CN112289718A - 基板载具及其气体扩散模块 - Google Patents

基板载具及其气体扩散模块 Download PDF

Info

Publication number
CN112289718A
CN112289718A CN201910741543.1A CN201910741543A CN112289718A CN 112289718 A CN112289718 A CN 112289718A CN 201910741543 A CN201910741543 A CN 201910741543A CN 112289718 A CN112289718 A CN 112289718A
Authority
CN
China
Prior art keywords
gas
outer cover
air inlet
layer
gas diffusion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201910741543.1A
Other languages
English (en)
Inventor
邱铭乾
林志铭
李柏廷
褚育辰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Gudeng Precision Industrial Co Ltd
Original Assignee
Gudeng Precision Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Gudeng Precision Industrial Co Ltd filed Critical Gudeng Precision Industrial Co Ltd
Publication of CN112289718A publication Critical patent/CN112289718A/zh
Pending legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H01L21/67393—Closed carriers characterised by atmosphere control characterised by the presence of atmosphere modifying elements inside or attached to the closed carrierl
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65D—CONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D85/00—Containers, packaging elements or packages, specially adapted for particular articles or materials
    • B65D85/30—Containers, packaging elements or packages, specially adapted for particular articles or materials for articles particularly sensitive to damage by shock or pressure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67373—Closed carriers characterised by locking systems
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67376—Closed carriers characterised by sealing arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67379—Closed carriers characterised by coupling elements, kinematic members, handles or elements to be externally gripped
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67386—Closed carriers characterised by the construction of the closed carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67772—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving removal of lid, door, cover

Abstract

本发明提供了一种基板载具及其气体扩散模块。其中所述气体扩散模块包括一外盖、至少一进气部、一气密层、一气匀层以及一承载部。所述至少一进气部与所述外盖连接，所述气密层与所述外盖及所述至少一进气部连接，所述气匀层透过所述气密层与所述外盖密合，而所述承载部同时与所述外盖、所述至少一进气部及所述气匀层密合。其中所述承载部设于作为一半导体容器的基板载具上。

Description

基板载具及其气体扩散模块
技术领域
本发明涉及用于半导体容器相关洁净技术的技术领域。尤指一种透过气室 制造容器内均匀流动气体的方式来达到洁净效果的基板载具及其气体扩散模 块。
背景技术
在半导体技术领域中，基板(Substrate)和光罩(Reticle)都是制程上 不可或缺的一块。有鉴于半导体结构实质上属于极度精密的构造，因此在其制 程上对于洁净程度的要求自有极高的限制。
其中，基板(Substrate)更是制作所有半导体组件时不可或缺的基础材 料。其包括常见的硅基板(如晶圆)、玻璃基板、陶瓷基板甚至是蓝宝石基板 等。而在一般半导体组件制程上，由于半导体制程最后所制作出来的微结构基 本上都是微米甚至是纳米等级的结构。因此，制程强调在极精密的环境下操作， 不得有任何微小粒子的附着，否则会造成最后半导体组件成品的良率下降。
用于运载半导体制程所需组件的载具皆被要求要有严格的气密性，以防止 微小粒子于承载或储存时附着于所述些组件上，进而影响半导体成品的良率。 然而，纯粹气密的手段仅属于被动的防止微小粒子进入，但无法主动排除早先 已经附着于如基板或光罩等基础材料上的微小粒子。因此，在乘载所述类材料 的半导体容器多半会配合洁净系统的使用，来主动去除微小粒子可能存在的风 险。
在传统的技术中，大多半导体容器会透过进气口以及出气口的方式来达到 容器内的气体流动。并借由极度洁净干燥气体(Extreme Clean Dry Air,XCDA) 的进出，将先前已经附着的微小粒子带走。但是，由于单纯透过半导体容器上 的气阀来控制气体进出虽然可行，但由于气体无法均匀的吹拂于基板或是光罩 等半导体材料上，因此仍有无法完全洁净的风险。
随着技术的进步，目前已经有许多将管状或具有开孔结构的扩散装置设置 于半导体容器内的技术产生。但由于大多数的半导体容器规格已经有统一的标 准，这种需要额外装设于半导体容器内部的扩散机构多半需要特别为避开基板 或光罩承载区域特别设计。而设置于半导体容器内部的设计，也致使替换上较 为不便。
发明内容
为解决先前技术中所提及的问题，本发明提供了一种基板载具及其气体扩 散模块。
其中所述气体扩散模块包括一外盖、至少一进气部、一气密层、一气匀层 以及一承载部。所述至少一进气部与所述外盖连接，所述气密层与所述外盖及 所述至少一进气部连接。而所述气匀层透过所述气密层与所述外盖密合，所述 承载部则同时与所述外盖、所述至少一进气部及所述气匀层密合。其中所述承 载部设于一半导体容器上。
更进一步来说，本发明提供的基板载具包括一盒体、一门板、至少一入气 口以及一气体扩散模块。
其中所述盒体设有一开口，而所述门板与所述开口盖合。至于所述至少一 入气口则设于所述盒体底部。所述气体扩散模块包括一外盖、至少一进气部、 一气密层、一气匀层以及一承载部。所述至少一进气部与所述外盖连接，所述 气密层与所述外盖及所述至少一进气部连接。而所述气匀层透过所述气密层与 所述外盖密合，所述承载部则同时与所述外盖、所述至少一进气部及所述气匀 层密合。其中所述承载部设于所述盒体上。
附图说明
为了更清楚地说明本发明实施例或现有技术中的技术方案，下面将对实施 例或现有技术描述中所需要使用的附图作简单地介绍，显而易见地，下面描述 中的附图仅仅是本发明的一些实施例，对于本领域普通技术人员来讲，在不付 出创造性劳动的前提下，还可以根据这些附图示出的结构获得其他的附图。
图1为本发明实施例的结构组成示意图。
图2为本发明实施例的外盖内侧结构示意图。
图3为本发明实施例的矢状切面示意图。
附图标号说明：
10 气体扩散模块
101 外盖
102 进气部
103 气密层
104 气匀层
105 承载部
106 第一锁扣部
107 第二锁扣部
108 外密圈
109 锁扣气密部
110 内密圈
111 进气气密部
112 准位部
200 半导体容器
201 开口
202 门板
203 入气口
204 盒体
本发明目的的实现、功能特点及优点将结合实施例，参照附图做进一步说 明。
具体实施方式
下面将结合本发明实施例中的附图，对本发明实施例中的技术方案进行清 楚、完整地描述，显然，所描述的实施例仅仅是本发明的一部分实施例，而不 是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有作出创 造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。
为能了解本发明的技术特征及实用功效，并可依照说明书的内容来实施， 兹进一步以如图式所示的较佳实施例，详细说明如后：
请同时参照图1及图2，图1为本发明实施例的结构组成示意图；图2为 本发明实施例的外盖内侧结构示意图。如图1所示，图1中提供一种半导体容 器200，其上搭载有气体扩散模块10。在本实施例中，半导体容器200为一种 基板载具，更进一步来说是前开式晶圆盒(Front Opening Unified Pod,FOUP)。 当然，本发明实施例可采用的半导体容器200不以此为限，凡是需要通入气体 进行洁净作业的半导体容器200应皆包括在本发明的范围的内。
在图1的实施例中，可清楚看出其中气体扩散模块10包括外盖101、至少 一进气部102、气密层103、气匀层104以及承载部105。至少一进气部102 与外盖101连接。在本实施例中，至少一进气部102连接于外盖101的底部， 并且呈略湾的形状向半导体容器200弯折。在本实施例中，外盖101上设有复 数第一锁扣部106。在半导体容器200及承载部105相应所述复数第一锁扣部 106设有复数第二锁扣部107。
本实施例透过此结构，可由外盖101将至少一进气部102、气密层103及 气匀层104依序整合固定装载于半导体容器200上的承载部105。即承载部105 同时与外盖101、至少一进气部102及气匀层104密合。
而气密层103与外盖101及至少一进气部102连接。更进一步来说，气密 层103需要配合外盖101及至少一进气部102共构出的形状进行气密布局设计。 如图1的实施例所示，本实施例中，气密层103由外密圈108、复数锁扣气密 部109、内密圈110以及至少一进气气密部111构成。其中，复数锁扣气密部 109设于外密圈108上，可以加强第一锁扣部106及第二锁扣部107之间接合 时的气密性。
而内密圈110则与外密圈108连接，形成相对于外部环境的双重气密结构。 至于至少一进气气密部111的数量及构型相应至少一进气部102设置，进气气 密部111与外密圈108连接，共构成一道气密防线。如此一来，可以大幅确保 本实施例运作时的气密环境，并进行适度的气体压力控制。
而气匀层104透过气密层103与外盖101密合。在本实施例中，气匀层104 选用过滤材料。更进一步来说，可以是烧结聚合物等多孔性材质。本实施例的 气匀层104主要功效在于保压稳定气压，之后当气室内的压力上升到一定程度 后，均匀且稳定的通过过滤材料吹拂洁净气体，达到洁净半导体容器200内部 的功效。
如图2所示，图2中明确展示出了外盖101及至少一进气部102共构的结 构示意图。由于外盖101和进气部102必须固定于半导体容器200的承载部 105。因此，为了确保进气部102能够准确地和承载部105卡合，本实施例的 进气部102更设有至少一准位部112。透过所述至少一准位部112的设置，可 以让进气部102准确的固定于承载部105。
接着请参照图3，图3为本发明实施例的矢状切面示意图。如图3所示， 图3展示了本实施例作为半导体容器200的基板载具，其运作时的结构剖面示 意图。所述基板载具包括盒体204、门板202、至少一入气口203以及气体扩 散模块10。
其中所述盒体204设有开口201，而门板202与开口201盖合。至于至少 一入气口203则设于盒体204底部。气体扩散模块10则采用图1-2实施例所 述的结构，包括外盖101、至少一进气部102、气密层103、气匀层104以及承 载部105。至少一进气部102与外盖101连接，气密层103与外盖101及至少 一进气部102连接。而气匀层104透过气密层103与外盖101密合，承载部105 则同时与外盖101、至少一进气部102及气匀层104密合。且承载部105设于所述盒体204上。
由图3的实施例可看出，进气部102可与入气口203接合，透过入气口203 收集的洁净气体，进一步进入进气部102，并在气密层103的双重气密结构保 护下进入到外盖101及气匀层104共构的气室中。待洁净气体压力提高到预设 好的阈值后，均匀地向盒体204中吹拂，达到气体扩散洁净的效果。
以上所述仅为本发明的优选实施例，并非因此限制本发明的专利范围，凡 是在本发明的构思下，利用本发明说明书及附图内容所作的等效结构变换，或 直接/间接运用在其他相关的技术领域均包括在本发明的专利保护范围内。

Claims (10)

1.一种气体扩散模块，其特征在于，包括：一外盖；
至少一进气部，与所述外盖连接；
一气密层，与所述外盖及所述至少一进气部连接；
一气匀层，透过所述气密层与所述外盖密合；以及
一承载部，同时与所述外盖、所述至少一进气部及所述气匀层密合；
其中，所述承载部设于一半导体容器上。
2.根据权利要求1所述的气体扩散模块，其特征在于，所述外盖上设有复数第一锁扣部。
3.根据权利要求2所述的气体扩散模块，其特征在于，所述承载部上相应所述复数第一锁扣部设有复数第二锁扣部。
4.根据权利要求1所述的气体扩散模块，其特征在于，所述气密层包括：
一外密圈；
复数锁扣气密部，设于所述外密圈上；
一内密圈，与所述外密圈连接；以及
至少一进气气密部，与所述外密圈连接。
5.根据权利要求1所述的气体扩散模块，其特征在于，所述至少一进气部更设有至少一准位部。
6.根据权利要求1所述的气体扩散模块，其特征在于，所述气匀层为一过滤材料。
7.根据权利要求1所述的气体扩散模块，其特征在于，所述半导体容器为一前开式晶圆盒。
8.一种基板载具，其特征在于，包括：
一盒体，设有一开口；
一门板，与所述开口盖合；
至少一入气口，设于所述盒体底部；
一气体扩散模块，包括：
一外盖；
至少一进气部，与所述外盖及所述至少一入气口连接；
一气密层，与所述外盖及所述至少一进气部连接；
一气匀层，透过所述气密层与所述外盖密合；以及
一承载部，同时与所述外盖、所述至少一进气部及所述气匀层密合；
其中，所述承载部设于所述盒体上。
9.根据权利要求8所述的基板载具，其特征在于，所述外盖设有复数第一锁扣部；所述承载部相应所述复数第一锁扣部设有复数第二锁扣部。
10.根据权利要求8所述的基板载具，其特征在于，所述基板载具为前开式晶圆盒。
CN201910741543.1A 2019-07-13 2019-08-12 基板载具及其气体扩散模块 Pending CN112289718A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
TW108124813 2019-07-13
TW108124813 2019-07-13

Publications (1)

Publication Number Publication Date
CN112289718A true CN112289718A (zh) 2021-01-29

Family

ID=74102751

Family Applications (2)

Application Number Title Priority Date Filing Date
CN201910741543.1A Pending CN112289718A (zh) 2019-07-13 2019-08-12 基板载具及其气体扩散模块
CN202010404417.XA Pending CN112289719A (zh) 2019-07-13 2020-05-13 基板容器系统

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN202010404417.XA Pending CN112289719A (zh) 2019-07-13 2020-05-13 基板容器系统

Country Status (6)

Country Link
US (2) US20210013075A1 (zh)
JP (2) JP2021015951A (zh)
KR (1) KR102396244B1 (zh)
CN (2) CN112289718A (zh)
SG (1) SG10202006027VA (zh)
TW (1) TWI727795B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWD209927S (zh) * 2019-08-02 2021-02-21 家登精密工業股份有限公司 光罩傳送盒之上蓋
TWD209117S (zh) * 2019-08-02 2021-01-01 家登精密工業股份有限公司 光罩傳送盒之上蓋
CN117063271A (zh) * 2021-03-10 2023-11-14 恩特格里斯公司 具有前及后开口的半导体衬底载运容器
CN113937041A (zh) * 2021-06-30 2022-01-14 家登精密工业股份有限公司 基板容器系统

Family Cites Families (23)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3198841B2 (ja) 1994-12-16 2001-08-13 日本鋼管株式会社 気体中浮遊粒子の原子吸光分析方法及び装置
CN100431930C (zh) 2005-08-04 2008-11-12 北京市塑料研究所 用于大直径硅片储存和运输的包装容器
CN102017119B (zh) 2008-03-13 2014-01-01 安格斯公司 具有管状环境控制部件的晶圆容器
US8413815B2 (en) 2008-08-27 2013-04-09 Gudeng Precision Industrial Co, Ltd Wafer container with at least one purgeable supporting module having a long slot
CN102812545B (zh) 2009-12-10 2016-08-03 恩特格里公司 用于微环境中均匀分布吹扫气体的多孔隔板
TWI431712B (zh) * 2011-09-20 2014-03-21 Gudeng Prec Ind Co Ltd 大型前開式晶圓盒
JP6217977B2 (ja) 2014-02-27 2017-10-25 Tdk株式会社 ポッド、及び該ポッドを用いたパージシステム
JP6351317B2 (ja) * 2014-03-14 2018-07-04 ミライアル株式会社 基板収納容器
TWM489155U (en) 2014-06-09 2014-11-01 Gudeng Precision Industrial Co Ltd Gas diffusion device of wafer pod
JP6271354B2 (ja) 2014-06-30 2018-01-31 信越ポリマー株式会社 基板収納容器及びその製造方法
CN106537574B (zh) 2014-07-25 2020-06-05 信越聚合物株式会社 基板收纳容器
JP6450156B2 (ja) * 2014-11-12 2019-01-09 ミライアル株式会社 ガスパージ用フィルタ
KR20220053034A (ko) 2015-05-12 2022-04-28 엔테그리스, 아이엔씨. 외부 수동 게터 모듈을 구비하는 웨이퍼 컨테이너
JP6431440B2 (ja) * 2015-05-27 2018-11-28 信越ポリマー株式会社 基板収納容器
JP6367153B2 (ja) * 2015-06-09 2018-08-01 信越ポリマー株式会社 基板収納容器
JP6400534B2 (ja) * 2015-07-06 2018-10-03 信越ポリマー株式会社 基板収納容器
US10161033B2 (en) 2015-08-21 2018-12-25 Taiwan Semiconductor Manufacturing Co., Ltd. Method for cleaning load port of wafer processing apparatus
KR101688620B1 (ko) 2015-12-24 2016-12-21 피코앤테라(주) 웨이퍼 수납용기
KR101865636B1 (ko) 2016-07-06 2018-06-08 우범제 웨이퍼 수납용기
DE112018001612T5 (de) * 2017-03-27 2020-01-16 Shin-Etsu Polymer Co., Ltd. Substratlagerungsbehälter
WO2018203384A1 (ja) 2017-05-02 2018-11-08 ミライアル株式会社 基板収納容器
TWM563421U (zh) 2018-03-06 2018-07-11 中勤實業股份有限公司 晶圓容器
JP7087357B2 (ja) 2017-11-28 2022-06-21 Tdk株式会社 ポッド及びパージ装置

Also Published As

Publication number Publication date
JP7024159B2 (ja) 2022-02-24
KR20210008460A (ko) 2021-01-22
CN112289719A (zh) 2021-01-29
TW202102416A (zh) 2021-01-16
TWI727795B (zh) 2021-05-11
JP2021015979A (ja) 2021-02-12
SG10202006027VA (en) 2021-02-25
JP2021015951A (ja) 2021-02-12
US20210013076A1 (en) 2021-01-14
KR102396244B1 (ko) 2022-05-09
US11508594B2 (en) 2022-11-22
US20210013075A1 (en) 2021-01-14

Similar Documents

Publication Publication Date Title
CN112289718A (zh) 基板载具及其气体扩散模块
US8403143B2 (en) Reticle storing container
US9536765B2 (en) Load port unit and EFEM system
US20160086811A1 (en) Vertical no-spin process chamber
US10522379B2 (en) Substrate transfer apparatus
JP2005150706A (ja) 基板移送コンテナ、基板移送装置および基板移送方法
JP2010283356A (ja) 基板処理装置および半導体装置の製造方法
JP3312163B2 (ja) 真空吸着装置
US20040237244A1 (en) Purge system for product container and interface seal used in the system
KR20180124726A (ko) 할로겐 제거 모듈 및 연관된 시스템들 및 방법들
JP2004345715A (ja) 製品収容容器用パージシステム
KR100819114B1 (ko) 기판 이송 로봇 및 이를 포함하는 기판 가공 장치
US20210323756A1 (en) Substrate container system
US10056274B2 (en) System and method for forming a sealed chamber
TW201018628A (en) Ventilated front-opening unified pod
US20040069409A1 (en) Front opening unified pod door opener with dust-proof device
TWM532450U (zh) 晶圓運送裝置
JP2017188609A (ja) パージ性能を備えたウエハシッパー微環境
WO2021207311A1 (en) Sample carrier cleaner
JP7458442B2 (ja) 基板容器システム
JP2000164688A (ja) キャリアカセットおよびそれを用いた半導体装置の製造方法
JP2004349619A (ja) インターフェースシール
WO1999044221A1 (en) A seal member and a vacuum chamber
KR102327535B1 (ko) 기판 처리 장치
TW202322257A (zh) 轉移晶圓基底的系統、降低相對濕度方法及減少氣流方法

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination