JP2009272516A - Surface mounting type electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a surface mounting type electronic component coping with increasing identification information without preventing miniaturization thereof. <P>SOLUTION: This surface mounting type electronic component includes a ceramic base 1 mounted with an electronic component element and a lid 2 hermetically sealing the mounted electronic component element. At least identification information different from each other in signage is formed on a top surface portion of the lid and a bottom surface portion of the ceramic base. In the identification information M4 formed on the bottom surface portion of the ceramic base, individual information and encrypted information of the housed electronic component element are described by irradiating beam. This identification information is formed at a position between functional electrode terminal pads 11 and 13 which are formed on the bottom surface of the ceramic base and not connected to each other. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a surface mount type electronic component in which an electronic component element such as a piezoelectric diaphragm is mounted on a ceramic base, and more particularly to identification information written on a package of the surface mount type electronic component.

  In the surface-mounted electronic component, as shown in Patent Document 1, identification information such as a manufacturer name, a manufactured product name, and a manufacturing lot number is formed on the upper surface of the lid. As a means for forming this identification information, an offset stamp using ink or a laser stamp that irradiates a laser or the like is widely used.

However, with the recent miniaturization of surface-mounted electronic components, the formation area of identification information on the top surface of the lid is also narrowed, so that only the minimum necessary identification information can be formed. On the other hand, in some electronic components, it is currently required to form identification information with higher added value such as individual characteristic information and individual product information at the same time.
JP 2003-197794 A

  Accordingly, the present invention has been made to solve the above-described problems, and an object thereof is to provide a surface-mounted electronic component that can cope with the increase in the number of identification information without hindering downsizing of the surface-mounted electronic component. And

  In order to achieve the above object, as described in claim 1 of the present invention, a surface comprising a ceramic base on which an electronic component element is mounted and a lid for hermetically sealing the mounted electronic component element In the mounting electronic component, at least identification information different from each other is formed on the top surface portion of the lid and the bottom surface portion of the ceramic base, and the identification information formed on the bottom surface portion of the ceramic base is The individual information and encryption information of the electronic component element to be stored are either carved, protruded, or a combination thereof, and the identification information is formed on the bottom surface of the ceramic base. It is characterized in that it is formed at a position that blocks between the functional electrode terminal pads that are not connected to each other.

  With the above configuration, the identification information is additionally formed not only on the lid but also on the bottom surface of the ceramic base, so that it is possible to cope with the increase in the number of identification information without hindering the downsizing of the surface mount electronic component. In particular, since the identification information formed on the bottom surface of the ceramic base describes individual information and encryption information of the electronic component element housed by beam irradiation, it is soldered to the electrode terminal pad of the surface mount type electronic component. When the conductive bonding material such as the above is applied and formed, necessary individual information of each electronic component element to be stored, encryption information that is not necessary after mounting the circuit board, and the like can be recognized in advance. In other words, individual characteristic information and individual product information specific to each electronic component element such as characteristic data and characteristic results table are recognized immediately before mounting a surface-mounted electronic component on a circuit board, or encrypted identification information The surface mount type electronic component can be mounted on the circuit board after recognizing this, and after mounting the surface mount type electronic component on the circuit board, it is unnecessary identification information. Identification information can be formed. In addition, such individual information and encrypted information are not only represented as such, but by using such information in a bar code or a two-dimensional bar code, it is possible to save identification information and save a lot of information. It is more desirable because In addition, the identification information formed on the bottom surface of the ceramic base is configured in either a carved state, a protruding state, or a combination thereof, and is formed on the bottom surface of the ceramic base. Since the functional electrode terminal pad is not connected to the functional electrode terminal pad, the identification information functions as a flow stopper for the conductive bonding material even if a conductive bonding material such as solder of the functional electrode terminal pad flows out. Thus, a short circuit accident between the functional electrode terminal pads can be eliminated. In particular, a bar-coded one or a two-dimensional bar-coded one is more desirable as a flow stop for the conductive bonding material because the unevenness is formed in a denser state.

  As described above, the present invention can provide a surface-mounted electronic component corresponding to the increase in the number of identification information without hindering the downsizing of the surface-mounted electronic component.

  An embodiment of the present invention will be described with reference to a drawing by taking a surface-mounted crystal resonator as an example of a surface-mounted electronic component. FIG. 1 is a perspective view showing an embodiment of the present invention, and FIG. 2 is a bottom view of FIG. The surface-mount type crystal resonator includes a ceramic base 1 having a concave portion with an upper opening, a crystal diaphragm (not shown) as an electronic component element housed in the ceramic base, and an opening of the ceramic base. It consists of the lid | cover 2 joined.

  The ceramic base 1 is a rectangular parallelepiped as a whole, and has a configuration in which a ceramic such as alumina and a conductive material such as tungsten or molybdenum are appropriately laminated, and has a concave storage portion when viewed in cross section. A crystal diaphragm is stored in the storage portion. A bank portion is formed around the storage portion, and a circumferential sealing member is formed between the bank portion and the lid 2. This sealing member differs depending on the sealing method, but in the case of hermetically sealing using a metal lid, the metal layer is composed of, for example, tungsten, molybdenum, nickel, and gold on the top surface of the bank portion. is doing. Such tungsten or molybdenum is integrally formed at the time of ceramic firing by metallization technology using thick film printing technology, and each layer of nickel and gold is formed by plating technology. In the case of hermetically sealing using a ceramic lid, a glass sealing member is formed by utilizing thick film printing technology on at least one of the top surface of the ceramic base and the bottom surface side of the ceramic lid. Yes.

  For example, four electrode terminal pads 11, 12, 13, and 14 are formed on the bottom surface side of the ceramic base 1. Among these, the electrode terminal pads 11 and 13 are electrically led out to a part of the internal electrode terminal pads connected to the crystal diaphragm of the ceramic base storage portion by a conductive via or castellation (not shown), It is configured as a functional electrode terminal pad. The electrode terminal pads 12 and 14 are electrode terminal pads that do not function and are not connected to anything. Each electrode terminal pad and internal electrode terminal pad form a metal layer in the order of, for example, tungsten, molybdenum, nickel, and gold in the same manner as the metal layer. Tungsten or molybdenum is integrally formed during ceramic firing by metallization technology using thick film printing technology, and each layer of nickel and gold is formed by plating technology.

  An inner electrode terminal pad (not shown) is formed on the inner bottom surface of the storage portion of the ceramic base 1, and a quartz diaphragm (not shown) is electrically machined through a conductive bonding material such as a conductive resin adhesive or a metal bump. It is joined and mounted. As the quartz diaphragm, for example, a rectangular AT-cut quartz diaphragm or a tuning-fork-shaped bending vibrating piece can be used, and a pair of excitation electrodes and an extraction electrode for electrically connecting the excitation electrodes to the internal electrode terminals are formed. Has been. Each of these electrodes includes, for example, a laminated thin film composed of a chromium base electrode layer, a silver or gold intermediate electrode layer, and a chromium upper electrode layer, a chromium base electrode layer, and a silver or gold intermediate electrode. A laminated thin film composed of a layer and a nickel upper electrode layer, or a laminated thin film composed of a chromium base electrode layer and a silver or gold upper electrode layer. Each of these electrodes can be formed by a thin film forming means such as a vacuum deposition method or a sputtering method. Note that an aluminum upper electrode layer may be formed instead of chromium or nickel, or a silver upper electrode layer may be formed when the intermediate layer is gold.

  In the case of a metal lid among the lids 2 that hermetically seal the ceramic base 1, for example, a metal brazing material (sealing material) is formed on a core material made of Kovar or the like. More specifically, for example, a multilayer structure in the order of a nickel layer, a kovar core material, a copper layer, and a silver brazing layer from the upper surface, and the silver brazing layer is joined to the ceramic-based metal layer. In the case of a ceramic lid, for example, a glass sealing member is formed on the bottom surface of a ceramic plate such as alumina. The outlines of these lids in plan view are substantially the same as or slightly smaller than those of the ceramic base.

  Covering the ceramic base 1 with the crystal diaphragm stored in the storage portion with the lid 2, melting and curing the sealing material of the lid 2, and performing hermetic sealing, thereby completing the surface-mounted crystal resonator Become. As a method of hermetic sealing, seam welding, beam welding, or atmospheric heating by a heating and melting furnace can be used.

  On the upper surface of the lid of the hermetically sealed surface-mount crystal unit, the name of the manufacturer (trademark, abbreviation, mark, etc.), the name of the product (abbreviation, etc.), the frequency (number), the production location, the production lot Among the identification information such as numbers, the one having high priority as identification information after the circuit board is mounted is formed by offset stamping or laser stamping. In FIG. 1, for example, trademark identification information M1 indicating a manufacturing company, identification information M2 indicating a frequency, and identification information M3 indicating a manufacturing lot number are shown.

  On the bottom surface of the ceramic base of the hermetically sealed surface-mount type crystal resonator, the frequency, vibration characteristics (for example, frequency temperature characteristics), vibration waveform, series resonance resistance value, characteristic result table, general specification information, etc. Laser marking of individual characteristic information and individual product information of crystal units (electronic component elements) housed in surface-mount type crystal units or encrypted identification information for differentiation from counterfeit products It is formed by (beam irradiation). As shown in FIG. 2, these pieces of identification information form identification information M4 at positions where the functional electrode terminal pads 11, 13 formed on the bottom surface of the ceramic base are not connected to each other. Such individual information and encrypted information are not only represented as such, but by using bar codes or two-dimensional bar codes of these information, it is possible to save space and increase the number of information in the identification information. It is more desirable because it can be done. Further, among the pieces of identification information that could not be formed on the lid in the state adjacent to the identification information M4, information having a high notation priority may be additionally formed. In FIG. 2, for example, identification information M5 such as a notation of a manufacturing company is additionally formed.

  According to the above embodiment, the identification information M4, 5 is additionally formed not only on the lid 2 but also on the bottom surface of the ceramic base 1, thereby making the identification information multi-information without hindering the downsizing of the surface-mounted crystal resonator. It can correspond to. In particular, the identification information M4 formed on the bottom surface of the ceramic base 1 describes individual characteristic information and encrypted identification information of the quartz crystal housed therein. When applying a conductive bonding material such as solder to the electrode terminal pads 11, 12, 13, and 14, the necessary individual characteristic information of each crystal resonator to be housed and necessary after mounting the circuit board It is possible to recognize in advance encrypted information or the like for determining a non-counterfeit product. That is, more optimal quality control can be performed by recognizing individual information M4 specific to each crystal resonator such as vibration characteristic data and a characteristic result table immediately before mounting the surface mount type crystal resonator on the circuit board. In addition, since the surface-mounted electronic component can be mounted on the circuit board after the encrypted identification information M4 is recognized in advance, it is possible to prevent erroneous mounting of counterfeit products and defective products. The identification information M4 and M5 formed on the bottom surface of the ceramic base 1 is formed by beam irradiation, and can be configured in either a carved state, a protruding state, or a combination thereof. Further, since the identification information M4 and M5 is formed at a position where the gap between the functional electrode terminal pads 11 and 13 which are formed on the bottom surface of the ceramic base and which are not connected to each other is blocked. Even if the conductive bonding material flows out, the identification information configured in either a sculpted state, a protruding state, or a combination thereof functions as a flow stop for the conductive bonding material, so that the functional electrode terminal pad The short circuit accident between 11 and 13 can be eliminated. In particular, in a miniaturized surface-mount type crystal resonator (surface-mount type electronic component), the area ratio of the electrode terminal pad to the bottom area of the ceramic base is 50% so as not to reduce the bonding strength to the circuit board. There are some things that will not be reduced below. In such a configuration, the functional electrode terminal pads are arranged closer to each other. Therefore, the functional electrode terminal pads are formed by either the engraved state, the protruded state, or the combined state according to the present invention between these electrode terminal pads. The effect of combining the configurations that take into account the identification information is enormous.

  In the above-described embodiment, the electrode terminal pads 11 and 13 are described as functional electrode terminal pads. However, the electrode terminal pads 12 and 14 are also used as functional electrode terminal pads such as a ground. As shown in FIG. 3, it is more desirable to form the electrode terminal pads 11, 12, 13, and 14 so that the identification information M <b> 6 and M <b> 7 are blocked. Further, in the above embodiment, the electrode terminal pad terminal formed on the bottom surface of the ceramic base of the surface-mount type crystal resonator has only a four-terminal configuration as an example, but a two-terminal configuration, a three-terminal configuration, a five-terminal configuration or more It can also be applied to things. In addition, as the identification information configured in either a carved state, a protruding state, or a combination thereof, the information irradiated with the beam is taken as an example, but it may be formed by other methods. Furthermore, although what was formed only in the bottom face part of a lid | cover and a ceramic base is disclosed in the said embodiment, the other side information and the inner surface of the accommodating part may be considered and other identification information may be added. In the above-described embodiment, an example of a crystal resonator is shown as an example of a surface-mount type electronic component. However, other piezoelectric vibration devices may be used and can be applied to other electronic components.

  The present invention can be implemented in various other forms without departing from the spirit or main features thereof. For this reason, the above-described embodiment is merely an example in all respects and should not be interpreted in a limited manner. The scope of the present invention is indicated by the claims, and is not restricted by the text of the specification. Further, all modifications and changes belonging to the equivalent scope of the claims are within the scope of the present invention.

The perspective view which shows embodiment of this invention. The bottom view of FIG. The bottom view which shows other embodiment of this invention.

Explanation of symbols

1 Ceramic base 2 Lid M1-M7 Identification information

Claims (1)

A surface-mount type electronic component comprising a ceramic base for mounting an electronic component element and a lid for hermetically sealing the mounted electronic component element, wherein the upper surface portion of the lid and the bottom surface portion of the ceramic base are provided. Are formed with identification information different from each other at least, and the identification information formed on the bottom surface portion of the ceramic base protrudes from the state in which individual information or encryption information of the electronic component element to be stored is carved The identification information is formed at a position that blocks between the functional electrode terminal pads formed on the bottom surface of the ceramic base and not connected to each other. A package for electronic components.

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