JP5361886B2 - 熱安定性の酸窒化物蛍光体及びこの種の蛍光体を有する光源 - Google Patents
熱安定性の酸窒化物蛍光体及びこの種の蛍光体を有する光源 Download PDFInfo
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- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052693 Europium Inorganic materials 0.000 claims abstract description 19
- 239000012190 activator Substances 0.000 claims abstract description 18
- 239000000203 mixture Substances 0.000 claims abstract description 17
- 229910052788 barium Inorganic materials 0.000 claims abstract description 9
- 150000001768 cations Chemical class 0.000 claims abstract description 9
- 229910052712 strontium Inorganic materials 0.000 claims abstract description 9
- 229910052684 Cerium Inorganic materials 0.000 claims abstract description 8
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 229910052791 calcium Inorganic materials 0.000 claims abstract description 7
- 229910052771 Terbium Inorganic materials 0.000 claims abstract description 6
- 229910052769 Ytterbium Inorganic materials 0.000 claims abstract description 6
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052749 magnesium Inorganic materials 0.000 claims abstract description 4
- 229910052760 oxygen Inorganic materials 0.000 claims abstract description 4
- 239000001301 oxygen Substances 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 229910052748 manganese Inorganic materials 0.000 claims abstract description 3
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims description 20
- 238000004519 manufacturing process Methods 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 239000000126 substance Substances 0.000 claims description 10
- 230000004907 flux Effects 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 4
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 claims description 2
- 229910006360 Si—O—N Inorganic materials 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- BVKZGUZCCUSVTD-UHFFFAOYSA-L Carbonate Chemical compound [O-]C([O-])=O BVKZGUZCCUSVTD-UHFFFAOYSA-L 0.000 claims 1
- 239000002243 precursor Substances 0.000 claims 1
- 238000010298 pulverizing process Methods 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 229910013627 M-Si Inorganic materials 0.000 abstract 1
- 229910052681 coesite Inorganic materials 0.000 abstract 1
- 229910052906 cristobalite Inorganic materials 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 229910052682 stishovite Inorganic materials 0.000 abstract 1
- 229910052905 tridymite Inorganic materials 0.000 abstract 1
- 230000005284 excitation Effects 0.000 description 17
- 239000000843 powder Substances 0.000 description 17
- 230000005855 radiation Effects 0.000 description 14
- 238000000295 emission spectrum Methods 0.000 description 9
- 229910016066 BaSi Inorganic materials 0.000 description 7
- 229910052814 silicon oxide Inorganic materials 0.000 description 7
- 239000007789 gas Substances 0.000 description 6
- 206010001497 Agitation Diseases 0.000 description 5
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000695 excitation spectrum Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 3
- 229910004283 SiO 4 Inorganic materials 0.000 description 3
- 150000002500 ions Chemical class 0.000 description 3
- 238000010587 phase diagram Methods 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- 239000007858 starting material Substances 0.000 description 3
- 238000005303 weighing Methods 0.000 description 3
- -1 Ba 2 SiO 4 Chemical class 0.000 description 2
- 235000005811 Viola adunca Nutrition 0.000 description 2
- 240000009038 Viola odorata Species 0.000 description 2
- 235000013487 Viola odorata Nutrition 0.000 description 2
- 235000002254 Viola papilionacea Nutrition 0.000 description 2
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical group [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000000354 decomposition reaction Methods 0.000 description 2
- 238000010348 incorporation Methods 0.000 description 2
- 229910052738 indium Inorganic materials 0.000 description 2
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 2
- 150000004767 nitrides Chemical class 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 238000010791 quenching Methods 0.000 description 2
- 230000000171 quenching effect Effects 0.000 description 2
- 238000009877 rendering Methods 0.000 description 2
- 150000004760 silicates Chemical class 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910016036 BaF 2 Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-M Fluoride anion Chemical compound [F-] KRHYYFGTRYWZRS-UHFFFAOYSA-M 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 150000004645 aluminates Chemical class 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 229910014307 bSiO Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 150000001805 chlorine compounds Chemical class 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000921 elemental analysis Methods 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000007850 fluorescent dye Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 150000002472 indium compounds Chemical class 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 229910001507 metal halide Inorganic materials 0.000 description 1
- 150000005309 metal halides Chemical class 0.000 description 1
- 229910052605 nesosilicate Inorganic materials 0.000 description 1
- 150000004762 orthosilicates Chemical class 0.000 description 1
- IBIRZFNPWYRWOG-UHFFFAOYSA-N phosphane;phosphoric acid Chemical compound P.OP(O)(O)=O IBIRZFNPWYRWOG-UHFFFAOYSA-N 0.000 description 1
- 238000012216 screening Methods 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000010183 spectrum analysis Methods 0.000 description 1
- 238000012916 structural analysis Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Description
EP-A 1 413 618は、酸窒化物(Oxinitride)の種類からなりかつ組成MSi2O2N2:Euを有する蛍光体を開示している。この場合、Mは有利にCa、Ba又はSrであり、付活剤Zは有利にEuである。これを、本願明細書ではSionとする。この蛍光体は、UV及び青色スペクトル領域で良好に励起することができる。前記蛍光体は、LEDのような光源のために適している。
本発明の課題は、有利に緑色で発光する狭帯域の熱安定性の蛍光体を提供することであった。この場合、前記蛍光体は、UV−LED及び青色LEDと共に使用するために特に適しているべきである。しかしながら、他の適用も排除されない。
次に、実施例に基づき本発明を詳細に説明する。
図1は、熱による消光についての効率の安定性を示す。新たに見出された蛍光体相は、他の公知の全ての狭帯域で約525〜535nmで発光する、大抵はEu2+で付活された系と比べて、発光の優れた熱安定性を有する。図1は、本発明によるBa−SiON相と、最良の先行技術である類似の発光を有するSrBa−オルトシリケートとの間の比較を示す。
BaCO3 11.473g、SiO2 6.238g、Si3N4 2.081g及びEu2O3 0.209g。
BaCO3 11.864g、SiO2 5.529g、Si3N4 2.391g及びEu2O3 0.216g。
−青緑BaSi2O2N2:Eu並びに青緑Ba2SiO4:Eu。この両方は、矢印により示されている。両方の系は、本発明による蛍光体よりも明らかに悪い温度挙動を示す。この円は、新規の相の特に高い効率の範囲を表す。ほぼ又は完全に純相の新規の種類の蛍光体は黒丸で表され、他の相との混合相は斜線で塗った丸で表され、他の相だけは白色の丸で表される。この他の相は、バッチ化学量論に応じて、Si3N4、Baオルトケイ酸塩、SiO2、Ba2Si5N8、Ba−SiO3、BaSi2O5、BaO、Ba3SiO5並びにBa2Si3O8である。新規の種類の相について有利な結果は、例えば次の頂点を有する正方形内にあるバッチ化学量論を提供する:
(1) SiO2:SiN4/3:BaCO3=0.525:0.25:0.225(Ba1.8Si6.2O10.2N2.67に相当);
(2) SiO2:SiN4/3:BaCO3=0.425:0.25:0.325(Ba2.6Si5.4O9.4N2.67に相当);
(3) SiO2:SiN4/3:BaCO3=0.475:0.15:0.375(Ba3Si5O10.6N1.6に相当);
(4) SiO2:SiN4/3:BaCO3=0.575:0.15:0.275(Ba2.2Si5.8O11.4N1.6に相当)。
Claims (16)
- カチオンM及び付活剤Dを有し、MはBa又はSrにより単独又は混合した形で表されるM−Si−O−N系からなり、Eu又はCe又はTbにより単独で又は混合した形で付活されていて、前記付活剤DがカチオンMを部分的に置き換えているM−Si−O−N系からなる熱安定性蛍光体において、前記蛍光体は、バッチ化学量論MO−SiO2−SiN4/3から製造されていて、公知の蛍光体のMSi2O2N2:Dと比べて高い酸素含有量を有し、その際、MOはMの酸化物化合物であり、かつ主に化学量論MaSib+3cOa+2bN4cを有し、その際、b/c=4.8〜8.0及び/又はa/c=3.5〜5.5であることを特徴とする、熱安定性蛍光体。
- さらに、MはCa、Mg、Zn、Cuのグループからなる少なくとも1つの他の元素と組み合わされている、請求項1に記載の熱安定性蛍光体。
- さらに、Mn又はYbと共ドープされた形で付活されている、請求項1に記載の熱安定性蛍光体。
- MOの割合が、化合物MCO3を介して導入されていることを特徴とする、請求項1記載の蛍光体。
- MはBa単独又は優勢である、つまり50Mol%より多いことを特徴とする、請求項1記載の蛍光体。
- バッチ混合物の比MCO3:SiO2は1:1.5〜1:2(境界値を含める)であることを特徴とする、請求項4記載の蛍光体。
- 前記蛍光体自体は、化学量論M2.5Si6O11.5N2を有し、その際、MはBa単独であるか又は50Mol%より多い優勢であることを特徴とする、請求項1記載の蛍光体。
- b/cは5〜6の範囲内にあり、同時にa/cは3.5〜4の範囲内にあることを特徴とする、請求項1記載の蛍光体。
- 請求項1から8までのいずれか1項に記載の蛍光体を有する光源。
- 前記光源はLEDであることを特徴とする、請求項9記載の光源。
- 請求項1から8までのいずれか1項記載の蛍光体の製造方法において、次の方法工程:
a) 物質MCO3、SiO2、Si3N4及び付活剤物質の前駆体として付活剤Dの酸化物を2〜6時間にわたり均質化する工程;
b) 1:1.5〜1:2のMO:SiO2の比率(限界値を含める)の考慮下で前記物質を混合する工程;
c) 前記バッチ混合物を、還元条件下で、1200〜1400℃の温度で、4〜10時間、第1の強熱する工程;
を特徴とする、蛍光体の製造方法。 - さらに、工程d)として、強熱ケークを粉砕する工程を含む、請求項11に記載の蛍光体の製造方法。
- さらに、工程e)として、還元条件下で、850〜1450℃の温度で、第2の強熱する工程を含む、請求項11または12に記載の蛍光体の製造方法。
- MOの割合が、化合物MCO3を介して導入されていることを特徴とする、請求項11記載の方法。
- バッチ混合物の比率MCO3:SiO2は1:1.5〜1:2(境界値を含める)であることを特徴とする、請求項14記載の方法。
- 融剤として塩化物又は炭酸塩を、融剤なしのバッチ化学量論に対して、5質量%以下の割合で使用することを特徴とする、請求項11記載の方法。
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2018518565A (ja) * | 2015-06-08 | 2018-07-12 | オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングOsram Opto Semiconductors GmbH | 複合酸窒化セラミック変換体およびこの変換体を備えた光源 |
Families Citing this family (23)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101379163B (zh) | 2006-02-02 | 2013-01-02 | 三菱化学株式会社 | 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物 |
JP2009263610A (ja) * | 2007-08-01 | 2009-11-12 | Mitsubishi Chemicals Corp | 蛍光体及びその製造方法、結晶性窒化珪素及びその製造方法、蛍光体含有組成物、並びに、該蛍光体を用いた発光装置、画像表示装置及び照明装置 |
DE102009055185A1 (de) * | 2009-12-22 | 2011-06-30 | Osram Gesellschaft mit beschränkter Haftung, 81543 | Leuchtstoff und Lichtquelle mit derartigen Leuchtstoff |
TW201144408A (en) * | 2010-06-03 | 2011-12-16 | qi-rui Cai | Photovoltaic panel and transparent light conversion powder thereof |
DK2468090T3 (da) * | 2010-12-21 | 2014-04-28 | Valoya Oy | Fremgangsmåde og midler til akklimatisering af stiklinger til livet udendørs |
DE102011115879A1 (de) * | 2011-10-12 | 2013-04-18 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Leuchtstoffe |
KR101883337B1 (ko) * | 2011-12-05 | 2018-07-30 | 엘지이노텍 주식회사 | 산질화물 형광체 및 그를 포함한 발광소자 패키지 |
DE102012202927B4 (de) * | 2012-02-27 | 2021-06-10 | Osram Gmbh | Lichtquelle mit led-chip und leuchtstoffschicht |
DE102012218053A1 (de) | 2012-10-02 | 2014-01-30 | Bundesdruckerei Gmbh | Sicherheitsmerkmal, das Sicherheitsmerkmal enthaltendes Wert- und/oder Sicherheitsprodukt sowie Verfahren zur Herstellung des Wert- und/oder Sicherheitsprodukts |
DE102012218615B4 (de) | 2012-10-12 | 2019-03-28 | Bundesdruckerei Gmbh | Sicherheitsmerkmal für ein Wert- und/oder Sicherheitsprodukt mit Farbverlaufsstruktur und das Sicherheitsmerkmal aufweisendes Wert- und/oder Sicherheitsdokument |
DE102013200895B4 (de) | 2013-01-21 | 2017-05-11 | Bundesdruckerei Gmbh | Wert- oder Sicherheitsprodukt sowie Verfahren zur Herstellung eines Sicherheitsmerkmals auf oder in dem Wert- oder Sicherheitsprodukt |
DE102013201945A1 (de) | 2013-02-06 | 2014-08-07 | Bundesdruckerei Gmbh | Sicherheitsmerkmal für ein Wert- oder Sicherheitsprodukt sowie Verfahren zum Herstellen des Sicherheitsmerkmals |
DE102013205329A1 (de) * | 2013-03-26 | 2014-10-16 | Siemens Aktiengesellschaft | Verfahren zum Herstellen einer Leuchtstoffkeramik |
DE102013206130B4 (de) | 2013-04-08 | 2018-06-21 | Bundesdruckerei Gmbh | Multilumineszentes Sicherheitselement und dieses enthaltendes Wert- oder Sicherheitsdokument |
TWI468842B (zh) | 2013-05-07 | 2015-01-11 | Delta Electronics Inc | 用於調控投影裝置的出光波長之方法 |
JP5768846B2 (ja) * | 2013-08-23 | 2015-08-26 | 日亜化学工業株式会社 | 蛍光体及びこれを用いた発光装置 |
JP2015131898A (ja) * | 2014-01-10 | 2015-07-23 | 電気化学工業株式会社 | 蛍光体及び発光装置 |
DE102015110258A1 (de) | 2015-06-25 | 2016-12-29 | Osram Gmbh | Leuchtstoff, Verfahren zum Herstellen eines Leuchtstoffs und Verwendung eines Leuchtstoffs |
DE102015212492A1 (de) | 2015-07-03 | 2017-01-05 | Bundesdruckerei Gmbh | Sicherheits- oder Wertdokument mit einem Lumineszenzmerkmal und Verfahren zum Prüfen der Echtheit des Sicherheits- oder Wertdokuments |
US11901492B2 (en) | 2015-09-10 | 2024-02-13 | Intematix Corporation | High color rendering white light emitting devices and high color rendering photoluminescence compositions |
DE102015120775A1 (de) * | 2015-11-30 | 2017-06-01 | Osram Opto Semiconductors Gmbh | Optoelektronisches Bauelement und Hintergrundbeleuchtung für ein Display |
EP3178904A1 (de) | 2015-12-09 | 2017-06-14 | Merck Patent GmbH | Leuchtstoffe |
US11060025B2 (en) | 2017-12-26 | 2021-07-13 | Nichia Corporation | Oxynitride fluorescent material, light emitting device, and method for producing oxynitride fluorescent material |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4810938A (en) | 1987-10-01 | 1989-03-07 | General Electric Company | High efficacy electrodeless high intensity discharge lamp |
US7662791B2 (en) | 2000-08-02 | 2010-02-16 | University Of Southern California | Gene silencing using mRNA-cDNA hybrids |
US6958575B2 (en) | 2001-12-20 | 2005-10-25 | Koninklijke Philips Electronics N.V. | Metal halide lamp with improved red rendition and CRI |
EP1413618A1 (en) | 2002-09-24 | 2004-04-28 | Osram Opto Semiconductors GmbH | Luminescent material, especially for LED application |
JP4524468B2 (ja) | 2004-05-14 | 2010-08-18 | Dowaエレクトロニクス株式会社 | 蛍光体とその製造方法および当該蛍光体を用いた光源並びにled |
CN101044222B (zh) * | 2004-09-22 | 2012-06-06 | 独立行政法人物质·材料研究机构 | 荧光体及其制造方法和发光器具 |
WO2006035991A1 (en) * | 2004-09-29 | 2006-04-06 | Showa Denko K.K. | Oxynitride-based fluorescent material and method for production thereof |
JP4754919B2 (ja) * | 2004-09-29 | 2011-08-24 | 昭和電工株式会社 | 酸窒化物系蛍光体及びその製造法 |
US8277687B2 (en) * | 2005-08-10 | 2012-10-02 | Mitsubishi Chemical Corporation | Phosphor and light-emitting device using same |
DE102005059521A1 (de) * | 2005-12-13 | 2007-06-14 | Patent-Treuhand-Gesellschaft für elektrische Glühlampen mbH | Rot emittierender Leuchtstoff und Lichtquelle mit einem derartigen Leuchtstoff |
CN101379163B (zh) * | 2006-02-02 | 2013-01-02 | 三菱化学株式会社 | 复合氧氮化物荧光体、使用该荧光体的发光装置、图像显示装置、照明装置、含荧光体的组合物以及复合氧氮化物 |
JP4733535B2 (ja) * | 2006-02-24 | 2011-07-27 | パナソニック株式会社 | 酸窒化物蛍光体、酸窒化物蛍光体の製造方法、半導体発光装置、発光装置、光源、照明装置、及び画像表示装置 |
JP5071709B2 (ja) * | 2007-07-17 | 2012-11-14 | 独立行政法人物質・材料研究機構 | 蛍光体と発光器具 |
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