JP2010056930A5 - - Google Patents

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Publication number
JP2010056930A5
JP2010056930A5 JP2008220151A JP2008220151A JP2010056930A5 JP 2010056930 A5 JP2010056930 A5 JP 2010056930A5 JP 2008220151 A JP2008220151 A JP 2008220151A JP 2008220151 A JP2008220151 A JP 2008220151A JP 2010056930 A5 JP2010056930 A5 JP 2010056930A5
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JP
Japan
Prior art keywords
printed
shows
piezoelectric element
state
element built
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JP2008220151A
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Japanese (ja)
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JP5362293B2 (en
JP2010056930A (en
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Priority to JP2008220151A priority Critical patent/JP5362293B2/en
Priority claimed from JP2008220151A external-priority patent/JP5362293B2/en
Publication of JP2010056930A publication Critical patent/JP2010056930A/en
Publication of JP2010056930A5 publication Critical patent/JP2010056930A5/ja
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Publication of JP5362293B2 publication Critical patent/JP5362293B2/en
Expired - Fee Related legal-status Critical Current
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Description

本発明の圧電素子内蔵部品への判別記号の印字方法の実施例の印字対象となる圧電素子内蔵部品(図1(a))及び(図1(b))の縦断面図である。It is a longitudinal cross-sectional view of the piezoelectric element built-in component (FIG. 1 (a)) and (FIG. 1 (b)) used as the printing object of the Example of the printing method of the discrimination symbol to the piezoelectric element built-in component of this invention. 図1に示した圧電素子内蔵部品の分解図であって、図2(a)は、そのカバー部を、また、図2(b)は、その圧電素子部を、さらに図2(c)は、そのベース部を、それぞれ示す。FIG. 2A is an exploded view of the piezoelectric element built-in component shown in FIG. 1, FIG. 2A shows the cover part, FIG. 2B shows the piezoelectric element part, and FIG. The base parts are respectively shown. 図1に示した圧電素子内蔵部品の斜視図であって、図3(a)は、そのカバー部へ判別記号を浮き出し文字で印字した状態を、また、図3(b)は、そのカバー部へ判別記号を抜き文字で印字した状態を、さらに図3(c)は、そのベース部へ判別記号を浮き出し文字で印字した状態を、さらにまた図3(d)は、そのベース部へ判別記号を抜き文字で印字した状態を、それぞれ示す。3A and 3B are perspective views of the piezoelectric element built-in component shown in FIG. 1, in which FIG. 3A shows a state in which a discrimination symbol is printed on the cover portion, and FIG. 3B shows the cover portion. FIG. 3 (c) shows a state in which the discrimination symbol is printed with characters extracted, and FIG. 3 (d) shows a state in which the discrimination symbol is printed on the base portion, and FIG. The state in which the characters are printed with the characters omitted is shown. 本発明の圧電素子内蔵部品への判別記号の印字をウエハ上で複数個まとめて一括して行う状態の平面図である。FIG. 5 is a plan view showing a state where a plurality of discrimination symbols are printed on the wafer in a lump collectively on the piezoelectric element built-in component according to the present invention. 判別記号の水晶振動子への印字をレーザー加工により行う従来例の斜視図である。FIG. 10 is a perspective view of a conventional example in which a discrimination symbol is printed on a crystal resonator by laser processing.

JP2008220151A 2008-08-28 2008-08-28 Manufacturing method of component with built-in piezoelectric element Expired - Fee Related JP5362293B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2008220151A JP5362293B2 (en) 2008-08-28 2008-08-28 Manufacturing method of component with built-in piezoelectric element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2008220151A JP5362293B2 (en) 2008-08-28 2008-08-28 Manufacturing method of component with built-in piezoelectric element

Publications (3)

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JP2010056930A JP2010056930A (en) 2010-03-11
JP2010056930A5 true JP2010056930A5 (en) 2012-09-20
JP5362293B2 JP5362293B2 (en) 2013-12-11

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JP2008220151A Expired - Fee Related JP5362293B2 (en) 2008-08-28 2008-08-28 Manufacturing method of component with built-in piezoelectric element

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Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5615663B2 (en) * 2010-03-26 2014-10-29 セイコーインスツル株式会社 Package marking method
JP6173758B2 (en) * 2013-04-24 2017-08-02 日本電波工業株式会社 Junction crystal oscillator
JP2017085390A (en) * 2015-10-29 2017-05-18 京セラクリスタルデバイス株式会社 Crystal device

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61177748A (en) * 1985-02-04 1986-08-09 Hitachi Ltd Electronic component
JPH0696462B2 (en) * 1989-02-28 1994-11-30 株式会社ミツトヨ Glass marking method
JP3378880B2 (en) * 1997-12-26 2003-02-17 松下電器産業株式会社 Semiconductor device and manufacturing method thereof
JP2007109750A (en) * 2005-10-12 2007-04-26 Hitachi Metals Ltd Electric/electronic component and its manufacturing method
JP2007165503A (en) * 2005-12-13 2007-06-28 Seiko Epson Corp Hermetic seal structure, piezoelectric device and its manufacturing method

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