JP2010140966A5 - - Google Patents

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Publication number
JP2010140966A5
JP2010140966A5 JP2008313533A JP2008313533A JP2010140966A5 JP 2010140966 A5 JP2010140966 A5 JP 2010140966A5 JP 2008313533 A JP2008313533 A JP 2008313533A JP 2008313533 A JP2008313533 A JP 2008313533A JP 2010140966 A5 JP2010140966 A5 JP 2010140966A5
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JP
Japan
Prior art keywords
substrate
gas
processed
supplying
processing liquid
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JP2008313533A
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English (en)
Japanese (ja)
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JP5408982B2 (ja
JP2010140966A (ja
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Priority to JP2008313533A priority Critical patent/JP5408982B2/ja
Priority claimed from JP2008313533A external-priority patent/JP5408982B2/ja
Publication of JP2010140966A publication Critical patent/JP2010140966A/ja
Publication of JP2010140966A5 publication Critical patent/JP2010140966A5/ja
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Publication of JP5408982B2 publication Critical patent/JP5408982B2/ja
Expired - Fee Related legal-status Critical Current
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JP2008313533A 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法 Expired - Fee Related JP5408982B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008313533A JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008313533A JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Publications (3)

Publication Number Publication Date
JP2010140966A JP2010140966A (ja) 2010-06-24
JP2010140966A5 true JP2010140966A5 (https=) 2012-01-19
JP5408982B2 JP5408982B2 (ja) 2014-02-05

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ID=42350872

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2008313533A Expired - Fee Related JP5408982B2 (ja) 2008-12-09 2008-12-09 基板の帯電除去装置及び帯電除去方法

Country Status (1)

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JP (1) JP5408982B2 (https=)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10219670B2 (en) 2014-09-05 2019-03-05 Tennant Company Systems and methods for supplying treatment liquids having nanobubbles
JP6541492B2 (ja) * 2015-07-29 2019-07-10 東京エレクトロン株式会社 液処理方法および液処理装置
JP6924993B2 (ja) * 2017-10-04 2021-08-25 株式会社荏原製作所 基板洗浄装置及び基板洗浄方法
KR102090975B1 (ko) * 2018-09-10 2020-03-19 (주)신우에이엔티 나노 버블을 이용한 기판 세정 장치
JP7242228B2 (ja) * 2018-09-26 2023-03-20 芝浦メカトロニクス株式会社 基板処理装置及び基板処理方法
JP2021069999A (ja) * 2019-10-31 2021-05-06 キヤノン株式会社 ウルトラファインバブル生成方法、ウルトラファインバブル含有液の製造装置および製造方法
JP7399783B2 (ja) * 2020-04-30 2023-12-18 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置、基板処理方法、学習用データの生成方法、学習方法、学習装置、学習済モデルの生成方法、および、学習済モデル
JP7750677B2 (ja) * 2021-06-29 2025-10-07 芝浦メカトロニクス株式会社 洗浄装置
JP7770557B2 (ja) 2022-05-26 2025-11-14 東京エレクトロン株式会社 基板処理装置、および基板処理方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004121962A (ja) * 2002-10-01 2004-04-22 National Institute Of Advanced Industrial & Technology ナノバブルの利用方法及び装置
JP2007253120A (ja) * 2006-03-24 2007-10-04 Hitachi Plant Technologies Ltd 超音波洗浄方法
JP2007317821A (ja) * 2006-05-25 2007-12-06 Dainippon Screen Mfg Co Ltd 基板処理装置および基板処理方法
JP5023705B2 (ja) * 2007-01-10 2012-09-12 東京エレクトロン株式会社 半導体装置の製造方法、半導体製造装置及び記憶媒体
JP4776030B2 (ja) * 2007-03-30 2011-09-21 大日本スクリーン製造株式会社 基板処理装置および基板処理方法

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