JP5354386B2 - 発光装置および照明装置 - Google Patents
発光装置および照明装置 Download PDFInfo
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- JP5354386B2 JP5354386B2 JP2010064934A JP2010064934A JP5354386B2 JP 5354386 B2 JP5354386 B2 JP 5354386B2 JP 2010064934 A JP2010064934 A JP 2010064934A JP 2010064934 A JP2010064934 A JP 2010064934A JP 5354386 B2 JP5354386 B2 JP 5354386B2
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- Prior art keywords
- electrode
- electrical connection
- light
- light emitting
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000010410 layer Substances 0.000 claims description 149
- 239000000758 substrate Substances 0.000 claims description 61
- 239000010931 gold Substances 0.000 claims description 17
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 14
- 229910052737 gold Inorganic materials 0.000 claims description 14
- 239000011241 protective layer Substances 0.000 claims description 11
- 238000007789 sealing Methods 0.000 claims description 9
- 238000005286 illumination Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 description 13
- 230000005540 biological transmission Effects 0.000 description 9
- 239000000463 material Substances 0.000 description 8
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 229910052751 metal Inorganic materials 0.000 description 7
- 239000002184 metal Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 6
- 229920003023 plastic Polymers 0.000 description 6
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 229910052581 Si3N4 Inorganic materials 0.000 description 4
- 239000010408 film Substances 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 4
- 239000011112 polyethylene naphthalate Substances 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 4
- KMUONIBRACKNSN-UHFFFAOYSA-N potassium dichromate Chemical compound [K+].[K+].[O-][Cr](=O)(=O)O[Cr]([O-])(=O)=O KMUONIBRACKNSN-UHFFFAOYSA-N 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 238000007747 plating Methods 0.000 description 3
- 229920001707 polybutylene terephthalate Polymers 0.000 description 3
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000000295 emission spectrum Methods 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000011777 magnesium Substances 0.000 description 2
- SJCKRGFTWFGHGZ-UHFFFAOYSA-N magnesium silver Chemical compound [Mg].[Ag] SJCKRGFTWFGHGZ-UHFFFAOYSA-N 0.000 description 2
- 229910052750 molybdenum Inorganic materials 0.000 description 2
- 239000011733 molybdenum Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 239000012286 potassium permanganate Substances 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 238000001579 optical reflectometry Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000002310 reflectometry Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 230000000087 stabilizing effect Effects 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 1
Images
Description
11 基板
11a 光透過部
11b 電気接続部
12 一方の電極
12c 保護層
12d 中間層
13 発光層
14 他方の電極
14c 保護層
14d 中間層
15 封止層
20 照明装置
21 器具本体
23 電気接続部材
R1 粗面
S1 間隔
Claims (3)
- 光透過部と電気接続部を有し、少なくとも電気接続部の表面を凹凸状の粗面に形成した透光性を有する基板と;
少なくとも基板の光透過部および電気接続部の粗面に形成され、粗面に形成される厚さが粗面の凹凸の高さ寸法より薄く形成される一方の電極と;
基板の光透過部に対向し前記一方の電極に形成される発光層と;
発光層および前記基板の電気接続部の粗面に形成され、粗面に形成される厚さが粗面の凹凸の高さ寸法より薄く、かつ前記一方の電極と間隔を有して形成される他方の電極と;
少なくとも発光層を覆うように形成される封止層と;
を具備していることを特徴とする発光装置。 - 前記基板の電気接続部の粗面に形成される前記一方の電極および他方の電極は、その表面に粗面の凹凸の高さ寸法より厚い中間層が形成され、この中間層の上に金からなる保護層が形成されたことを特徴とする請求項1記載の発光装置。
- 請求項1または2記載の発光装置と;
発光装置における電気接続部の粗面に形成される一方の電極および他方の電極が接続され
る電気接続部材を有する器具本体と;
を具備していることを特徴とする照明装置。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010064934A JP5354386B2 (ja) | 2010-03-19 | 2010-03-19 | 発光装置および照明装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2010064934A JP5354386B2 (ja) | 2010-03-19 | 2010-03-19 | 発光装置および照明装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2011198651A JP2011198651A (ja) | 2011-10-06 |
JP5354386B2 true JP5354386B2 (ja) | 2013-11-27 |
Family
ID=44876585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2010064934A Expired - Fee Related JP5354386B2 (ja) | 2010-03-19 | 2010-03-19 | 発光装置および照明装置 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP5354386B2 (ja) |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3750631B2 (ja) * | 2002-05-24 | 2006-03-01 | 富士電機ホールディングス株式会社 | 有機薄膜発光素子パネルの製造方法 |
US6819036B2 (en) * | 2002-05-28 | 2004-11-16 | Eastman Kodak Company | OLED lighting apparatus |
US6771021B2 (en) * | 2002-05-28 | 2004-08-03 | Eastman Kodak Company | Lighting apparatus with flexible OLED area illumination light source and fixture |
JP4915589B2 (ja) * | 2007-11-26 | 2012-04-11 | パナソニック株式会社 | 面状発光モジュール及び照明器具 |
JP2010040491A (ja) * | 2008-08-08 | 2010-02-18 | Tdk Corp | 有機el装置及びその製造方法並びに配線構造体 |
-
2010
- 2010-03-19 JP JP2010064934A patent/JP5354386B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2011198651A (ja) | 2011-10-06 |
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