JP5398727B2 - 抵抗変化メモリ - Google Patents
抵抗変化メモリ Download PDFInfo
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- JP5398727B2 JP5398727B2 JP2010532722A JP2010532722A JP5398727B2 JP 5398727 B2 JP5398727 B2 JP 5398727B2 JP 2010532722 A JP2010532722 A JP 2010532722A JP 2010532722 A JP2010532722 A JP 2010532722A JP 5398727 B2 JP5398727 B2 JP 5398727B2
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/101—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including resistors or capacitors only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
- H01L27/10—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
- H01L27/102—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components
- H01L27/1021—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration including bipolar components including diodes only
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Semiconductor Memories (AREA)
Description
本発明は、互いに交差する行線と列線との交差部にメモリセルが配置されるいわゆるクロスポイント型抵抗変化メモリを対象とする。このような抵抗変化メモリでは、読み出し/書き込み時に発生する回り込み電流(sneak current)に起因するディスターブやセンス感度の低下などの問題を防止するために、抵抗変化素子に直列に非オーミック素子であるダイオード接続することが一般的に行われる。
(1) 全体図
図1は、本発明の第一実施形態に係わる抵抗変化メモリを示している。
図2は、図1の抵抗変化メモリ内のメモリセルアレイ、第一デコーダ及び第二デコーダの回路例を示している。
図1及び図2のクロスポイント型抵抗変化メモリの動作について説明する。
図4は、メモリセル構造の例を示している。
図6は、メモリセルアレイ構造の例を示している。
図4乃至図6のメモリセル及びメモリセルアレイの製造方法について説明する。
図21は、本発明の適用例としての抵抗変化メモリを示す斜視図である。
本発明によれば、抵抗変化メモリのメモリセルを構成するダイオードの順方向に流れる電流の許容値とキャリア散乱による損失とを同時に改善することができる。
Claims (7)
- 第一方向に延びる複数本の行線と、前記第一方向に交差する第二方向に延びる複数本の列線と、前記複数本の行線と前記複数本の列線との交差部に配置され、それぞれ直列接続された抵抗変化素子とダイオードとから構成される複数のメモリセルと、前記複数本の行線から行線を選択する第一デコーダと、前記複数本の列線から列線を選択する第二デコーダと、書き込み時に、前記第一デコーダにより選択される行線と前記第二デコーダにより選択される列線との間に供給する電圧パルスを生成する電圧パルス生成回路とを具備し、
前記ダイオードは、前記複数本の列線側から前記複数本の行線側に向って、第一導電型の第一半導体領域、第一導電型の不純物の原子密度が前記第一半導体領域のそれよりも低い第一導電型の第二半導体領域、及び、前記第一導電型とは逆の第二導電型の第三半導体領域の積層構造を備え、
前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向の前記第一半導体領域、前記第二半導体領域、及び、前記第三半導体領域の端部は、前記複数本の列線側から前記複数本の行線側に向かう方向に連続し、
前記ダイオードは、前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向の前記第二半導体領域の端部に、第一導電型の不純物の原子密度が前記第二半導体領域のそれよりも高い第一導電型の第四半導体領域を有し、かつ、
前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向における前記複数のメモリセル間は、絶縁層により満たされる
ことを特徴とする抵抗変化メモリ。 - 前記第四半導体領域の第一導電型の不純物の原子密度は、前記第一半導体領域のそれよりも低いことを特徴とする請求項1に記載の抵抗変化メモリ。
- 前記第四半導体領域は、前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向の前記第二半導体領域の端部の前記第一半導体領域側の半分に配置されることを特徴とする請求項1に記載の抵抗変化メモリ。
- 前記第四半導体領域は、前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向の前記第二半導体領域の端部を取り囲むことなく部分的に配置されることを特徴とする請求項1に記載の抵抗変化メモリ。
- 前記第四半導体領域は、前記複数本の行線が延びる方向の二つの端部にそれぞれ配置されることを特徴とする請求項4に記載の抵抗変化メモリ。
- 前記第四半導体領域は、前記複数本の列線が延びる方向の二つの端部にそれぞれ配置されることを特徴とする請求項4に記載の抵抗変化メモリ。
- 前記ダイオードは、前記複数本の列線側から前記複数本の行線側に向かう方向に直交する方向の前記第四半導体領域の幅が100nm以下であることを特徴とする請求項1に記載の抵抗変化メモリ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2008/068184 WO2010041302A1 (ja) | 2008-10-06 | 2008-10-06 | 抵抗変化メモリ |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2010041302A1 JPWO2010041302A1 (ja) | 2012-03-01 |
JP5398727B2 true JP5398727B2 (ja) | 2014-01-29 |
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Application Number | Title | Priority Date | Filing Date |
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JP2010532722A Expired - Fee Related JP5398727B2 (ja) | 2008-10-06 | 2008-10-06 | 抵抗変化メモリ |
Country Status (3)
Country | Link |
---|---|
US (1) | US8335102B2 (ja) |
JP (1) | JP5398727B2 (ja) |
WO (1) | WO2010041302A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20100301449A1 (en) * | 2007-12-31 | 2010-12-02 | Sandisk 3D Llc | Methods and apparatus for forming line and pillar structures for three dimensional memory arrays using a double subtractive process and imprint lithography |
US8466068B2 (en) | 2007-12-31 | 2013-06-18 | Sandisk 3D Llc | Methods and apparatus for forming memory lines and vias in three dimensional memory arrays using dual damascene process and imprint lithography |
JP2010009669A (ja) | 2008-06-26 | 2010-01-14 | Toshiba Corp | 半導体記憶装置 |
JP5454945B2 (ja) * | 2008-09-05 | 2014-03-26 | 株式会社東芝 | 記憶装置 |
JP5044586B2 (ja) | 2009-02-24 | 2012-10-10 | 株式会社東芝 | 半導体記憶装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184782A (ja) * | 2000-12-12 | 2002-06-28 | Sanken Electric Co Ltd | 半導体装置及びその製造方法 |
JP2003152198A (ja) * | 2001-02-23 | 2003-05-23 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2005072379A (ja) * | 2003-08-26 | 2005-03-17 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2006310672A (ja) * | 2005-05-02 | 2006-11-09 | Renesas Technology Corp | 半導体装置の製造方法 |
WO2008105155A1 (ja) * | 2007-02-23 | 2008-09-04 | Panasonic Corporation | 不揮発性メモリ装置、および不揮発性メモリ装置におけるデータ書込方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS572580A (en) * | 1980-06-05 | 1982-01-07 | Mitsubishi Electric Corp | Semiconductor device |
DE10207522B4 (de) | 2001-02-23 | 2018-08-02 | Fuji Electric Co., Ltd. | Halbleiterbauelement und Verfahren zu dessen Herstellung |
US7400522B2 (en) * | 2003-03-18 | 2008-07-15 | Kabushiki Kaisha Toshiba | Resistance change memory device having a variable resistance element formed of a first and second composite compound for storing a cation |
-
2008
- 2008-10-06 JP JP2010532722A patent/JP5398727B2/ja not_active Expired - Fee Related
- 2008-10-06 WO PCT/JP2008/068184 patent/WO2010041302A1/ja active Application Filing
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2011
- 2011-03-25 US US13/071,943 patent/US8335102B2/en active Active
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002184782A (ja) * | 2000-12-12 | 2002-06-28 | Sanken Electric Co Ltd | 半導体装置及びその製造方法 |
JP2003152198A (ja) * | 2001-02-23 | 2003-05-23 | Fuji Electric Co Ltd | 半導体装置およびその製造方法 |
JP2005072379A (ja) * | 2003-08-26 | 2005-03-17 | Renesas Technology Corp | 半導体装置の製造方法 |
JP2006310672A (ja) * | 2005-05-02 | 2006-11-09 | Renesas Technology Corp | 半導体装置の製造方法 |
WO2008105155A1 (ja) * | 2007-02-23 | 2008-09-04 | Panasonic Corporation | 不揮発性メモリ装置、および不揮発性メモリ装置におけるデータ書込方法 |
Also Published As
Publication number | Publication date |
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JPWO2010041302A1 (ja) | 2012-03-01 |
US8335102B2 (en) | 2012-12-18 |
US20110228589A1 (en) | 2011-09-22 |
WO2010041302A1 (ja) | 2010-04-15 |
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