 3 passes over the residual ball removing device 6, as shown in FIG. The residual solder ball 22 is brought into contact with the film 28 of the apparatus 6. Further, regarding the residual ball removing device 6, before the mounting head 3 passes over the residual ball removing device 6, the film winding unit 9 starts winding the film 28 and the film contact mechanism with a heating function. 11 is heated to a temperature at which the resin layer of the film 28 causes stickiness, for example, about 80 ° C.
[0042]
By performing such an operation, as shown in FIG. 7, not only the residual solder balls 22 but also foreign matters adhering to the mounting head 3 are removed from the mounting head 3 by the residual ball removing device 6.
[0043]
Then, after the mounting head 3 is moved onto the ball supply device 5, the ball suction for mounting the next ball is performed, and these operations are repeated a predetermined number of times.
[0044]
Actually, when the present inventor has mounted the solder balls 4 ten times and detected the residual solder balls 22 and the like, the residual solder balls 22 are generated at an average of 20 locations immediately after mounting, and at three locations. Foreign matter was attached. Here, the flux-coated wafer 23 in which 385,000 bump forming positions are set was used, and the solder ball 4 made of 63Sn-37Pb eutectic having a diameter of 100 μm was used. The diameter of the holes formed in the ball array plate 24 was 70 μm.
[0045]
However, after the mounting, the position of the film contact mechanism 10 and the film contact mechanism 11 with a heating function is adjusted and the film contact mechanism 11 with a heating function is heated to move the mounting head 3 while the residual solder balls 22 are in contact with the film 28. As a result, the residual solder balls 22 and the foreign matters were completely removed from the mounting head 3, and there was no residual solder balls 22 and foreign matters when shifting to the ball adsorption for the next ball mounting.
[0046]
Further, when 10 wafers on which the solder balls 4 were mounted were reflowed at a maximum temperature of 230 ° C. and then washed and inspected, no defects were found in the bumps.
[0047]
As the film 28, a film having a width of 200 mm and a thickness of 100 μm provided with a resin layer that is softened by heating to a thickness of 100 μm and generates adhesiveness is used. The peripheral speed of the film 28 was adjusted to be equal to the moving speed of the mounting head 3. Moreover, the temperature of the heating part of the film contact mechanism 11 with a heating function was set to 80 ° C. so that the film 28 and the ball array plate 24 were in direct contact with each other (no gap).
[0048]
Furthermore, when the distance between the film contact mechanism 11 with a heating function and the film contact mechanism 10 was set to 30 mm, the temperature of the film 28 in the film contact mechanism 10 was 23 ° C., which was the same as the ambient temperature.
[0049]
In addition, this invention is not limited only to the above-mentioned embodiment, A various change etc. are possible within the scope of the present invention.
[0050]
For example, in the method of arranging balls by dropping solder balls into an array plate having holes larger than the balls instead of a mechanism for arranging and holding solder balls with a ball array plate mounted on the mounting head, It can also be used to remove residual balls or foreign matter.
[0051]
Further, the film may be a cloth or a cloth impregnated with a solvent, and is not limited to a film as long as it can fix and remove residual solder balls and foreign matters, and the form is not particularly limited.
[0052]
Further, it is not always necessary to bring the film into partial contact with the wafer, and the residual solder balls can be removed by bringing a film having the size of the entire surface of the wafer into contact with one another. In this case, not a continuous film but a sheet of sheets may be used.
[0053]
Furthermore, a residual ball removing device may be provided outside the mounting portion, and after removing the residual solder balls, it may be moved to the supply portion.
[0054]
As the film, in addition to those used in the above embodiment, tapes and films generally sold under names such as dicing tape and backgrinding protective tape can be used.
[0055]
The Y-θ moving mechanism may be provided on the mounting head, or the Z-axis moving mechanism may be provided on the table or the removal device.
[0056]
Furthermore, the conductive ball is not limited to the solder ball, and any other conductive ball may be used. In addition to the wafer, for example, a printed board may be used as the mounted object.
[0057]
【The invention's effect】
As described above in detail, according to the semiconductor device manufacturing apparatus and the semiconductor device manufacturing method according to the present invention, it is possible to efficiently and reliably remove the residual solder balls generated when the balls are mounted. In manufacturing the device, the ball mounting process can be performed efficiently. Therefore, it is possible to improve the yield and to form bumps with excellent quality.
[Brief description of the drawings]
FIG. 1 is a schematic view showing an overall image of a semiconductor device manufacturing apparatus according to a first embodiment of the present invention.
FIG. 2 is a schematic diagram showing a residual ball removing device 6 according to the first embodiment of the present invention.
FIG. 3 is a schematic view showing a method for manufacturing a semiconductor device using the manufacturing apparatus according to the first embodiment of the present invention.
FIG. 4 is a schematic diagram illustrating a method for manufacturing a semiconductor device using the manufacturing apparatus according to the first embodiment of the present invention, following FIG. 3;
FIG. 5 is a schematic view showing a residual ball removing device 6 in a second embodiment of the present invention.
FIG. 6 is a schematic view showing a method for manufacturing a semiconductor device using a manufacturing apparatus according to a second embodiment of the present invention.
FIG. 7 is a schematic view illustrating a method for manufacturing a semiconductor device using the manufacturing apparatus according to the second embodiment of the present invention, following FIG. 6;
[Explanation of symbols]
1: X-axis moving device 2: Z-axis moving device 3: Mounting head 4: Solder ball 5: Ball supply device 6: Residual ball removing device 7: Y-θ table 8: Film supply unit 9: Film winding unit 10: Film contact mechanism 11: Film contact mechanism with heating function 22: Residual solder ball 23: Semiconductor wafer 24: Ball array plate 27, 28: Film

Claims (14)

A conductive ball supply unit;
A mounting head having a holding surface for adsorbing and holding conductive balls in a plurality of suction holes;
A mounting portion for supporting an object on which a conductive ball is mounted;
A moving mechanism for relatively moving a mounting head between the supply unit and the mounting unit;
In a manufacturing apparatus of a semiconductor device for mounting a conductive ball in which the conductive ball held in the supply unit by the mounting head is mounted on an object to be mounted in the mounting unit.
Adhesive removing means for removing unnecessary conductive balls or foreign matters left on the mounting head after mounting the conductive balls on the mounted object is a relative position of the mounting head between the supply unit and the mounting unit. An apparatus for manufacturing a semiconductor device, wherein the apparatus is provided in a moving path. 2. The apparatus for manufacturing a semiconductor device according to claim 1, wherein the fixing removal means is means for fixing unnecessary conductive balls or foreign matters to the film to remove them. The apparatus for manufacturing a semiconductor device according to claim 2, wherein the film is a film including a base material and an adhesive layer. 3. The apparatus for manufacturing a semiconductor device according to claim 2, wherein the film is a film composed of a thermoplastic resin or a base material and a layer that is softened by heating and generates adhesiveness. 3. The semiconductor device manufacturing apparatus according to claim 2, wherein the film is a film made of cloth or cloth impregnated with a solvent. The sticking removal means includes
A mechanism for supplying the film;
A mechanism for bringing the film into contact with a holding surface on which a conductive ball is adsorbed and held;
A mechanism for winding the film;
6. The apparatus for manufacturing a semiconductor device according to claim 2, further comprising: The sticking removal means includes
A mechanism for supplying the film;
A mechanism for contacting the holding surface for adsorbing and holding the conductive balls while heating the film;
A mechanism for contacting the film with the holding surface until the film is cooled;
A mechanism for winding the film;
6. The apparatus for manufacturing a semiconductor device according to claim 2, further comprising: In a method for manufacturing a semiconductor device in which a conductive ball is mounted on an electrode portion of a mounted object such as a semiconductor device or a substrate, and a bump is formed,
After arranging the balls in the ball arrangement holding holes of the ball arrangement plate provided corresponding to the electrode positions and transferring and bonding them to the electrode portion of the mounted object, unnecessary balls or foreign matters remaining on the arrangement plate are fixedly removed. A method for manufacturing a semiconductor device, comprising: a step. 9. The method of manufacturing a semiconductor device according to claim 8, wherein the fixing and removing step is a step of removing unnecessary balls or foreign matters remaining on the array plate by fixing them to the film. The method for manufacturing a semiconductor device according to claim 9, wherein the film is a film including a base material and an adhesive layer. The method for manufacturing a semiconductor device according to claim 9, wherein the film is a film composed of a thermoplastic resin or a base material and a layer that is softened by heating and generates adhesiveness. The method for manufacturing a semiconductor device according to claim 9, wherein the film is a film made of a cloth or a cloth impregnated with a solvent. The step of fixing and removing includes
Supplying the film;
Bringing the film into contact with a holding surface on which conductive balls are adsorbed and held, and winding the film;
The method for manufacturing a semiconductor device according to claim 8, comprising: The step of fixing and removing includes
Supplying the film;
Contacting the ball array plate while heating the film;
Contacting the film with a holding surface until the film is cooled;
Winding the film;
The method for manufacturing a semiconductor device according to claim 8, comprising:

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