JP5372665B2 - 光硬化型接着剤、光ピックアップ装置及びその製造方法 - Google Patents
光硬化型接着剤、光ピックアップ装置及びその製造方法 Download PDFInfo
- Publication number
- JP5372665B2 JP5372665B2 JP2009199207A JP2009199207A JP5372665B2 JP 5372665 B2 JP5372665 B2 JP 5372665B2 JP 2009199207 A JP2009199207 A JP 2009199207A JP 2009199207 A JP2009199207 A JP 2009199207A JP 5372665 B2 JP5372665 B2 JP 5372665B2
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- JP
- Japan
- Prior art keywords
- adhesive
- filler
- added
- clay
- optical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
- G11B7/12—Heads, e.g. forming of the optical beam spot or modulation of the optical beam
- G11B7/22—Apparatus or processes for the manufacture of optical heads, e.g. assembly
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G2650/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
- C08G2650/02—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule characterized by the type of post-polymerisation functionalisation
- C08G2650/16—Photopolymerisation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/346—Clay
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Mounting And Adjusting Of Optical Elements (AREA)
- Optical Head (AREA)
Description
また、本発明では、繊維状フィラーとしてカーボン繊維、ガラス繊維、ステンレス、鉄、金、銀、アルミニウム等の金属繊維等が使用されることが望ましい。
2:接着剤との屈折率の差が±0.02以下であるフィラー
3:粘土フィラー
4:受光素子
5:レンズ
6:プリズム
7:ミラー
8:アクチュエータ
9:光ディスク
10:発光素子
11:ピックアップケース
12:針状フィラー
13:繊維状フィラー
14:金属フィラー
100:光ピックアップ装置
101:光ディスクドライブ装置
Claims (4)
- 光開始剤を含み、光で硬化する接着剤において、上記接着剤との屈折率の差が0.02以下である第一のフィラーと、上記第一のフィラーとは異なる、上記接着剤との屈折率の差が0.02よりも大きい第二のフィラーとを備え、上記第二のフィラーは、ケイ酸を主成分とする層状粘土鉱物を含むことを特徴とした光硬化型接着剤。
- 請求項1記載の光硬化型接着剤において、
上記層状粘土鉱物は、少なくとも一辺が100nm以上500nm以下であり、一枚のシートの厚さが2nm以下であることを特徴とする光硬化型接着剤。 - 請求項1または請求項2のいずれかに記載の光硬化型接着剤において、
上記層状粘土鉱物は、表面が有機分子で覆われていることを特徴とする光硬化型接着剤。 - 請求項1〜3のいずれかに記載の光硬化型接着剤において、
上記層状粘土鉱物が2wt%〜10wt%含まれていることを特徴とする光硬化型接着剤。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009199207A JP5372665B2 (ja) | 2009-08-31 | 2009-08-31 | 光硬化型接着剤、光ピックアップ装置及びその製造方法 |
US12/765,467 US20110051588A1 (en) | 2009-08-31 | 2010-04-22 | Photo-curing type adhesive, optical pickup unit and manufacturing method thereof |
CN2010101678555A CN102002327A (zh) | 2009-08-31 | 2010-04-26 | 光硬化型粘接剂、光拾取装置及其制造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009199207A JP5372665B2 (ja) | 2009-08-31 | 2009-08-31 | 光硬化型接着剤、光ピックアップ装置及びその製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011052033A JP2011052033A (ja) | 2011-03-17 |
JP5372665B2 true JP5372665B2 (ja) | 2013-12-18 |
Family
ID=43624751
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2009199207A Expired - Fee Related JP5372665B2 (ja) | 2009-08-31 | 2009-08-31 | 光硬化型接着剤、光ピックアップ装置及びその製造方法 |
Country Status (3)
Country | Link |
---|---|
US (1) | US20110051588A1 (ja) |
JP (1) | JP5372665B2 (ja) |
CN (1) | CN102002327A (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170008248A (ko) * | 2014-05-22 | 2017-01-23 | 가부시키가이샤 덴소 | 광경화성 접착제 |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9753190B2 (en) * | 2013-08-28 | 2017-09-05 | Corning Incorporated | Adhesive with embedded waveguides for curing |
CN106133079B (zh) * | 2014-03-26 | 2020-04-24 | 琳得科株式会社 | 粘着性组合物、粘着剂及粘着片 |
US20180017735A1 (en) * | 2016-07-13 | 2018-01-18 | Futurewei Technologies, Inc. | Wavelength Division Multiplexer/Demultiplexer with Flexibility of Optical Adjustment |
JP2019174781A (ja) * | 2017-08-24 | 2019-10-10 | キヤノン株式会社 | 反射光学素子およびステレオカメラ装置 |
CN109735258A (zh) * | 2018-12-13 | 2019-05-10 | 深圳市艾迪恩科技有限公司 | 高耐热性封装胶、应用该封装胶的led封装器件及封装方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5838769A (ja) * | 1981-08-31 | 1983-03-07 | Suriibondo:Kk | チクソトロピ−性紫外線硬化接着剤組成物 |
US20020126381A1 (en) * | 2001-03-05 | 2002-09-12 | Suh Seong Woo | Stacks of optical structures and methods and apparatus for making same |
US6709756B2 (en) * | 2001-05-21 | 2004-03-23 | Shin-Etsu Chemical Co., Ltd. | Optical device-related adhesive and optical device |
JP2004066803A (ja) * | 2002-06-12 | 2004-03-04 | Daicel Chem Ind Ltd | 接着性樹脂用表面保護フィルム及びその製法 |
CN1735637A (zh) * | 2002-11-08 | 2006-02-15 | 三菱化学株式会社 | 可辐射固化树脂组合物及其固化产物 |
WO2004041888A1 (ja) * | 2002-11-08 | 2004-05-21 | Mitsubishi Chemical Corporation | 放射線硬化性樹脂組成物及びその硬化物 |
TW200500739A (en) * | 2002-11-14 | 2005-01-01 | Tomoegawa Paper Co Ltd | Anisotropic light diffusing adhesive layer, laminated body of anisotropic light diffusing adhesive layers, and illumination device therewith |
JP2005044744A (ja) * | 2003-07-25 | 2005-02-17 | Clariant Internatl Ltd | 面光源装置 |
US7186945B2 (en) * | 2003-10-15 | 2007-03-06 | National Starch And Chemical Investment Holding Corporation | Sprayable adhesive material for laser marking semiconductor wafers and dies |
JP2005255706A (ja) * | 2004-03-09 | 2005-09-22 | Lintec Corp | 粘接着剤組成物、光ディスク製造用シートおよび光ディスク |
WO2005098497A1 (ja) * | 2004-03-31 | 2005-10-20 | Hitachi Chemical Company, Ltd. | 光素子結合構造体及び光ファイバー構造体 |
JP2006302415A (ja) * | 2005-04-21 | 2006-11-02 | Nidec Sankyo Corp | 光ヘッド装置 |
US7802274B2 (en) * | 2005-11-21 | 2010-09-21 | General Electric Company | Optical data storage article having a physical surface modification as an anti-theft feature and a system and method for inhibiting theft of same |
JP4538416B2 (ja) * | 2006-02-03 | 2010-09-08 | 株式会社日立メディアエレクトロニクス | 光ピックアップ装置、その製造方法及び光ドライブ装置 |
WO2008140059A1 (ja) * | 2007-05-09 | 2008-11-20 | Nippon Sheet Glass Company, Limited | ガラスフィラーとそれを用いた光硬化型塗料組成物および光硬化型樹脂組成物、並びに光硬化型接着剤 |
JP2009001694A (ja) * | 2007-06-22 | 2009-01-08 | Toyo Ink Mfg Co Ltd | 感圧式接着剤用ポリエステル及びこれを含む感圧式接着剤組成物 |
JP2009098187A (ja) * | 2007-10-12 | 2009-05-07 | Sekisui Chem Co Ltd | 光学部品用接着剤 |
US8017246B2 (en) * | 2007-11-08 | 2011-09-13 | Philips Lumileds Lighting Company, Llc | Silicone resin for protecting a light transmitting surface of an optoelectronic device |
JP5088376B2 (ja) * | 2007-11-29 | 2012-12-05 | 日立化成工業株式会社 | 回路部材接続用接着剤及び半導体装置 |
-
2009
- 2009-08-31 JP JP2009199207A patent/JP5372665B2/ja not_active Expired - Fee Related
-
2010
- 2010-04-22 US US12/765,467 patent/US20110051588A1/en not_active Abandoned
- 2010-04-26 CN CN2010101678555A patent/CN102002327A/zh active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20170008248A (ko) * | 2014-05-22 | 2017-01-23 | 가부시키가이샤 덴소 | 광경화성 접착제 |
Also Published As
Publication number | Publication date |
---|---|
JP2011052033A (ja) | 2011-03-17 |
US20110051588A1 (en) | 2011-03-03 |
CN102002327A (zh) | 2011-04-06 |
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