JP2005130342A - Manufacturing method of surface acoustic wave device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method, by which a surface acoustic wave element is mounted on a mounting substrate, and by which a surface acoustic wave device impressed with a seal for specifying a product can be manufactured at low cost. <P>SOLUTION: The manufacturing method of a surface acoustic wave device 6 is provided with a process of mounting a plurality of surface acoustic wave elements 3 on an aggregated substrate 10, composed of a plurality of mounting substrates so that the aggregated substrate 10 is faces the oscillating portion of the surface acoustic wave elements 3, a process of sealing the surface acoustic wave elements mounted with a sealing resin 4, a process of coating a printing resin 5 on the sealing resin 4 and curing, a process of sealing the printing resin 5 with a CO<SB>2</SB>laser, and a process of dividing the aggregated substrate 10 into individual devices. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention relates to a method of manufacturing a surface acoustic wave device used for a communication device such as a mobile phone, and more particularly to a method of manufacturing a surface acoustic wave device having a seal for specifying a product.

  Due to the recent reduction in size and weight of electronic devices, electronic components are also required to be multifunctional. Against this background, surface acoustic wave filters (hereinafter referred to as SAW filters) as surface acoustic wave devices used in communication devices such as mobile phones are similarly required to be smaller and lighter. Yes.

  Therefore, in recent years, as disclosed in Patent Document 1, for example, a surface acoustic wave element is mounted on a mounting substrate by a Philip chip bonding method, and the surface acoustic wave element is sealed with a sealing resin. A surface acoustic wave device having a chip size package has been proposed. In other words, the surface acoustic wave element is sealed with a sealing resin instead of a package structure having a lid and a side wall, so that the size is reduced.

In the surface acoustic wave device of the chip size package as described above, the marking for specifying the product has been conventionally performed as shown in FIG. As shown in FIG. 8, the surface acoustic wave device 105 is picked up by the component supply device 100, the surface acoustic wave device is picked up one by one, the direction is recognized by the image processing device 101 for direction recognition, and the element transport / direction is detected. A direction recognition step of setting the surface acoustic wave device 105 in a predetermined direction by the rotating nozzle 102, and an alignment step of arranging and aligning the surface acoustic wave device 105 set in a desired direction in a plurality of recesses in the component placement table 103. In addition, the surface acoustic wave devices 105 arranged on the component placement table 103 are subjected to a stamping process in which the laser marker 104 is used for marking.
Japanese Patent Laid-Open No. 10-321666 (Released on December 4, 1998)

  However, the above-described conventional marking method requires a process of aligning the surface acoustic wave device with the component placement table 103, which increases the manufacturing time.

  Further, when aligning the surface acoustic wave device with the component placement table 103, in order to set the surface acoustic wave device in a desired direction, it is necessary to install an image processing device 101 for performing position recognition. The cost increase was also invited.

  Further, with the miniaturization of the surface acoustic wave device, the component supply device 100 is required to have higher positioning accuracy when arranging the surface acoustic wave devices, which further increases the cost of production equipment. It was.

Furthermore, when the piezoelectric substrate of the surface acoustic wave device is a transparent substrate such as LiTaO ₃ , LiNbO ₃ , quartz, etc., if a YAG laser is used for the laser marker 104, the laser transmits through the piezoelectric substrate, which is a transparent substrate, when marking. There is also a problem that the comb-shaped electrode portion in the surface acoustic wave device is destroyed.

  The present invention has been made in view of the above-described problems, and an object of the present invention is to provide a surface acoustic wave device in which a surface acoustic wave element is mounted on a mounting substrate and a mark for identifying the product is provided. It is in providing the manufacturing method which can be manufactured cheaply.

In order to solve the above problems, a method for manufacturing a surface acoustic wave device according to the present invention includes mounting a surface acoustic wave element having a piezoelectric substrate and a vibrating portion including a comb-shaped electrode portion formed on the piezoelectric substrate. A method of manufacturing a surface acoustic wave device in which a substrate and the vibrating portion are mounted so as to face each other, and the mounted surface acoustic wave element is sealed with a sealing resin, the method comprising: a plurality of mounting substrates Mounting a plurality of surface acoustic wave elements on the assembly substrate, sealing the plurality of mounted surface acoustic wave elements with a sealing resin, and applying and curing a printing resin on the sealing resin And a step of stamping the printing resin with a CO ₂ laser, and a step of dividing the aggregate substrate into individual devices.

  Further, in order to solve the above problems, a method for manufacturing a surface acoustic wave device according to the present invention includes a surface acoustic wave element including a piezoelectric substrate and a vibrating portion including a comb-shaped electrode portion formed on the piezoelectric substrate. A method of manufacturing a surface acoustic wave device in which a mounting substrate and the vibrating portion are mounted so as to face each other, and the mounted surface acoustic wave element is sealed with a sealing resin, the method comprising: A step of mounting a surface acoustic wave element having a protective film on a surface different from the surface on which the electrode portion is formed on a collective substrate composed of a plurality of mounting substrates, and sealing the plurality of mounted surface acoustic wave elements The method includes a step of sealing with a resin, a step of stamping the sealing resin with a laser, and a step of dividing the assembly substrate into individual devices.

  Furthermore, in the method for manufacturing a surface acoustic wave device of the present invention, it is preferable that the collective substrate has a direction recognition portion.

  Furthermore, in the method for manufacturing a surface acoustic wave device according to the present invention, it is preferable that the aggregate substrate is divided into a plurality of regions, and marking is performed for each region.

Furthermore, in the method for manufacturing a surface acoustic wave device of the present invention, the piezoelectric substrate is preferably made of any one of LiTaO ₃ , LiNbO ₃ , and quartz.

As described above, the surface acoustic wave device manufacturing method according to the present invention has the surface acoustic wave device mounted on the collective substrate. Therefore, the surface acoustic wave device is arranged in a desired direction at the time of stamping. Since it is not necessary, the manufacturing time can be shortened, and an image processing device for recognizing the direction of the surface acoustic wave device is not necessary, and the cost of production equipment can be reduced. Furthermore, after the printing resin is coated and cured on the sealing resin, since the seal on the print resin by CO ₂ laser, may be used an inexpensive and excellent in maintenance performance CO ₂ laser marker, The cost of production facilities can be further reduced. Further, since the CO ₂ laser is almost absorbed by the piezoelectric substrate of the surface acoustic wave element, the comb-shaped electrode portion is not broken, and the yield rate of the manufactured surface acoustic wave device can be improved. . As described above, the production cost of the surface acoustic wave device can be suppressed.

  As described above, the surface acoustic wave device manufacturing method according to the present invention has the surface acoustic wave device mounted on the collective substrate. Therefore, the surface acoustic wave device is arranged in a desired direction at the time of stamping. Since it is not necessary, the manufacturing time can be shortened, and an image processing device for recognizing the direction of the surface acoustic wave device is not necessary, and the cost of production equipment can be reduced. Furthermore, the surface acoustic wave element has a protective film formed on a surface different from the surface on which the comb-shaped electrode portion of the piezoelectric substrate is formed. Transmission through the substrate is prevented. Thereby, the comb-shaped electrode portion of the surface acoustic wave element can be prevented from being broken by the laser, and the yield rate of the surface acoustic wave device to be manufactured can be improved. As described above, the production cost of the surface acoustic wave device can be suppressed.

  Furthermore, in the method for manufacturing a surface acoustic wave device according to the present invention, since the collective substrate has a direction recognition portion, the direction in which the surface acoustic wave element is to be mounted and the collective substrate at the time of marking are moved. The direction can be easily recognized without erroneous recognition.

  Furthermore, in the method for manufacturing a surface acoustic wave device according to the present invention, the aggregate substrate is divided into a plurality of regions, and the marking is performed by changing the laser direction using a scan mirror for each region. There is no need to move the collective substrate or the laser marker.

  Generally, since the collective substrate is attracted and held on a direct biaxial robot and the collective substrate is moved for marking, if each surface acoustic wave device is imprinted, the communication time and operation with the laser marker are performed. Since time is required for the number of surface acoustic wave devices manufactured from one collective substrate, it takes a very long time to process one collective substrate.

  On the other hand, by dividing and stamping the collective substrate into regions as described above, the number of times and the time for moving the collective substrate or the laser marker as compared with the case of printing each surface acoustic wave device on the collective substrate one by one. And can be stamped in a short time.

Examples of the piezoelectric substrate include LiTaO ₃ , LiNbO ₃ , and quartz.

[Embodiment 1]
A method for manufacturing a surface acoustic wave device according to an embodiment of the present invention will be described below with reference to FIGS. The method of manufacturing the surface acoustic wave device according to the present embodiment is such that after the surface acoustic wave element is sealed with resin on the collective substrate, each elastic material is kept in the state of the collective substrate before the surface acoustic wave device is individually cut. The surface wave device is stamped to identify a product. The surface acoustic wave element includes a vibrating portion including a piezoelectric substrate and at least one comb-shaped electrode portion on the piezoelectric substrate. Examples of the piezoelectric substrate include transparent substrates such as LiTaO ₃ , LiNbO ₃ , and quartz.

  The surface acoustic wave device manufacturing method according to the present embodiment roughly includes (1) a surface acoustic wave element mounting process, (2) a sealing process, (3) a resin coating process for printing, and (4) a stamping process. And (5) a dicing process is included.

  Further, after the dicing process, a curing process for completely curing the sealing resin 4 and the printing resin 5 and a characteristic selection for inspecting whether the manufactured surface acoustic wave device has a predetermined characteristic. A predetermined number of processes and surface acoustic wave devices are inserted into a tape that is a shipping form to perform a shipping process, and an inspection process that is a final inspection before shipping is performed. Details are as shown in FIG.

  Hereinafter, each process of said (1)-(5) is demonstrated in detail.

  In the surface acoustic wave element mounting step (1), after preparing a collective substrate 10 in which the mounting substrates 1 in the surface acoustic wave device are aggregated (see FIG. 1A), the bumps 2b having a reduced diameter are disposed on the collective substrate 10. A plurality of surface acoustic wave elements 3 are formed on the electrode lands 2a or on the electrode pads of the surface acoustic wave elements 3 so that each surface acoustic wave element 3 corresponds to the mounting substrate 1 or the like. This is a process of mounting on the collective substrate 10 (see FIG. 1B).

  As such a collective substrate 10, a ceramic substrate, a resin substrate, or the like can be used. In this embodiment, instead of the collective substrate 10, collective substrates 10a to 10d shown in FIGS. 4A to 4D may be used.

  These collective substrates 10a to 10d are each capable of recognizing the direction in which the surface acoustic wave element 3 is to be mounted on the collective substrate 10 and the display direction at the time of imprinting. , Mark 13 and mark 14) are formed. The collective substrate 10c is such that the mark 13 is formed near the apex of the rectangular collective substrate 1c. The collective substrate 10d is formed by forming the mark 14 near the center of one side of the rectangular collective substrate 10d. The formation position of the direction recognition unit is not particularly limited as long as it is a position where the direction on the collective substrate 10 can be recognized. Further, the shape of the hole 12 and the marks 13 and 14 is not particularly limited, and may be any shape such as a circle, a triangle, or a quadrangle. By this direction recognition unit, it is possible to align the directions of the surface acoustic wave elements 3 on the collective substrate 10 easily and without erroneous recognition.

  The bump 2 b joins the surface acoustic wave element 3 to the collective substrate 10 (mounting substrate 1) and secures a space between the surface acoustic wave element 3 and the collective substrate 10. When the surface acoustic wave element 3 is mounted on the collective substrate 10 (mounting substrate 1), the surface of the piezoelectric substrate of the surface acoustic wave element 3 on which the comb-shaped electrode portion is formed is the collective substrate 10 (mounting substrate 1). ) So that it faces.

  In the sealing step (2), the sealing resin 4 is applied to the collective substrate 10 on which the surface acoustic wave element 3 is mounted so as to seal the surface acoustic wave element 3, and the sealing resin 4 is cured. (See FIG. 1C).

  The printing resin coating step (3) is a step of applying the printing resin 5 on the sealing resin 4 and curing the printing resin 5 (see FIG. 1D). That is, it is a step of overcoating the printing resin 5 on the sealing resin 4. Examples of the printing resin 5 include a resin having a color different from a resin containing a color former or a sealing resin. As the color former, commercially available ones can be used, and examples thereof include azo dyes and titanium oxide.

  The stamping step (4) is a step of stamping the printing resin 5 with a laser. As shown in FIG. 5, the stamping process is performed by separating the printing resin 4 on the collective substrate 10 shown in FIG. 1D with the laser 9 of the laser marker 8 and the subsequent dicing process (5). Sealing is performed for each surface acoustic wave device. When a resin containing a color former is used as the printing resin 5, the printing resin 5 is colored by the laser 9 of the laser marker 8, and high visibility marking can be performed. Further, when a resin having a color different from that of the sealing resin 4 is used as the printing resin 5, the printing resin 5 is shaved with the laser 9 of the laser marker 8 to expose the sealing resin 4 and the difference in contrast. Highly visible marking can be performed.

As the laser 9 of the laser marker 8, any laser having a wavelength that can be absorbed by the piezoelectric substrate without destroying the comb-shaped electrode portion of the surface acoustic wave element 3 by the laser 9, for example, the surface acoustic wave element 3 can be used. In which the wavelength is 9.3 μm to 13 μm, specifically, a CO ₂ laser is preferable. Thereby, it can prevent that the comb-shaped electrode part in the surface acoustic wave element 3 is destroyed, and can improve the yield rate of the surface acoustic wave apparatus manufactured. The CO ₂ laser marker is particularly preferable because it is inexpensive and excellent in maintainability.

  The detailed structure of the laser marker 8 is shown in FIG. The laser marker 8 includes scan mirrors 20 and 20. The direction of the laser 9 emitted from the laser marker 8 can be changed by the scan mirror 20. As a result, the laser marker 8 can be stamped with the position being fixed in the region (scannable region) divided by the one-dot chain line of the collective substrate 10 in FIG.

  In general, the collective substrate 10 is attracted and held on the orthogonal biaxial robot and the collective substrate 10 is moved to perform the marking. Therefore, if each surface acoustic wave device is imprinted, the communication time with the laser marker is increased. In addition, since the operation time is required for the number of surface acoustic wave devices manufactured from one collective substrate 10, it takes a very long time to process one collective substrate 10.

  On the other hand, by dividing and stamping the collective substrate 10 into regions as described above, the collective substrate 10 or the laser marker 8 is moved as compared with the case where each surface acoustic wave device on the collective substrate 10 is imprinted. It is possible to reduce the number of times and the time for the marking, and it is possible to perform the marking in a short time.

  Further, since the collective substrate 10 is warped or distorted, there is a possibility that the position to be stamped deviates from the design position. However, in the laser marker 8, the positional deviation of the stamp can be suppressed by correcting the position data to be stamped for each scannable region.

  The dicing process (5) is a process of dividing the aggregate substrate 10 stamped in the process (4) into the surface acoustic wave devices 6 by dicing (see FIG. 1 (e)). By this step, the surface acoustic wave device 6 shown in FIG. 3 is completed.

  Here, the thickness of the printing resin 5 when a resin containing a color former was used as the printing resin 5 was examined. The examination results are shown in Table 1.

  As can be seen from Table 1, when the thickness of the printing resin 5 is less than 5 μm, the visibility of the seal is deteriorated. Therefore, the thickness of the printing resin 5 is preferably 5 μm or more.

[Embodiment 2]
The following will describe another embodiment of the present invention with reference to FIG. For convenience of explanation, members having the same functions as those shown in the first embodiment are given the same reference numerals, and explanation thereof is omitted.

  As shown in FIG. 7, the surface acoustic wave device 6 a according to the present embodiment is not formed with the printing resin 5 in the first embodiment, and the comb-shaped electrode portion is formed on the piezoelectric substrate of the surface acoustic wave element 3. It has a structure in which a protective film 7 is formed on a surface (top surface) that is not formed.

The protective film 7 is preferably a metal film such as Ti or Cu, or an insulating film such as SiO ₂ or SiN, and can be formed by sputtering or vapor deposition. The protective film 7 may be formed in advance when the surface acoustic wave element 3 is manufactured, that is, before the surface acoustic wave element 3 is mounted on the collective substrate 10. Therefore, when the surface acoustic wave device according to the present embodiment is manufactured, the printing resin 5 in the first embodiment is not formed, and the sealing resin 4 may be stamped with a laser marker.

  In the surface acoustic wave device 6a of the present embodiment, the protective film 7 prevents the laser from the laser marker from passing through the piezoelectric substrate of the surface acoustic wave element 3, that is, the surface acoustic wave element 3 is protected. Therefore, the comb electrode portion of the surface acoustic wave element 3 is not destroyed. Thereby, the yield rate of the surface acoustic wave device manufactured can be improved.

  As the laser marker, a laser marker that can be stamped on the sealing resin 4 may be used. As this laser marker, an existing one such as a YAG laser marker can be used.

It is a figure explaining the process of the manufacturing method of the surface acoustic wave apparatus concerning one Embodiment of this invention. It is a flowchart of the manufacturing method of the surface acoustic wave apparatus concerning one Embodiment of this invention. It is sectional drawing of the said surface acoustic wave apparatus. (A)-(d) is a top view which shows the modification of an aggregate substrate. It is a figure explaining a stamping process. It is a figure explaining the modification of a stamping process. It is sectional drawing in the surface acoustic wave apparatus concerning other embodiment of this invention. It is a figure explaining the manufacturing method of the surface acoustic wave apparatus of a prior art.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Collective substrate 2 (a) Electrode land 2 (b) Bump 3 Surface acoustic wave element 4 Sealing resin 5 Printing resin 6, 6a Surface acoustic wave device 7 Protective film 8 Laser marker

Claims (5)

A surface acoustic wave element having a piezoelectric substrate and a vibrating portion formed of a comb-shaped electrode portion formed on the piezoelectric substrate is mounted so that the mounting substrate and the vibrating portion face each other, and the mounted surface acoustic wave A method of manufacturing a surface acoustic wave device in which an element is sealed with a sealing resin,
Mounting a plurality of surface acoustic wave elements on a collective substrate composed of a plurality of mounting substrates;
Sealing a plurality of mounted surface acoustic wave elements with a sealing resin;
Applying and curing a printing resin on the sealing resin;
A step of marking the printing resin with a CO ₂ laser;
Dividing the assembly board into individual devices;
A method for manufacturing a surface acoustic wave device, comprising: A surface acoustic wave element having a piezoelectric substrate and a vibrating portion formed of a comb-shaped electrode portion formed on the piezoelectric substrate is mounted so that the mounting substrate and the vibrating portion face each other, and the mounted surface acoustic wave A method of manufacturing a surface acoustic wave device in which an element is sealed with a sealing resin,
Mounting a surface acoustic wave element having a protective film on a surface different from the surface on which the comb-shaped electrode portion of the piezoelectric substrate is formed on a collective substrate composed of a plurality of mounting substrates;
Sealing a plurality of mounted surface acoustic wave elements with a sealing resin;
Marking the sealing resin with a laser;
Dividing the assembly board into individual devices;
A method of manufacturing a surface acoustic wave device comprising:   The method of manufacturing a surface acoustic wave device according to claim 1, wherein the collective substrate includes a direction recognition unit.   The surface acoustic wave device according to any one of claims 1 to 3, wherein the collective substrate is divided into a plurality of regions, and marking is performed by changing a laser direction by a scan mirror for each region. Production method. 5. The method for manufacturing a surface acoustic wave device according to claim 1, wherein the piezoelectric substrate is made of any one of LiTaO ₃ , LiNbO ₃ , and quartz.

Images