JP5327275B2 - End polishing brush and method for manufacturing glass substrate for magnetic recording medium - Google Patents

End polishing brush and method for manufacturing glass substrate for magnetic recording medium Download PDF

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JP5327275B2
JP5327275B2 JP2011119586A JP2011119586A JP5327275B2 JP 5327275 B2 JP5327275 B2 JP 5327275B2 JP 2011119586 A JP2011119586 A JP 2011119586A JP 2011119586 A JP2011119586 A JP 2011119586A JP 5327275 B2 JP5327275 B2 JP 5327275B2
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glass substrate
inner peripheral
polishing
shaft
magnetic recording
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JP2012245588A (en
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出 鹿島
大介 吉宗
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AGC Inc
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Asahi Glass Co Ltd
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Priority to JP2011119586A priority Critical patent/JP5327275B2/en
Priority to CN201510641690.3A priority patent/CN105364688A/en
Priority to CN201210166594.4A priority patent/CN102794685B/en
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B29/00Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents
    • B24B29/005Machines or devices for polishing surfaces on work by means of tools made of soft or flexible material with or without the application of solid or liquid polishing agents using brushes
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B9/00Arrangements of the bristles in the brush body
    • A46B9/08Supports or guides for bristles
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B24GRINDING; POLISHING
    • B24BMACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B9/00Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor
    • B24B9/02Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground
    • B24B9/06Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain
    • B24B9/08Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass
    • B24B9/10Machines or devices designed for grinding edges or bevels on work or for removing burrs; Accessories therefor characterised by a special design with respect to properties of materials specific to articles to be ground of non-metallic inorganic material, e.g. stone, ceramics, porcelain of glass of plate glass
    • CCHEMISTRY; METALLURGY
    • C03GLASS; MINERAL OR SLAG WOOL
    • C03CCHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
    • C03C15/00Surface treatment of glass, not in the form of fibres or filaments, by etching
    • AHUMAN NECESSITIES
    • A46BRUSHWARE
    • A46BBRUSHES
    • A46B2200/00Brushes characterized by their functions, uses or applications
    • A46B2200/30Brushes for cleaning or polishing
    • A46B2200/3086Brushes for polishing

Description

本発明は端面研磨ブラシ及び前記端面研磨ブラシを使用した磁気記録媒体用ガラス基板の製造方法に関する。   The present invention relates to an end face polishing brush and a method for producing a glass substrate for a magnetic recording medium using the end face polishing brush.

近年、磁気ディスクの高密度記録化に伴い、磁気記録媒体用ガラス基板への要求特性が厳しくなってきている。特に、中心部に円形孔を有する円盤状の磁気記録媒体用ガラス基板の端面を研磨する場合の、ガラス基板の端面形状や寸法の品質に対する要求精度が高くなっている。   In recent years, with high density recording of magnetic disks, required characteristics for glass substrates for magnetic recording media have become stricter. In particular, when polishing the end face of a disk-shaped glass substrate for a magnetic recording medium having a circular hole in the center, the required accuracy for the end face shape and dimensional quality of the glass substrate is high.

磁気記録媒体用ガラス基板は、その製造工程において、ガラス基板の側面部や面取り部のキズと凹凸を除去して平滑な鏡面に仕上げるために端面研磨が施される。ガラス基板の側面部や面取り部を平滑な鏡面に仕上げることにより、ガラス基板の機械的強度が向上する。また、側面部や端面部の凹凸に捕捉される異物の数が低減し、側面部や端面部の凹凸がカセットの樹脂部材を削り発生するパーティクルが低減する。   In the manufacturing process of the glass substrate for magnetic recording medium, end face polishing is performed in order to remove the scratches and irregularities on the side surface portion and chamfered portion of the glass substrate and finish it to a smooth mirror surface. By finishing the side surface and chamfered portion of the glass substrate into a smooth mirror surface, the mechanical strength of the glass substrate is improved. In addition, the number of foreign substances trapped by the unevenness of the side surface portion and the end surface portion is reduced, and particles generated by the unevenness of the side surface portion and the end surface portion scraping the resin member of the cassette are reduced.

ガラス基板の内周端面研磨では、例えば、ガラス基板を積層させたガラス基板積層体を端面研磨装置に装着し、このガラス基板積層体に研磨ブラシを挿入して研磨する。しかしながら、ガラス基板積層体の内周端面に研磨ブラシを押し込む際に、研磨ブラシのシャフトがガラス基板積層体の反発によって曲がってしまうという問題点を有していた。   In the inner peripheral end surface polishing of the glass substrate, for example, a glass substrate laminate in which glass substrates are laminated is mounted on an end surface polishing apparatus, and polishing is performed by inserting a polishing brush into the glass substrate laminate. However, when the polishing brush is pushed into the inner peripheral end face of the glass substrate laminate, the shaft of the polishing brush is bent due to the repulsion of the glass substrate laminate.

そこで、特許文献1では、研磨ブラシに対して下向きの荷重をかけた状態でガラス基板積層体を研磨することで、研磨ブラシの曲がりを抑制する技術が開示されている。   Therefore, Patent Document 1 discloses a technique for suppressing the bending of the polishing brush by polishing the glass substrate laminate in a state where a downward load is applied to the polishing brush.

特開2006−007350号公報JP 2006-007350 A

しかしながら、特許文献1の方法では、下向きの荷重をかける機構が必要であり、端面研磨装置が複雑な構成になるという問題点があった。また、ガラス基板積層体内の研磨ばらつき及び鏡面不良の程度が実際に評価されていなかった。   However, the method of Patent Document 1 requires a mechanism for applying a downward load, and has a problem that the end surface polishing apparatus has a complicated configuration. Moreover, the grinding | polishing dispersion | variation in a glass substrate laminated body and the grade of a mirror surface defect were not actually evaluated.

そこで、本発明は、複雑な構成の端面研磨装置を使用することなく、内周面取り部と内周側面部とを均一かつ安定的に研磨する端面研磨ブラシを提供することを目的とする。   Accordingly, an object of the present invention is to provide an end surface polishing brush that uniformly and stably polishes an inner peripheral chamfered portion and an inner peripheral side surface portion without using an end surface polishing apparatus having a complicated configuration.

本発明によれば、
中心部に円形孔を有する磁気記録媒体用ガラス基板の内周端面を研磨する端面研磨ブラシであって、
前記端面研磨ブラシはシャフトにブラシ毛が植毛されており、前記シャフトは、荷重19.6Nをかけた時の最大たわみ量が390μm以下である、端面研磨ブラシ、が提供される。
According to the present invention,
An end face polishing brush for polishing an inner peripheral end face of a glass substrate for a magnetic recording medium having a circular hole in the center,
The end surface polishing brush is provided with an end surface polishing brush in which brush hair is planted on a shaft, and the shaft has a maximum deflection amount of 390 μm or less when a load of 19.6 N is applied.

本発明によれば、以下の効果を奏する。   The present invention has the following effects.

複雑な構成の端面研磨装置を使用することなく、内周面取り部と内周側面部とを均一かつ安定的に研磨する端面研磨ブラシを提供できる。   An end surface polishing brush for uniformly and stably polishing the inner peripheral chamfered portion and the inner peripheral side surface portion can be provided without using an end surface polishing apparatus having a complicated configuration.

図1は、本発明のガラス基板の製造方法に係る、ガラス基板の構成を説明するための、斜視断面図である。FIG. 1 is a perspective cross-sectional view for explaining a configuration of a glass substrate according to the method for manufacturing a glass substrate of the present invention. 図2は、ガラス基板の内周端面研磨の様子を表す概略図である。FIG. 2 is a schematic view showing a state of polishing of the inner peripheral end face of the glass substrate. 図3は、本発明の端面研磨ブラシの模式的断面図である。FIG. 3 is a schematic cross-sectional view of the end surface polishing brush of the present invention. 図4は、本発明の端面研磨ブラシの拡大断面図である。FIG. 4 is an enlarged cross-sectional view of the end surface polishing brush of the present invention.

以下、本発明に係る実施形態を、図面を参照しながら説明する。   Hereinafter, embodiments according to the present invention will be described with reference to the drawings.

まず、本発明の端面研磨ブラシで研磨を施す、磁気記録媒体用ガラス基板の構成を説明する。図1に、ガラス基板の構成を説明するための、斜視断面図の例を示す。図1において、ガラス基板1は、主表面2の中心に円形孔3を有するドーナツ状を呈している。ガラス基板1の外周側の側面は外周端面4であり、円形孔3の側面は内周端面7である。外周端面4は、主表面2に対して90度の角度を有する外周側面部5と、主表面2と外周側面部5とに接する外周面取り部6を含む。また、内周端面7は、主表面2に対して90度の角度を有する内周側面部8と、主表面2と内周側面部8とに接する内周面取り部9を含む。   First, the structure of a glass substrate for a magnetic recording medium that is polished with the end face polishing brush of the present invention will be described. In FIG. 1, the example of a perspective sectional view for demonstrating the structure of a glass substrate is shown. In FIG. 1, a glass substrate 1 has a donut shape having a circular hole 3 at the center of a main surface 2. The side surface on the outer peripheral side of the glass substrate 1 is an outer peripheral end surface 4, and the side surface of the circular hole 3 is an inner peripheral end surface 7. The outer peripheral end surface 4 includes an outer peripheral side surface portion 5 having an angle of 90 degrees with respect to the main surface 2 and an outer peripheral chamfered portion 6 in contact with the main surface 2 and the outer peripheral side surface portion 5. The inner peripheral end surface 7 includes an inner peripheral side surface portion 8 having an angle of 90 degrees with respect to the main surface 2, and an inner peripheral chamfered portion 9 in contact with the main surface 2 and the inner peripheral side surface portion 8.

図2に、磁気記録媒体用ガラス基板の内周端面研磨の様子を表す概略図を示す。磁気記録媒体用ガラス基板の内周端面を研磨する場合、通常、複数の円盤形状ガラス基板を、円形孔の位置をあわせて重ね合わせて、ガラス基板積層体を形成する。この時、図2に示すように、隣り合う円盤形状ガラス基板1の間には、例えば、スペーサ10を挿入しても良い。スペーサ10を挿入することで、主表面2と内周面取り部9との間の境界部に、ブラシ毛や研磨液が届きやすくなるため、内周端面7をより均一に研磨できる。また、ガラス基板の主表面への加傷を防止できる。通常、ガラス基板積層体において、スペーサ10の円形孔及びガラス基板の円形孔の中心は、同一の中心軸を有し、この中心軸は、ガラス基板1の主表面2に直交する方向に延びる。   FIG. 2 is a schematic view showing a state of polishing of the inner peripheral end face of the glass substrate for a magnetic recording medium. When polishing the inner peripheral end face of the magnetic recording medium glass substrate, a plurality of disk-shaped glass substrates are usually overlapped with the positions of the circular holes to form a glass substrate laminate. At this time, as shown in FIG. 2, for example, a spacer 10 may be inserted between the adjacent disk-shaped glass substrates 1. Inserting the spacer 10 makes it easier for brush bristles and polishing liquid to reach the boundary between the main surface 2 and the inner peripheral chamfered portion 9, so that the inner peripheral end surface 7 can be more uniformly polished. Moreover, the damage to the main surface of a glass substrate can be prevented. Usually, in the glass substrate laminate, the center of the circular hole of the spacer 10 and the circular hole of the glass substrate has the same central axis, and this central axis extends in a direction perpendicular to the main surface 2 of the glass substrate 1.

スペーサ10の円形孔の内径は、ガラス基板1の主表面2と内周面取り部9との境界部により形成される径よりも若干大きいことが好ましい。スペーサ10の内径を、ガラス基板1の主表面2と内周面取り部9との境界部により形成される径よりも若干大きくすることで、内周面取り部9の全面を均一に研磨できる。さらに、スペーサ10の厚みは、0.2mm〜0.5mmであることが好ましい。スペーサ10の厚みが0.2mm未満では、内周面取り部9の全面を均一に研磨することが難しくなるおそれがある。一方、スペーサ10の厚みが0.5mmを超える場合、ガラス基板積層体のサイズが大きくなり、好ましくない。なお、スペーサ10の材質としては、特に限定されず、例えば、ゴム、プラスチック、アルミニウム合金、ステンレス鋼などを使用できる。   The inner diameter of the circular hole of the spacer 10 is preferably slightly larger than the diameter formed by the boundary portion between the main surface 2 of the glass substrate 1 and the inner peripheral chamfered portion 9. By making the inner diameter of the spacer 10 slightly larger than the diameter formed by the boundary between the main surface 2 of the glass substrate 1 and the inner peripheral chamfered portion 9, the entire surface of the inner peripheral chamfered portion 9 can be uniformly polished. Furthermore, the thickness of the spacer 10 is preferably 0.2 mm to 0.5 mm. If the thickness of the spacer 10 is less than 0.2 mm, it may be difficult to uniformly polish the entire surface of the inner peripheral chamfered portion 9. On the other hand, when the thickness of the spacer 10 exceeds 0.5 mm, the size of the glass substrate laminate is increased, which is not preferable. In addition, it does not specifically limit as a material of the spacer 10, For example, rubber | gum, a plastic, an aluminum alloy, stainless steel etc. can be used.

複数枚積層したガラス基板積層体11は、公知の内周端面研磨装置のガラス基板積層体を保持する保持部に設置される。その後、ガラス基板積層体11の中央部に形成された円形孔3に、後述する端面研磨ブラシ12を挿入して、ガラス基板の内周側面部8と、内周面取り部9にブラシ毛13を当接させる。次に、ガラス基板の内周側面部8と内周面取り部9に、砥粒を含む研磨液を供給する。この状態で、ガラス基板積層体11と端面研磨ブラシ12とを反対方向に回転させて研磨を進行させる。   A plurality of laminated glass substrate laminates 11 are installed in a holding unit that holds a glass substrate laminate of a known inner peripheral end surface polishing apparatus. Thereafter, an end face polishing brush 12 to be described later is inserted into the circular hole 3 formed in the central portion of the glass substrate laminate 11, and the brush bristles 13 are attached to the inner peripheral side surface portion 8 and the inner peripheral chamfered portion 9 of the glass substrate. Make contact. Next, a polishing liquid containing abrasive grains is supplied to the inner peripheral side surface portion 8 and the inner peripheral chamfered portion 9 of the glass substrate. In this state, the glass substrate laminate 11 and the end surface polishing brush 12 are rotated in opposite directions to advance polishing.

この時、例えば、1.5〜2.0mm程度、端面研磨ブラシ12をガラス基板積層体11に対して押し当てても良い。また、端面研磨ブラシ12は、ブラシ挿入方向に往復運動させて研磨を行っても良い。なお、端面研磨ブラシ12を往復運動させる場合における往復距離は、ガラス基板積層体の積層方向の長さに対して15%以上であることが好ましい。端面研磨ブラシ12の往復運動させる距離が、ガラス基板積層体の積層方向の長さに対して15%未満の場合、研磨ブラシの軸方向での特性のバラツキに起因して、ガラス基板積層体内の研磨量のばらつきが発生することがある。   At this time, for example, the end surface polishing brush 12 may be pressed against the glass substrate laminate 11 by about 1.5 to 2.0 mm. Further, the end surface polishing brush 12 may be polished by reciprocating in the brush insertion direction. The reciprocating distance when the end surface polishing brush 12 is reciprocated is preferably 15% or more with respect to the length in the laminating direction of the glass substrate laminate. When the reciprocating distance of the end surface polishing brush 12 is less than 15% with respect to the length in the stacking direction of the glass substrate laminate, the variation in the characteristics in the axial direction of the polishing brush causes a variation in the glass substrate stack. Variation in the polishing amount may occur.

図2においては、6枚の円盤形状ガラス基板を重ね合わせてガラス基板積層体を形成しているが、本発明はこれに限定されない。重ね合わせる複数の円盤形状ガラス基板の枚数としては、特に制限はなく、例えば、100枚、200枚、300枚のガラス基板を重ね合わせてガラス基板積層体を形成できる。一般的には、重ね合わせるガラス基板の枚数を多くすることで、多くのガラス基板を同時に研磨できるため、経済性及び効率性の面より好ましい。   In FIG. 2, six disk-shaped glass substrates are stacked to form a glass substrate laminate, but the present invention is not limited to this. There is no restriction | limiting in particular as the number of the some disk-shaped glass substrates to overlap | superpose, For example, a glass substrate laminated body can be formed by superimposing 100, 200, and 300 glass substrates. In general, by increasing the number of glass substrates to be stacked, many glass substrates can be polished simultaneously, which is preferable from the viewpoint of economy and efficiency.

[端面研磨ブラシ]
図3に、本発明に係る端面研磨ブラシ12の模式的断面図を示す。また、図4に、その拡大断面図を示す。端面研磨ブラシ12は、主として、円柱形状のシャフト14と、シャフト14に設置されたブラシ毛13とを含む。ブラシ毛13は、シャフト14の軸方向に対して概ね直交する方向に植毛されている。
[End polishing brush]
FIG. 3 is a schematic cross-sectional view of the end surface polishing brush 12 according to the present invention. FIG. 4 shows an enlarged sectional view thereof. The end surface polishing brush 12 mainly includes a cylindrical shaft 14 and brush hairs 13 installed on the shaft 14. The bristles 13 are planted in a direction substantially perpendicular to the axial direction of the shaft 14.

円柱形状のシャフト14の軸方向の中心における最大たわみ量δ(μm)は、通常、加える荷重P(N)、シャフト14の軸方向の長さL(mm)、シャフトの径r(底面の半径)(mm)、構成材料のヤング率E(GPa)を用いて、下記式(1)で定義される。
δ=PL/(12πrE)・・・式(1)
式(1)の最大たわみ量を測定する方法として、下記に一例を挙げるが、本発明はこの点において限定されない。シャフトの軸方向の両端から10mm内側を支持し、シャフトの軸方向の中心部にプッシュプルゲージ等により、19.6Nの荷重を加え、中心部の移動距離(即ち、最大たわみ量)をダイヤルゲージなどで測定する方法などが、挙げられる。
The maximum deflection amount δ (μm) at the center of the cylindrical shaft 14 in the axial direction is usually the applied load P (N), the axial length L (mm) of the shaft 14, the shaft diameter r (the radius of the bottom surface). ) (Mm), which is defined by the following formula (1) using the Young's modulus E (GPa) of the constituent material.
δ = PL 3 / (12πr 4 E) (1)
An example is given below as a method for measuring the maximum deflection amount of the formula (1), but the present invention is not limited in this respect. Support the inner side 10mm from both ends of the shaft in the axial direction, apply a 19.6N load to the central portion of the shaft in the axial direction with a push-pull gauge, etc. The method of measuring by etc. is mentioned.

本発明の端面研磨ブラシ12においては、シャフト14に荷重19.6Nを付与した場合のたわみ量が、420μm以下であることが好ましく、400μm以下であることがより好ましく、300μm以下であることがさらに好ましく、250μm以下であることが特に好ましい。シャフト14に荷重19.6Nを付与した場合のたわみ量が、420μm以下である端面研磨ブラシを使用することにより、内周端面研磨時にシャフトが撓むことなく、ガラス基板積層体を均一に研磨できる。具体的には、同一のガラス基板積層体ロット内の研磨ばらつきを7μm以下にでき、内周面取り部と内周側面部の、均一かつ安定的な研磨が達成される。この時、シャフトのヤング率E、シャフトの底面の半径r、及び、シャフトの長さLは、シャフトのたわみ量δが、式(1)に基づく上述の条件を満たしていれば、特に制限されない。   In the end surface polishing brush 12 of the present invention, the amount of deflection when a load of 19.6 N is applied to the shaft 14 is preferably 420 μm or less, more preferably 400 μm or less, and further preferably 300 μm or less. The thickness is preferably 250 μm or less. By using an end surface polishing brush having a deflection of 420 μm or less when a load of 19.6 N is applied to the shaft 14, the glass substrate laminate can be uniformly polished without the shaft being bent during the inner peripheral end surface polishing. . Specifically, polishing variation within the same glass substrate laminate lot can be reduced to 7 μm or less, and uniform and stable polishing of the inner peripheral chamfered portion and the inner peripheral side surface portion is achieved. At this time, the Young's modulus E of the shaft, the radius r of the bottom surface of the shaft, and the length L of the shaft are not particularly limited as long as the deflection amount δ of the shaft satisfies the above-described condition based on the formula (1). .

端面研磨ブラシ12にブラシ毛13を植毛する方法は、特に限定されず、例えば図3に示すように、ブラシ毛13を植毛したチャンネル部品15をシャフト14に巻きつけて固定する方法が挙げられる。他にも、シャフト14に形成した凹形状の溝に、ブラシ毛13を直接植毛する方法などを採用しても良い。ブラシ毛13を植毛したチャンネル部品15をシャフト14に巻きつけて固定する方法は、端面研磨ブラシ12を設計する場合の自由度が高いため、好ましい。   The method of planting the bristle 13 on the end surface polishing brush 12 is not particularly limited, and for example, as shown in FIG. 3, there is a method of winding and fixing the channel component 15 in which the bristle 13 is implanted around the shaft 14. In addition, a method in which the bristles 13 are directly planted in a concave groove formed in the shaft 14 may be employed. The method of winding and fixing the channel component 15 in which the bristles 13 are planted around the shaft 14 is preferable because the degree of freedom in designing the end surface polishing brush 12 is high.

また、シャフト14における、ブラシ毛が植毛されている植毛部18の長さ16(以後、植毛長16と呼ぶ(図3参照))は、ガラス基板積層体11の全長よりも長く設定することが、内周端面研磨を均一に進行でき、かつ、十分な研磨速度を確保できるため好ましい。   Further, the length 16 (hereinafter referred to as the flocked length 16 (see FIG. 3)) of the flocked portion 18 where the bristles are planted in the shaft 14 may be set longer than the total length of the glass substrate laminate 11. The inner peripheral end face polishing can be progressed uniformly, and a sufficient polishing rate can be secured, which is preferable.

さらに、植毛部18における、植毛箇所18Aの長さ16Aと、非植毛箇所18Bの長さ16Bと、の合計(植毛長16)に対する、植毛箇所18Aの長さ16Aの割合(植毛箇所の面積率と呼ぶことがある)は、25〜95%であることが好ましく、30〜90%であることがより好ましく、30〜85%であることがさらに好ましい。植毛箇所の面積率が25%より低い場合、研磨速度が遅くなることがある。一方、植毛箇所の面積率が95%より高い場合、端面研磨ブラシをガラス基板積層体に押し当てた時に、ガラス積層体による反発が大きくなるため、端面研磨ブラシ12のシャフト14がたわんでしまい、内周面取り部の研磨を十分に行えない場合がある。   Furthermore, the ratio of the length 16A of the flocked portion 18A to the total (flocked length 16) of the length 16A of the flocked portion 18A and the length 16B of the non-flocked portion 18B in the flocked portion 18 (the area ratio of the flocked portion) Is preferably 25 to 95%, more preferably 30 to 90%, and still more preferably 30 to 85%. When the area ratio of the flocked portion is lower than 25%, the polishing rate may be slow. On the other hand, when the area ratio of the flocked portion is higher than 95%, when the end surface polishing brush is pressed against the glass substrate laminate, the repulsion due to the glass laminate increases, so the shaft 14 of the end surface polishing brush 12 is bent, The inner peripheral chamfered portion may not be sufficiently polished.

なお、植毛箇所の面積率の測定方法としては、例えば、シャフトの軸方向の単位長さ(例えば100mm)中における植毛箇所18Aが占める長さを測定して、その測定値から計算により求める方法などが挙げられる。なお、チャンネル部品15を使用する場合、チャンネル部品15に占める植毛箇所の幅、チャンネル部品15のピッチ幅19等は、植毛箇所の面積率が25〜95%となれば、特に制限されない。   In addition, as a measuring method of the area ratio of the flocked part, for example, a method in which the length occupied by the flocked part 18A in the unit length (for example, 100 mm) in the axial direction of the shaft is measured and obtained by calculation from the measured value, etc. Is mentioned. In addition, when using the channel component 15, the width | variety of the flocked location which occupies for the channel component 15, the pitch width 19 of the channel component 15, etc. will not be restrict | limited especially if the area ratio of a flocked location will be 25-95%.

シャフト、ブラシ毛、チャンネル部品を含む端面研磨ブラシ12の外径20は、内周端面研磨を行うガラス基板の円形孔の直径よりも大きくても良く、小さくても良い。端面研磨ブラシ12の外径20が、ガラス基板の円形孔の直径よりも小さい場合、端面研磨ブラシ12をガラス基板の内周端面に接触するまで移動させる必要がある。   The outer diameter 20 of the end surface polishing brush 12 including the shaft, the brush bristles, and the channel parts may be larger or smaller than the diameter of the circular hole of the glass substrate on which the inner peripheral end surface is polished. When the outer diameter 20 of the end surface polishing brush 12 is smaller than the diameter of the circular hole of the glass substrate, it is necessary to move the end surface polishing brush 12 until it contacts the inner peripheral end surface of the glass substrate.

ブラシ毛の長さ21が長すぎる場合、ブラシ毛をガラス基板の内周端面に適切な押圧で接触できなくなり、研磨速度が低下することがある。一方、ブラシ毛の長さが短すぎる場合、ガラス基板の内周面取り部の奥までブラシ毛を確実に届かせることが困難となるために、内周面取り部の研磨が十分に進行しない場合がある。そのため、シャフトの径、端面研磨ブラシ12の外径20、ガラス基板の円形孔の直径、チャンネル部品の高さ17、並びに、後述するブラシ毛の材質、線径等に応じて、適切なブラシ毛の長さを選択することが重要となる。   When the length 21 of the bristle is too long, the bristle cannot be brought into contact with the inner peripheral end surface of the glass substrate with an appropriate pressure, and the polishing rate may be reduced. On the other hand, if the length of the brush bristles is too short, it may be difficult to ensure that the bristles reach the back of the inner chamfered portion of the glass substrate, so the polishing of the inner chamfered portion may not proceed sufficiently. is there. Therefore, an appropriate brush hair is selected according to the diameter of the shaft, the outer diameter 20 of the end surface polishing brush 12, the diameter of the circular hole of the glass substrate, the height 17 of the channel component, and the material and wire diameter of the brush hair described later. It is important to select the length.

ブラシ毛の材質としては、ナイロン繊維、ポリプロピレン繊維、塩化ビニル繊維、ポリブチレンテレフタレート繊維などの化学合成繊維、豚や馬などの動物の毛、ピアノ線やステンレス繊維などの金属線、炭素繊維などの従来のブラシ毛の中から、当業者が適宜選択できるものである。   Brush hair materials include nylon fibers, polypropylene fibers, vinyl chloride fibers, polybutylene terephthalate fibers, and other synthetic synthetic fibers, animal hair such as pigs and horses, metal wires such as piano wires and stainless fibers, and carbon fibers. Those skilled in the art can appropriately select from conventional brush hairs.

ブラシ毛の線径は、前述のブラシ毛の長さなどにも依存するが、通常、0.1mm〜0.3mmであることが好ましい。ブラシ毛の線径が0.1mm未満の場合、ブラシ毛をガラス基板の内周端面に適切な押圧で接触できなくなり、研磨速度が低下することがある。さらに、ブラシ毛の経時変化が大きくなる場合がある。一方、ブラシ毛の線径が0.3mmを越える場合、ガラス基板の内周面取り部の奥までブラシ毛を確実に届かせることが困難となるために、内周面取り部の研磨が十分に進行しない場合がある。   The wire diameter of the brush bristles is preferably 0.1 mm to 0.3 mm, although it depends on the length of the bristles described above. When the wire diameter of the bristle is less than 0.1 mm, the bristle cannot be brought into contact with the inner peripheral end surface of the glass substrate with an appropriate pressure, and the polishing rate may decrease. Further, the change with time of the brush hair may become large. On the other hand, when the wire diameter of the brush bristle exceeds 0.3 mm, it becomes difficult to reliably reach the brush bristle to the back of the inner peripheral chamfered portion of the glass substrate, so that the inner peripheral chamfered portion is sufficiently polished. May not.

[研磨液]
本発明の端面研磨ブラシを使用して研磨する際の、研磨液としては、特に制限されない。一例を挙げると、下記で挙げる砥粒を、水又は水溶性有機溶媒に、分散させて得る。研磨液には、必要に応じて、分散剤、pH調整剤、粘度調整剤、キレート化剤などを添加できる。
[Polishing liquid]
The polishing liquid for polishing using the end face polishing brush of the present invention is not particularly limited. As an example, the following abrasive grains are obtained by dispersing in water or a water-soluble organic solvent. A dispersing agent, a pH adjuster, a viscosity adjuster, a chelating agent, and the like can be added to the polishing liquid as necessary.

研磨液に含まれる砥粒としては、特に限定されず、例えば、酸化セリウムなどの希土類酸化物、酸化ジルコニウム、酸化アルミニウム、酸化マグネシウム、酸化ケイ素、炭化ケイ素、酸化マンガン、酸化鉄、ダイヤモンド、窒化ホウ素及びジルコンなどの砥粒を含む研磨液を使用できる。上述した砥粒の中でも、酸化セリウム、酸化ジルコニウム、酸化アルミニウム、ジルコンを含む砥粒を使用することが好ましい。これらの砥粒は、1種類を単独で使用しても良く、2種類以上を併用して使用しても良い。   The abrasive grains contained in the polishing liquid are not particularly limited. For example, rare earth oxides such as cerium oxide, zirconium oxide, aluminum oxide, magnesium oxide, silicon oxide, silicon carbide, manganese oxide, iron oxide, diamond, boron nitride A polishing liquid containing abrasive grains such as zircon can be used. Among the abrasive grains described above, it is preferable to use abrasive grains containing cerium oxide, zirconium oxide, aluminum oxide, and zircon. One type of these abrasive grains may be used alone, or two or more types may be used in combination.

砥粒の平均粒子直径(D50)としては、特に限定されず、通常0.5μm〜5μmであり、好ましくは0.5μm〜2μmであり、より好ましくは0.7μm〜1.5μmである。   It does not specifically limit as an average particle diameter (D50) of an abrasive grain, Usually, they are 0.5 micrometer-5 micrometers, Preferably they are 0.5 micrometer-2 micrometers, More preferably, they are 0.7 micrometer-1.5 micrometers.

[磁気記録媒体用ガラス基板の製造方法]
以下、本発明の磁気記録媒体用ガラス基板の製造方法について説明する。
[Method for producing glass substrate for magnetic recording medium]
Hereinafter, the manufacturing method of the glass substrate for magnetic recording media of this invention is demonstrated.

本発明の磁気記録媒体用ガラス基板の製造方法は、本発明の端面研磨ブラシを使用して内周端面研磨すれば、他の工程は、特に制限されない。   In the method for producing a glass substrate for a magnetic recording medium of the present invention, other steps are not particularly limited as long as the inner peripheral end surface is polished using the end surface polishing brush of the present invention.

一例を挙げると、一般的に、磁気記録媒体用ガラス基板は、
(1)ガラス素基板を、中央部に円孔を有する円盤形状に加工した後、内周側面と外周側面を面取り加工する形状付与工程、
(2)ガラス基板の外周端面を研磨する外周端面研磨工程、
(3)ガラス基板の内周端面を研磨する。内周端面研磨工程、
(4)ガラス基板の上下両主平面を研磨する主平面研磨工程、
(5)ガラス基板を精密洗浄して乾燥し、磁気記録媒体用ガラス基板を得る洗浄工程、
等の工程により製造される。本発明は上記方法に限定されないが、(3)の内周端面研磨工程では、本発明の端面研磨ブラシを用いてガラス基板の内周端面を研磨する。
As an example, generally, a glass substrate for a magnetic recording medium is
(1) A shape imparting step of chamfering the inner peripheral side surface and the outer peripheral side surface after processing the glass base substrate into a disk shape having a circular hole in the central portion;
(2) An outer peripheral end surface polishing step for polishing the outer peripheral end surface of the glass substrate,
(3) The inner peripheral end face of the glass substrate is polished. Inner peripheral edge polishing process,
(4) a main surface polishing step for polishing the upper and lower main surfaces of the glass substrate;
(5) A cleaning step of precisely cleaning and drying the glass substrate to obtain a glass substrate for a magnetic recording medium,
It is manufactured by such processes. Although this invention is not limited to the said method, in the inner peripheral end surface grinding | polishing process of (3), the inner peripheral end surface of a glass substrate is grind | polished using the end surface polishing brush of this invention.

(2)外周端面研磨工程と(3)内周端面研磨工程とは、どちらの工程を先に実施しても良い。また、(2)及び(3)の端面研磨工程の前後のうち少なくとも一方で、主平面のラップ(例えば、遊離砥粒ラップ、固定砥粒ラップなど)を実施しても良く、各工程間にガラス基板の洗浄(工程間洗浄)やガラス基板表面のエッチング(工程間エッチング)を実施しても良い。なお、ここで言う主平面のラップは、広義の主平面の研磨である。   Either the (2) outer peripheral end surface polishing step or the (3) inner peripheral end surface polishing step may be performed first. In addition, at least one of the end surface polishing steps (2) and (3) before and after the end surface polishing step, a main plane lapping (for example, loose abrasive lapping, fixed abrasive lapping, etc.) may be performed. Glass substrate cleaning (inter-process cleaning) and glass substrate surface etching (inter-process etching) may be performed. Note that the main plane lapping here is polishing of the main plane in a broad sense.

研磨工程は、1次研磨のみでも良く、1次研磨と2次研磨を行っても良く、2次研磨の後に3次研磨を行っても良い。   The polishing step may be only primary polishing, primary polishing and secondary polishing may be performed, or tertiary polishing may be performed after secondary polishing.

本発明において、磁気記録媒体用ガラス基板は、アモルファスガラスでも良く、結晶化ガラスでも良く、ガラス基板の表層に強化層を有する強化ガラス(例えば、化学強化ガラス)でも良い。一例を挙げると、磁気記録媒体用ガラス基板に高い機械的強度が求められる場合、ガラス基板の表層に強化層を形成する強化工程(例えば、化学強化工程)を実施する。強化工程は、最初の研磨工程前、最後の研磨工程後、又は各研磨工程間のいずれで実施しても良い。また、本発明のガラス基板のガラス素基板は、フロート法、フュージョン法、リドロー法、プレス成形法などの方法により作製されるが、本発明はこの点で限定されない。   In the present invention, the glass substrate for a magnetic recording medium may be amorphous glass, crystallized glass, or tempered glass (for example, chemically tempered glass) having a tempered layer on the surface layer of the glass substrate. As an example, when high mechanical strength is required for a glass substrate for magnetic recording media, a strengthening step (for example, a chemical strengthening step) for forming a reinforcing layer on the surface layer of the glass substrate is performed. The strengthening step may be performed either before the first polishing step, after the last polishing step, or between each polishing step. The glass substrate of the glass substrate of the present invention is produced by a method such as a float method, a fusion method, a redraw method, or a press molding method, but the present invention is not limited in this respect.

下記に、ガラス基板の(2)外周端面研磨工程、(4)主平面研磨工程及び(5)洗浄工程について、一例を挙げるが、本発明はこれに限定されない。   Examples of the glass substrate (2) outer peripheral end surface polishing step, (4) main surface polishing step, and (5) cleaning step are given below, but the present invention is not limited thereto.

(2)の外周端面研磨工程では、ガラス基板の外周側面と外周面取り部のキズを除去し、鏡面となるように加工する。この時、例えば、研磨ブラシと砥粒を含有する研磨液を用いて研磨できる。研磨液に含まれる砥粒としては、特に限定されず、例えば、酸化セリウムなどの希土類酸化物、酸化ジルコニウム、酸化アルミニウム、酸化マグネシウム、酸化ケイ素、炭化ケイ素、酸化マンガン、酸化鉄、ダイヤモンド、窒化ホウ素及びジルコンなどの砥粒を含む研磨液を使用できる。上述した砥粒の中でも、酸化セリウム、酸化ジルコニウム、酸化アルミニウム、ジルコンを含む砥粒を使用することが好ましい。これらの砥粒は、1種類を単独で使用しても良く、2種類以上を併用して使用しても良い。   In the outer peripheral end surface polishing step (2), scratches on the outer peripheral side surface and the outer peripheral chamfered portion of the glass substrate are removed, and the glass substrate is processed into a mirror surface. At this time, for example, polishing can be performed using a polishing liquid containing a polishing brush and abrasive grains. The abrasive grains contained in the polishing liquid are not particularly limited. For example, rare earth oxides such as cerium oxide, zirconium oxide, aluminum oxide, magnesium oxide, silicon oxide, silicon carbide, manganese oxide, iron oxide, diamond, boron nitride A polishing liquid containing abrasive grains such as zircon can be used. Among the abrasive grains described above, it is preferable to use abrasive grains containing cerium oxide, zirconium oxide, aluminum oxide, and zircon. One type of these abrasive grains may be used alone, or two or more types may be used in combination.

砥粒の平均粒子直径(D50)としては、特に限定されず、通常0.5μm〜5μmであり、好ましくは0.5μm〜2μmであり、より好ましくは0.7μm〜1.5μmである。外周端面研磨工程後は、酸化セリウムを洗浄除去して次の工程に供する。   It does not specifically limit as an average particle diameter (D50) of an abrasive grain, Usually, they are 0.5 micrometer-5 micrometers, Preferably they are 0.5 micrometer-2 micrometers, More preferably, they are 0.7 micrometer-1.5 micrometers. After the outer peripheral end surface polishing step, the cerium oxide is washed and removed and used for the next step.

(4)の主平面研磨工程では、例えば、研磨具として硬質ウレタンパッドと酸化セリウム砥粒を含有した研磨液を用いて、両面研磨装置により上下主平面の研磨加工を行っても良い。また、例えば、研磨具として軟質ウレタンパッドと酸化セリウム砥粒(前記酸化セリウム砥粒よりも平均粒径が小さい酸化セリウム砥粒を用いても良い)を含有した研磨液を用いて、両面研磨装置により上下主平面の研磨加工を行っても良い。さらに、研磨具として軟質ウレタンパッドと、一次粒子の平均粒径が20〜30nm程度のコロイダルシリカを主成分とする研磨液組成物等を用いて、両面研磨装置により上下主平面の仕上げ研磨加工を行う。   In the main plane polishing step (4), for example, the upper and lower main planes may be polished by a double-side polishing apparatus using a polishing liquid containing a hard urethane pad and cerium oxide abrasive grains as a polishing tool. Further, for example, a double-side polishing apparatus using a polishing liquid containing a soft urethane pad and cerium oxide abrasive grains (which may be cerium oxide abrasive grains having an average particle size smaller than the cerium oxide abrasive grains) as a polishing tool. The upper and lower main planes may be polished. Further, using a polishing composition mainly composed of a soft urethane pad and colloidal silica having an average primary particle size of about 20 to 30 nm as a polishing tool, the upper and lower main surfaces are subjected to final polishing by a double-side polishing apparatus. Do.

(5)の洗浄工程では、仕上げ研磨後のガラス基板を、洗剤を用いたスクラブ洗浄、洗剤溶液へ浸漬した状態での超音波洗浄、純水へ浸漬した状態での超音波洗浄等を順次行い、イソプロピルアルコール等の蒸気により乾燥する。   In the cleaning step (5), the glass substrate after finish polishing is sequentially subjected to scrub cleaning using a detergent, ultrasonic cleaning in a state immersed in a detergent solution, ultrasonic cleaning in a state immersed in pure water, and the like. Dry with steam such as isopropyl alcohol.

上記方法により得られた磁気記録媒体用ガラス基板の上に、下地層、磁性層、保護層、潤滑層などの層を積層することで、磁気ディスクを製造できる。各層の積層方法などは、従来の方法などを適宜使用できる。磁気ディスクのサイズとしては、特に限定されず、例えば、0.85インチ型磁気ディスク(内径6mm、外径21.6mm、板厚0.381mm)、1.0インチ型磁気ディスク(内径7mm、外径27.4mm、板厚0.381mm)、1.8インチ型磁気ディスク(内径12mm、外径48mm、板厚0.508mm)、2.5インチ型磁気ディスク(内径20mm、外径65mm、板厚0.635mm、0.8mm)等の、種々の大きさの磁気ディスクを製造できる。   A magnetic disk can be manufactured by laminating layers such as an underlayer, a magnetic layer, a protective layer, and a lubricating layer on the glass substrate for a magnetic recording medium obtained by the above method. A conventional method or the like can be appropriately used as a method for laminating each layer. The size of the magnetic disk is not particularly limited. For example, 0.85 inch type magnetic disk (inner diameter 6 mm, outer diameter 21.6 mm, plate thickness 0.381 mm), 1.0 inch type magnetic disk (inner diameter 7 mm, outer Diameter 27.4 mm, plate thickness 0.381 mm), 1.8 inch type magnetic disk (inner diameter 12 mm, outer diameter 48 mm, plate thickness 0.508 mm), 2.5 inch type magnetic disk (inner diameter 20 mm, outer diameter 65 mm, plate) Magnetic disks of various sizes such as 0.635 mm and 0.8 mm in thickness can be manufactured.

(実施例1)
以下に実施例及び比較例を挙げて本発明を更に説明するが、本発明はこれにより何ら制限されるものではない。
Example 1
Examples The present invention will be further described below with reference to examples and comparative examples, but the present invention is not limited thereby.

実施例及び比較例の内周端面研磨で使用した端面研磨ブラシのたわみ量は、シャフトの軸方向の両端から10mm内側を固定して、シャフトの中心部にプッシュプルゲージにより19.6Nの荷重を印加し、シャフト中心部の移動距離をダイヤルゲージで測定した値を使用した。   The deflection of the end face polishing brush used in the inner peripheral end face polishing of the example and the comparative example was fixed 10 mm inside from both ends in the axial direction of the shaft, and a load of 19.6 N was applied to the center portion of the shaft by a push-pull gauge. A value obtained by applying and measuring a moving distance of the central portion of the shaft with a dial gauge was used.

また、実施例及び比較例で使用した端面研磨ブラシは、チャンネル高さが2.5mm、ブラシ毛の長さが3.7mm、ブラシ毛の線径が0.2mm、植毛部の面積率が30%のものを使用した。   Moreover, the end surface polishing brush used in the Examples and Comparative Examples has a channel height of 2.5 mm, a brush bristle length of 3.7 mm, a bristle wire diameter of 0.2 mm, and a flocked area ratio of 30. % Were used.

さらに、研磨液としては、平均粒径1.4μmの酸化セリウム砥粒を主成分とし、比重を1.2に調製した研磨液を用いた。下記に、詳細な研磨手順を記す。   Further, as the polishing liquid, a polishing liquid mainly composed of cerium oxide abrasive grains having an average particle diameter of 1.4 μm and a specific gravity of 1.2 was used. The detailed polishing procedure is described below.

フロート法で成形されたSiOを主成分とするガラス板を、外径65mm、内径20mm、板厚0.635mmの磁気記録媒体用ガラス基板が得られるような、中央部に円孔を有する円盤形状に加工した。 A disk having a circular hole in the center so as to obtain a glass substrate for magnetic recording media having an outer diameter of 65 mm, an inner diameter of 20 mm, and a thickness of 0.635 mm made of a glass plate mainly composed of SiO 2 formed by the float process. Processed into shape.

この中央部に円孔を有する円盤状ガラス基板の内周側面および外周側面を、最終製品である磁気記録媒体用ガラス基板としたときの面取り幅0.15mm、面取り角度45°となるように面取り加工した。その後、ガラス基板の上下主平面を、アルミナ砥粒(平均粒径7〜7.5μm)を用いて研削(ラッピング)した後、砥粒を洗浄・除去した。   Chamfering so that the inner peripheral side surface and the outer peripheral side surface of the disk-shaped glass substrate having a circular hole in the center portion have a chamfering width of 0.15 mm and a chamfering angle of 45 ° when the glass substrate for a magnetic recording medium as a final product is used. processed. Thereafter, the upper and lower main planes of the glass substrate were ground (wrapped) using alumina abrasive grains (average particle diameter of 7 to 7.5 μm), and then the abrasive grains were washed and removed.

次に、ガラス基板を、アライメント治具を用いて積層し、ガラス基板積層体を形成した。なお、ガラス基板とガラス基板との間には、厚さ0.2mmの樹脂製スペーサを挿入し、合計200枚のガラス板を重ね合わせ、ガラス基板積層体を形成した。   Next, the glass substrate was laminated using an alignment jig to form a glass substrate laminate. In addition, a resin spacer having a thickness of 0.2 mm was inserted between the glass substrates, and a total of 200 glass plates were stacked to form a glass substrate laminate.

得られたガラス基板積層体を、内周端面研磨用の治具に挿入し、ガラス基板積層体の上下方向から締め付けて固定下の地、アライメント治具をガラス基板積層体から取り外した。このガラス基板積層体を、内周端面研磨装置(ユーティーケー・システム社製、製品名:BTK−08)の被研磨体保持部に設置し、ガラス基板積層体の中央部の円形孔に端面研磨ブラシを挿入した。使用した端面研磨ブラシは、ヤング率が206GPa、端面研磨ブラシのシャフト部の長さが375mm、ガラス基板の円形孔の直径に対しシャフトの直径が50%、前述の方法で測定したたわみ量が210μmであった。   The obtained glass substrate laminate was inserted into a jig for polishing the inner peripheral end surface, and was clamped in the vertical direction of the glass substrate laminate to remove the fixed ground and alignment jig from the glass substrate laminate. This glass substrate laminate is placed in the polished object holding part of the inner peripheral end surface polishing apparatus (product name: BTK-08, manufactured by TK System Co., Ltd.), and the end surface is polished in the circular hole at the center of the glass substrate laminate. A brush was inserted. The end face polishing brush used has a Young's modulus of 206 GPa, the length of the shaft part of the end face polishing brush is 375 mm, the diameter of the shaft is 50% of the diameter of the circular hole of the glass substrate, and the amount of deflection measured by the above method is 210 μm. Met.

端面研磨ブラシをガラス基板積層体の円形孔の中心から一方向に移動させ、ブラシ毛をガラス基板積層体の内周側面部と内周面取り部に一定量押し込んだ。上述の研磨液をガラス基板積層体の内周端面部に供給し、研磨ブラシとガラス基板積層体を反対方向に回転させ、さらに、端面研磨ブラシをガラス基板積層体の積層方向に揺動させながら研磨した。   The end surface polishing brush was moved in one direction from the center of the circular hole of the glass substrate laminate, and a certain amount of brush hair was pushed into the inner peripheral side surface portion and the inner peripheral chamfered portion of the glass substrate laminate. While supplying the above polishing liquid to the inner peripheral end surface portion of the glass substrate laminate, rotating the polishing brush and the glass substrate laminate in opposite directions, and further swinging the end surface polishing brush in the laminating direction of the glass substrate laminate Polished.

なお、本実施例及び比較例においては、研磨液を7〜8L/min、研磨ブラシの回転速度を2500rpm、ガラス基板積層体の回転速度を39rpm、揺動速度を100〜1500mm/minに設定し、内周側面部の研磨量が25μm(片面では12.5μm)となるまで研磨を行った。   In this example and comparative example, the polishing liquid was set to 7 to 8 L / min, the rotation speed of the polishing brush was set to 2500 rpm, the rotation speed of the glass substrate laminate was set to 39 rpm, and the rocking speed was set to 100 to 1500 mm / min. Polishing was performed until the polishing amount of the inner peripheral side surface portion was 25 μm (12.5 μm on one side).

内周端面研磨後、ガラス基板積層体を内周端面研磨用の治具から取り外し、ガラス基板積層体からガラス基板を1枚毎に分離した。分離されたガラス基板は、砥粒を洗浄除去し、下記の評価方法に供した。   After polishing the inner peripheral end face, the glass substrate laminate was removed from the inner peripheral end face polishing jig, and the glass substrates were separated from the glass substrate laminate one by one. The separated glass substrate was subjected to the following evaluation method after washing and removing the abrasive grains.

(実施例2)
使用した端面研磨ブラシは、ヤング率が199GPa、端面研磨ブラシのシャフト部の長さが375mm、ガラス基板の円形孔の直径に対しシャフトの直径が50%、前述の方法で測定したたわみ量が220μmであった以外は、実施例1と同様の工程で研磨を行った。
(Example 2)
The end face polishing brush used has a Young's modulus of 199 GPa, the length of the shaft part of the end face polishing brush is 375 mm, the diameter of the shaft is 50% of the diameter of the circular hole of the glass substrate, and the amount of deflection measured by the above method is 220 μm. Except that, polishing was performed in the same process as in Example 1.

(実施例3)
使用した端面研磨ブラシは、ヤング率が199GPa、端面研磨ブラシのシャフト部の長さが230mm、ガラス基板の円形孔の直径に対しシャフトの直径が40%、前述の方法で測定したたわみ量が120μmであった以外は、実施例1と同様の工程で研磨を行った。
(Example 3)
The end face polishing brush used has a Young's modulus of 199 GPa, the length of the shaft part of the end face polishing brush is 230 mm, the diameter of the shaft is 40% of the diameter of the circular hole of the glass substrate, and the amount of deflection measured by the above method is 120 μm. Except that, polishing was performed in the same process as in Example 1.

(実施例4)
使用した端面研磨ブラシは、ヤング率が199GPa、端面研磨ブラシのシャフト部の長さが230mm、ガラス基板の円形孔の直径に対しシャフトの直径が30%、前述の方法で測定したたわみ量が390μmであった以外は、実施例1と同様の工程で研磨を行った。
Example 4
The end face polishing brush used has a Young's modulus of 199 GPa, the length of the shaft part of the end face polishing brush is 230 mm, the diameter of the shaft is 30% with respect to the diameter of the circular hole of the glass substrate, and the deflection measured by the above method is 390 μm. Except that, polishing was performed in the same process as in Example 1.

(比較例1)
使用した端面研磨ブラシは、ヤング率が101GPa、端面研磨ブラシのシャフト部の長さが375mm、ガラス基板の円形孔の直径に対しシャフトの直径が50%、前述の方法で測定したたわみ量が430μmであった以外は、実施例1と同様の工程で研磨を行った。
(Comparative Example 1)
The used end face polishing brush has a Young's modulus of 101 GPa, the length of the shaft part of the end face polishing brush is 375 mm, the diameter of the shaft is 50% of the diameter of the circular hole of the glass substrate, and the deflection measured by the above method is 430 μm. Except that, polishing was performed in the same process as in Example 1.

(比較例2)
使用した端面研磨ブラシは、ヤング率が69GPa、端面研磨ブラシのシャフト部の長さが375mm、ガラス基板の円形孔の直径に対しシャフトの直径が50%、前述の方法で測定したたわみ量が640μmであった以外は、実施例1と同様の工程で研磨を行った。
(Comparative Example 2)
The end face polishing brush used has a Young's modulus of 69 GPa, the length of the shaft part of the end face polishing brush is 375 mm, the diameter of the shaft is 50% of the diameter of the circular hole of the glass substrate, and the amount of deflection measured by the above method is 640 μm. Except that, polishing was performed in the same process as in Example 1.

[評価]
(研磨量の差)
研磨量は、端面研磨前のガラス基板と、端面研磨後に得られたガラス基板を洗浄乾燥したものとを、高精度2次元寸法測定機(キーエンス社製、製品名:VM8040)を用いて測定した。具体的には、ガラス基板中央部の円形孔の直径を、内周側面部で測定し、端面研磨前後の円形孔直径差を研磨量とした。
[Evaluation]
(Difference in polishing amount)
The amount of polishing was measured using a high-precision two-dimensional dimension measuring machine (manufactured by Keyence Corporation, product name: VM8040) obtained by washing and drying the glass substrate before end face polishing and the glass substrate obtained after end face polishing. . Specifically, the diameter of the circular hole in the central portion of the glass substrate was measured at the inner peripheral side surface portion, and the difference in circular hole diameter before and after end face polishing was taken as the polishing amount.

200枚のガラス基板積層体ロットから、任意に20枚抜き取り、上述の研磨量を測定し、その最大値と最小値の差を同一ロット内の研磨量の差と定義した。   20 sheets were arbitrarily extracted from 200 glass substrate laminate lots, the above-mentioned polishing amount was measured, and the difference between the maximum value and the minimum value was defined as the difference in polishing amount in the same lot.

(ピット欠陥数)
研磨後のガラス基板の内周端面を、フッ酸と硝酸を含む酸性のエッチング溶液を用いて、ガラス基板を深さ方向に5μmエッチングする。これにより、加工変質層(キズ)を、観察しやすいピット欠陥とすることができる。この後、洗浄と乾燥を行う。最後に、ガラス基板を切断して、ピット欠陥数を評価しやすいサイズにして、内周側面部8及び内周面取り部9を含むピット欠陥数観察試料を作製した。
(Number of pit defects)
The inner peripheral end face of the polished glass substrate is etched 5 μm in the depth direction using an acidic etching solution containing hydrofluoric acid and nitric acid. As a result, the work-affected layer (scratches) can be easily observed as pit defects. Thereafter, washing and drying are performed. Finally, the glass substrate was cut so that the number of pit defects could be easily evaluated, and a pit defect number observation sample including the inner peripheral side surface portion 8 and the inner peripheral chamfered portion 9 was produced.

ピット欠陥数は、光学顕微鏡(オリンパス社製、明視野・微分干渉金属顕微鏡BX60M)を用いてカウントし、評価した。各観察試料を試料台に固定し、内周側面部8又は内周面取り部9の面が、光学顕微鏡の対物レンズのレンズ面に対して平行となるように固定した。光学顕微鏡の対物レンズは20倍を使用し、観察視野を480μm×328μmとして、直径が10μm以上の円形状又は楕円形状のピット欠陥の数をカウントした。そして、計測したピット欠陥数を観察面積で除した数値を算出した。   The number of pit defects was counted and evaluated using an optical microscope (manufactured by Olympus, bright field / differential interference metal microscope BX60M). Each observation sample was fixed to the sample stage, and fixed so that the surface of the inner peripheral side surface portion 8 or the inner peripheral chamfered portion 9 was parallel to the lens surface of the objective lens of the optical microscope. The objective lens of the optical microscope was 20 times, the observation visual field was 480 μm × 328 μm, and the number of circular or elliptical pit defects having a diameter of 10 μm or more was counted. Then, a numerical value obtained by dividing the measured number of pit defects by the observation area was calculated.

200枚のガラス基板積層体ロットにおいて、おおよそ上部、中部、下部と分類し、分類された各々の場所から、任意に3枚抜き取り、上述の方法で計測し、その数値の平均をピット欠陥数とした。通常、得られた数値が5個/mmより小さくなる研磨方法が好ましく、5個/mm以上のものを含む研磨方法は好ましくない。 In 200 glass substrate laminate lots, roughly classify them as upper, middle, and lower, and arbitrarily three samples are taken from each classified location and measured by the method described above, and the average of the numerical values is the number of pit defects. did. Usually, a polishing method in which the obtained numerical value is smaller than 5 pieces / mm 2 is preferable, and a polishing method including 5 pieces / mm 2 or more is not preferable.

Figure 0005327275
本発明の端面研磨ブラシは、荷重19.6Nを付与した場合のたわみ量が420μm以下であるため、ガラス基板の内周面取り部と内周側面部とを均一かつ安定的に研磨できる。
Figure 0005327275
Since the end surface polishing brush of the present invention has a deflection amount of 420 μm or less when a load of 19.6 N is applied, the inner peripheral chamfered portion and the inner peripheral side surface portion of the glass substrate can be uniformly and stably polished.

1 ガラス基板
2 主表面
3 円形孔
4 外周端面
5 外周側面部
6 外周面取り部
7 内周端面
8 内周側面部
9 内周面取り部
10 スペーサ
11 ガラス基板積層体
12 端面研磨ブラシ
13 ブラシ毛
14 シャフト
15 チャンネル部品
16 植毛長
17 チャンネル部品の高さ
18 植毛部
19 チャンネル部品のピッチ幅
20 端面研磨ブラシの外径
21 ブラシ毛の長さ
DESCRIPTION OF SYMBOLS 1 Glass substrate 2 Main surface 3 Circular hole 4 Outer peripheral end surface 5 Outer peripheral side surface portion 6 Outer peripheral chamfered portion 7 Inner peripheral end surface 8 Inner peripheral side surface portion 9 Inner peripheral chamfered portion 10 Spacer 11 Glass substrate laminated body 12 End surface polishing brush 13 Brush hair 14 Shaft 15 Channel part 16 Flocking length 17 Channel part height 18 Flocking part 19 Channel part pitch width 20 Outer surface polishing brush outer diameter 21 Brush hair length

Claims (8)

中心部に円形孔を有する磁気記録媒体用ガラス基板の内周端面を研磨する端面研磨ブラシであって、
前記端面研磨ブラシはシャフトにブラシ毛が植毛されており、前記シャフトは、荷重19.6Nを受けた時の最大たわみ量が390μm以下である、端面研磨ブラシ。
An end face polishing brush for polishing an inner peripheral end face of a glass substrate for a magnetic recording medium having a circular hole in the center,
The end surface polishing brush has an end surface polishing brush in which brush hair is planted on a shaft, and the shaft has a maximum deflection amount of 390 μm or less when a load of 19.6 N is applied.
前記シャフトは、ヤング率が199GPa以上である、請求項1に記載の端面研磨ブラシ。 The end face polishing brush according to claim 1, wherein the shaft has a Young's modulus of 199 GPa or more. 前記シャフトにおける、前記ブラシ毛が植毛されている植毛部は、植毛箇所と非植毛箇所とを備え、前記シャフトの前記植毛箇所の軸方向の長さと前記非植毛箇所の軸方向の長さの合計に対する、前記植毛箇所の軸方向の長さの割合は、25〜95%である、請求項1又は2に記載の端面研磨ブラシ。   In the shaft, the flocked part in which the brush hair is flocked includes a flocked part and a non-flocked part, and the total length of the shaft in the axial direction of the flocked part and the axial length of the non-flocked part. The end surface polishing brush according to claim 1 or 2, wherein a ratio of an axial length of the flocked portion to 25 to 95%. 内周側面部と、外周側面部と、主表面とを有する、中心部に円形孔を有する円盤状のガラス基板を形成する形状付与工程と、
前記ガラス基板の前記内周側面部と前記主表面との交差部に内周面取り部を形成する内周面取り工程と、
前記内周側面部と前記内周面取り部を研磨する内周端面研磨工程と、
ガラス基板の主平面を研磨する主平面研磨工程と、
を備え、
前記内周端面研磨工程は、
前記ガラス基板を複数枚積層し、積層された前記ガラス基板の前記内周側面部及び前記内周面取り部に砥粒を含む研磨液を供給する工程と、
シャフトにブラシ毛が植毛されており、前記シャフトは荷重19.6Nをかけた時の最大たわみ量が390μm以下である、端面研磨ブラシを回転させた状態で、前記内周側面部及び前記内周面取り部に接触させる工程と、
を含む、磁気記録媒体用ガラス基板の製造方法。
A shape imparting step of forming a disk-shaped glass substrate having a circular hole in the center part, having an inner peripheral side part, an outer peripheral side part, and a main surface;
An inner peripheral chamfering step for forming an inner peripheral chamfered portion at an intersection between the inner peripheral side surface portion and the main surface of the glass substrate;
An inner peripheral end surface polishing step for polishing the inner peripheral side surface portion and the inner peripheral chamfered portion;
A main surface polishing step for polishing the main surface of the glass substrate;
With
The inner peripheral end surface polishing step includes:
Laminating a plurality of the glass substrates, supplying a polishing liquid containing abrasive grains to the inner peripheral side surface portion and the inner peripheral chamfered portion of the laminated glass substrate;
The shaft is brushed with bristles, and the shaft has a maximum deflection of 390 μm or less when a load of 19.6 N is applied. A step of contacting the peripheral chamfered portion;
The manufacturing method of the glass substrate for magnetic recording media containing this.
前記シャフトの直径は、前記円形孔の直径の30%〜60%である、請求項4に記載の磁気記録媒体用ガラス基板の製造方法。   The diameter of the said shaft is a manufacturing method of the glass substrate for magnetic recording media of Claim 4 which is 30%-60% of the diameter of the said circular hole. 前記シャフトは、ヤング率が199GPa以上である、請求項4又は5に記載の磁気記録媒体用ガラス基板の製造方法。 The method for producing a glass substrate for a magnetic recording medium according to claim 4, wherein the shaft has a Young's modulus of 199 GPa or more. 前記内周端面研磨工程において内周端面研磨した後の前記ガラス基板の前記内周端面をエッチング溶液で前記ガラス基板の深さ方向に5μmエッチングしたとき、前記内周面取り部における直径が10μm以上の円形状又は楕円形状のピット欠陥は5個/mmWhen the inner peripheral end face of the glass substrate after the inner peripheral end face polishing in the inner peripheral end face polishing step is etched by 5 μm in the depth direction of the glass substrate with an etching solution, the diameter of the inner peripheral chamfered portion is 10 μm or more. 5 circular / elliptical pit defects / mm 2 未満である、請求項4乃至6のいずれか一項に記載の磁気記録媒体用ガラス基板の製造方法。The manufacturing method of the glass substrate for magnetic recording media as described in any one of Claims 4 thru | or 6 which is less than. 請求項4乃至7のいずれか一項に記載の磁気記録媒体用ガラス基板の製造方法によって製造された磁気記録媒体用ガラス基板であって、A glass substrate for a magnetic recording medium manufactured by the method for manufacturing a glass substrate for a magnetic recording medium according to any one of claims 4 to 7,
前記磁気記録媒体用ガラス基板は、前記内周端面をエッチング溶液で前記ガラス基板の深さ方向に5μmエッチングしたとき、前記内周面取り部における直径が10μm以上の円形状又は楕円形状のピット欠陥は5個/mm  When the inner peripheral end surface of the glass substrate for magnetic recording medium is etched by 5 μm in the depth direction of the glass substrate with an etching solution, a circular or elliptical pit defect having a diameter of 10 μm or more at the inner peripheral chamfered portion is 5 / mm 2 未満である、磁気記録媒体用ガラス基板。The glass substrate for magnetic recording media which is less than.
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