JP5311968B2 - 気密端子のめっき方法 - Google Patents
気密端子のめっき方法 Download PDFInfo
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- JP5311968B2 JP5311968B2 JP2008283084A JP2008283084A JP5311968B2 JP 5311968 B2 JP5311968 B2 JP 5311968B2 JP 2008283084 A JP2008283084 A JP 2008283084A JP 2008283084 A JP2008283084 A JP 2008283084A JP 5311968 B2 JP5311968 B2 JP 5311968B2
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- lead
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- 238000007747 plating Methods 0.000 title claims description 166
- 238000000034 method Methods 0.000 title claims description 36
- 239000002184 metal Substances 0.000 claims description 124
- 229910052751 metal Inorganic materials 0.000 claims description 124
- 239000000463 material Substances 0.000 claims description 79
- 239000011521 glass Substances 0.000 claims description 35
- 238000005219 brazing Methods 0.000 claims description 25
- 238000004519 manufacturing process Methods 0.000 claims description 22
- 229910045601 alloy Inorganic materials 0.000 claims description 18
- 239000000956 alloy Substances 0.000 claims description 18
- 238000007789 sealing Methods 0.000 claims description 16
- 230000008569 process Effects 0.000 claims description 15
- 229910017709 Ni Co Inorganic materials 0.000 claims description 8
- 229910003267 Ni-Co Inorganic materials 0.000 claims description 8
- 229910003262 Ni‐Co Inorganic materials 0.000 claims description 8
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 claims description 7
- 238000005476 soldering Methods 0.000 claims description 6
- 238000005520 cutting process Methods 0.000 claims description 5
- 239000011810 insulating material Substances 0.000 claims description 5
- 230000000149 penetrating effect Effects 0.000 claims description 5
- 229910001209 Low-carbon steel Inorganic materials 0.000 claims description 3
- 238000004873 anchoring Methods 0.000 claims 1
- 239000013078 crystal Substances 0.000 description 42
- 229910000679 solder Inorganic materials 0.000 description 18
- PXHVJJICTQNCMI-UHFFFAOYSA-N nickel Substances [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 10
- 239000010453 quartz Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 229910001128 Sn alloy Inorganic materials 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 239000003566 sealing material Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000002093 peripheral effect Effects 0.000 description 4
- 239000011230 binding agent Substances 0.000 description 3
- 239000005388 borosilicate glass Substances 0.000 description 3
- 238000010438 heat treatment Methods 0.000 description 3
- 230000001965 increasing effect Effects 0.000 description 3
- 230000035515 penetration Effects 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- FGUUSXIOTUKUDN-IBGZPJMESA-N C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 Chemical compound C1(=CC=CC=C1)N1C2=C(NC([C@H](C1)NC=1OC(=NN=1)C1=CC=CC=C1)=O)C=CC=C2 FGUUSXIOTUKUDN-IBGZPJMESA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical group [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000978 Pb alloy Inorganic materials 0.000 description 2
- 229910020816 Sn Pb Inorganic materials 0.000 description 2
- 229910020922 Sn-Pb Inorganic materials 0.000 description 2
- 229910008783 Sn—Pb Inorganic materials 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000008151 electrolyte solution Substances 0.000 description 2
- 229910002804 graphite Inorganic materials 0.000 description 2
- 239000010439 graphite Substances 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 230000007935 neutral effect Effects 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 229910000640 Fe alloy Inorganic materials 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- 229910020836 Sn-Ag Inorganic materials 0.000 description 1
- 229910020830 Sn-Bi Inorganic materials 0.000 description 1
- 229910020988 Sn—Ag Inorganic materials 0.000 description 1
- 229910018728 Sn—Bi Inorganic materials 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 230000004308 accommodation Effects 0.000 description 1
- 229910052788 barium Inorganic materials 0.000 description 1
- DSAJWYNOEDNPEQ-UHFFFAOYSA-N barium atom Chemical compound [Ba] DSAJWYNOEDNPEQ-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005496 eutectics Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
- 229910000833 kovar Inorganic materials 0.000 description 1
- 229910052745 lead Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 239000005361 soda-lime glass Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Images
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- Manufacturing Of Electrical Connectors (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
Description
22…絶縁ガラス、22a…ガラスタブレット(溶融前絶縁ガラス)、
23…貫通リード、 23a…リード(パッケージ内部)、
23b …リード(下端面)、 23c…リード(切断前)、
24…電解Cuめっき層及びはんだめっき層(外環部)、
25…電解Cuめっき層及びはんだめっき層(リード部)、30…金属キャップ、
31…電解Niめっき層(金属キャップ部)、40…水晶片、 50…固着材、
60…リード切断位置、
Claims (3)
- 円筒状金属外環にガラス絶縁材を介し相互に離隔配置した一対の所定長の貫通リードを気密封着し、前記金属外環および前記貫通リードのそれぞれの露呈する表面にはんだ付け良好なろう材めっき層を設けた気密端子の製造方法において、所定サイズの金属外環にガラスタブレットおよび所定長より長いリード材を封着治具に組み込み、前記ガラスタブレットを加熱溶融して前記金属外環にガラス絶縁材を介してリード材を貫通させた端子部品とする気密封着工程、多数の前記端子部品をバレルに収容して前記金属外環および前記リード材の表面にめっき層を形成するバレルめっき工程、および前記端子部品の前記リード材を所定長の貫通リードに切断する工程を備え、気密封着後のバレルめっきにより前記金属外環および前記リード材の表面に同時にめっき層を形成し、前記貫通リードのめっき厚さ(t1)と前記金属外環のめっき厚さ(t2)との比率(t1/t2)を1.6〜2.5の範囲内に選定するよう、前記リード材の長さを調製したことを特徴とする気密端子の製造方法。
- 前記バレルめっき工程は端子部品のリード材の下端部同士を橋絡するめっき処理前の固着結合工程および橋絡を切離するめっき処理後の固着解除工程を備えることを特徴とする請求項1に記載の気密端子の製造方法。
- 前記金属外環は外径寸法が0.90±0.05mmに成形加工された低炭素鋼、Fe―Ni合金またはFe−Ni−Co合金のいずれかの材質からなり、前記リードは外径寸法が0.15±0.02mmのFe―Ni合金またはFe−Ni−Co合金のいづれかからなることを特徴とする請求項1または請求項2に記載の気密端子の製造方法。
Priority Applications (1)
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JP2008283084A JP5311968B2 (ja) | 2008-11-04 | 2008-11-04 | 気密端子のめっき方法 |
Applications Claiming Priority (1)
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JP2008283084A JP5311968B2 (ja) | 2008-11-04 | 2008-11-04 | 気密端子のめっき方法 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2010114132A JP2010114132A (ja) | 2010-05-20 |
JP2010114132A5 JP2010114132A5 (ja) | 2011-11-24 |
JP5311968B2 true JP5311968B2 (ja) | 2013-10-09 |
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JP2008283084A Active JP5311968B2 (ja) | 2008-11-04 | 2008-11-04 | 気密端子のめっき方法 |
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JP (1) | JP5311968B2 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6362171B2 (ja) * | 2015-04-22 | 2018-07-25 | ショット日本株式会社 | 気密端子およびその気密端子を用いたアルミ電解コンデンサ |
CN107636781B (zh) * | 2015-06-03 | 2020-01-17 | 肖特(日本)株式会社 | 气密端子、铝电解电容器以及铝电解电容器的制造方法 |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS6418583U (ja) * | 1987-07-21 | 1989-01-30 | ||
JP4812154B2 (ja) * | 2000-03-21 | 2011-11-09 | エヌイーシー ショット コンポーネンツ株式会社 | 気密端子の製造方法 |
JP2007053252A (ja) * | 2005-08-18 | 2007-03-01 | Shinko Electric Ind Co Ltd | 光半導体素子用パッケージ及びその製造方法 |
JP4817370B2 (ja) * | 2006-03-24 | 2011-11-16 | エヌイーシー ショット コンポーネンツ株式会社 | 電子部品用パッケージ |
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