JP5408982B2 - 基板の帯電除去装置及び帯電除去方法 - Google Patents

基板の帯電除去装置及び帯電除去方法 Download PDF

Info

Publication number
JP5408982B2
JP5408982B2 JP2008313533A JP2008313533A JP5408982B2 JP 5408982 B2 JP5408982 B2 JP 5408982B2 JP 2008313533 A JP2008313533 A JP 2008313533A JP 2008313533 A JP2008313533 A JP 2008313533A JP 5408982 B2 JP5408982 B2 JP 5408982B2
Authority
JP
Japan
Prior art keywords
substrate
charge
liquid
gas
processed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2008313533A
Other languages
English (en)
Japanese (ja)
Other versions
JP2010140966A5 (https=
JP2010140966A (ja
Inventor
勉 菊池
正泰 安部
治道 廣瀬
幸伸 西部
佳大 安藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shibaura Mechatronics Corp
Original Assignee
Shibaura Mechatronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shibaura Mechatronics Corp filed Critical Shibaura Mechatronics Corp
Priority to JP2008313533A priority Critical patent/JP5408982B2/ja
Publication of JP2010140966A publication Critical patent/JP2010140966A/ja
Publication of JP2010140966A5 publication Critical patent/JP2010140966A5/ja
Application granted granted Critical
Publication of JP5408982B2 publication Critical patent/JP5408982B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Cleaning Or Drying Semiconductors (AREA)
JP2008313533A 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法 Expired - Fee Related JP5408982B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008313533A JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008313533A JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Publications (3)

Publication Number Publication Date
JP2010140966A JP2010140966A (ja) 2010-06-24
JP2010140966A5 JP2010140966A5 (https=) 2012-01-19
JP5408982B2 true JP5408982B2 (ja) 2014-02-05

Family

ID=42350872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008313533A Expired - Fee Related JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Country Status (1)

Country Link
JP (1) JP5408982B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10219670B2 (en) 2014-09-05 2019-03-05 Tennant Company Systems and methods for supplying treatment liquids having nanobubbles
JP6541492B2 (ja) * 2015-07-29 2019-07-10 東京エレクトロン株式会社 液処理方法および液処理装置
JP6924993B2 (ja) * 2017-10-04 2021-08-25 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
KR102090975B1 (ko) * 2018-09-10 2020-03-19 (주)신우에이엔티 나노 버블을 이용한 기판 세정 장치
JP7242228B2 (ja) * 2018-09-26 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP2021069999A (ja) * 2019-10-31 2021-05-06 キヤノン株式会社 ウルトラファインバブル生成方法、ウルトラファインバブル含有液の製造装置および製造方法
JP7399783B2 (ja) * 2020-04-30 2023-12-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、および、学習済モデル
JP7750677B2 (ja) * 2021-06-29 2025-10-07 芝浦メカトロニクス株式会社 洗浄装置
JP7770557B2 (ja) 2022-05-26 2025-11-14 東京エレクトロン株式会社 基板処理装置、および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2007253120A (ja) * 2006-03-24 2007-10-04 Hitachi Plant Technologies Ltd 超音波洗浄方法
JP2007317821A (ja) * 2006-05-25 2007-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5023705B2 (ja) * 2007-01-10 2012-09-12 東京エレクトロン株式会社 半導体装置の製造方法、半導体製造装置及び記憶媒体
JP4776030B2 (ja) * 2007-03-30 2011-09-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

Also Published As

Publication number Publication date
JP2010140966A (ja) 2010-06-24

Similar Documents

Publication Publication Date Title
JP5408982B2 (ja) 基板の帯電除去装置及び帯電除去方法
CN108780746B (zh) 基板清洗装置、基板清洗方法、基板处理装置以及基板干燥装置
JP2012170872A (ja) 基板洗浄装置、基板洗浄方法、表示装置の製造装置及び表示装置の製造方法
US8888925B2 (en) Nozzle, substrate processing apparatus, and substrate processing method
JP4976949B2 (ja) 基板処理装置
US20230256479A1 (en) Substrate processing method and substrate processing device
US20120247506A1 (en) Substrate treatment apparatus and substrate treatment method
JPWO2006038472A1 (ja) 基板処理装置及び基板処理方法
JP2008183532A (ja) 基板処理装置および基板処理方法
TW200919570A (en) Substrate treatment apparatus, substrate treatment method, and storage medium
KR100563843B1 (ko) 기판세정장치 및 기판세정방법
WO2013035731A1 (ja) 基板液処理装置、及び基板液処理装置の制御方法
JP2018129470A (ja) 基板処理装置及び基板処理方法
KR20000057905A (ko) 판형 부품의 세정 장치 및 그 방법
JP4776030B2 (ja) 基板処理装置および基板処理方法
US9640384B2 (en) Substrate cleaning apparatus and substrate cleaning method
JP2006286665A (ja) 電子デバイス洗浄方法及び電子デバイス洗浄装置
JP2009246000A (ja) 基板の処理装置及び処理方法
JP3638511B2 (ja) 基板洗浄装置
US11161136B2 (en) Liquid processing apparatus and liquid processing method
KR100682538B1 (ko) 반도체 웨이퍼 세정설비 및 세정방법
JP5302781B2 (ja) 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを格納した記憶媒体
JP2005252137A (ja) 基板の洗浄方法及び基板洗浄装置
JP4342324B2 (ja) 基板処理方法および基板処理装置
JP2006286947A (ja) 電子デバイス洗浄方法及び電子デバイス洗浄装置

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20111128

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20111128

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20130131

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20130226

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20130412

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20131029

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20131105

R150 Certificate of patent or registration of utility model

Ref document number: 5408982

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees