JP5362293B2 - Manufacturing method of component with built-in piezoelectric element - Google Patents
Manufacturing method of component with built-in piezoelectric element Download PDFInfo
- Publication number
- JP5362293B2 JP5362293B2 JP2008220151A JP2008220151A JP5362293B2 JP 5362293 B2 JP5362293 B2 JP 5362293B2 JP 2008220151 A JP2008220151 A JP 2008220151A JP 2008220151 A JP2008220151 A JP 2008220151A JP 5362293 B2 JP5362293 B2 JP 5362293B2
- Authority
- JP
- Japan
- Prior art keywords
- piezoelectric element
- component
- element built
- built
- wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Oscillators With Electromechanical Resonators (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
Abstract
Description
本発明は、透明な多層石英材料からなる圧電素子内蔵部品ならびにそのカバー部及びベース部への判別記号の印字をウエハレベルで一括して行う判別記号印字方法に関する。 The present invention relates to a piezoelectric element built-in component made of a transparent multilayer quartz material, and a discrimination symbol printing method for collectively printing discrimination symbols on a cover portion and a base portion at a wafer level.
従来、圧電素子内蔵部品、例えば水晶振動子を製造した後、インクにより、製造メーカー名、周波数、製造ロットナンバー、QRコード、バーコード等の判別記号を部品表面に一個ずつ印刷により表示していた。しかしながら、印刷表面が、その表面状態により、インクの乗りが悪い場合があり、そのために印刷歩留りの低下、耐溶剤性不良、印字はがれ等が生じる問題点があった。 Conventionally, after manufacturing a piezoelectric element built-in part, for example, a crystal resonator, a discriminator such as a manufacturer name, frequency, manufacturing lot number, QR code, bar code, etc. is printed on the surface of the part one by one with ink. . However, depending on the surface state of the printing surface, there are cases in which the ink is poorly loaded, which causes problems such as a decrease in printing yield, poor solvent resistance, and print peeling.
そこで、このような問題点を解決するために、レーザー加工により該表面に所定の判別記号をマーキングして、より確実で信頼性の高い印字状態を維持することが行われていた。 Therefore, in order to solve such a problem, a predetermined discrimination symbol is marked on the surface by laser processing to maintain a more reliable and reliable printing state.
例えば、図5に示すように、従来の水晶振動子40は、電極が形成された水晶板が搭載されたセラミックベース42と、その底面に配設された外部接続端子48とからなり、セラミックベース42に金属カバー44を覆せて、気密封止してある。そして、レーザー光Lをレーザー照射装置から照射して、金属カバー44の表面に製造ロットナンバー等の判別記号を彫り込んで表示(印字)Sするようにしている。 For example, as shown in FIG. 5, a conventional crystal resonator 40 includes a ceramic base 42 on which a crystal plate on which electrodes are formed is mounted, and an external connection terminal 48 disposed on the bottom surface thereof. 42 is covered with a metal cover 44 and hermetically sealed. A laser beam L is emitted from a laser irradiation device, and a discrimination symbol such as a manufacturing lot number is engraved on the surface of the metal cover 44 for display (printing) S.
しかしながら、レーザー加工による場合には、製品の表面を削って印字するため、その分、印字対象製品に厚みが必要となり、この種の圧電素子内蔵部品、例えば水晶振動子の小型化、低背化に適合しなくなる問題が生じる。また、水晶、ガラス材料のような石英材料を判別記号の印字対象とし、例えばそのカバー部、ベース部に、レーザー加工により印字しようとすると、それらの部材が透明であるため、レーザー光がそれらの部材を透過してしまい、他の部材に損傷を生じるおそれがあった。
本発明が解決しようとする課題は、透明な水晶、ガラス材料等の石英材料からなる圧電素子内蔵部品の表面に損傷を生じることなく、ウエハ処理工程の別工程の実施と同時に、判別記号をウエハ上に一括して印字することである。 The problem to be solved by the present invention is that a discriminating symbol is displayed at the same time as performing another process of the wafer processing process without causing damage to the surface of the piezoelectric element built-in component made of a quartz material such as a transparent crystal or glass material. It is to print on the top.
上記した課題を解決するために本発明は、圧電素子を内部に具備し、該圧電素子を外部雰囲気から遮断する部品であって、該部品が水晶あるいはガラス材料からなり、前記部品表面にスパッタリングあるいはフォトリソグラフィにより判別記号を表示する。また、ウエハ工法を用い、複数の判別記号を、ウエハ上に一括してスパッタリングあるいはフォトリソグラフィにより表示する。 In order to solve the above-described problems, the present invention is a component that includes a piezoelectric element inside and shields the piezoelectric element from the external atmosphere, and the component is made of a crystal or glass material, and is sputtered on the surface of the component. A discrimination symbol is displayed by photolithography. In addition, a plurality of discriminating symbols are collectively displayed on the wafer by sputtering or photolithography using a wafer method.
判別記号をウエハ上に一括して鮮明に印字できるとともに、個片毎の判別記号の印字が省略できるので、その製造工数を大巾に低減できる。 The discrimination symbol can be clearly and collectively printed on the wafer, and the discrimination symbol for each piece can be omitted, so that the number of manufacturing steps can be greatly reduced.
以下、図1から図4に沿って本発明の水晶部品への判別記号の表示方法の実施例を圧電素子内蔵部品、例えば水晶振動子の実施例について説明する。 Hereinafter, an embodiment of a method for displaying a discrimination symbol on a quartz component according to the present invention will be described with reference to FIGS.
まず、本発明の水晶部品の判別記号の印字(マーキング)対象となる水晶部品、例えば、圧電素子内蔵部品(水晶振動子)について、図1及び図2に基づいて説明する。 First, a quartz component, for example, a component with a built-in piezoelectric element (quartz crystal resonator), which is a target for printing (marking) a discrimination symbol of the quartz component of the present invention, will be described with reference to FIGS.
図1(a)に示すように、圧電素子内蔵部品1は、透明な石英材料、例えば水晶、ガラスからなるベース部2、同じく透明材料からなるこのベース部2の上面に積層した圧電素子部3、及びこの圧電素子部3に覆せた透明材料からなるカバー部4とからなる。ここで、ベース部2には、その中央に断面凹状のキャビティ5が形成され、このキャビティ5の底面5aには、バンプ7を介してICチップ6がフリップチップ実装されている。また、ベース部2の底部には外部接続端子8が配設されている。 As shown in FIG. 1A, a piezoelectric element built-in component 1 includes a base part 2 made of a transparent quartz material, for example, quartz or glass, and a piezoelectric element part 3 laminated on the upper surface of the base part 2 also made of a transparent material. And a cover part 4 made of a transparent material covered with the piezoelectric element part 3. Here, a cavity 5 having a concave section is formed at the center of the base portion 2, and an IC chip 6 is flip-chip mounted on the bottom surface 5 a of the cavity 5 via bumps 7. An external connection terminal 8 is disposed on the bottom of the base portion 2.
同様に水晶振動子1aは、図1(b)に示すように、透明な石英材料、例えば水晶、ガラスからなるベース部2、同じく透明材料からなるこのベース部2の上面に積層した圧電素子部3、及びこの圧電素子部3に覆せた透明材料からなるカバー部4とからなる。 Similarly, as shown in FIG. 1B, the crystal resonator 1a includes a base portion 2 made of a transparent quartz material, for example, quartz or glass, and a piezoelectric element portion laminated on the upper surface of the base portion 2 also made of a transparent material. 3 and a cover portion 4 made of a transparent material covered with the piezoelectric element portion 3.
また、カバー部4の中央には断面凹状のキャビティ9が形成されている。 A cavity 9 having a concave cross section is formed at the center of the cover portion 4.
ここで、さらに詳しく図1に示す圧電素子内蔵部品1をそれぞれカバー部4(図2(a))、圧電素子部3(図2(b))及びベース部2(図2(c))に分解して説明する。 Here, in more detail, the piezoelectric element built-in component 1 shown in FIG. 1 is applied to the cover portion 4 (FIG. 2A), the piezoelectric element portion 3 (FIG. 2B), and the base portion 2 (FIG. 2C), respectively. Decompose and explain.
まず、カバー部4は、図1及び図2(a)に示すような構成とし、その中央にキャビティ4bを有するとともに、その上表面に金属薄膜4aが形成されている。 First, the cover part 4 is configured as shown in FIGS. 1 and 2A, and has a cavity 4b at the center thereof, and a metal thin film 4a is formed on the upper surface thereof.
また、圧電素子部3は、図2(b)に示すように、水晶片31は、平面視略正方形状を有し、その中央部を振動領域として、その両主面に励振電極32を有する。この励振電極32から一端部両側に引出電極33が延出し、さらに電極貫通孔34によって互いに反対側の主面に延出する。また、圧電素子部3の外縁には、接合用の環状電極36が形成され、他端部両側に電極貫通孔34を有するアース電極35が形成されている。 2B, the crystal element 31 has a substantially square shape in plan view, and has excitation electrodes 32 on both principal surfaces thereof with the central portion serving as a vibration region. . An extraction electrode 33 extends from the excitation electrode 32 to both sides of one end, and further extends to opposite main surfaces by electrode through holes 34. An annular electrode 36 for bonding is formed on the outer edge of the piezoelectric element portion 3, and a ground electrode 35 having electrode through holes 34 on both sides of the other end portion is formed.
さらに、ベース部2は、図1及び図2(c)に示すように、その中央部にキャビティ5が形成され、このキャビティ5の底面にICチップ6がバンプを介してフリップチップ実装されている。さらに、ベース部2の上表面には、金属薄膜2aが形成されるとともに、一対のアース電極22と一対の水晶端子21とが配設されている。また、ベース部2の外縁には、接合用の環状電極23が形成されている。 Further, as shown in FIGS. 1 and 2C, the base portion 2 has a cavity 5 formed in the center thereof, and an IC chip 6 is flip-chip mounted on the bottom surface of the cavity 5 via bumps. . Further, a metal thin film 2 a is formed on the upper surface of the base portion 2, and a pair of ground electrodes 22 and a pair of crystal terminals 21 are disposed. An annular electrode 23 for bonding is formed on the outer edge of the base portion 2.
このように、本発明の圧電素子内蔵部品では、カバー4、圧電素子部3及びベース部2を透明材料で構成し、引出し電極33が延出した水晶片31の一端部両側とベース部2の水晶端子21とを、また、圧電素子部3とベース部2のアース電極22,35とを、さらにそれらの環状電極23,36とを、水晶片31とカバー部4とを位置決めしてから、それらの間に共晶合金を介在させて接合・積層する。 Thus, in the piezoelectric element built-in component of the present invention, the cover 4, the piezoelectric element portion 3, and the base portion 2 are made of a transparent material, and both sides of one end portion of the crystal piece 31 from which the extraction electrode 33 extends and the base portion 2. After positioning the crystal terminal 21, the piezoelectric element portion 3, the ground electrodes 22 and 35 of the base portion 2, and the annular electrodes 23 and 36, the crystal piece 31 and the cover portion 4, They are joined and laminated with a eutectic alloy interposed between them.
とくに、本発明の水晶部品への判別記号の印字方法の特徴とする点は、図4に示すように、カバー部あるいはベース部を構成する一枚のウエハWに、ウエハ処理工程の別工程、例えば、カバー部あるいはベース部の電極形成と同時に一括して製造メーカー名、周波数、製造ロットナンバー等の判別記号を文字列、電子機器による読み取りが可能なコード表示(バーコード、QRコード等)を浮き出し文字(記号)あるいは抜き文字(記号)で印字して表示する。 In particular, the characteristic feature of the method for printing a discrimination symbol on a quartz part according to the present invention is that, as shown in FIG. 4, a single wafer W constituting a cover part or a base part is separated from a wafer processing step. For example, when the electrode of the cover part or base part is formed at the same time, the discriminating symbols such as the manufacturer name, frequency, and manufacturing lot number are character strings, and the code display (bar code, QR code, etc.) that can be read by electronic equipment Printed and displayed with embossed characters (symbols) or extracted characters (symbols).
そして、この印字による表示法としては、まず、ウエハ表面に蒸着により所定厚(電極と同じ厚み、例えば、Cr/Auで100〜2000Å)の金属薄膜2a,4aを蒸着により形成し、スパッタリング、フォトリソグラフィにより前述した所定の判別記号をマーキングする。 As a display method by printing, first, metal thin films 2a and 4a having a predetermined thickness (the same thickness as the electrode, for example, 100 to 2000 mm of Cr / Au) are formed by vapor deposition on the wafer surface, and sputtering, photo The above-mentioned predetermined discrimination symbol is marked by lithography.
とくに、フォトリソ・エッチングによる印字方法は、インクやレーザーによるものよりもマーキングの加工精度が高く、小さなパターンもマーキングとして印字可能である。そのため、水晶部品においては、常にその小型化が要求されるため、フォトリソ・エッチングによる印字は効果的である。 In particular, the printing method by photolithography / etching has higher processing accuracy of marking than that by ink or laser, and a small pattern can be printed as a marking. For this reason, quartz parts are always required to be miniaturized, and printing by photolithography / etching is effective.
他方、レーザーによる印字の場合には、製品を削る加工よりマーキングを行うため、印字対象部品に所定の厚みが必要であるが、フォトリソ・エッチングでは、まず金属薄膜を蒸着によりウエハの表面に成膜し、この薄膜をパターニングして判別記号の印字を行うだけである。それ故、本発明の判別記号印字方法ではレーザー加工のように、製品の削り取りを行わないので、圧電素子内蔵部品、例えば、水晶振動子、の小型化、低背化の要求を十分満足した印字方法となる。 On the other hand, in the case of laser printing, since marking is performed by machining the product, a predetermined thickness is required for the parts to be printed. In photolithography / etching, a metal thin film is first deposited on the wafer surface by vapor deposition. Then, this thin film is simply patterned to print a discrimination symbol. Therefore, the discriminating symbol printing method of the present invention does not scrape the product like laser processing, so that printing that sufficiently satisfies the requirements for downsizing and low profile of a piezoelectric element built-in part, for example, a crystal resonator. Become a method.
また、本発明の圧電素子内蔵部品への判別記号の印字方法では、図3に示すように、カバー部、ベース部あるいは圧電素子部を構成するウエハから、それぞれ個片の圧電素子内蔵部品にダイシング等により分割して、カバー部4、圧電素子部3、及びベース部2とからなる圧電素子内蔵部品を構成したときに、判別記号S(例えば、NT001)が、図3(a)、(b)に示すように圧電素子内蔵部品のカバー部4の金属薄膜4aに浮き出し文字(記号)(図3(a))あるいは抜き文字(記号)(図3(b))として表示されるようにする。さらには、図3(c)、(d)に示すように、圧電素子内蔵部品のベース部2の金属薄膜2aに浮き出し文字(記号)(図3(c))、あるいは抜き文字(記号)(図3(d))で表示されるように、それぞれ構成する。 Further, in the method for printing a discrimination symbol on the piezoelectric element built-in part of the present invention, as shown in FIG. 3, dicing is performed from the wafer constituting the cover part, the base part or the piezoelectric element part to the individual piezoelectric element built-in parts. When the piezoelectric element built-in component composed of the cover portion 4, the piezoelectric element portion 3, and the base portion 2 is configured by dividing the disc, etc., the discrimination symbol S (for example, NT001) is changed to FIG. As shown in FIG. 3A, the metal film 4a of the cover portion 4 of the piezoelectric element built-in component is displayed as a raised character (symbol) (FIG. 3A) or a blank character (symbol) (FIG. 3B). . Further, as shown in FIGS. 3C and 3D, the raised character (symbol) (FIG. 3C) or the extracted character (symbol) (symbol) ( Each is configured as shown in FIG.
本発明の圧電素子内蔵部品及びその判別記号印字方法は、水晶あるいはガラス材料等の透明材料からなる圧電部品に広範に利用できる。 The piezoelectric element built-in component of the present invention and its identification symbol printing method can be widely used for piezoelectric components made of a transparent material such as crystal or glass material.
1 圧電素子内蔵部品(水晶振動子)
2 ベース部
2a 金属薄膜
3 圧電素子部
4 カバー部
4a 金属薄膜
4b キャビティ
5 キャビティ
6 ICチップ
7 バンプ
8 外部接続端子
1 Built-in piezoelectric element (quartz crystal)
2 Base part 2a Metal thin film 3 Piezoelectric element part 4 Cover part 4a Metal thin film 4b Cavity 5 Cavity 6 IC chip 7 Bump 8 External connection terminal
Claims (3)
前記圧電素子内蔵部品が、圧電素子内蔵部、該圧電素子内蔵部の上面に載置されたカバー部、及び前記圧電素子内蔵部の底面に配置され、かつ、外部接続端子面を構成するベース部と、からなる圧電素子内蔵部品の製造方法において、
ウエハ工法を用い、前記カバー部を構成するウエハ上に金属薄膜を形成する工程と、
前記ウエハ上に形成した前記金属薄膜に一括してフォトリソグラフィによって複数の判別記号を表示する工程と、からなることを特徴とする圧電素子内蔵部品の製造方法。 A piezoelectric element built-in component comprising a piezoelectric element inside, shielding the piezoelectric element from the external atmosphere, and made of crystal or glass material,
The piezoelectric element built-in component is a piezoelectric element built-in part, a cover part placed on the upper surface of the piezoelectric element built-in part, and a base part which is disposed on the bottom surface of the piezoelectric element built-in part and constitutes an external connection terminal surface In a method for manufacturing a piezoelectric element built-in component consisting of:
Using the wafer method, a step of forming a metal thin film on the wafer which constitutes the cover portion,
And a step of displaying a plurality of discriminating symbols on the metal thin film formed on the wafer by photolithography at once.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008220151A JP5362293B2 (en) | 2008-08-28 | 2008-08-28 | Manufacturing method of component with built-in piezoelectric element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2008220151A JP5362293B2 (en) | 2008-08-28 | 2008-08-28 | Manufacturing method of component with built-in piezoelectric element |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010056930A JP2010056930A (en) | 2010-03-11 |
JP2010056930A5 JP2010056930A5 (en) | 2012-09-20 |
JP5362293B2 true JP5362293B2 (en) | 2013-12-11 |
Family
ID=42072368
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2008220151A Expired - Fee Related JP5362293B2 (en) | 2008-08-28 | 2008-08-28 | Manufacturing method of component with built-in piezoelectric element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5362293B2 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5615663B2 (en) * | 2010-03-26 | 2014-10-29 | セイコーインスツル株式会社 | Package marking method |
JP6173758B2 (en) * | 2013-04-24 | 2017-08-02 | 日本電波工業株式会社 | Junction crystal oscillator |
JP2017085390A (en) * | 2015-10-29 | 2017-05-18 | 京セラクリスタルデバイス株式会社 | Crystal device |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61177748A (en) * | 1985-02-04 | 1986-08-09 | Hitachi Ltd | Electronic component |
JPH0696462B2 (en) * | 1989-02-28 | 1994-11-30 | 株式会社ミツトヨ | Glass marking method |
JP3378880B2 (en) * | 1997-12-26 | 2003-02-17 | 松下電器産業株式会社 | Semiconductor device and manufacturing method thereof |
JP2007109750A (en) * | 2005-10-12 | 2007-04-26 | Hitachi Metals Ltd | Electric/electronic component and its manufacturing method |
JP2007165503A (en) * | 2005-12-13 | 2007-06-28 | Seiko Epson Corp | Hermetic seal structure, piezoelectric device and its manufacturing method |
-
2008
- 2008-08-28 JP JP2008220151A patent/JP5362293B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2010056930A (en) | 2010-03-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4885206B2 (en) | Tuning fork type piezoelectric vibrating piece and piezoelectric device | |
JP4933903B2 (en) | Quartz vibrator, quartz vibrator and quartz wafer | |
US8365371B2 (en) | Methods for manufacturing piezoelectric vibrating devices | |
JP2008079033A (en) | Method for manufacturing piezoelectric vibrator, piezoelectric vibrator and electronic component | |
JP3714228B2 (en) | Piezoelectric vibrator and method for manufacturing piezoelectric device | |
JP4292825B2 (en) | Method for manufacturing quartz vibrating piece | |
JP5362293B2 (en) | Manufacturing method of component with built-in piezoelectric element | |
JP2007013383A (en) | Manufacturing method of piezoelectric resonator piece, and piezoelectric resonator piece | |
US20140375176A1 (en) | Resonator element, resonator, electronic device, electronic apparatus, and moving object | |
JP2010136202A (en) | Method of manufacturing piezoelectric oscillating piece, piezoelectric oscillating piece, and piezoelectric resonator | |
JP4636170B2 (en) | Quartz vibrating piece, manufacturing method thereof, quartz crystal device using quartz crystal vibrating piece, mobile phone device using quartz crystal device, and electronic equipment using quartz crystal device | |
CN109891744B (en) | Method for adjusting frequency of piezoelectric vibration device | |
JP2007077471A (en) | Masking device for film formation | |
JP6432343B2 (en) | Method for manufacturing light emitting device | |
JP5434042B2 (en) | Method for manufacturing element for crystal resonator | |
JP2007142795A (en) | Method of manufacturing piezoelectric vibration chip, and method of forming alignment marker | |
JP2013192027A (en) | Piezoelectric device | |
JP2009225219A (en) | Piezoelectric device and method for manufacturing the same | |
JP5465992B2 (en) | Quartz crystal unit, electronic component, and method for manufacturing crystal unit | |
JP2014192647A (en) | Crystal oscillator and manufacturing method of crystal oscillator | |
JP2010010955A (en) | Method for manufacturing piezoelectric vibrator, and piezoelectric vibrator | |
JP2005130342A (en) | Manufacturing method of surface acoustic wave device | |
JP2009272516A (en) | Surface mounting type electronic component | |
JP2013074218A (en) | Imprint method to electronic component | |
JP4774615B2 (en) | Piezoelectric wafer structure, piezoelectric vibration element manufacturing method, piezoelectric device manufacturing method, and piezoelectric vibration element |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20110825 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120703 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120806 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130212 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130312 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20130514 |
|
A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130624 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130813 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130904 |
|
R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S531 | Written request for registration of change of domicile |
Free format text: JAPANESE INTERMEDIATE CODE: R313531 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
LAPS | Cancellation because of no payment of annual fees |