JP5377622B2 - 大型前面開閉一体型ウェハポッド - Google Patents
大型前面開閉一体型ウェハポッド Download PDFInfo
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- JP5377622B2 JP5377622B2 JP2011275915A JP2011275915A JP5377622B2 JP 5377622 B2 JP5377622 B2 JP 5377622B2 JP 2011275915 A JP2011275915 A JP 2011275915A JP 2011275915 A JP2011275915 A JP 2011275915A JP 5377622 B2 JP5377622 B2 JP 5377622B2
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- holes
- foup
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- 230000004308 accommodation Effects 0.000 claims description 3
- 235000012431 wafers Nutrition 0.000 description 48
- 238000000034 method Methods 0.000 description 19
- 238000001746 injection moulding Methods 0.000 description 14
- 230000032258 transport Effects 0.000 description 13
- 239000000463 material Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- 229920006351 engineering plastic Polymers 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 238000010926 purge Methods 0.000 description 2
- 230000003749 cleanliness Effects 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67386—Closed carriers characterised by the construction of the closed carrier
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
- B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
- B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
- B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
- B65D85/38—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure for delicate optical, measuring, calculating or control apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Description
先ず、本発明のウェハ容器の容器本体の図である図2を参照する。図2に示すように、FOUP1は後部14と結合され収容スペースを形成する左側部13、右側部12、上部10、及び底部11から成る容器本体2と、後部14と反対側の開口15と、容器本体2の開口15の大きさに対応した大きさでこの開口15を閉じるドア3とを備える。
代りに、先ず、ウェハ容器が射出成形により形成され、次に別の較正システム、例えばレーザー又は他の高精度旋盤台装置を使用して、容器本体2の右側部12と左側部13の対称位置をマークし、複数の第1貫通孔1211、1231、1311、1331を右側部12の前端121近くと後端123近く、及び左側部13の前端131近くと後端133近くにそれぞれ穴あけする。本発明の1つの実施形態では、13個の第1貫通孔1211、1231、1311、1331が右側部12の前端121近くと後端123近く、及び左側部13の前端131近くと後端133近くにそれぞれ穴あけされる。各側部にあけられた孔の数は破線で示すように正確に同じである(下記に詳細に説明する)。なお、あけられた孔の数は本発明において限定されず、上述のように13個の第1貫通孔があけられた本実施形態は、本発明の技術的特徴を単に具体的に例示する。
第2スタッド603は貫通孔の形態であってもよく、本発明において限定されない。第2スタッド603は第1スタッド105に対応する。上部10のスナップ嵌合溝103に対応するスナップ嵌合片605がOHTパッド60の周りに形成されてもよい。また、丸いほぞ穴部材621がOHTヘッド62の中央に形成され、複数の突出した第3貫通孔623が一方の側に形成され、第3貫通孔623と第2スタッド603と第1スタッド105とは対応して配置されている。OHTヘッド62の丸いほぞ穴部材621はOHTパッド60の貫通孔601を通され、突出部材101と係合する。OHTパッド60のスナップ嵌合片605は上部10のスナップ嵌合溝103にパチンと嵌合する。OHTパッド60上の第2スタッド603と容器本体2の上部10上の第1スタッド105とOHTヘッド62の第3貫通孔623とは整列され、複数の第3ロック留め具54を使用して、第2スタッド603と第3貫通孔623とを容器本体2の上部10上の第1スタッド105にロック固定することでOHTパッド60、OHTヘッド62、及び容器本体2の上部10を結合する。
OHTパッド60上の複数の突出した第2スタッド603とOHTヘッド62の複数の第3貫通孔623が第3ロック留め具54によりロック固定されるので、OHTヘッド62は容器本体2の上部10上の第1スタッド105に、よりしっかりとロック固定されうる。OHTヘッド62の中央の丸いほぞ穴部材621はFOUP1の重心の後ろに位置し、丸いほぞ穴部材621は容器本体2の上部10の突出部材101と係合するので、OHTヘッド62はバランスが保たれ、振動しない。また、本発明のOHTパッド60の材料は高硬度のエンジニアリングプラスチックであってよい。特に、OHTパッド60の材料の硬度は容器本体の材料より高い。
2 容器本体
3 ドア
10 上部
11 底部
12 右側部
13 左側部
14 後部
15 開口
20 位置決め枠
30 支持モジュール
50 第1ロック留め具
52 第2ロック留め具
201 第2貫通孔
301 突出したロック固定穴
303 リブ
1211、1231、1311、1331 第1貫通孔
Claims (1)
- 後部と結合され収容スペースを形成する左側部、右側部、上部、及び底部から成る容器本体と、該後部と反対側の開口と、該容器本体の該開口の大きさに対応した大きさで該開口を閉じるドアとを備えるウェハ容器であって、
複数の第1貫通孔が該容器本体の該左側部及び右側部の前端と後端に形成され、
複数の位置決め枠に該複数の第1貫通孔に対応して配置される複数の第2貫通孔が形成され、該複数の位置決め枠が該左側部の外面と該右側部の外面とにロック固定されるよう該各位置決め枠は該第2貫通孔の幾つかと該第1貫通孔の幾つかを使用し複数の第1ロック留め具により結合され、
複数の支持モジュールがそれぞれ、その一方の側に形成された複数の突出したロック固定穴と、反対側に一定間隔で水平に配列形成された複数のリブとを有し、該各支持モジュールの該複数の突出したロック固定穴は該左側部又は該右側部の該複数の第1貫通孔の残りと、対応する該位置決め枠の該複数の第2貫通孔の残りとを貫通して、該複数の支持モジュールは該左側部の内面と該右側部の内面とに複数の第2ロック留め具により固定されることを特徴とするウェハ容器。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW100133761 | 2011-09-20 | ||
TW100133761A TWI431712B (zh) | 2011-09-20 | 2011-09-20 | 大型前開式晶圓盒 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2013070014A JP2013070014A (ja) | 2013-04-18 |
JP5377622B2 true JP5377622B2 (ja) | 2013-12-25 |
Family
ID=47751466
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011275915A Active JP5377622B2 (ja) | 2011-09-20 | 2011-12-16 | 大型前面開閉一体型ウェハポッド |
Country Status (6)
Country | Link |
---|---|
US (1) | US8794444B2 (ja) |
JP (1) | JP5377622B2 (ja) |
KR (1) | KR20130031175A (ja) |
CN (1) | CN103021913B (ja) |
DE (1) | DE102012107252B4 (ja) |
TW (1) | TWI431712B (ja) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105336650B (zh) * | 2014-08-13 | 2018-05-08 | 北京北方华创微电子装备有限公司 | 片盒定位装置以及半导体加工设备 |
CN108028216B (zh) * | 2015-08-25 | 2022-08-02 | 恩特格里斯公司 | 互锁模块化衬底支撑柱 |
KR200492425Y1 (ko) * | 2016-04-08 | 2020-10-13 | 엔테그리스, 아이엔씨. | 퍼지 성능을 갖는 웨이퍼 운반기 미세 환경 |
KR102477834B1 (ko) | 2017-11-15 | 2022-12-16 | 신에츠 폴리머 가부시키가이샤 | 기판 수납 용기 |
US10504762B2 (en) * | 2018-02-06 | 2019-12-10 | Applied Materials, Inc. | Bridging front opening unified pod (FOUP) |
CN108461433B (zh) * | 2018-04-17 | 2023-09-22 | 无锡市瑞达电子科技有限公司 | 一种集成电路封测用自动识别圆片盒 |
US11551957B2 (en) * | 2019-04-26 | 2023-01-10 | Entegris, Inc. | Purge connectors and modules for a substrate container |
CN112289718A (zh) * | 2019-07-13 | 2021-01-29 | 家登精密工业股份有限公司 | 基板载具及其气体扩散模块 |
US11370114B2 (en) * | 2019-12-09 | 2022-06-28 | Applied Materials, Inc. | Autoteach enclosure system |
US12027397B2 (en) | 2020-03-23 | 2024-07-02 | Applied Materials, Inc | Enclosure system shelf including alignment features |
USD954769S1 (en) * | 2020-06-02 | 2022-06-14 | Applied Materials, Inc. | Enclosure system shelf |
TWI746045B (zh) * | 2020-07-07 | 2021-11-11 | 家登精密工業股份有限公司 | 基板載具鎖扣結構 |
TWI751814B (zh) * | 2020-09-22 | 2022-01-01 | 家登精密工業股份有限公司 | 支撐片狀物的中央支撐裝置及存放片狀物的儲存設備 |
CN113937041A (zh) * | 2021-06-30 | 2022-01-14 | 家登精密工业股份有限公司 | 基板容器系统 |
TWI806710B (zh) * | 2022-07-18 | 2023-06-21 | 保泰精密工業股份有限公司 | 液晶面板傳送盒 |
TWI832599B (zh) * | 2022-07-27 | 2024-02-11 | 家登精密工業股份有限公司 | 上開式載板載具 |
Family Cites Families (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR0135049B1 (ko) * | 1994-05-31 | 1998-04-20 | 양승택 | 반도체 제조장비의 웨이퍼 장착 카세트 |
US6736268B2 (en) * | 1997-07-11 | 2004-05-18 | Entegris, Inc. | Transport module |
US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6145673A (en) * | 1999-03-31 | 2000-11-14 | Applied Materials, Inc. | Wafer transfer cassette |
JP3916342B2 (ja) * | 1999-04-20 | 2007-05-16 | 信越ポリマー株式会社 | 基板収納容器 |
JP4334123B2 (ja) * | 2000-09-27 | 2009-09-30 | 信越ポリマー株式会社 | 精密基板収納容器 |
TW563680U (en) * | 2002-03-12 | 2003-11-21 | Au Optronics Corp | Cartridge and carrier structure for transmitting glass substrate |
US7347329B2 (en) * | 2003-10-24 | 2008-03-25 | Entegris, Inc. | Substrate carrier |
US7201276B2 (en) * | 2003-11-07 | 2007-04-10 | Entegris, Inc. | Front opening substrate container with bottom plate |
US7316325B2 (en) * | 2003-11-07 | 2008-01-08 | Entegris, Inc. | Substrate container |
JP2005256983A (ja) * | 2004-03-12 | 2005-09-22 | Shin Etsu Polymer Co Ltd | 基板収納容器 |
WO2005112107A1 (ja) * | 2004-05-17 | 2005-11-24 | Shin-Etsu Polymer Co., Ltd. | 基板収納容器及びその位置決め方法 |
JP2007123673A (ja) * | 2005-10-31 | 2007-05-17 | Asyst Shinko Inc | 物品収納用容器の防振機構 |
US8365919B2 (en) * | 2005-12-29 | 2013-02-05 | Shin-Etsu Polymer Co., Ltd. | Substrate storage container |
JP4842879B2 (ja) * | 2007-04-16 | 2011-12-21 | 信越ポリマー株式会社 | 基板収納容器及びそのハンドル |
TWI371076B (en) * | 2008-08-27 | 2012-08-21 | Gudeng Prec Industral Co Ltd | A wafer container with at least one supporting module having a long slot |
US8413814B2 (en) * | 2008-08-27 | 2013-04-09 | Gudeng Precision Industrial Co, Ltd | Front opening unified pod disposed with purgeable supporting module |
TWI363030B (en) * | 2009-07-10 | 2012-05-01 | Gudeng Prec Industral Co Ltd | Wafer container with top flange structure |
JP2011086775A (ja) * | 2009-10-15 | 2011-04-28 | Shin Etsu Polymer Co Ltd | 基板収納容器及び蓋体 |
JP5268858B2 (ja) * | 2009-10-23 | 2013-08-21 | 信越ポリマー株式会社 | 基板収納容器 |
-
2011
- 2011-09-20 TW TW100133761A patent/TWI431712B/zh active
- 2011-09-30 CN CN201110305366.6A patent/CN103021913B/zh active Active
- 2011-12-01 KR KR1020110127945A patent/KR20130031175A/ko not_active Application Discontinuation
- 2011-12-02 US US13/309,727 patent/US8794444B2/en active Active
- 2011-12-16 JP JP2011275915A patent/JP5377622B2/ja active Active
-
2012
- 2012-08-07 DE DE102012107252.3A patent/DE102012107252B4/de active Active
Also Published As
Publication number | Publication date |
---|---|
US8794444B2 (en) | 2014-08-05 |
TWI431712B (zh) | 2014-03-21 |
CN103021913A (zh) | 2013-04-03 |
CN103021913B (zh) | 2015-06-17 |
DE102012107252B4 (de) | 2021-02-04 |
US20130068656A1 (en) | 2013-03-21 |
DE102012107252A1 (de) | 2013-03-21 |
JP2013070014A (ja) | 2013-04-18 |
TW201314823A (zh) | 2013-04-01 |
KR20130031175A (ko) | 2013-03-28 |
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