JP5374289B2 - 研磨材固定用両面粘着テープ - Google Patents

研磨材固定用両面粘着テープ Download PDF

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Publication number
JP5374289B2
JP5374289B2 JP2009216324A JP2009216324A JP5374289B2 JP 5374289 B2 JP5374289 B2 JP 5374289B2 JP 2009216324 A JP2009216324 A JP 2009216324A JP 2009216324 A JP2009216324 A JP 2009216324A JP 5374289 B2 JP5374289 B2 JP 5374289B2
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fixing
abrasive
sensitive adhesive
pressure
adhesive layer
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Japanese (ja)
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JP2010150512A (ja
JP2010150512A5 (enrdf_load_stackoverflow
Inventor
賢司 酒井
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Sekisui Chemical Co Ltd
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Sekisui Chemical Co Ltd
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Priority to JP2009216324A priority Critical patent/JP5374289B2/ja
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  • Polishing Bodies And Polishing Tools (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2009216324A 2008-11-20 2009-09-18 研磨材固定用両面粘着テープ Active JP5374289B2 (ja)

Priority Applications (1)

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JP2009216324A JP5374289B2 (ja) 2008-11-20 2009-09-18 研磨材固定用両面粘着テープ

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2008296278 2008-11-20
JP2008296278 2008-11-20
JP2009216324A JP5374289B2 (ja) 2008-11-20 2009-09-18 研磨材固定用両面粘着テープ

Publications (3)

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JP2010150512A JP2010150512A (ja) 2010-07-08
JP2010150512A5 JP2010150512A5 (enrdf_load_stackoverflow) 2012-08-30
JP5374289B2 true JP5374289B2 (ja) 2013-12-25

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JP2009216324A Active JP5374289B2 (ja) 2008-11-20 2009-09-18 研磨材固定用両面粘着テープ

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JP (1) JP5374289B2 (enrdf_load_stackoverflow)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5658976B2 (ja) * 2010-11-05 2015-01-28 日東電工株式会社 両面粘着テープおよび研磨部材
JP6471574B2 (ja) * 2015-03-25 2019-02-20 東洋インキScホールディングス株式会社 研磨パッド固定用粘着剤、および研磨パッド固定用粘着シート
JP6976048B2 (ja) * 2015-11-30 2021-12-01 日東電工株式会社 研磨パッド固定用粘着シート
JP7358768B2 (ja) * 2019-04-16 2023-10-11 Dic株式会社 粘着テープ

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1025455A (ja) * 1996-07-12 1998-01-27 Oji Paper Co Ltd 剥離用粘着テープ
JP2005034940A (ja) * 2003-07-14 2005-02-10 Toshiro Doi 研磨パッド及びその剥離方法
JP4574234B2 (ja) * 2004-06-02 2010-11-04 リンテック株式会社 半導体加工用粘着シートおよび半導体チップの製造方法

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