JP5308768B2 - 透明導電膜の形成方法 - Google Patents
透明導電膜の形成方法 Download PDFInfo
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- JP5308768B2 JP5308768B2 JP2008265610A JP2008265610A JP5308768B2 JP 5308768 B2 JP5308768 B2 JP 5308768B2 JP 2008265610 A JP2008265610 A JP 2008265610A JP 2008265610 A JP2008265610 A JP 2008265610A JP 5308768 B2 JP5308768 B2 JP 5308768B2
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- 238000000034 method Methods 0.000 title claims description 32
- 239000002243 precursor Substances 0.000 claims description 50
- 239000002250 absorbent Substances 0.000 claims description 42
- 230000002745 absorbent Effects 0.000 claims description 42
- 239000000758 substrate Substances 0.000 claims description 39
- 238000001035 drying Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 6
- 238000005245 sintering Methods 0.000 claims description 6
- 238000001771 vacuum deposition Methods 0.000 claims description 6
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000003980 solgel method Methods 0.000 claims description 4
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 20
- 239000006096 absorbing agent Substances 0.000 description 12
- 239000000463 material Substances 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 239000006229 carbon black Substances 0.000 description 10
- 239000004065 semiconductor Substances 0.000 description 10
- 239000011787 zinc oxide Substances 0.000 description 10
- 238000000576 coating method Methods 0.000 description 9
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 7
- 239000011521 glass Substances 0.000 description 7
- 239000010453 quartz Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 7
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 6
- 239000006185 dispersion Substances 0.000 description 6
- 238000010304 firing Methods 0.000 description 6
- 238000002834 transmittance Methods 0.000 description 6
- 239000002585 base Substances 0.000 description 5
- 229910044991 metal oxide Inorganic materials 0.000 description 5
- 150000004706 metal oxides Chemical group 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 4
- 239000000975 dye Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- 230000003595 spectral effect Effects 0.000 description 4
- 238000004528 spin coating Methods 0.000 description 4
- 239000005341 toughened glass Substances 0.000 description 4
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 229910052738 indium Inorganic materials 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 229910001510 metal chloride Inorganic materials 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 239000011701 zinc Substances 0.000 description 3
- 239000004246 zinc acetate Substances 0.000 description 3
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 2
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- 238000010521 absorption reaction Methods 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- VSCWAEJMTAWNJL-UHFFFAOYSA-K aluminium trichloride Chemical compound Cl[Al](Cl)Cl VSCWAEJMTAWNJL-UHFFFAOYSA-K 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000005229 chemical vapour deposition Methods 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000008021 deposition Effects 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- PSCMQHVBLHHWTO-UHFFFAOYSA-K indium(iii) chloride Chemical compound Cl[In](Cl)Cl PSCMQHVBLHHWTO-UHFFFAOYSA-K 0.000 description 2
- 238000007733 ion plating Methods 0.000 description 2
- 238000005224 laser annealing Methods 0.000 description 2
- 229910001960 metal nitrate Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 238000005268 plasma chemical vapour deposition Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 2
- 229910001887 tin oxide Inorganic materials 0.000 description 2
- HPGGPRDJHPYFRM-UHFFFAOYSA-J tin(iv) chloride Chemical compound Cl[Sn](Cl)(Cl)Cl HPGGPRDJHPYFRM-UHFFFAOYSA-J 0.000 description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 2
- 229910052721 tungsten Inorganic materials 0.000 description 2
- 239000010937 tungsten Substances 0.000 description 2
- JIAARYAFYJHUJI-UHFFFAOYSA-L zinc dichloride Chemical compound [Cl-].[Cl-].[Zn+2] JIAARYAFYJHUJI-UHFFFAOYSA-L 0.000 description 2
- ONDPHDOFVYQSGI-UHFFFAOYSA-N zinc nitrate Chemical compound [Zn+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O ONDPHDOFVYQSGI-UHFFFAOYSA-N 0.000 description 2
- BNGXYYYYKUGPPF-UHFFFAOYSA-M (3-methylphenyl)methyl-triphenylphosphanium;chloride Chemical compound [Cl-].CC1=CC=CC(C[P+](C=2C=CC=CC=2)(C=2C=CC=CC=2)C=2C=CC=CC=2)=C1 BNGXYYYYKUGPPF-UHFFFAOYSA-M 0.000 description 1
- DDFHBQSCUXNBSA-UHFFFAOYSA-N 5-(5-carboxythiophen-2-yl)thiophene-2-carboxylic acid Chemical compound S1C(C(=O)O)=CC=C1C1=CC=C(C(O)=O)S1 DDFHBQSCUXNBSA-UHFFFAOYSA-N 0.000 description 1
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- VEXZGXHMUGYJMC-UHFFFAOYSA-M Chloride anion Chemical compound [Cl-] VEXZGXHMUGYJMC-UHFFFAOYSA-M 0.000 description 1
- IMROMDMJAWUWLK-UHFFFAOYSA-N Ethenol Chemical compound OC=C IMROMDMJAWUWLK-UHFFFAOYSA-N 0.000 description 1
- -1 ITO Chemical class 0.000 description 1
- 229910021617 Indium monochloride Inorganic materials 0.000 description 1
- 229910002651 NO3 Inorganic materials 0.000 description 1
- NHNBFGGVMKEFGY-UHFFFAOYSA-N Nitrate Chemical compound [O-][N+]([O-])=O NHNBFGGVMKEFGY-UHFFFAOYSA-N 0.000 description 1
- XURCIPRUUASYLR-UHFFFAOYSA-N Omeprazole sulfide Chemical compound N=1C2=CC(OC)=CC=C2NC=1SCC1=NC=C(C)C(OC)=C1C XURCIPRUUASYLR-UHFFFAOYSA-N 0.000 description 1
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 229910006404 SnO 2 Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 229910021626 Tin(II) chloride Inorganic materials 0.000 description 1
- 229910021627 Tin(IV) chloride Inorganic materials 0.000 description 1
- HDYRYUINDGQKMC-UHFFFAOYSA-M acetyloxyaluminum;dihydrate Chemical compound O.O.CC(=O)O[Al] HDYRYUINDGQKMC-UHFFFAOYSA-M 0.000 description 1
- 238000007605 air drying Methods 0.000 description 1
- 125000003158 alcohol group Chemical group 0.000 description 1
- 239000012670 alkaline solution Substances 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229940009827 aluminum acetate Drugs 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- VBXWCGWXDOBUQZ-UHFFFAOYSA-K diacetyloxyindiganyl acetate Chemical compound [In+3].CC([O-])=O.CC([O-])=O.CC([O-])=O VBXWCGWXDOBUQZ-UHFFFAOYSA-K 0.000 description 1
- QBWXYICYWNSGPT-UHFFFAOYSA-L dichlorotin pentahydrate Chemical compound O.O.O.O.O.Cl[Sn]Cl QBWXYICYWNSGPT-UHFFFAOYSA-L 0.000 description 1
- 239000002612 dispersion medium Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- APHGZSBLRQFRCA-UHFFFAOYSA-M indium(1+);chloride Chemical compound [In]Cl APHGZSBLRQFRCA-UHFFFAOYSA-M 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002609 medium Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- WMHSAFDEIXKKMV-UHFFFAOYSA-N oxoantimony;oxotin Chemical compound [Sn]=O.[Sb]=O WMHSAFDEIXKKMV-UHFFFAOYSA-N 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 235000011150 stannous chloride Nutrition 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- AXZWODMDQAVCJE-UHFFFAOYSA-L tin(II) chloride (anhydrous) Chemical compound [Cl-].[Cl-].[Sn+2] AXZWODMDQAVCJE-UHFFFAOYSA-L 0.000 description 1
- YJGJRYWNNHUESM-UHFFFAOYSA-J triacetyloxystannyl acetate Chemical compound [Sn+4].CC([O-])=O.CC([O-])=O.CC([O-])=O.CC([O-])=O YJGJRYWNNHUESM-UHFFFAOYSA-J 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011592 zinc chloride Substances 0.000 description 1
- 235000005074 zinc chloride Nutrition 0.000 description 1
Images
Landscapes
- Inorganic Compounds Of Heavy Metals (AREA)
- Physical Vapour Deposition (AREA)
- Manufacturing Of Electric Cables (AREA)
Description
ITO酸化膜の作成
ITO膜を基板上に真空蒸着法にて石英板に成膜して、この成膜品に炉加熱の代りにレーザー照射を行った。ITO膜は、膜厚の異ならしめることにより、抵抗値の異なる3種類の試料(低抵抗試料、中抵抗試料、及び高抵抗試料)を作成した。
ZnO膜の作成
代表的な酢酸亜鉛を原料としたゾルゲル成膜法について実施した。
酢酸亜鉛 43g 43g
アルミニユム−トリエトキシド − 4g
2−アミノエタノール 12g 12g
2−メトキシエタノール 57g 57g
上記配合表のごとくゾル液を作成し、30mmφ、1mm厚の石英基板上にスピンコートと100℃、20分の乾燥を10回繰り返し、所定膜厚のZnO膜前逐体を成膜した。さらにZnO膜前駆体上にカーボンブラック分散体(CB)をスピンコートし、常温乾燥させて吸収剤層を形成した。
SnO膜(ネサ膜)
酢酸金属物からの成膜法に代わり、金属塩化物から透明導電膜を成膜した。原料として、4塩化スズでも成膜は可能であるが、抵抗特性が劣るため、2塩化スズを使用した。No3の下記配合試料を作成した。
塩化スズ(II)5水和物 18g
水 20g
2メトキシエタノール 40g
上記配合比により、完全溶解したゾルを得た。その後30mmφ、2mm厚の石英基板に、ゾルをスピンコートして100℃、20分乾燥する作業を10回繰り返し、SnO膜前逐体を得た。この物の抵抗値は無限であった。レーザー光にはCO2レーザーを使用した。CO2レーザーは、出力10W,5mmφのビームを直接コート面に照射した。走査速度は2mm/秒、走査時の重ねピッチ幅2mmで30×20mmの面を走査照射した。走査照射後の抵抗値、及び透過率を測定した。測定結果を表4に示す。
1a レーザー光
2 基板
3 透明導電膜前駆体
4 吸収剤層
Claims (3)
- 基材上に形成され焼結によって透明導電膜を形成する透明導電膜前駆体の表面に、レーザー光に対して吸収のある吸収剤を含む吸収剤含有液を塗布し乾燥させることにより吸収剤層を形成し、該吸収剤層に吸収のある波長を有するレーザー光を該吸収剤層に照射することにより、前記透明導電膜前駆体を焼結させて透明導電膜を形成することを特徴とする透明導電膜の形成方法。
- 前記透明導電膜前駆体をゾル−ゲル法によって前記基材上に形成するステップを更に有することを特徴とする請求項1に記載の透明導電膜の形成方法。
- 前記透明導電膜前駆体を真空蒸着法によって前記基材上に形成するステップを更に有することを特徴とする請求項1に記載の透明導電膜の形成方法。
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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ITRM20110184A1 (it) * | 2011-04-12 | 2012-10-13 | Dyepower | Procedimento di sinterizzazione di formulazioni a base di ossidi metallici. |
JP5865601B2 (ja) | 2011-04-28 | 2016-02-17 | 株式会社リコー | 強誘電体膜の製造方法及び強誘電体膜の製造装置 |
JP5283291B1 (ja) * | 2012-07-03 | 2013-09-04 | 石原薬品株式会社 | 導電膜形成方法及び焼結進行剤 |
FR3021967B1 (fr) * | 2014-06-06 | 2021-04-23 | Saint Gobain | Procede d'obtention d'un substrat revetu d'une couche fonctionnelle |
JP6681797B2 (ja) * | 2016-06-28 | 2020-04-15 | 住友金属鉱山株式会社 | 被処理物の加熱方法、被処理物の熱処理方法、鋼板の熱処理方法、及び加熱促進コーティング層 |
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JP4080065B2 (ja) * | 1997-12-29 | 2008-04-23 | 株式会社Kri | 金属分散ゲル膜およびその製造方法ならびにIn2O3−SnO2薄膜の製造方法 |
JP4670026B2 (ja) * | 2000-05-02 | 2011-04-13 | 富士化学株式会社 | In2O3−SnO2前駆体塗布液およびその製造方法ならびにIn2O3−SnO2薄膜の製造方法 |
JP2003249123A (ja) * | 2002-02-26 | 2003-09-05 | Fuji Photo Film Co Ltd | 透明導電膜およびそのパターニング方法 |
JP2006278274A (ja) * | 2005-03-30 | 2006-10-12 | Asahi Techno Glass Corp | 複合酸化物薄膜及びその製造方法及び光学素子 |
JP5099616B2 (ja) * | 2005-10-28 | 2012-12-19 | 旭硝子株式会社 | 回路パターン付き透明基板の製造方法 |
JP4872585B2 (ja) * | 2005-12-06 | 2012-02-08 | 旭硝子株式会社 | レーザーパターニング用透明導電膜付き基板およびその製造方法 |
JP5082391B2 (ja) * | 2006-11-06 | 2012-11-28 | コニカミノルタホールディングス株式会社 | 透明導電膜の作製方法、透明導電膜及びプラズマディスプレイ用電磁波シールド |
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