JP5327356B2 - 発光装置 - Google Patents

発光装置 Download PDF

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Publication number
JP5327356B2
JP5327356B2 JP2012110401A JP2012110401A JP5327356B2 JP 5327356 B2 JP5327356 B2 JP 5327356B2 JP 2012110401 A JP2012110401 A JP 2012110401A JP 2012110401 A JP2012110401 A JP 2012110401A JP 5327356 B2 JP5327356 B2 JP 5327356B2
Authority
JP
Japan
Prior art keywords
light emitting
light
recess
emitting element
emitting device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012110401A
Other languages
English (en)
Japanese (ja)
Other versions
JP2012178598A5 (https=
JP2012178598A (ja
Inventor
育也 新居
宏明 宇川
伸英 笠江
俊公 高尾
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2012110401A priority Critical patent/JP5327356B2/ja
Publication of JP2012178598A publication Critical patent/JP2012178598A/ja
Publication of JP2012178598A5 publication Critical patent/JP2012178598A5/ja
Application granted granted Critical
Publication of JP5327356B2 publication Critical patent/JP5327356B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/531—Shapes of wire connectors
    • H10W72/5366—Shapes of wire connectors the bond wires having kinks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5524—Materials of bond wires comprising metals or metalloids, e.g. silver comprising aluminium [Al]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5525—Materials of bond wires comprising metals or metalloids, e.g. silver comprising copper [Cu]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Led Device Packages (AREA)
JP2012110401A 2012-05-14 2012-05-14 発光装置 Active JP5327356B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012110401A JP5327356B2 (ja) 2012-05-14 2012-05-14 発光装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012110401A JP5327356B2 (ja) 2012-05-14 2012-05-14 発光装置

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP2006213929A Division JP5205724B2 (ja) 2006-08-04 2006-08-04 発光装置

Publications (3)

Publication Number Publication Date
JP2012178598A JP2012178598A (ja) 2012-09-13
JP2012178598A5 JP2012178598A5 (https=) 2013-04-25
JP5327356B2 true JP5327356B2 (ja) 2013-10-30

Family

ID=46980189

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012110401A Active JP5327356B2 (ja) 2012-05-14 2012-05-14 発光装置

Country Status (1)

Country Link
JP (1) JP5327356B2 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8594228B2 (en) 1999-04-16 2013-11-26 Parkervision, Inc. Apparatus and method of differential IQ frequency up-conversion

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6555243B2 (ja) 2016-12-16 2019-08-07 日亜化学工業株式会社 発光装置および発光装置の製造方法
KR102369820B1 (ko) * 2017-03-22 2022-03-03 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 반도체 소자 패키지 및 조명 시스템

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS624380A (ja) * 1985-06-29 1987-01-10 Toshiba Corp 発光ダイオ−ド装置
JPH04137570A (ja) * 1990-09-27 1992-05-12 Sanyo Electric Co Ltd 発光ダイオードランプ
JP2582096Y2 (ja) * 1992-09-16 1998-09-30 三洋電機株式会社 発光ダイオードランプ
JP2003324215A (ja) * 2002-04-30 2003-11-14 Toyoda Gosei Co Ltd 発光ダイオードランプ
JP3707688B2 (ja) * 2002-05-31 2005-10-19 スタンレー電気株式会社 発光装置およびその製造方法
JP2003017755A (ja) * 2002-06-13 2003-01-17 Nichia Chem Ind Ltd 発光装置
JP4241184B2 (ja) * 2002-07-25 2009-03-18 パナソニック電工株式会社 光電素子部品
JP4001082B2 (ja) * 2003-08-20 2007-10-31 松下電器産業株式会社 発光ダイオード
TWI237546B (en) * 2003-01-30 2005-08-01 Osram Opto Semiconductors Gmbh Semiconductor-component sending and/or receiving electromagnetic radiation and housing-basebody for such a component
JP2006032885A (ja) * 2003-11-18 2006-02-02 Sharp Corp 光源装置およびそれを用いた光通信装置
JP2005167079A (ja) * 2003-12-04 2005-06-23 Toyoda Gosei Co Ltd 発光装置
JP2005197369A (ja) * 2004-01-05 2005-07-21 Toshiba Corp 光半導体装置
TWI286393B (en) * 2004-03-24 2007-09-01 Toshiba Lighting & Technology Lighting apparatus
JP5081370B2 (ja) * 2004-08-31 2012-11-28 日亜化学工業株式会社 発光装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8594228B2 (en) 1999-04-16 2013-11-26 Parkervision, Inc. Apparatus and method of differential IQ frequency up-conversion

Also Published As

Publication number Publication date
JP2012178598A (ja) 2012-09-13

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