JP2007077471A - Masking device for film formation - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a masking device for film formation, which can be easily assembled, eliminates poor insulation or breaking of a wire due to a displacement of a spacer and upper and lower mask sheets, and provides high operatability and reliability. <P>SOLUTION: The masking device for film formation has: the spacer 5 having a through-hole formed therein; a lower mask 4 having a mask pattern corresponding to the through-hole formed therein; an upper mask 6 having a mask pattern corresponding to the through-hole formed therein; a top plate 7 for pressing the mask; and the bottom plate 1 for pressing the mask. A specific component of the masking device for film formation has a base guide pin 33 to be fixed on a plate surface of a component, and two or more fixed guide pins 35 and 36 formed thereon. The other component of the masking device for film formation has a guiding hole for engagement and a positioning hole formed therein. The vertex of the fixed guide pin to be inserted into the guiding hole is formed so as to be approximately parallel to the top face of the upper mask. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a film forming mask apparatus for forming an electrode material on a quartz plate, a ceramic plate, etc., and more particularly to an improvement of a film forming mask apparatus in which a mask is aligned by a guide pin.

For example, when performing physical vapor deposition of metal materials for electrodes in the electrode forming process of a crystal resonator, electrodes were formed on necessary portions of the crystal piece by vacuum vapor deposition or sputtering using a film formation mask device. . The vapor deposition method using this film forming mask apparatus is a method of stacking a plurality of masks such as a spacer for housing a crystal plate, upper and lower mask plates, and other auxiliary jigs, and integrating them by screwing or magnetic force. It is common to use, integrate necessary mask constituent parts by spot welding, or assemble two or more integrated parts by screwing or the like. The reason why the mask plate or the like is used in such a state that it can be divided is that it is necessary to peel and remove the vapor deposition electrode material (silver, gold, aluminum, etc.) adhering to the mask plate or the like. This peeling and removing operation is performed by immersing in a specific cleaning solution. And before performing the said electrode formation process, plate bodies, such as a plurality of masks, such as the said spacer, an upper and lower mask board, and another auxiliary jig, are piled up and integrated again. Recently, as shown in Patent Document 1, in order to simplify such a screwing operation, a method of bringing a mask plate or the like into close contact with a magnetic force has become widespread.
Japanese Patent Publication No. 6-74498

  In such an integration operation, if the alignment is not performed when the spacer and the upper and lower mask plates are overlapped, the electrode deposited on the quartz plate may shift. In particular, in a miniaturized quartz plate, the problem of this electrode displacement is remarkable, and it is easy to lead to a decrease in product yield due to defective wiring or disconnection. In the assembly work of the plate body, the spacer and the upper and lower mask plates are aligned by the spacers, screw holes provided in the upper and lower masks, or guide pins and guide holes. In this case, since the positioning by the screw holes cannot be performed and the positioning is performed only by the guide pins and the guide holes, the position accuracy of the guide pins and the guide holes easily affects the product yield. In particular, in the case where the positioning accuracy of the guide pin and the guide hole is poor, even when accurate alignment is achieved when the spacer and the upper and lower mask plates are overlapped, a deviation occurs due to an impact or the like when transporting these mask devices. There was a problem.

  Conventionally, in a general film forming mask apparatus having a guide pin, a guide hole into which the guide pin is inserted is formed in two types of shapes. One is a fixing guide hole formed to have substantially the same diameter as the guide pin, and the other is to have substantially the same diameter as the guide pin in a specific direction in order to absorb the generation of stress due to the thermal expansion difference of each mask member. In addition to being formed, it has a diameter larger than that of the guide pin in a direction perpendicular to the specific direction, and includes a positioning hole formed in, for example, an oval shape or a rectangular shape. Normally, the guide pin and the guide hole are worn with use, but the influence of the wear tends to increase in the positioning hole, and the positional accuracy of the guide pin and the guide hole is deteriorated. As a result, the product yield is reduced due to the mask displacement. There was a problem of being invited. In other words, the guide hole having a specific margin with respect to the guide pin is unsuitable for recent miniaturized quartz plates, which leads to a decrease in product yield due to wiring defects due to mask displacement and the need for disconnection. Cheap. In addition, the high-frequency quartz plate is thinned, and the spacer and the upper and lower mask plates are also thinned accordingly, so that it is difficult to position the deposition mask device.

  Further, the guide hole is generally formed by etching which has ease of processing and cost advantages. However, when the guide hole is formed by etching, the shallow part is formed slightly wider than the deep part of the hole due to the processing characteristics, and the convex remaining part is formed at the center of the hole. There was also a problem that the positional accuracy of the pin and the guide hole was likely to be further deteriorated.

  An object of the present invention is to provide a film forming mask apparatus that facilitates the assembling work of a film forming mask apparatus, eliminates an insulation failure and a disconnection defect due to misalignment between a spacer and upper and lower mask plates, and has high workability and reliability. It is intended.

In view of the above, the film forming mask apparatus according to the present invention comprises, as shown in claim 1, a spacer in which a plurality of through-holes to be deposited are formed, a spacer formed in close contact with the lower surface of the spacer, and the through hole A lower mask having a lower mask pattern for film formation formed in a portion corresponding to the upper surface of the spacer, and an upper mask pattern for film formation formed in a portion corresponding to the through hole. A film forming mask apparatus comprising an upper mask, a mask pressing upper plate and a mask pressing lower plate arranged in close contact with each other on the outer side of the lower mask and the upper mask,
A specific component member of the film forming mask apparatus is formed with a reference guide pin and two or more fixed guide pins fixed to the plate surface of the component member,
The reference guide pins and other film forming mask devices in which the fixed guide pins are not formed include a guide hole that fits with one of the reference guide pins and one of the fixed guide pins, A positioning hole is formed in which the other fixed guide pin is positioned, and only the direction in which the other fixed guide pin and the reference guide pin are arranged is wider than the fixed guide pin,
The apex of the fixed guide pin inserted into the guide hole is formed at substantially the same height as the upper surface of the upper mask, the lower surface of the lower mask, or the upper surface of the upper mask and the lower surface of the lower mask. And

  In addition to the above configuration, the top of the fixed guide pin inserted into the positioning hole is formed higher than the top of the fixed guide pin inserted into the guide hole. It is characterized by.

  According to a third aspect of the present invention, in addition to the above-described configuration, a taper is formed so that the apex of the fixed guide pin inserted into the guide hole gradually increases toward the reference guide pin. It is characterized by.

  According to a fourth aspect of the present invention, in addition to the above-described configuration, a magnet holding plate or a plate-shaped magnet body holding a plurality of magnets is interposed between the film forming mask devices, so that the film forming mask device is magnetically applied. It is characterized by sticking.

  According to a fifth aspect of the present invention, in addition to the above-described configuration, the thermal expansion coefficients of at least the spacer, the upper mask, and the lower mask among the constituent members of the film forming mask apparatus are approximated. To do.

  Further, as shown in claim 6, in addition to the above-described configuration, a reference guide pin and a fixed guide pin are formed on any one of the upper mask holding plate, the lower mask holding plate, or the magnet holding plate. Features.

  According to claim 1 of the present invention, when a film forming mask apparatus comprising the spacer and the upper and lower masks is assembled, a reference guide pin fixed to a plate surface of a specific component of the film forming mask apparatus and two or more reference guide pins A fixed guide pin is formed, and is inserted into a guide hole configured to fit with the reference guide pin and one fixed guide pin formed in another film forming mask apparatus other than the constituent members, and the film forming mask Since the devices are aligned without being displaced from each other, there is no mask displacement.

Since the reference guide pin, one fixed guide pin, and each guide hole in the film forming mask apparatus are configured to fit each other, the positional accuracy of the reference guide pin or one of the fixed guide pins and the guide hole is increased by wear. The adverse effect of lowering is drastically suppressed. As a result, a reduction in product yield due to mask displacement can be eliminated. Furthermore, since the influence of wear is small, even if the guide hole is formed by etching, its reliability is not lowered.

In addition, the apex of the fixed guide pin inserted into the guide hole is formed at substantially the same height as the upper surface of the upper mask, the lower surface of the lower mask, or the upper surface of the upper mask and the lower surface of the lower mask. When assembling a film forming mask apparatus composed of the spacer and the upper and lower masks, the insertability into the guide hole is not lowered.

Since the other fixed guide pins are inserted into the positioning holes whose width is wider than the fixed guide pins only in the direction in which the other fixed guide pins and the reference guide pins are arranged, the spacer, the upper and lower masks, and the mask presser upper plate And a mask presser lower plate and a mask presser lower plate that are not positioned by the fixed guide pins inserted into the guide holes without degrading the insertability into the positioning holes. Can be positioned.

As described above, the film forming mask apparatus can be easily assembled, and the aligned film forming mask apparatus is not displaced by a mask after assembly due to an impact during transportation. It is possible to provide a film formation mask device that eliminates defective insulation and disconnection and has high workability and reliability.

  According to claim 2 of the present invention, in addition to the above-described effects, the vertex of the fixed guide pin inserted into the positioning hole is formed higher than the vertex of the fixed guide pin inserted into the guide hole. When inserting each fixed guide pin into the guide hole or positioning hole with the reference guide pin as a base point, the fixed guide pin formed higher after the first fixed guide pin is first inserted into the positioning hole. Is later inserted into the guide hole. As a result, the high fixed guide pin that is inserted first is inserted into the positioning hole that is formed so that the direction in which it is arranged with the reference guide pin is wide, so that rough positioning can be performed without reducing the insertion workability. Can do. Since the low fixed guide pin to be inserted later is inserted into the guide hole that fits in a roughly positioned state, high-accuracy positioning can be completed without reducing the insertion workability.

  According to claim 3 of the present invention, in addition to the above-described effects, a taper is formed such that the apex of the fixed guide pin inserted into the guide hole gradually increases toward the reference guide pin. Using the reference guide pin as a base point, the workability when the fixed guide pin is inserted into the guide hole can be remarkably improved, and the film forming mask apparatus can be easily assembled.

  According to claim 4 of the present invention, in addition to the above-described effects, the mask plate and the like can be easily brought into close contact by magnetic force without screwing, so that the film forming mask apparatus can be assembled and disassembled very easily. can do.

  According to the fifth aspect of the present invention, in addition to the above-described effects, the guide pins and the guide holes of these members are not displaced due to the difference in thermal expansion between the spacer, the upper mask, and the lower mask. No stress is generated between them. For this reason, mask displacement is eliminated, and adverse effects such as destruction of the mask device and lift of the mask are eliminated. Since the upper and lower masks are more securely fixed, the crystal plate is prevented from being displaced and lifted, and more reliable and highly reliable film formation can be performed.

  According to claim 6 of the present invention, in addition to the above-described effects, by forming a reference guide pin and a fixed guide pin on any one of the mask holding upper plate, the mask holding lower plate, or the magnet holding plate, Since the thickness dimension of the spacer and the upper and lower masks is not increased, the mask pattern can be arranged in close contact with the film formation target, and film formation with higher accuracy according to the mask pattern can be performed.

  An embodiment according to the present invention will be described with reference to the drawings by taking as an example the formation of an electrode of a crystal resonator using a rectangular crystal plate. FIG. 1 is an exploded perspective view showing a film forming mask apparatus according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view taken along line AA in FIG. FIG. 3 is a sectional view of the assembled state of FIG.

  The film formation mask apparatus is, for example, a rectangular plate, and from below, from a mask holding lower plate 1, a magnet holding lower plate 2, a magnet holding upper plate 3, a lower mask 4, a spacer 5, an upper mask 6, and a mask holding upper plate 7. It is comprised in the state which can be attached or detached. The reason why the film forming mask apparatus is used in such a detachable state is that it is necessary to peel and remove the vapor deposition electrode material (silver, gold, aluminum, etc.) adhering to the mask or the like. This peeling and removing operation is performed by immersing in a specific cleaning solution, and the spacer, the upper and lower masks, other auxiliary jigs, and the like are overlapped and integrated again before the electrode forming step.

  At the bottom, a mask presser lower plate 1 made of a magnetic material such as SUS-430 is disposed. The mask holding lower plate 1 has a plurality of through holes 11 for exposing a lower mask pattern of a lower mask, which will be described later. In addition, a circular guide hole 13 is formed at one end of the mask presser lower plate 1 in the long side direction so as to be inserted into a reference guide pin 33 described later. At the other end of the direction, a length for positioning a fixed guide pin 35, which will be described later, in such a manner that it can slide only in the long side direction of the mask holding lower plate (the direction in which the fixed guide pin 35 and the reference guide pin 33 are arranged), for example. A circular positioning hole 15 is formed.

  On the upper surface of the mask presser lower plate 1, two magnets, a magnet holding lower plate 2 made of a magnetic material such as SUS-430 and a magnet holding upper plate 3 made of a non-magnetic material such as SUS-304, are superimposed. A magnet holding plate to be housed is arranged in close contact. The magnet holding lower plate 2 is formed with a plurality of through holes 21 corresponding to the above-described through holes 11 and exposing the lower mask pattern, and a plurality of magnet storage portions 22 for positioning and storing the magnet M. Yes. In addition, a circular guide hole 23 is formed at one end of the magnet holding lower plate 2 in the long side direction so as to be fitted in a reference guide pin 33 described later. At the other end of the direction, an ellipse for positioning a fixed guide pin 35, which will be described later, for example, in a state in which it can slide only in the long side direction of the magnet holding plate (the direction in which the fixed guide pin 35 and the reference guide pin 33 are arranged). A positioning hole 25 is formed.

  The magnet holding upper plate 3 is formed with a plurality of through holes 31 corresponding to the above-described through holes 21 and exposing the lower mask pattern, and magnetically permeable holes for positioning with the upper part of the magnet M partially exposed. A plurality of (through holes) 32 are formed. In addition, a cylindrical reference guide pin 33 for positioning each mask component is implanted on one side of the long side direction of the magnet holding upper plate 3 on the upper and lower surfaces. At the other end, a cylindrical fixed guide pin 35 for positioning each mask component is planted on the upper and lower surfaces, and a fixed guide pin 34 is implanted on the upper surface on the outer end side of the fixed guide pin 35. ing. The vertex of the fixed guide pin 35 is formed higher than the vertex of the fixed guide pin 34. The fixed guide pin 34 positions only the lower mask 4, the spacer 5 and the upper mask 6 which will be described later, and the apex of the fixed guide pin 34 is formed at substantially the same height as the upper surface of the upper mask which will be described later. The apex portion of the reference guide pin 33 is formed with a taper 331 that gradually increases toward the fixed guide pin 35. Each apex portion of the fixed guide pin 34 is formed with a taper 341 that gradually increases toward the reference guide pin 33, and a taper 342 is also formed at a portion facing the taper 341. The apex portion of the fixed guide pin 35 is formed with a taper 351 that gradually increases toward the reference guide pin 33.

  A lower mask 4 made of a magnetic material such as SUS-430 is disposed in close contact with the upper surface of the magnet holding upper plate 3. The lower mask 4 is formed with a plurality of lower mask patterns 41 corresponding to predetermined positions of a crystal plate Q to be described later, and the magnetic force is applied to positions corresponding to the upper portions where the magnets are disposed, as will be described later. A magnetically permeable hole (through hole) 42 is formed. Further, circular guide holes 43 and 44 inserted in a state where the reference guide pin 33 and the fixed guide pin 34 are fitted to each other and both ends in the long side direction of the lower mask 4 and fixed guide pins 35 are provided, for example. An oval positioning hole 45 is formed for positioning in a slidable state only in the long side direction of the lower mask (direction in which the fixed guide pin 35 and the reference guide pin 33 are arranged).

  A spacer 5 is disposed in close contact with the upper surface of the lower mask 4. The spacer 5 is made of a magnetic material such as SUS-430, and is provided with a through hole 51 for positioning and storing a plurality of quartz plates Q at a predetermined interval, and at a position corresponding to the upper portion where the magnet is disposed. A permeable hole (through hole) 52 is formed to transmit magnetic force to an upper mask or the like to be described later. Further, circular guide holes 53 and 54 to be inserted in a state in which the reference guide pin 33 and the fixed guide pin 34 are fitted to each other and both ends in the long side direction of the spacer 5 and the fixed guide pin 35 are, for example, a spacer. An oblong positioning hole 55 is formed for positioning in a slidable state only in the long side direction (the direction in which the fixed guide pin 35 and the reference guide pin 33 are arranged).

  An upper mask 6 made of a magnetic material such as SUS-430 is disposed in close contact with the upper surface of the spacer 5. The upper mask 6 is formed with a plurality of upper mask patterns 61 corresponding to predetermined positions of the above-mentioned quartz plate Q, and the magnetic force is applied to a position corresponding to the upper portion where the magnet is disposed, as will be described later. A magnetic permeable hole (through hole) 62 is formed to transmit to the upper plate. Further, circular guide holes 63 and 64 inserted in a state where the reference guide pin 33 and the fixed guide pin 34 are fitted to each other and both ends in the long side direction of the upper mask 6 and the fixed guide pin 35 are provided, for example. An oval positioning hole 65 is formed for positioning in a slidable state only in the long side direction of the upper mask (the direction in which the fixed guide pins 35 and the reference guide pins 33 are arranged).

  A mask presser upper plate 7 made of a magnetic material such as SUS-430 is disposed at the top. A plurality of through holes 71 for exposing the upper mask pattern of the upper mask described above are formed in the mask holding upper plate 7, and the reference guide pins are provided at both ends in the long side direction of the mask holding upper plate 7. For example, the circular guide hole 73 and the fixed guide pin 35 inserted in a state of being fitted to 33 are arranged only in the long side direction of the mask pressing upper plate (the direction in which the fixed guide pin 35 and the reference guide pin 33 are arranged). An oval positioning hole 75 for positioning in a slidable state is formed.

  In addition, in each of the above mask structures, the through hole exposing the mask pattern, the mask pattern, the magnet storage portion, the magnetic permeability hole, the through hole storing the crystal plate, the guide hole, the positioning hole, etc. are easy to create and cost. Because of its merit, it is formed by an etching technique. The guide hole is formed by etching after etching with a diameter smaller than that of the guide pin and then performing reaming using a tool having a diameter substantially the same as the guide pin. The convex remaining portion at the center of the cross section of the hole that may possibly be removed is completely removed, and a more desirable fit with the guide pin can be performed. As a result, the positioning accuracy is dramatically improved, and adverse effects such as a decrease in the positional accuracy of the guide pin and the guide hole due to wear are drastically suppressed.

  Then, by performing physical vapor deposition on such a film formation mask device by a vacuum vapor deposition method, a sputtering method or the like, a film formation body (crystal piece) having a desired film formation pattern can be obtained.

  In the above-described embodiment, three guide pin configurations including one reference guide pin and two fixed guide pins at both ends in the long side direction are disclosed. However, each guide pin is formed and the number of each guide pin is formed. Is not specified. For example, in FIG. 4, in addition to the configuration of the above embodiment, the reference guide pin 36 is formed at one end portion in the long side direction of the magnet holding upper plate 3 with a slight shift from the reference guide pin 33 in the short side direction. In each of the other film forming mask devices, circular guide holes 16, 26, 46 to 76 that are inserted in a state of being fitted to the reference guide pins 36 are formed. The two reference guide pins 33 and 36 are arranged close to each other, and a taper 361 is formed at the apex portion of the reference guide pin 36 so as to gradually increase toward the reference guide pin 33. For this reason, in the configuration of the present embodiment, when assembling each film forming mask apparatus, the positioning is performed by the two reference guide pins without deteriorating the insertion property, so that the film does not rotate with the reference guide pin as a base point, and is displaced. This is a more preferable form in which it is difficult to occur. Further, since the direction of the front and back of each film forming mask apparatus can be recognized by the added guide holes 16, 26, 46 to 76, the front and back are not mistakenly assembled. In addition, the structure which increased not only the reference | standard guide pin but the formation number of the fixed guide pin may be sufficient.

  Further, the reference guide pin and the fixed guide pin are formed only on the magnet holding plate. However, specific components (mask holding lower plate 1, lower mask 4, spacer 5) constituting another film forming mask apparatus are disclosed. The upper mask 6 and the mask holding upper plate 7) can be selectively formed, and the reference guide pin and the fixed guide pin may be formed on different specific components. However, only the lower mask 4, the spacer 5, and the upper mask 6 are fixed guide pins (fixed guide pins 34 in the above embodiment) that are inserted in a state of being fitted to circular guide holes among the fixed guide pins. Therefore, it is necessary to form the apex of the fixed guide pin 34 at substantially the same height as the upper surface of the upper mask, the lower surface of the lower mask, or the upper surface of the upper mask and the lower surface of the lower mask according to the formation location. There is. In addition, since the reference guide pin and the fixed guide pin are formed on any one of the mask holding upper plate, the mask holding lower plate, and the magnet holding plate, the thickness of the spacer and the upper and lower masks is not increased. It is more preferable that the mask pattern can be disposed in a state of being in close contact with the film formation target body, and the film can be formed with higher accuracy according to the mask pattern. Further, the guide pin (reference guide pin, fixed guide pin) is formed in a cylindrical shape and the guide hole is formed in a circular shape. However, other shapes may be used as long as they can be fitted to each other.

  In the above embodiment, since the materials of the spacer, the upper mask, and the lower mask are unified to SUS-430, these members are not displaced from each other due to a difference in thermal expansion, and each guide pin and each guide hole No stress is generated during this period. For this reason, the mask displacement is eliminated, and adverse effects such as destruction of the mask device and lift of the mask are eliminated. Not only these materials but also a combination of one or more other materials is not particularly problematic, but it is preferable to use materials having similar thermal expansion coefficients.

  It should be noted that the present invention is not limited to those disclosed in each of the above embodiments, and the lower mask, the spacer, and the upper mask may be integrated by a magnet such as a method using a spacer made of a plate-like magnet body. However, they may be integrated by tightening with screws. Although the film formation target is a rectangular crystal plate, it can also be applied to crystal plates of other shapes such as a disk shape and a tuning fork shape, and a crystal filter. Other piezoelectric vibrators such as ceramics may be used, and can be applied to a wide range of film forming bodies such as electrode formation of electronic parts.

  That is, the present invention can be implemented in various other forms without departing from the spirit or containment characteristics thereof, and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not limited by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

The disassembled perspective view which shows the Example of this invention. Sectional drawing along the AA line of FIG. Sectional drawing of the state which assembled FIG. The disassembled perspective view which shows the other Example of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mask pressing lower plate 2 Magnet holding lower plate 3 Magnet holding upper plate 4 Lower mask 5 Spacer 6 Upper mask 7 Mask pressing upper plate M Magnet Q Crystal plate (film formation target)

Claims (6)

A spacer in which a plurality of through-holes for forming a film-formation forming body are formed, and a lower mask that is disposed in close contact with the lower surface of the spacer and has a lower mask pattern for film formation formed in a portion corresponding to the through-hole. An upper mask that is disposed in close contact with the upper surface of the spacer and has an upper mask pattern for film formation formed in a portion corresponding to the through hole, and is disposed in close contact with the outer side of the lower mask and the upper mask. A film mask apparatus comprising a mask presser upper plate and a mask presser lower plate,
A specific component member of the film forming mask apparatus is formed with a reference guide pin and two or more fixed guide pins fixed to the plate surface of the component member,
The reference guide pins and other film forming mask devices in which the fixed guide pins are not formed include a guide hole that fits with one of the reference guide pins and one of the fixed guide pins, A positioning hole is formed in which the other fixed guide pin is positioned, and only the direction in which the other fixed guide pin and the reference guide pin are arranged is wider than the fixed guide pin,
The apex of the fixed guide pin inserted into the guide hole is formed at substantially the same height as the upper surface of the upper mask, the lower surface of the lower mask, or the upper surface of the upper mask and the lower surface of the lower mask. A film forming mask apparatus. 2. The film forming mask apparatus according to claim 1, wherein a vertex of the fixed guide pin inserted into the positioning hole is formed higher than a vertex of the fixed guide pin inserted into the guide hole. The film forming mask apparatus according to claim 1, wherein a taper is formed such that the apex of the fixed guide pin gradually increases toward the reference guide pin. 4. The film-forming mask device is closely attached by a magnetic force by interposing a magnet holding plate or a plate-like magnet body holding a plurality of magnets between the film-forming mask devices. The film-forming mask apparatus of description. 5. The film forming mask apparatus according to claim 1, wherein among the constituent members of the film forming mask apparatus, the thermal expansion coefficients of at least the spacer, the upper mask, and the lower mask are approximated. . The film formation according to claim 1, wherein a reference guide pin and a fixed guide pin are formed on any one of the mask holding upper plate, the mask holding lower plate, and the magnet holding plate. Mask device.

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