JP5393965B2 - 半導体集積回路装置の不良分析方法及びシステム - Google Patents

半導体集積回路装置の不良分析方法及びシステム Download PDF

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Publication number
JP5393965B2
JP5393965B2 JP2007242656A JP2007242656A JP5393965B2 JP 5393965 B2 JP5393965 B2 JP 5393965B2 JP 2007242656 A JP2007242656 A JP 2007242656A JP 2007242656 A JP2007242656 A JP 2007242656A JP 5393965 B2 JP5393965 B2 JP 5393965B2
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Japan
Prior art keywords
wafer
defect
analog
defective
database
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JP2007242656A
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English (en)
Japanese (ja)
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JP2008091902A (ja
JP2008091902A5 (enExample
Inventor
鍾 弦 李
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Samsung Electronics Co Ltd
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Samsung Electronics Co Ltd
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2894—Aspects of quality control [QC]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/006—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation at wafer scale level, i.e. wafer scale integration [WSI]
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C29/56008—Error analysis, representation of errors
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C2029/0403—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals during or with feedback to manufacture
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/08—Functional testing, e.g. testing during refresh, power-on self testing [POST] or distributed testing
    • G11C29/12—Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
    • G11C29/38—Response verification devices
    • G11C29/40—Response verification devices using compression techniques
    • G11C2029/4002—Comparison of products, i.e. test results of chips or with golden chip
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/04—Detection or location of defective memory elements, e.g. cell constructio details, timing of test signals
    • G11C29/50—Marginal testing, e.g. race, voltage or current testing
    • G11C2029/5002—Characteristic
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11C—STATIC STORES
    • G11C29/00—Checking stores for correct operation ; Subsequent repair; Testing stores during standby or offline operation
    • G11C29/56—External testing equipment for static stores, e.g. automatic test equipment [ATE]; Interfaces therefor
    • G11C2029/5606—Error catch memory

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • For Increasing The Reliability Of Semiconductor Memories (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Static Random-Access Memory (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP2007242656A 2006-09-29 2007-09-19 半導体集積回路装置の不良分析方法及びシステム Expired - Fee Related JP5393965B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2006-0096065 2006-09-29
KR1020060096065A KR100827440B1 (ko) 2006-09-29 2006-09-29 반도체 집적 회로 장치의 불량 분석 방법 및 시스템

Publications (3)

Publication Number Publication Date
JP2008091902A JP2008091902A (ja) 2008-04-17
JP2008091902A5 JP2008091902A5 (enExample) 2010-11-04
JP5393965B2 true JP5393965B2 (ja) 2014-01-22

Family

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JP2007242656A Expired - Fee Related JP5393965B2 (ja) 2006-09-29 2007-09-19 半導体集積回路装置の不良分析方法及びシステム

Country Status (4)

Country Link
US (1) US7733719B2 (enExample)
JP (1) JP5393965B2 (enExample)
KR (1) KR100827440B1 (enExample)
TW (1) TWI445110B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7552762B2 (en) * 2003-08-05 2009-06-30 Stream-Flo Industries Ltd. Method and apparatus to provide electrical connection in a wellhead for a downhole electrical device
KR100809340B1 (ko) * 2007-01-15 2008-03-07 삼성전자주식회사 반도체 집적 회로 장치의 불량 분석 방법 및 시스템
KR101529880B1 (ko) * 2008-10-31 2015-06-19 삼성전자주식회사 에러 추정 방법 및 정정 방법
JP2012018052A (ja) * 2010-07-07 2012-01-26 Toshiba Corp 半導体装置の不良解析システム及び方法
CN102385843A (zh) * 2011-08-11 2012-03-21 上海华碧检测技术有限公司 一种液晶面板显示驱动芯片的电性分析方法
US9277186B2 (en) * 2012-01-18 2016-03-01 Kla-Tencor Corp. Generating a wafer inspection process using bit failures and virtual inspection
TWI588673B (zh) 2016-04-27 2017-06-21 亦思科技股份有限公司 半導體製程錯誤分析方法以及電腦程式產品
TWI606531B (zh) 2017-03-30 2017-11-21 義守大學 適用於三維晶片的缺陷測試方法及系統
KR102589004B1 (ko) 2018-06-18 2023-10-16 삼성전자주식회사 반도체 불량 분석 장치 및 그것의 불량 분석 방법
US11934094B2 (en) * 2021-03-23 2024-03-19 International Business Machines Corporation Mask fingerprint using mask sensitive circuit

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3639636B2 (ja) * 1995-04-25 2005-04-20 株式会社ルネサステクノロジ 半導体ウェハの不良解析装置及び不良解析方法
US6009545A (en) * 1995-04-25 1999-12-28 Mitsubishi Denki Kabushiki Kaisha System for analyzing a failure in a semiconductor wafer by calculating correlation coefficient between collated data of defects per prescribed unit and failures per prescribed unit
JP2734416B2 (ja) * 1995-07-24 1998-03-30 日本電気株式会社 故障モードの特定方法及び装置
EP0853243A3 (en) 1997-01-13 1999-07-28 Schlumberger Technologies, Inc. Method and apparatus for detecting defects in wafers
JP3995768B2 (ja) * 1997-10-02 2007-10-24 株式会社ルネサステクノロジ 不良解析方法及びその装置
US6185707B1 (en) 1998-11-13 2001-02-06 Knights Technology, Inc. IC test software system for mapping logical functional test data of logic integrated circuits to physical representation
US6553521B1 (en) * 2000-02-24 2003-04-22 Infineon Technologies, Richmond L.P. Method for efficient analysis semiconductor failures
JP2002183554A (ja) * 2000-12-14 2002-06-28 Mitsubishi Electric Corp メモリデバイス販売装置、およびメモリデバイス販売方法
US6610550B1 (en) * 2002-04-03 2003-08-26 Advanced Micro Devices Method and apparatus for correlating error model with defect data
JP2003315415A (ja) 2002-04-23 2003-11-06 Mitsubishi Electric Corp 半導体デバイス解析システム
KR20050020012A (ko) * 2003-08-20 2005-03-04 삼성전자주식회사 웨이퍼 검사 장치 및 검사 방법
KR100748552B1 (ko) * 2004-12-07 2007-08-10 삼성전자주식회사 반도체 장치의 불량 분석을 위한 분석 구조체 및 이를이용한 불량 분석 방법

Also Published As

Publication number Publication date
KR100827440B1 (ko) 2008-05-06
KR20080029532A (ko) 2008-04-03
TW200822261A (en) 2008-05-16
TWI445110B (zh) 2014-07-11
JP2008091902A (ja) 2008-04-17
US7733719B2 (en) 2010-06-08
US20080080277A1 (en) 2008-04-03

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