JP5367259B2 - ブリッジ切除方法及びリードフレーム条 - Google Patents

ブリッジ切除方法及びリードフレーム条 Download PDF

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JP5367259B2
JP5367259B2 JP2007337690A JP2007337690A JP5367259B2 JP 5367259 B2 JP5367259 B2 JP 5367259B2 JP 2007337690 A JP2007337690 A JP 2007337690A JP 2007337690 A JP2007337690 A JP 2007337690A JP 5367259 B2 JP5367259 B2 JP 5367259B2
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frame
punch
lead
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JP2009158828A5 (enExample
JP2009158828A (ja
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秀行 田光
聡 浦山
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Shinko Electric Industries Co Ltd
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Shinko Electric Industries Co Ltd
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JP2007337690A 2007-12-27 2007-12-27 ブリッジ切除方法及びリードフレーム条 Active JP5367259B2 (ja)

Priority Applications (1)

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JP2007337690A JP5367259B2 (ja) 2007-12-27 2007-12-27 ブリッジ切除方法及びリードフレーム条

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JP2007337690A JP5367259B2 (ja) 2007-12-27 2007-12-27 ブリッジ切除方法及びリードフレーム条

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JP2009158828A JP2009158828A (ja) 2009-07-16
JP2009158828A5 JP2009158828A5 (enExample) 2011-01-13
JP5367259B2 true JP5367259B2 (ja) 2013-12-11

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JP2007337690A Active JP5367259B2 (ja) 2007-12-27 2007-12-27 ブリッジ切除方法及びリードフレーム条

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117283051A (zh) * 2023-11-03 2023-12-26 广州丰江微电子有限公司 引线框架生产用切割装置及其使用方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6029226B2 (ja) * 1977-02-28 1985-07-09 日本電気株式会社 半導体装置用リ−ドフレ−ム
JPH0770663B2 (ja) * 1985-10-29 1995-07-31 大日本印刷株式会社 多面付けエツチング製品
JPH0281721U (enExample) * 1988-12-12 1990-06-25
JPH04179260A (ja) * 1990-11-14 1992-06-25 Oki Electric Ind Co Ltd リードフレーム
JPH04324970A (ja) * 1991-04-25 1992-11-13 Oki Electric Ind Co Ltd 半導体装置のリードフレームの製造方法
JP2002137022A (ja) * 2000-10-30 2002-05-14 Mitsui High Tec Inc 打抜き形成方法
JP2005317827A (ja) * 2004-04-30 2005-11-10 Shinko Electric Ind Co Ltd リードフレームの製造方法

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