JP5367745B2 - ヒート・シンクの熱交換率を向上する方法および電子機器 - Google Patents

ヒート・シンクの熱交換率を向上する方法および電子機器 Download PDF

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Publication number
JP5367745B2
JP5367745B2 JP2011047154A JP2011047154A JP5367745B2 JP 5367745 B2 JP5367745 B2 JP 5367745B2 JP 2011047154 A JP2011047154 A JP 2011047154A JP 2011047154 A JP2011047154 A JP 2011047154A JP 5367745 B2 JP5367745 B2 JP 5367745B2
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Prior art keywords
heat
heat sink
ground
potential
ground plane
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Japanese (ja)
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JP2012186246A (ja
Inventor
拓郎 上村
良太 野原
貴光 安達
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Lenovo Singapore Pte Ltd
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Lenovo Singapore Pte Ltd
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Priority to JP2011047154A priority Critical patent/JP5367745B2/ja
Priority to CN201210055037.5A priority patent/CN102686083B/zh
Publication of JP2012186246A publication Critical patent/JP2012186246A/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2011047154A 2011-03-04 2011-03-04 ヒート・シンクの熱交換率を向上する方法および電子機器 Active JP5367745B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2011047154A JP5367745B2 (ja) 2011-03-04 2011-03-04 ヒート・シンクの熱交換率を向上する方法および電子機器
CN201210055037.5A CN102686083B (zh) 2011-03-04 2012-03-05 提高散热器的热交换效率的方法以及电子设备

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2011047154A JP5367745B2 (ja) 2011-03-04 2011-03-04 ヒート・シンクの熱交換率を向上する方法および電子機器

Publications (2)

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JP2012186246A JP2012186246A (ja) 2012-09-27
JP5367745B2 true JP5367745B2 (ja) 2013-12-11

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JP2011047154A Active JP5367745B2 (ja) 2011-03-04 2011-03-04 ヒート・シンクの熱交換率を向上する方法および電子機器

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JP (1) JP5367745B2 (zh)
CN (1) CN102686083B (zh)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5926157B2 (ja) * 2012-09-18 2016-05-25 シャープ株式会社 冷却庫
CN103353787A (zh) * 2013-07-26 2013-10-16 浪潮电子信息产业股份有限公司 一种免线缆的cpu散热器
JP2022108688A (ja) * 2021-01-13 2022-07-26 本田技研工業株式会社 車両用温調システム
CN115458488A (zh) * 2021-06-08 2022-12-09 联想（新加坡）私人有限公司 散热构造及电子设备

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6483719B1 (en) * 2000-03-21 2002-11-19 Spraylat Corporation Conforming shielded form for electronic component assemblies
JP4382246B2 (ja) * 2000-04-14 2009-12-09 レノボ シンガポール プライヴェート リミテッド コネクタ、コネクタ接続構造、及び電子機器
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
CN2611959Y (zh) * 2002-12-17 2004-04-14 孟繁泉 带液晶显示器的便携式台式计算机
JP2007150192A (ja) * 2005-11-30 2007-06-14 Toshiba Corp ヒートパイプを有した放熱器を備える情報処理装置
WO2008120358A1 (ja) * 2007-03-29 2008-10-09 Fujitsu Limited ヒートシンク
JP2008306138A (ja) * 2007-06-11 2008-12-18 Fujitsu Ltd 実装基板

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Publication number Publication date
CN102686083A (zh) 2012-09-19
CN102686083B (zh) 2016-08-17
JP2012186246A (ja) 2012-09-27

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