JP5585269B2 - Method for manufacturing glass substrate for magnetic recording medium - Google Patents

Description

  The present invention relates to a method for manufacturing a glass substrate for a magnetic recording medium, which includes a grinding step of grinding a main plane of a glass substrate using a fixed abrasive tool.

  The manufacturing process of the glass substrate for magnetic recording media and the magnetic disk includes the following processes. (1) A shape imparting step in which a glass base substrate molded by a float method, a fusion method, a press molding method, or the like is processed into a disk shape having a circular hole in the center, and the inner peripheral side surface and the outer peripheral side surface are chamfered. (2) A grinding step of grinding the main plane of the glass base substrate. (3) An end surface polishing step of end-polishing the side surface portion and the chamfered portion of the glass substrate. (4) A polishing step for polishing the main plane of the glass substrate. (5) A cleaning step of precisely cleaning and drying the glass substrate to obtain a glass substrate for a magnetic recording medium. (6) A magnetic disk manufacturing process for manufacturing a magnetic disk by forming a thin film such as a magnetic layer on a glass substrate for a magnetic recording medium.

  In the manufacturing process of the glass substrate for a magnetic recording medium, (2) the grinding process of grinding the main plane of the glass base substrate is a step of making the glass base substrate have a desired plate thickness and flatness.

  When the main plane of the formed glass base substrate is smooth, if the main plane of the glass base substrate is ground with a fixed abrasive tool containing diamond abrasive grains having a small particle diameter, the diamond abrasive grains are caught on the main plane of the glass base substrate. It was difficult, and the diamond abrasive grains slipped on the main plane of the glass base substrate, which made it difficult to grind the glass base substrate, resulting in a reduction in the grinding processing speed.

  When grinding a glass base substrate with a smooth main plane, as a means of not reducing the grinding processing speed, before grinding the main plane of the glass base substrate with a fixed abrasive tool, Have been proposed (Patent Document 1, Patent Document 2).

  However, the frost processing for roughening the main flat surface of the glass substrate with a chemical solution etches the glass substrate isotropically, so that the glass substrate cannot be controlled to have a desired plate thickness and flatness. Therefore, in the subsequent grinding process and polishing process, it is necessary to set a large amount of grinding and polishing in order to control the plate thickness and flatness, which may result in poor productivity.

  In addition, when the main plane of the glass base substrate is ground and roughened with loose abrasive grains, deep cracks (hereinafter also referred to as a work-affected layer) occur on the main plane or end face of the glass substrate, and the work-affected layer is In order to remove it, it is necessary to increase the grinding amount or the polishing amount in the subsequent grinding step or polishing step, which may reduce the productivity.

WO2010 / 041623 A1 JP 2009-99249 A

  The present invention provides a method for producing a glass substrate for a magnetic recording medium, which includes a step of processing a glass substrate having a plate shape into a glass substrate excellent in plate thickness distribution and flatness with high productivity.

The present invention is a method for manufacturing a glass substrate for a magnetic recording medium, wherein the grinding step of grinding a main plane of a glass substrate having a plate shape is any one of diamond abrasive grains, alumina abrasive grains, and silicon carbide abrasive grains. A first grinding step of grinding the main surface of the glass base substrate using a first fixed abrasive tool including one or more abrasive grains, and an average particle diameter smaller than the abrasive grains contained in the first fixed abrasive tool diamond abrasive grains using a second fixed abrasive tool comprising possess a second grinding step of grinding the main surfaces of the glass substrate, the grinding surface of the first fixed abrasive tool, the abrasive grains The surface roughness Ra ₁ measured using a stylus type surface roughness measuring machine is 2 μm to 8 μm, and the abrasive surface of the second fixed abrasive tool is exposed by diamond abrasive grains. and it has a surface roughness Ra ₂ which was measured using a surface roughness tester stylus type The processing speed of the glass substrate in the first grinding step (main surface on one side) is 13 μm / min or more, and the processing speed of the glass substrate in the second grinding step (on one side) is 0.1 μm to 2 μm. The main plane) is 1 to 10 μm / min, and a method for producing a glass substrate for a magnetic recording medium is provided.

  The method for manufacturing a glass substrate for a magnetic recording medium having a grinding process according to the present invention controls the thickness distribution and flatness of a glass substrate having a plate shape in the first grinding process of grinding the main plane of the glass substrate. However, since the main plane can be roughened without causing major damage to the main plane or the end face of the glass substrate, the main plane of the glass substrate can be efficiently ground in the second grinding step.

  According to the present invention, a gas substrate for a magnetic recording medium having excellent plate thickness distribution and flatness and excellent surface roughness can be produced with high productivity.

The perspective view of the glass substrate for magnetic recording media. Schematic of a double-sided grinding device. Sectional drawing which represents the grinding surface of a fixed abrasive tool typically. Schematic which shows the surface roughness measurement location of the grinding surface of a lower side fixed abrasive tool.

  Hereinafter, although the form for implementing this invention is demonstrated, this invention is not restricted to embodiment described below.

  Generally, the manufacturing process of the glass substrate for magnetic recording media and the magnetic disk includes the following processes. (1) A glass substrate formed by a float method, a fusion method or a press molding method is processed into a disk shape having a circular hole in the center. (2) Chamfering the inner peripheral side surface and the outer peripheral side surface of a disk-shaped glass substrate having a circular hole in the center. (3) The main plane of the glass substrate is ground. (4) The side surface portion and the chamfered portion of the glass substrate are subjected to end surface polishing. (5) The main plane of the glass substrate is polished. The polishing step may be primary polishing only, primary polishing and secondary polishing may be performed, or tertiary polishing may be performed after secondary polishing. (6) The glass substrate is precisely cleaned to obtain a glass substrate for a magnetic recording medium. (7) A thin film such as a magnetic layer is formed on a glass substrate for a magnetic recording medium to manufacture a magnetic disk.

  In the manufacturing process of the magnetic recording medium glass substrate and magnetic disk, the glass substrate may be cleaned (inter-process cleaning) or the glass substrate surface may be etched (inter-process etching) between the processes. Furthermore, when high mechanical strength is required for the glass substrate for magnetic recording media, a strengthening step (for example, chemical strengthening step) for forming a reinforcing layer on the surface layer of the glass substrate is performed before the polishing step, after the polishing step, or between the polishing steps. May be implemented.

  In the present invention, the glass substrate for a magnetic recording medium may be amorphous glass, crystallized glass, or tempered glass (for example, chemically tempered glass) having a tempered layer on the surface layer of the glass substrate. Moreover, the glass base substrate of the present invention may be manufactured by a float process, may be manufactured by a fusion process, or may be manufactured by a press molding process. As the glass base substrate of the present invention, one produced by a float method or a fusion method is preferable because of its high productivity.

  The present invention relates to (3) a process of grinding a main surface of a glass substrate, and relates to grinding of a glass substrate for a magnetic recording medium. Grinding of a glass substrate having a plate shape will be described using an example in which both principal planes of a glass substrate are simultaneously ground using a double-side grinding apparatus.

  FIG. 1 is a perspective view of a glass substrate for a magnetic recording medium. 10 is a glass substrate for a magnetic recording medium, 101 is a main plane of the glass substrate for a magnetic recording medium, 102 is an inner peripheral side, and 103 is an outer peripheral side. Show.

  FIG. 2 is a schematic view showing a state in which both main planes of the glass substrate for a magnetic recording medium are simultaneously ground using the double-side grinding apparatus 20. In FIG. 2, 10 is a glass substrate for a magnetic recording medium, 30 is a grinding surface of an upper fixed abrasive tool, 40 is a grinding surface of a lower fixed abrasive tool, 50 is a carrier, 201 is an upper surface plate, 202 is a lower surface plate. , 203 indicates a sun gear, and 204 indicates an internal gear. The same parts as those in FIG. 1 are denoted by the same reference numerals, and the description thereof is omitted.

  The magnetic recording medium glass substrate 10 is held between the grinding surface 30 of the upper fixed abrasive tool and the grinding surface 40 of the lower fixed abrasive tool while being held by the glass substrate holding portion of the carrier 50. In the state where the grinding surface 30 of the upper fixed abrasive tool and the grinding surface 40 of the lower fixed abrasive tool are pressed against each other on both main planes of the glass substrate, the grinding liquid is supplied to both main planes of the glass substrate, The main surface of the glass substrate is ground simultaneously by relatively moving the glass substrate and the grinding surface.

  The double-side grinding apparatus 20 drives the sun gear 203 and the internal gear 204 to rotate around the sun gear 203 while rotating the carrier 50 by rotating and driving the sun gear 203 and the internal gear 204 respectively. The main surfaces of the glass substrate are ground by rotating the respective 202 at a predetermined rotational speed.

  A fixed abrasive tool is mounted on the surface of the upper surface plate 201 and the lower surface plate 202 facing the glass substrate. The fixed abrasive tool mounted on the upper surface plate 201 and the lower surface plate 202 has a predetermined surface shape for the grinding surface 30 of the upper fixed abrasive tool and the grinding surface 40 of the lower fixed abrasive tool. Dressing is performed using tools. In the dressing process, dressing water is supplied between the dressing jig and the grinding surfaces 30 and 40, and the dressing jig and the grinding surfaces 30 and 40 are relatively moved to scrape the grinding surface of the fixed abrasive tool. Is done.

  In the method of manufacturing a glass substrate for a magnetic recording medium, the present inventor converts a glass base substrate having a smooth main surface formed by a float method or the like into a glass substrate excellent in plate thickness distribution and flatness and excellent in surface roughness. We examined the means of processing with high productivity. As a result, in the grinding step, the first plane of the glass base substrate is ground using a first fixed abrasive tool including at least one of diamond abrasive grains, alumina abrasive grains, and silicon carbide abrasive grains. A glass substrate using one grinding step and a second fixed abrasive tool including diamond abrasive grains having an average particle diameter (hereinafter referred to as an average particle diameter) smaller than the abrasive grains included in the first fixed abrasive tool And a second grinding step of grinding the main surface of the magnetic recording medium.

  When not performing the 1st grinding process, the main plane of a glass substrate is ground using the 2nd fixed abrasive tool containing the diamond grain of the average particle diameter smaller than the abrasive grain contained in the 1st fixed abrasive tool. At this time, the diamond abrasive grains are not easily caught on the main plane of the glass base substrate, and the diamond abrasive grains slide on the main plane of the glass base substrate, so that there is a possibility that the processing speed of grinding is lowered and the productivity is inferior.

  On the other hand, when not performing the second grinding step, it is necessary to set a large amount of polishing in order to remove the work-affected layer generated on the main plane of the glass substrate ground in the first grinding step in the subsequent polishing step, Productivity may be inferior.

  In the first grinding step and / or the second grinding step, when the primary surface of the glass base substrate and / or the glass substrate is ground using loose abrasive grains, grinding using loose abrasive grains is a fixed abrasive tool. The processing speed is lower than grinding using, and it is necessary to increase the polishing amount so as to remove the work-affected layer in the subsequent polishing process in order to generate a deep work-affected layer on the main plane and end face of the glass substrate. There is a risk that the quality characteristics and productivity may be inferior, such as requiring time and effort to clean and remove the loose abrasive particles adhering to the surface of the glass substrate.

  Moreover, when the frost process which roughens the main surface of a glass base substrate with a chemical | medical solution instead of a 1st grinding process is carried out, since a chemical | medical solution etches a glass base substrate isotropic, board thickness is not uniform. The thickness of the glass substrate cannot be adjusted to the desired flatness by aligning the thickness of the glass substrate to the desired thickness. Therefore, in the subsequent grinding process or polishing process, it is necessary to increase the grinding amount or the polishing amount so that the glass substrate has a desired plate thickness and to have a desired flatness, resulting in poor productivity.

  In FIG. 3, sectional drawing which represents the grinding surface of a fixed abrasive tool typically is shown. In FIG. 3, 60 is a fixed abrasive tool, 601 is an abrasive grain exposed on the grinding surface (for example, diamond abrasive grain, alumina abrasive grain, silicon carbide abrasive grain, etc.), 602 is an abrasive contained in the fixed abrasive tool. Grains (for example, diamond abrasive grains, alumina abrasive grains, silicon carbide abrasive grains, etc.), 603 indicates a binder (for example, resin, metal, vitreous (vitrified), etc.). The same parts as those in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted.

  The first fixed abrasive tool includes one or more abrasive grains of diamond abrasive grains, alumina abrasive grains, and silicon carbide abrasive grains. Among the abrasive grains, the first fixed abrasive tool including diamond abrasive grains is preferable because it has a high grinding speed and hardly causes a work-affected layer. The first fixed abrasive tool is formed by bonding abrasive grains with metal, resin, vitreous, or the like, and exposes the abrasive grains to the grinding surface of the first fixed abrasive tool. Grind the glass substrate.

  The abrasive grains contained in the first fixed abrasive tool preferably have an average particle diameter of 7 to 50 μm. When the average grain size of the abrasive grains contained in the first fixed abrasive tool is less than 7 μm, the processing speed for grinding the glass substrate is low and the productivity may be inferior. When the average grain size of the abrasive grains exceeds 50 μm, a deep work-affected layer is generated on the main plane of the glass substrate, and the work-affected layer cannot be sufficiently removed in the subsequent grinding process or polishing process. There is a risk of causing defects (scratches) in the main plane. The average particle size of the abrasive grains contained in the first fixed abrasive tool is preferably 7 μm to 50 μm, more preferably 7 μm to 40 μm, and particularly preferably 7 μm to 30 μm.

  The second fixed abrasive tool includes diamond abrasive grains having an average particle size smaller than the abrasive grains included in the first fixed abrasive tool. The second fixed abrasive tool is formed by bonding diamond abrasive grains with metal, resin, vitreous, or the like, and the diamond abrasive grains are displayed on the grinding surface of the second fixed abrasive tool. The glass substrate is ground out.

  The diamond abrasive grains contained in the second fixed abrasive tool preferably have an average particle diameter of 0.1 to 6 μm. When the average particle diameter of the diamond abrasive grains contained in the second fixed abrasive tool is less than 0.1 μm, the processing speed for grinding the glass substrate is low, and the productivity may be inferior. When the average particle diameter of the diamond abrasive grains exceeds 6 μm, the roughness of the principal plane of the ground glass substrate is high, and in order to obtain a desired surface roughness in the subsequent polishing step, it is necessary to set a large amount of polishing, Productivity may be inferior. The average particle size of the abrasive grains contained in the second fixed abrasive tool is preferably 0.1 μm to 6 μm, more preferably 0.5 μm to 5 μm, and particularly preferably 1 μm to 5 μm.

  The first fixed abrasive tool mounted on the upper surface plate 201 and the lower surface plate 202 of the double-sided grinding device is subjected to dressing of the ground surface to a predetermined flatness and surface roughness by a dressing jig, While the grinding surface of the fixed abrasive tool is pressed against the main surface of the glass substrate, the grinding liquid is supplied between the glass substrate and the grinding surface of the fixed abrasive tool while grinding the glass substrate and the fixed abrasive tool. The main surface of the glass substrate is ground by moving the surface relatively.

The surface roughness Ra ₁ or Rz ₁ of the ground surface of the first fixed abrasive tool subjected to the dressing process is measured with a stylus type surface roughness measuring machine in accordance with JIS B 0601-2001. The surface roughness of the ground surface of the fixed abrasive tool is measured after calibration with a standard sample having a predetermined surface roughness before measurement.

In the present specification, the surface roughness Ra and Rz of the ground surface of the first fixed abrasive tool is denoted by Ra ₁ and Rz ₁ with a suffix 1 and the ground surface of the second fixed abrasive tool. The surface roughnesses Ra and Rz are denoted by Ra ₂ and Rz ₂ with a subscript 2. Further, the surface roughness Ra, Rz of the main plane of the glass substrate is denoted by Ra ₃ , Rz ₃ with a subscript 3 attached thereto.

The surface roughness Ra ₁ of the ground surface of the first fixed abrasive tool is preferably 2 to 8 μm. When the surface roughness Ra ₁ is less than 2 μm, the abrasive grains are difficult to be caught on the main plane of the glass base substrate, and the abrasive grains slide on the main plane of the glass base substrate, so that the grinding processing speed is low and the productivity may be inferior. is there. If the surface roughness Ra ₁ exceeds 8 μm, the surface roughness of the principal plane of the ground glass substrate becomes high, and it is necessary to set a large amount of grinding or polishing in the subsequent grinding or polishing step. There is a risk of lowering the productivity of the entire process. The surface roughness Ra ₁ of the grinding surface of the first fixed abrasive tool is preferably 2 to 8 μm, particularly preferably 2 to 5 μm.

It is preferable that the surface roughness Rz ₁ of the grinding surface of the first fixed abrasive tool is 30μm or less. If the surface roughness Rz ₁ exceeds 30 μm, a deep work-affected layer is generated on the main surface of the ground glass substrate, and the work-affected layer on the main surface of the glass substrate is sufficiently removed in the subsequent grinding and polishing processes. It cannot be removed, and there is a risk of causing defects (scratches) in the main plane of the glass substrate product. Preferably the surface roughness Rz ₁ of the grinding surface of the first fixed abrasive tool is 30μm or less, more preferably 25μm or less, particularly preferably 20 [mu] m.

Similarly to the first fixed abrasive tool, the second fixed abrasive tool is mounted on the upper surface plate 201 and the lower surface plate 202 of the double-sided grinding device, and the ground surface is given a predetermined flatness and surface roughness by a dressing jig. After the dressing process, the grinding liquid is supplied between the glass substrate and the grinding surface of the fixed abrasive tool while the grinding surface of the second fixed abrasive tool is pressed against the main surface of the glass substrate. However, the main surface of the glass substrate is ground by relatively moving the glass substrate and the grinding surface of the fixed abrasive tool. The surface roughness Ra ₂ or Rz ₂ of the ground surface of the second fixed abrasive tool subjected to the dressing process follows the same procedure as the surface roughness Ra ₁ or Rz ₁ of the ground surface of the first fixed abrasive tool. taking measurement.

The surface roughness Ra2 of the grinding surface of the second fixed abrasive tool is preferably 0.1 to _{2 [} mu] m. If the surface roughness Ra ₂ is less than 0.1 μm, the grinding speed is low and the productivity may be poor. When the surface roughness Ra ₂ exceeds ₂ μm, a high processing speed can be obtained, while it may be difficult to obtain a glass substrate having a low surface roughness and excellent smoothness. The surface roughness Ra ₂ of the grinding surface of the second fixed abrasive tool is preferably 0.1 to ₂ μm, more preferably 0.1 to 1.5 μm, and particularly preferably 0.2 to 1.2 μm.

The surface roughness Rz ₂ of the grinding surface of the second fixed abrasive tool is preferably 10 μm or less. When the surface roughness Rz ₂ exceeds 10 [mu] m, the grinding glass substrate causes to generate a damaged layer on the main plane, can not be sufficiently removed damaged layer of main planes of the glass substrates in the subsequent polishing process, There is a risk of causing defects (scratches) in the main plane of the glass substrate product. Preferably the surface roughness Rz ₂ of the grinding surface of the second fixed abrasive tool is 10μm or less, more preferably 9μm or less, particularly preferably 8 [mu] m.

  In the first grinding step of grinding the main plane of the glass base substrate using the first fixed abrasive tool, the processing speed of the glass substrate (the main plane on one side) is preferably 13 μm / min or more. If the processing speed of the glass substrate in the first grinding process is less than 13 μm / min, the productivity of the manufacturing process may be reduced.

  In the second grinding step of grinding the main surface of the glass substrate using the second fixed abrasive tool, the processing speed of the glass substrate (the main surface on one side) is preferably 1 to 10 μm / min. If the processing speed of the glass substrate in the first grinding process is less than 1 μm / min, the productivity of the manufacturing process may be reduced. When the processing speed of the glass substrate in the first grinding step exceeds 10 μm / min, it may be difficult to obtain a glass substrate that is excellent in smoothness of the main plane controlled to a desired plate thickness.

  The processing speed of the glass substrate is obtained by dividing the plate thickness (grinding amount) removed by grinding obtained by subtracting the plate thickness of the glass substrate after grinding from the plate thickness of the glass substrate before grinding by the grinding time. calculate. When both main planes of the glass substrate are ground simultaneously using a double-side grinding apparatus, the processing speed of the main plane on one side is obtained by dividing the processing speed by 2. The plate thickness of the glass substrate before and after grinding is measured with a micrometer or a laser displacement meter.

  In the first grinding step of grinding the principal plane of the glass base substrate using the first fixed abrasive tool of the present invention, the depth of the work-affected layer on the principal plane of the ground glass substrate may be 35 μm or less. preferable.

  When the depth of the work-affected layer on the main surface of the ground glass substrate exceeds 35 μm, it is necessary to increase the amount of grinding in order to remove the work-affected layer on the main surface of the glass substrate in the subsequent second grinding step. There is a risk that productivity is inferior. The depth of the work-affected layer on the main plane of the glass substrate ground in the first grinding step is preferably 35 μm or less, more preferably 30 μm or less, and particularly preferably 26 μm or less.

  The depth of the work-affected layer on the main plane of the glass substrate is determined by etching the surface of the glass substrate by several μm using an acidic etching solution containing hydrofluoric acid, nitric acid, etc., and the work-affected layer remaining on the surface of the glass substrate. Isotropically etched to form circular pits or elliptical pits with a size that can be easily observed, and then the principal plane of the glass substrate is polished by a predetermined amount and then evaluated using an optical microscope or a laser microscope. .

When the surface roughness of the main plane of the glass substrate ground by the first grinding step and the second grinding step of the present invention is measured with a stylus type surface roughness measuring machine, the surface of the main plane of the glass substrate The roughness Ra ₃ is preferably 0.3 μm or less.

When the surface roughness Ra ₃ exceeds 0.3 [mu] m, in order to surface roughness required for the glass substrate for a magnetic recording medium, it is necessary to increase the polishing amount, such as by setting the polishing time longer in the subsequent polishing process There is a risk that the productivity of the entire manufacturing process is lowered. The surface roughness Ra ₃ of the main plane of the glass substrate ground by the first grinding step and the second grinding step is preferably 0.3 μm or less, more preferably 0.2 μm or less, and particularly preferably 0.15 μm or less.

  In addition, the main plane of the ground glass substrate is measured with a stylus type surface roughness measuring machine in accordance with JIS B 0601-2001. In addition, the surface roughness measurement of the main plane of the ground glass substrate is performed after calibration with a standard sample having a predetermined surface roughness before the measurement.

  The glass substrates ground by the first grinding step and the second grinding step of the present invention preferably have a plate thickness distribution of 1 μm or less between the glass substrates in the same lot.

  When the thickness distribution between the glass substrates in the same lot of the ground glass substrates exceeds 1 μm, it is difficult to reduce the thickness distribution between the glass substrates in the same lot in the subsequent polishing process. It may be difficult to obtain a glass substrate for a magnetic recording medium that is excellent in performance. Further, if the plate thickness between the glass substrates in the same lot is non-uniform, it becomes difficult to uniformly polish the main plane of the glass substrate, surface characteristics of the main plane between the glass substrates in the same lot (for example, There is also a possibility that variations in surface roughness and edge shape may occur.

  The glass substrate ground by the first grinding step and the second grinding step of the present invention preferably has a flatness measured by an optical interferometer of 4 μm or less.

  When the flatness of the ground glass substrate exceeds 4 μm, it is difficult to process to a desired flatness in the subsequent polishing step, and it may be difficult to obtain a glass substrate for a magnetic recording medium having excellent flatness. . The glass substrate ground by the first grinding step and the second grinding step preferably has a flatness measured by an optical interferometer of 4 μm or less, particularly preferably 3 μm or less.

  Examples The present invention will be further described below with reference to examples and comparative examples, but the present invention is not limited thereby.

A disk-shaped glass having an outer diameter of 65 mm, an inner diameter of 20 mm, and a glass substrate for a magnetic recording medium having a thickness of 0.635 mm, a glass base substrate mainly composed of SiO ₂ formed by a float process, and having a circular hole in the center. Processed into a substrate.

  A glass base substrate processed into a disk-shaped glass substrate having a circular hole in the center is obtained by a double-side grinding apparatus (product name: 16BF-4M5P, manufactured by Hamai Sangyo Co., Ltd.) using a first fixed abrasive tool and a grinding fluid. The upper and lower main planes of the glass substrate are ground (first grinding step).

  As the first fixed abrasive tool, a fixed abrasive tool containing diamond abrasive grains having an average particle diameter of 20 μm, 12 μm, 9 μm, and 4 μm was used.

In the first grinding step, the main polishing pressure is 100 g / cm ² , the platen rotation speed is 30 rpm, the temperature of the supplied grinding liquid is 20 ° C., and the grinding amount of the glass substrate is 130 μm (the main surface on one side). The glass substrate was ground by adjusting the grinding time so that The ground glass substrate was ultrasonically cleaned while immersed in an alkaline detergent solution.

The glass substrate ground in the first grinding step is ground on the upper and lower main surfaces of the glass substrate by a double-sided grinding apparatus (product name: 16BF-4M5P, manufactured by Hamai Sangyo Co., Ltd.) using the second fixed abrasive tool and grinding fluid. (Second grinding step). A fixed abrasive tool (manufactured by 3M, product name: Trizact 4 μm AA1) in which diamond abrasive grains having an average particle diameter of 4 μm were bonded with a resin binder was used as the second fixed abrasive tool. In the second grinding step, the main polishing pressure is 100 g / cm ² , the platen rotation speed is 30 rpm, the temperature of the polishing liquid to be supplied is 20 ° C., and the processing deterioration of the main surface of the glass substrate generated in the first grinding step The glass substrate was ground by adjusting the grinding time so that the grinding amount (= the maximum depth of the work-affected layer generated in the first grinding step + 10 μm) can be removed. The ground glass substrate was ultrasonically cleaned while immersed in an alkaline detergent solution.

  The first fixed abrasive tool and the second fixed abrasive tool mounted on the upper surface plate and lower surface plate of the double-sided grinding device are subjected to dressing using a dressing jig before grinding the glass substrate. And a predetermined grinding surface shape and surface roughness.

Surface roughnesses Ra ₁ , Rz ₁ , Ra ₂ , Rz ₂ of the ground surfaces of the first fixed abrasive tool and the second fixed abrasive tool subjected to dressing processing are stylus type surface roughness measuring machines. (Manufactured by Tokyo Seimitsu Co., Ltd., product name: Handy Surf 130A, stylus type: KP66 DM43801). The surface roughness of the ground surface of the fixed abrasive tool was measured by setting the stylus scanning length to 1 mm, the stylus scanning length speed of 0.3 mm / s, and the cutoff value to 0.8 mm. The surface roughness Ra ₁ , Rz ₁ of the grinding surface is measured at three positions (positions X1, X2, and X3 shown in FIG. 4) on the grinding surface of the lower fixed abrasive tool, and the average value thereof. Were the surface roughness Ra ₁ , Rz ₁ and Ra ₂ , Rz ₂ of the ground surface of the fixed abrasive tool.

  The depth of the work-affected layer on the main plane of the glass substrate ground in the first grinding step is such that the surface of the glass substrate is etched by 5 μm using an acidic etching solution containing hydrofluoric acid, nitric acid, etc. Evaluation was made after isotropically etching the work-affected layer remaining on the flat surface. In the evaluation procedure, after etching the surface of the glass substrate by 5 μm, the main plane of the glass substrate is polished by a predetermined amount, washed and dried, and the processed damaged layer that has been etched into a circular pit or an elliptic pit is optical microscope. It was carried out by observing. The objective lens of the optical microscope used 20 times, and it observed with the observation visual field of 635 micrometers x 480 micrometers. Both main planes of the glass substrate were observed at a total of 8 positions of 0 °, 90 °, 180 °, and 270 °, and the depth of the work-affected layer was evaluated. The amount of polishing of the main plane of the glass substrate at the time when circular pits or elliptical pits were no longer observed on the main plane of the glass substrate was the maximum depth of the work-affected layer in the main plane of the glass substrate.

The surface roughness Ra ₃ and Rz ₃ of the main plane of the glass substrate ground in the first grinding step and the second grinding step is a stylus type surface roughness measuring machine (manufactured by Tokyo Seimitsu Co., Ltd., product name: Handy Surf 130A). And stylus type: KP66 DM43801). The measurement was performed under the same conditions as the surface roughness measurement of the ground surface of the fixed abrasive tool. The surface roughness Ra ₃ and Rz ₃ of the main plane of the glass substrate is 0 °, 120 ° at a position 20 mm from the center (intermediate area of the recording / reproducing area) on both main planes of the glass substrate for magnetic recording medium. Measurements were taken at a total of 6 locations of 240 °, and the average value was obtained.

  The thickness deviation within the same lot of the glass substrates ground in the first grinding process and the second grinding process is determined by extracting 10 glass substrates from one lot and measuring the thickness of each glass substrate using a micrometer. The difference between the maximum thickness value and the minimum thickness value in the same lot was obtained.

  The flatness of the glass substrate ground in the first grinding step and the second grinding step was measured using an optical interferometer (product name: FT-17) by removing five glass substrates from one lot. did.

  Table 1 shows the results when the glass substrate was ground by changing the first fixed abrasive tool used in the first grinding step. In Table 1, Examples 1 to 3 are Examples, and Examples 4 to 7 are Comparative Examples. In Examples 5 and 6, the glass substrate was ground using loose abrasive grains (white alumina abrasive grains) in the first grinding step. In Example 7, the glass substrate was treated with an acid solution instead of the first grinding step. The surface is etched and frosted.

  In the first grinding process of Examples 1 to 3, the glass base substrate was ground at a high processing speed, and a glass substrate having a shallow maximum depth of the work-affected layer on the main surface of the glass substrate could be obtained. The glass substrate obtained by grinding the glass substrate ground in the first grinding process of Examples 1 to 3 in the second grinding process is excellent in the surface roughness of the main plane of the glass substrate, the thickness deviation in the same lot, and the flatness. It was.

  In the first grinding step of Example 4, since the average grain size of the abrasive grains contained in the first fixed abrasive tool was small and the surface roughness of the grinding surface was low, the glass substrate could not be ground at a high processing speed.

  In Examples 5 and 6, the glass base substrate was ground using loose abrasive grains in the first grinding step, but the glass base substrate was ground to a glass substrate having a shallow maximum depth of the work-affected layer at a high processing speed. could not.

  In Example 7, instead of the first grinding step, the surface of the glass substrate was etched and frosted with an acid solution, but the glass substrate was used as in the first grinding step using a fixed abrasive tool or loose abrasive grains. Were adjusted to the desired plate thickness, and the desired flatness could not be controlled. Therefore, in order to control the plate thickness deviation and flatness within the same lot, the amount of grinding in the second grinding process was increased. The glass substrate that was frosted in the first grinding process could control the thickness deviation in the same lot by increasing the amount of grinding in the second grinding process, but a glass substrate with excellent flatness could not be obtained. .

  The glass substrate ground in the first grinding step and the second grinding step has a magnetic recording with a chamfering width of 0.15 mm and a chamfering angle of 45 ° on the inner and outer peripheral surfaces of a disk-shaped glass substrate having a circular hole in the center. Chamfering was performed to obtain a glass substrate for medium.

  Next, the inner peripheral side surface and the inner peripheral chamfered portion were polished using a polishing brush and a polishing liquid, scratches on the inner peripheral side surface and the inner peripheral chamfered portion were removed, and the inner peripheral end surface was polished so as to be a mirror surface. After polishing the inner peripheral edge surface, the outer peripheral side surface and the outer peripheral chamfered portion are polished with a polishing brush and a polishing liquid to remove scratches on the outer peripheral side surface and outer peripheral chamfered portion, and the outer peripheral end surface is polished so that it becomes a mirror surface did. The glass substrate after the outer peripheral end surface polishing was cleaned by scrub cleaning and ultrasonic cleaning in a state immersed in an alkaline detergent solution.

  The glass substrate after the end face processing is a polishing liquid containing a polishing pad made of hard urethane as a polishing tool and cerium oxide abrasive grains (a polishing liquid composition mainly composed of cerium oxide having an average primary particle diameter of about 1.3 μm). ) Was primarily polished by a double-side polishing apparatus.

  The glass substrate after the primary polishing is composed of a polishing pad made of soft urethane as a polishing tool and a polishing liquid containing colloidal silica (a polishing liquid composition mainly composed of colloidal silica having an average primary particle diameter of 20 to 30 nm). The upper and lower main planes were subjected to secondary polishing using a double-side polishing apparatus.

  In primary polishing and secondary polishing, the polishing pads mounted on the upper and lower surface plates of the double-side polishing apparatus are dressed using a dressing jig having diamond abrasive grains on the surface before polishing the glass substrate. Processing is performed to form a predetermined polished surface.

  The glass substrate that has been subjected to the secondary polishing is sequentially scrubbed with an alkaline detergent, ultrasonically washed in an alkaline detergent solution, and ultrasonically washed in pure water. It dried and obtained the glass substrate for magnetic recording media.

  After washing and drying the glass substrate, the surface roughness Ra of the glass substrate for magnetic recording medium was measured using an atomic force microscope. The surface roughness Ra of the glass substrate for magnetic recording medium is 0 °, 120 °, and 240 ° at a position 20 mm from the center (intermediate region of the recording / reproducing region) on both main planes of the glass substrate for magnetic recording medium. Measurements were made at a total of 6 points, and the average value was obtained. The surface roughness Ra of the glass substrate for magnetic recording media obtained by polishing, washing and drying the glass substrates of Examples 1 to 3 was 0.13 nm or less.

  INDUSTRIAL APPLICABILITY The present invention can be applied to a method for manufacturing a glass substrate having a grinding process in which a main plane of a glass substrate having a plate shape is ground using a fixed abrasive tool. Specific examples of the glass substrate having a plate shape include a glass substrate for a magnetic recording medium, a photomask, a display such as a liquid crystal or an organic EL, and an optical component such as an optical pickup or an optical filter. The polishing apparatus according to the embodiment of the present invention may be a double-side grinding apparatus or a single-side grinding apparatus.

10: glass substrate for magnetic recording medium, 101: main plane of glass substrate for magnetic recording medium, 102: inner peripheral side surface, 103: outer peripheral side surface.
20: Double-side grinding device, 30: Grinding surface of upper fixed abrasive tool, 40: Grinding surface of lower fixed abrasive tool, 50: Carrier, 201: Upper surface plate, 202: Lower surface plate, 203: Sun gear, 204: Internal gear,
60: fixed abrasive tool, 601: abrasive grains exposed on the grinding surface, 602: abrasive grains, 603: binder
X1: Surface roughness measurement position of the grinding surface in the inner peripheral region, X2: Surface roughness measurement position of the grinding surface in the central region, X3: Surface roughness measurement position of the grinding surface in the outer peripheral region.

Claims (8)

A shape imparting step of a glass base substrate having a plate shape, a grinding step of a main plane of the glass base substrate, a polishing step of a main plane of the glass substrate ground in the grinding step, a cleaning step of the glass substrate, In a method for producing a glass substrate for a magnetic recording medium having
In the grinding step, a first grinding is performed in which the main plane of the glass base substrate is ground using a first fixed abrasive tool including at least one of diamond abrasive grains, alumina abrasive grains, and silicon carbide abrasive grains. Process,
A second grinding step of grinding the main plane of the glass substrate using a second fixed abrasive tool containing diamond grains having an average particle diameter smaller than the abrasive grains contained in the first fixed abrasive tool;
I have a,
The ground surface of the first fixed abrasive tool has abrasive grains, and the surface roughness Ra ₁ measured using a stylus type surface roughness measuring machine is 2 μm to 8 μm, and the second The ground surface of the fixed abrasive tool is diamond abrasive, and the surface roughness Ra ₂ measured using a stylus type surface roughness measuring machine is 0.1 μm to ₂ μm,
In addition, the processing speed of the glass substrate in the first grinding step (main surface on one side) is 13 μm / min or more, and the processing speed of the glass substrate in the second grinding step (main surface on one side) is 1-10 μm / min. method of manufacturing a glass substrate for a magnetic recording medium, which is a min. 2. The production of a glass substrate for a magnetic recording medium according to claim 1 , wherein the surface roughness Rz ₁ measured using a stylus type surface roughness measuring machine of the ground surface of the first fixed abrasive tool is 30 μm or less. Method. The second fixed abrasive glass substrate for a magnetic recording medium according to claim 1 or 2, the surface roughness Rz ₂ measured using a surface roughness measuring instrument probe type of the grinding surface of the tool is 10μm or less Manufacturing method. Said first average particle diameter of abrasive grains contained in the fixed-abrasive tool manufacturing method of a glass substrate for a magnetic recording medium according to any one of claims 1 to 3 which is 7～50Myuemu. Said second average particle diameter of abrasive grains contained in the fixed-abrasive tool manufacturing method of a glass substrate for a magnetic recording medium according to any one of claims 1 to 4 which is a 0.1～6Myuemu. The glass substrate which has been ground by the first grinding step, the depth of the damaged layer of the main plane is 35μm or less claim 1 or method of manufacturing a glass substrate for a magnetic recording medium according to one of 5. The glass substrate which has been ground in the second grinding step, a method of manufacturing a glass substrate for a magnetic recording medium according to any one of claims 1-6 flatness measured by optical interferometer is 3μm or less. The glass substrate ground in the second grinding step has a surface roughness Ra of the main plane as measured by a stylus type surface roughness measuring machine. ₃ The manufacturing method of the glass substrate for magnetic recording media of any one of Claims 1-7 which is 0.3 micrometer or less.

Images