JP5398700B2 - 熱伝導性および電気抵抗性液晶ポリマー組成物 - Google Patents
熱伝導性および電気抵抗性液晶ポリマー組成物 Download PDFInfo
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- JP5398700B2 JP5398700B2 JP2010506287A JP2010506287A JP5398700B2 JP 5398700 B2 JP5398700 B2 JP 5398700B2 JP 2010506287 A JP2010506287 A JP 2010506287A JP 2010506287 A JP2010506287 A JP 2010506287A JP 5398700 B2 JP5398700 B2 JP 5398700B2
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- liquid crystal
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- 239000004014 plasticizer Substances 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 229920003055 poly(ester-imide) Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000001175 rotational moulding Methods 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K19/00—Liquid crystal materials
- C09K19/04—Liquid crystal materials characterised by the chemical structure of the liquid crystal components, e.g. by a specific unit
- C09K19/38—Polymers
- C09K19/3804—Polymers with mesogenic groups in the main chain
- C09K19/3809—Polyesters; Polyester derivatives, e.g. polyamides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/002—Inhomogeneous material in general
- H01B3/004—Inhomogeneous material in general with conductive additives or conductive layers
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US92592607P | 2007-04-24 | 2007-04-24 | |
| US60/925,926 | 2007-04-24 | ||
| PCT/US2008/005418 WO2008134031A2 (en) | 2007-04-24 | 2008-04-24 | Thermally conductive and electrically resistive liquid crystalline polymer composition |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010525145A JP2010525145A (ja) | 2010-07-22 |
| JP2010525145A5 JP2010525145A5 (cg-RX-API-DMAC7.html) | 2011-06-16 |
| JP5398700B2 true JP5398700B2 (ja) | 2014-01-29 |
Family
ID=39885865
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2010506287A Expired - Fee Related JP5398700B2 (ja) | 2007-04-24 | 2008-04-24 | 熱伝導性および電気抵抗性液晶ポリマー組成物 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8029694B2 (cg-RX-API-DMAC7.html) |
| EP (1) | EP2139944A2 (cg-RX-API-DMAC7.html) |
| JP (1) | JP5398700B2 (cg-RX-API-DMAC7.html) |
| CN (2) | CN103756348A (cg-RX-API-DMAC7.html) |
| WO (1) | WO2008134031A2 (cg-RX-API-DMAC7.html) |
Families Citing this family (37)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080153959A1 (en) * | 2006-12-20 | 2008-06-26 | General Electric Company | Thermally Conducting and Electrically Insulating Moldable Compositions and Methods of Manufacture Thereof |
| JP5229462B2 (ja) * | 2008-07-24 | 2013-07-03 | 三菱瓦斯化学株式会社 | 絶縁性高熱伝導率樹脂複合材料 |
| US9090751B2 (en) * | 2009-07-24 | 2015-07-28 | Ticona Llc | Thermally conductive thermoplastic resin compositions and related applications |
| JP5503915B2 (ja) * | 2009-07-30 | 2014-05-28 | 住友化学株式会社 | 液晶ポリエステル組成物およびこれを用いた電子回路基板 |
| KR20110012780A (ko) * | 2009-07-31 | 2011-02-09 | 엘지디스플레이 주식회사 | 액정표시장치 |
| WO2011106252A1 (en) * | 2010-02-25 | 2011-09-01 | Ticona Llc | Thermally conductive and dimensionally stable liquid crystalline polymer composition |
| US8552101B2 (en) | 2011-02-25 | 2013-10-08 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a low thermally conductive filler and uses thereof |
| US8741998B2 (en) | 2011-02-25 | 2014-06-03 | Sabic Innovative Plastics Ip B.V. | Thermally conductive and electrically insulative polymer compositions containing a thermally insulative filler and uses thereof |
| KR101773204B1 (ko) * | 2011-10-31 | 2017-09-01 | 심천 워트 어드밴스드 머티리얼즈 주식회사 | 대전방지 특성을 갖는 전방향족 액정 폴리에스테르 수지 컴파운드 및 물품 |
| KR101570753B1 (ko) * | 2012-06-05 | 2015-11-20 | 다우 코닝 (차이나) 홀딩 코포레이션., 엘티디. | 전력 컨버터에서 사용하기 위한 연성 점착성 겔 |
| KR102246137B1 (ko) | 2012-10-16 | 2021-04-28 | 티코나 엘엘씨 | 대전방지성 액체 결정질 중합체 조성물 |
| WO2014065910A1 (en) * | 2012-10-26 | 2014-05-01 | Laird Technologies, Inc. | Thermally conductive polymer composites containing magnesium silicate and boron nitride |
| US9355753B2 (en) | 2012-12-05 | 2016-05-31 | Ticona Llc | Conductive liquid crystalline polymer composition |
| US9227347B2 (en) | 2013-02-25 | 2016-01-05 | Sabic Global Technologies B.V. | Method of making a heat sink assembly, heat sink assemblies made therefrom, and illumants using the heat sink assembly |
| KR102230002B1 (ko) * | 2013-03-13 | 2021-03-19 | 티코나 엘엘씨 | 컴팩트 카메라 모듈 |
| WO2015095035A1 (en) * | 2013-12-20 | 2015-06-25 | Ticona Llc | Metal detectable liquid crystalline polymer composition |
| JP6349543B2 (ja) * | 2013-12-25 | 2018-07-04 | パナソニックＩｐマネジメント株式会社 | 冷却構造体および冷却構造体の製造方法 |
| CN106164172B (zh) | 2014-04-09 | 2019-07-26 | 提克纳有限责任公司 | 摄像模组 |
| JP2017513977A (ja) | 2014-04-09 | 2017-06-01 | ティコナ・エルエルシー | 静電防止ポリマー組成物 |
| CN104449583A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机储热材料及其制备方法 |
| CN104449582A (zh) * | 2014-11-03 | 2015-03-25 | 镇江新梦溪能源科技有限公司 | 一种新型有机物储热材料及其制备方法 |
| CN104388051A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机定型储热材料及其制备方法 |
| CN104388052A (zh) * | 2014-11-03 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型有机相变储热材料及其制备方法 |
| CN104388054A (zh) * | 2014-11-04 | 2015-03-04 | 镇江新梦溪能源科技有限公司 | 一种新型复合有机储热材料及其制备方法 |
| CN107710335B (zh) * | 2015-05-01 | 2020-06-02 | 金溶进 | 导电聚合物、它们的制造方法、以及它们的应用 |
| CN109104867A (zh) * | 2016-05-10 | 2018-12-28 | 共和理工学院 | 散热器、用于散热器的填料及其方法 |
| CN108192459B (zh) * | 2017-11-23 | 2019-12-31 | 中国科学院深圳先进技术研究院 | 导热复合材料及其制备方法和应用 |
| KR102627886B1 (ko) | 2017-12-05 | 2024-01-19 | 티코나 엘엘씨 | 카메라 모듈에 사용하기 위한 방향족 중합체 조성물 |
| US20200072564A1 (en) * | 2018-08-31 | 2020-03-05 | Sharp Kabushiki Kaisha | Thermal switch, method for manufacturing thermal switch, thermally conductive filler-containing composite material, apparatus containing the composite material, and display device |
| KR20200080017A (ko) * | 2018-12-26 | 2020-07-06 | 삼성전자주식회사 | 전지 케이스, 및 전지 |
| KR20220146567A (ko) | 2020-02-26 | 2022-11-01 | 티코나 엘엘씨 | 전자 디바이스 |
| KR20220147110A (ko) | 2020-02-26 | 2022-11-02 | 티코나 엘엘씨 | 전자 디바이스를 위한 중합체 조성물 |
| EP4111834A4 (en) | 2020-02-26 | 2024-06-05 | Ticona LLC | Circuit structure |
| US11728065B2 (en) | 2020-07-28 | 2023-08-15 | Ticona Llc | Molded interconnect device |
| US12247116B2 (en) | 2021-12-01 | 2025-03-11 | Ticona Llc | Antenna module |
| WO2024016312A1 (en) * | 2022-07-22 | 2024-01-25 | Ticona Llc | In-wheel motor |
| CN116948499A (zh) * | 2023-07-31 | 2023-10-27 | 深圳市信维通信股份有限公司 | 复合导热膜的制备方法及复合导热膜 |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05109313A (ja) * | 1991-10-14 | 1993-04-30 | Toshiba Chem Corp | 導電性樹脂組成物およびその成形品 |
| DK1421595T3 (da) * | 2001-08-31 | 2012-05-29 | Cool Options Inc | Termisk ledende lampereflektor |
| CN1308399C (zh) | 2001-09-27 | 2007-04-04 | 日本科学冶金株式会社 | 高导热性树脂组合物及其制备方法 |
| WO2006132185A1 (ja) * | 2005-06-06 | 2006-12-14 | Nippon Kagaku Yakin Co., Ltd. | 絶縁性熱伝導性樹脂組成物及び成形品並びにその製造方法 |
| JP2008075063A (ja) * | 2006-08-22 | 2008-04-03 | Sumitomo Chemical Co Ltd | 液晶性ポリマー成形体 |
-
2008
- 2008-04-23 US US12/148,906 patent/US8029694B2/en not_active Expired - Fee Related
- 2008-04-24 JP JP2010506287A patent/JP5398700B2/ja not_active Expired - Fee Related
- 2008-04-24 CN CN201310594246.1A patent/CN103756348A/zh active Pending
- 2008-04-24 WO PCT/US2008/005418 patent/WO2008134031A2/en not_active Ceased
- 2008-04-24 CN CN200880013142A patent/CN101663351A/zh active Pending
- 2008-04-24 EP EP08743344A patent/EP2139944A2/en not_active Withdrawn
Also Published As
| Publication number | Publication date |
|---|---|
| US20080265202A1 (en) | 2008-10-30 |
| WO2008134031A2 (en) | 2008-11-06 |
| US8029694B2 (en) | 2011-10-04 |
| JP2010525145A (ja) | 2010-07-22 |
| CN103756348A (zh) | 2014-04-30 |
| WO2008134031A3 (en) | 2009-01-22 |
| CN101663351A (zh) | 2010-03-03 |
| EP2139944A2 (en) | 2010-01-06 |
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